Datasheet AA028N1-99 Datasheet (ALPHA)

Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [e-mail] • www.alphaind.com 1

Specifications subject to change without notice. 10/99A

23–30 GHz Low Noise Amplifier

Features

■ 3 dB Noise Figure

■ 18 dB Gain

■ +9 dBm Output Power

■ Rugged, Reliable Package

■ Single Voltage Operation

■ 100% RF and DC Testing

Block Diagram

AA028N1-99

Description

The AA028N1-99 is a broadband millimeterwave amplifier
in a rugged package.The amplifier is designed for use in
millimeterwave communication and sensor systems as the
receiver front-end or transmitter gain stage when high
gain, wide dynamic range, and low noise figure are
required. The robust ceramic and metal package provides
excellent electrical performance, excellent thermal
performance, and a high degree of environmental
protection for long-term reliability. A single supply voltage
simplifies bias requirements. All amplifiers are screened
at the operating frequencies prior to shipment for
guaranteed performance. Amplifier is targeted for
millimeterwave point-to-point and point-to-multipoint
wireless communications systems.

0.057

(1.45 mm)

0.011

(0.28 mm)

0.022

(0.56 mm)

0.090

(2.29 mm)

0.028

(0.71 mm)

0.180

(4.57 mm)

0.225

(5.72 mm)

0.295 (7.49 mm)

0.008

(0.20 mm)

PIN 1

INDICATOR

AA028N1-99

YYWW

LNA

Parameter Symbol Min. Typ. Max. Unit

Bandwidth BW 23 22–31 30 GHz

Small Signal Gain G1518 dB

Noise Figure NF 2.9 3.5 dB

Input Return Loss RL

I

11 dB

Output Return Loss RL

O

13 dB

Output Power at 1 dB Gain Compression P

1 dB

6 9 dBm

Temperature Coefficient of Gain dG/dT -0.016 dB/C

RF

Electrical Specifications at 25°C (VD1= VD2= +5.5 V)

Parameter Symbol Min. Typ. Max. Unit

Drain Current 1 I

D1

20 mA

Drain Current 2 I

D2

22 mA

Total Drain Current ID1+ I

D2

42 60 mA

DC

23–30 GHz Low Noise Amplifier AA028N1-99

2 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [e-mail] • www.alphaind.com

Specifications subject to change without notice. 10/99A

Frequency (GHz)

Gain vs. Frequency

Gain (dB)

0

10

20

30

15 20 25 30 35

-55˚C

90˚C

25˚C

Frequency (GHz)

Noise Figure vs. Frequency

2

3

4

5

6

20 25 30 35

NF (dB)

Frequency (GHz)

Return Loss vs. Frequency

-30

-20

-10

0

2015 25 30 35

Return Loss (dB)

S

22

S

11

Typical Performance Data

Pin Out

RF In

PIN 1

INDICATOR

V

D2

N/C

V

D1

N/C

RF Out

Characteristic Value

Operating Temperature (TOP) -55°C to +90°C

Storage Temperature (TST) -65°C to +150°C

Bias Voltage (VD1)6 V

DC

Bias Voltage (VD2)6 V

DC

Power In (PIN) 13 dBm

Absolute Maximum Ratings

23–30 GHz Low Noise Amplifier AA028N1-99

Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [e-mail] • www.alphaind.com 3

Specifications subject to change without notice. 10/99A

Frequency

S

11

S

21

S

12

S

22

(GHz) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.)

10.0 -0.7 57.5 -44.8 -23.1 -50.5 -67.8 -0.7 92.4

15.0 -0.4 -62.4 8.0 100.9 -45.7 -93.0 -1.9 -73.7

16.0 -0.5 -82.8 10.6 40.9 -47.1 -87.3 -3.2 -97.4

17.0 -0.7 -102.1 12.2 -14.1 -46.0 -92.0 -4.4 -113.4

18.0 -0.9 -121.1 13.5 -63.1 -46.5 -92.9 -5.0 -126.6

19.0 -1.3 -141.8 15.1 -109.4 -48.5 -72.8 -5.4 -141.9

20.0 -2.3 -164.2 16.8 -156.5 -45.6 -55.3 -6.0 -157.7

21.0 -4.2 172.5 18.5 153.5 -43.1 -52.4 -7.2 -174.9

22.0 -7.9 153.1 19.5 100.8 -39.7 -54.3 -9.3 170.3

23.0 -12.5 158.2 19.6 50.4 -38.4 -71.5 -11.6 158.5

24.0 -13.5 174.4 19.3 3.1 -37.7 -82.2 -14.9 153.2

25.0 -13.0 170.7 19.0 -40.3 -37.3 -91.2 -18.7 153.5

26.0 -14.0 161.8 18.8 -81.6 -38.1 -99.0 -22.4 -172.2

27.0 -16.8 154.2 18.7 -122.4 -39.2 -107.0 -20.4 -139.0

28.0 -21.2 176.8 18.6 -162.9 -41.3 -109.3 -15.5 -129.0

29.0 -16.1 -142.2 18.5 156.1 -44.1 -101.9 -11.2 -145.8

30.0 -11.3 -151.7 18.4 114.5 -46.5 -65.4 -9.6 -166.5

31.0 -7.5 -171.8 18.0 73.1 -39.7 -50.4 -7.8 173.3

32.0 -5.6 157.7 17.4 30.7 -37.6 -62.4 -7.5 145.1

33.0 -4.5 130.2 16.6 -10.3 -35.0 -72.6 -7.2 121.0

34.0 -3.6 100.1 15.7 -50.9 -35.2 -92.9 -7.0 91.3

35.0 -3.3 69.5 14.4 -91.0 -36.0 -107.7 -7.3 62.4

36.0 -3.0 42.6 12.9 -129.0 -35.4 -108.3 -6.9 35.9

37.0 -2.8 15.3 11.2 -165.5 -37.7 -125.9 -6.7 9.8

38.0 -2.7 -8.1 9.4 160.2 -39.9 -123.7 -6.4 -12.4

40.0 -2.7 -47.9 5.9 97.3 -52.3 162.1 -5.7 -52.5

Typical S-Parameters

23–30 GHz Low Noise Amplifier AA028N1-99

4 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [e-mail] • www.alphaind.com

Specifications subject to change without notice. 10/99A

Co-Planar Millimeterwave Package
Handling/Mounting

Co-planar packages (Figure 1) require careful mounting
design to maintain optimal performance and to minimize
VSWR interactions. A connection to the ground pads on
either side of the RF line is optional and will depend on
the type of material and geometry of the interface at the
RF ports.

Handling

In general the co-planar ceramic package is quite rugged.
However, due to ceramic’s brittle nature one should
exercise care when handling with metal tools. Do not apply
heavy pressure to the lid. Vacuum tools may be used to
pick and place this part.

The Cu-Mo-Cu base of this package is very durable,
however, care should be exercised when attaching with
screw hardware on packages which come with screw
holes. Over-tightening of screws could deform the base,
which could cause cracks in the ceramic walls. Only
personnel trained in both ESD precautions, and handling
precautions should be allowed to handle these packages.

Microstrip Mounting

An example of a co-planar microstrip launch is illustrated
in Figure 2 using an equal height dielectric material. A hole
is cut into the circuit board to allow the package to be
mounted directly to the circuit ground plane. The hole
should be cut as close to the outer dimensions of the
package to minimize RF gap distances.

It is preferred to match (mirror) the geometry of the
package interface to achieve best results. Three
5 x 1/4 mil ribbon bonds will complete the connection
providing a minimum discontinuity connection. Multiple
bondwires are also acceptable.

Surface Mounting

Mounting of the package to the surface (Figure 3) of a
circuit can be accomplished by using a series of via holes
to provide ground for the package. Although, this method
is not preferred it can be done if careful design practices
are used. Via spacing and size may have a strong effect
on high frequency performance of the package.

Package Attachment

The package can be conductive epoxy attached to its
mounting surface using either a paste or film media. SnPb
eutectic attachment can also be used in situations were
heat removal is important. Some packages allow for
hardware mounting. Care should be taken to ensure good
ground contact is maintained.

RF/DC Bondwire Attachment

Standard thermosonic ball or ribbon attachment is used
to make the connections to the RF and DC interfaces.
When designing the layout, be aware that most bonding
machines have a limited reach and may require special
tooling to wire/ribbon bond in center of a large circuit.

Figure 1. Co-Planar Packages

RF OutRF In

RF OutRF In

Figure 2. Microstrip Mount

Package
Launch

Circuit
Board

Figure 3. Surface Mount

Package

Circuit
Board