The 80C562/83C562 (hereafter generically
referred to as 8XC562) Single-Chip 8-Bit
Microcontroller is manufactured in an
advanced CMOS process and is a derivative
of the 80C51 microcontroller family. The
83C562/83C562 has the same instruction set
as the 80C51.
The 8XC562 contains a non-volatile 256 × 8
read-only program memory, a volatile 256 × 8
read/write data memory (83C562) (the
80C562 is ROMless), a volatile 256 × 8
read/write data memory, six 8-bit I/O ports,
two 16-bit timer/event counters (identical to
the timers of the 80C51), an additional 16-bit
timer coupled to capture and compare
latches, a 15-source, two-priority-level,
nested interrupt structure, an 8-input ADC,
two pulse width modulated outputs, standard
80C51 UART, a “watchdog” timer and on-chip
oscillator and timing circuits. For systems that
require extra capability , the 83C562 can be
expanded using standard TTL compatible
memories and logic.
The device also functions as an arithmetic
processor having facilities for both binary and
BCD arithmetic plus bit-handling capabilities.
The instruction set consists of over 100
instructions: 49 one-byte, 45 two-byte and 17
three-byte. With a 12MHz crystal, 58% of the
instructions are executed in 1µs and 40% in
2µs. Multiply and divide instructions require
4µs.
FEA TURES
•80C51 instruction set
•8k × 8 ROM expandable externally to
64k bytes
•256 × 8 RAM, expandable externally to
64k bytes
•Two standard 16-bit timer/counters
•An additional 16-bit timer/counter coupled
to four capture registers and three compare
registers
S80C562-2A68S83C562-2A68SOT188S87C552-5A682SOT188-3–40 to +85, Plastic
S87C552-5K6821473A
PCA80C562-
WP
12
PCA83C562-
WP
/xxx
12
S80C562-6A68S83C562-6A68SOT188–40 to +125, Plastic
NOTES:
1. 80C562 and 83C562 frequency range is 1.2MHz–12MHz or 1.2MHz–16MHz.
2. 87C552 frequency range is 3.5MHz–16MHz. For full specification, see the 87C552 data sheets.
3. xxx denotes the ROM code number.
Drawing
Number
TEMPERATURE
RANGE °C
AND PACKAGEFREQ
0 to +70, Plastic
Leaded Chip Carrier
0 to +70, Plastic
Leaded Chip Carrier
w/Window
Leaded Chip
Carrier
–40 to +85, Plastic
Leaded Chip Carrier
w/Window
Leaded Chip Carrier
MHz
16
16
12
12
12
LOGIC SYMBOL
ADC0-7
CMSR0-5
CMT0
CMT1
V
SS
V
DD
XTAL1
XTAL2
EA
ALE
PSEN
AV
SS
AV
DD
AVref+
AVref–
STADC
PWM0
PWM1
RST
EW
LOW ORDER
ADDRESS AND
PORT 0
CT0I
CT1I
CT2I
CT3I
T2
PORT 1PORT 2PORT 3
RT2
PORT 5
PORT 4
RxD
TxD
INT0
INT1
T0
T1
WR
RD
ADDRESS AND
DATA BUS
HIGH ORDER
DATA BUS
1992 Jan 08
SU00225
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Page 4
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
BLOCK DIAGRAM
XTAL1
XTAL2
EA
ALE
PSEN
3
3
0
2
WR
RD
AD0–7
A8–15
T0T1INT0 INT1
3333
T0, T1
TWO 16-BIT
TIMER/EVENT
COUNTERS
80C51 CORE
PARALLEL I/O
PORTS AND
EXTERNAL BUS
EXCLUDING
ROM/RAM
CPU
SERIAL
UART
PORT
V
DD
PROGRAM
MEMORY
8k x 8 ROM
(83C562)
8-BIT
PORT
V
8-BIT INTERNAL BUS
16
FOUR
16-BIT
CAPTURE
LATCHES
SS
DATA
MEMORY
256 x 8 RAM
16-BIT
TIMER/
EVENT
COUNTERS
PWM0 PWM1
DUAL
PWM
T2
16
COMPARATORS
REGISTERS
T2
16-BIT
WITH
AV
SS
AV
DD
COMPARATOR
AV
REF
–+
STADC
ADC
OUTPUT
SELECTION
ADC0–7
5
T3
WATCHDOG
TIMER
P0P1P2P3 TxDRxDP5P4CT0I–CT3IT2RT2CMSR0–CMSR5
ALTERNATE FUNCTION OF PORT 0
0
1
ALTERNATE FUNCTION OF PORT 1
2
ALTERNATE FUNCTION OF PORT 2
33
3
ALTERNATE FUNCTION OF PORT 3
4
ALTERNATE FUNCTION OF PORT 4
5
ALTERNATE FUNCTION OF PORT 5
1114
CMT0, CMT1
RST EW
SU00226
1992 Jan 08
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Page 5
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
PIN DESCRIPTION
MNEMONICPIN NO.TYPENAME AND FUNCTION
V
DD
STADC3IStart ADC Operation: Input starting analog to digital conversion (ADC operation can also be started
PWM04OPulse Width Modulation: Output 0.
PWM15OPulse Width Modulation: Output 1.
EW6IEnable Watchdog Timer: Enable for T3 watchdog timer and disable power-down mode.
P0.0–P0.757–50I/OPort 0: Port 0 is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1s written to them float
RST15I/OReset: Input to reset the 87C552. It also provides a reset pulse as output when timer T3 overflows.
XTAL135ICrystal Input 1: Input to the inverting amplifier that forms the oscillator, and input to the internal clock
XTAL234OCrystal Input 2: Output of the inverting amplifier that forms the oscillator. Left open–circuit when an
V
SS
PSEN47OProgram Store Enable: Active-low read strobe to external program memory.
ALE48OAddress Latch Enable: Latches the low byte of the address during accesses to external memory. It is
EA49IExternal Access: When EA is held at TTL level high, the CPU executes out of the internal program
AV
REF–
AV
REF+
AV
SS
AV
DD
NOTE:
1. To avoid “latch-up” effect at power-on, the voltage on any pin at any time must not be higher or lower than V
respectively.
2IDigital Power Supply: +5V power supply pin during normal operation, idle and power-down mode.
by software).
and can be used as high-impedance inputs. Port 0 is also the multiplexed low-order address and data
bus during accesses to external program and data memory. In this application it uses strong internal
pull-ups when emitting 1s.
16–23I/O(P1.0–P1.7): Quasi-bidirectional port pins.
16–19I/OCT0I–CT3I (P1.0–P1.3): Capture timer input signals for timer T2.
7–12OCMSR0–CMSR5 (P4.0–P4.5): Timer T2 compare and set/reset outputs on a match with timer T2.
13, 14OCMT0, CMT1 (P4.6, P4.7): Timer T2 compare and toggle outputs on a match with timer T2.
IPort 5: 8-bit input port.
1
ADC0–ADC7 (P5.0–P5.7): Alternate function: Eight input channels to ADC.
generator. Receives the external clock signal when an external oscillator is used.
external clock is used.
36, 37IDigital ground.
activated every six oscillator periods. During an external data memory access, one ALE pulse is
skipped. ALE can drive up to eight LS TTL inputs and handles CMOS inputs without an external
pull-up.
ROM provided the program counter is less than 8192. When EA
executes out of external program memory. EA
is not allowed to float.
is held at TTL low level, the CPU
58IAnalog to Digital Conversion Reference Resistor: Low-end.
59IAnalog to Digital Conversion Reference Resistor: High-end.
60IAnalog Ground
61IAnalog Power Supply
+0.5V or VSS – 0.5V,
DD
1992 Jan 08
5
Page 6
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
OSCILLATOR
CHARACTERISTICS
XTAL1 and XTAL2 are the input and output,
respectively, of an inverting amplifier. The
pins can be configured for use as an on-chip
oscillator, as shown in the logic symbol.
To drive the device from an external clock
source, XTAL1 should be driven while XTAL2
is left unconnected. There are no
requirements on the duty cycle of the
external clock signal, because the input to
the internal clock circuitry is through a
divide-by-two flip-flop. However, minimum
and maximum high and low times specified in
the data sheet must be observed.
RESET
A reset is accomplished by holding the RST
pin high for at least two machine cycles (24
oscillator periods), while the oscillator is
running. To ensure a good power-on reset,
the RST pin must be high long enough to
allow the oscillator time to start up (normally
a few milliseconds) plus two machine cycles.
At power-on, the voltage on V
must come up at the same time for a proper
start-up.
and RST
DD
IDLE MODE
In the idle mode, the CPU puts itself to sleep
while all of the on-chip peripherals stay
active. The instruction to invoke the idle
mode is the last instruction executed in the
normal operating mode before the idle mode
is activated. The CPU contents, the on-chip
RAM, and all of the special function registers
remain intact during this mode. The idle
mode can be terminated either by any
enabled interrupt (at which time the process
is picked up at the interrupt service routine
and continued), or by a hardware reset which
starts the processor in the same manner as a
power-on reset.
POWER-DOWN MODE
In the power-down mode, the oscillator is
stopped and the instruction to invoke
power-down is the last instruction executed.
Only the contents of the on-chip RAM are
preserved. A hardware reset is the only way
to terminate the power-down mode. the
control bits for the reduced power modes are
in the special function register PCON. Table 1
shows the state of the I/O ports during low
current operating modes.
Table 1.External Pin Status During Idle and Power-Down Modes
Voltage on any other pin to V
Input, output DC current on any single I/O pin5.0mA
Power dissipation (based on package heat transfer limitations, not device power consumption)1.0W
Storage temperature range–65 to +150°C
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section
of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
3. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
noted.
TESTLIMITS
SYMBOLPARAMETERCONDITIONSMINMAXUNIT
Analog Inputs
AV
DD
AI
DD
AI
ID
AI
PD
AV
IN
AV
REF
R
REF
C
IA
t
ADS
t
ADC
DL
e
IL
e
OS
e
G
e
M
CTC
C
t
NOTES:
1. See Figures 8 through 12 for I
2. The operating supply current is measured with all output pins disconnected; XTAL1 driven with t
V
IH
3. The idle mode supply current is measured with all output pins disconnected; XTAL1 driven with t
V
IH
4. The power-down current is measured with all output pins disconnected; XTAL2 not connected; Port 0 = EW
EA
5. Pins of ports 1, 2, 3, and 4 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its
maximum value when V
6. Capacitive loading on ports 0 and 2 may cause spurious noise to be superimposed on the V
to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operations. In the
worst cases (capacitive loading > 100pF), the noise pulse on the ALE pin may exceed 0.8V . In such cases, it may be desirable to qualify
ALE with a Schmitt Trigger, or use an address latch with a Schmitt Trigger STROBE input. I
single output sinks more than 5mA and no more than two outputs exceed the test conditions.
7. Capacitive loading on ports 0 and 2 may cause the V
address bits are stabilizing.
8. Conditions: AV
9. The differential non-linearity (DL
10.The ADC is monotonic; there are no missing codes.
11.The integral non-linearity (IL
appropriate adjustment of gain and offset error. (See Figure 1.)
12.The offset error (OS
a straight line which fits the ideal transfer curve. (See Figure 1.)
13.The gain error (G
and the straight line which fits the ideal transfer curve. Gain error is constant at every point on the transfer curve. (See Figure 1.)
14.This should be considered when both analog and digital signals are simultaneously input to port 5.
PCA8XC562100µA
Analog input voltageAVSS–0.2AVDD+0.2V
Reference voltage:
AV
REF–
AV
REF+
Resistance between AV
REF+
and AV
REF–
AVSS–0.2V
AVDD+0.2V
525kΩ
Analog input capacitance15pF
Sampling time6t
Conversion time (including sampling time)24t
Differential non-linearity
Integral non-linearity
Offset error
Gain error
8, 12
8, 13
8, 9, 10
8, 11
Channel to channel matching±1LSB
Crosstalkbetween inputs of port 5
test conditions.
DD
= VDD – 0.5V; XTAL2 not connected; EA = RST = Port 0 = EW = VDD; STADC = VSS.
= VDD – 0.5V; XTAL2 not connected; Port 0 = EW = VDD; EA = RST = STADC = VSS.
14
0–100kHz–60dB
= tf = 10ns; VIL = VSS + 0.5V;
r
= tf = 10ns; VIL = VSS + 0.5V;
r
= VDD;
= RST = STADC = XTAL1 = VSS.
is approximately 2V .
IN
on ALE and PSEN to momentarily fall below the 0.9VDD specification when the
OH
= 0V; AVDD = 5.0V, AV
REF–
) is the absolute difference between the straight line which fits the actual transfer curve (after removing gain error), and
e
) is the relative difference in percent between the straight line fitting the actual transfer curve (after removing offset error),
e
) is the difference between the actual step width and the ideal step width. (See Figure 1.)
e
) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
e
= 5.12V. ADC is monotonic with no missing codes.
REF+
s of ALE and ports 1 and 3. The noise is due
OL
can exceed these conditions provided that no
OL
1.2mA
CY
CY
µs
µs
±1LSB
±1LSB
±1LSB
0.4%
1992 Jan 08
8
Page 9
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
Code
Out
255
254
253
252
251
250
Offset
error
OS
(2)
7
6
5
(5)
4
(4)
3
(1)
Gain
error
G
e
e
2
1
0
1234567250251252253254255256
Offset
error
OS
e
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential non-linearity (DL
(4) Integral non-linearity (ILe).
(5) Center of a step of the actual transfer curve.
).
e
(3)
1 LSB
(ideal)
1 LSB =
Figure 1. ADC Conversion Characteristic
AV
AVIN (LSB
REF+
256
–AV
ideal
REF–
)
SU00227
1992 Jan 08
9
Page 10
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
AC ELECTRICAL CHARACTERISTICS
1, 2
12MHz CLOCKVARIABLE CLOCK
SYMBOLFIGUREPARAMETERMINMAXMINMAXUNIT
1/t
t
LHLL
t
AVLL
t
LLAX
t
LLIV
t
LLPL
t
PLPH
t
PLIV
t
PXIX
t
PXIZ
t
AVIV
t
PLAZ
CLCL
2Oscillator frequency1.216MHz
2ALE pulse width1272t
2Address valid to ALE low28t
2Address hold after ALE low48t
2ALE low to valid instruction in2344t
2ALE low to PSEN low43t
2PSEN pulse width2053t
2PSEN low to valid instruction in1453t
–40ns
CLCL
–55ns
CLCL
–35ns
CLCL
–100ns
CLCL
–40ns
CLCL
–45ns
CLCL
–105ns
CLCL
2Input instruction hold after PSEN00ns
2Input instruction float after PSEN59t
2Address to valid instruction in3125t
–25ns
CLCL
–105ns
CLCL
2PSEN low to address float1010ns
Data Memory
t
AVLL
t
RLRH
t
WLWH
t
RLDV
t
RHDX
t
RHDZ
t
LLDV
t
AVDV
t
LLWL
t
AVWL
t
QVWX
t
DW
t
WHQX
t
RLAZ
t
WHLH
3, 4Address valid to ALE low43t
3RD pulse width4006t
4WR pulse width4006t
3RD low to valid data in2525t
–35ns
CLCL
–100ns
CLCL
–100ns
CLCL
–165ns
CLCL
3Data hold after RD00ns
3Data float after RD972t
3ALE low to valid data in5178t
3Address to valid data in5859t
3, 4ALE low to RD or WR low2003003t
3, 4Address valid to WR low or RD low2034t
4Data valid to WR transition23t
4Data before WR4337t
4Data hold after WR33t
–503t
CLCL
–130ns
CLCL
–60ns
CLCL
–150ns
CLCL
–50ns
CLCL
–70ns
CLCL
–150ns
CLCL
–165ns
CLCL
+50ns
CLCL
3RD low to address float00ns
3, 4RD or WR high to ALE high43123t
–40t
CLCL
+40ns
CLCL
External Clock
t
CHCX
t
CLCX
t
CLCH
t
CHCL
5High time
5Low time
5Rise time
5Fall time
3
3
3
3
2020ns
2020ns
2020ns
2020ns
NOTES:
1. Parameters are valid over operating temperature range unless otherwise specified.
2. Load capacitance for port 0, ALE, and PSEN
= 100pF, load capacitance for all other outputs = 80pF .
3. These values are characterized but not 100% production tested.
1992 Jan 08
10
Page 11
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
EXPLANATION OF THE AC SYMBOLS
Each timing symbol has five characters. The
first character is always ‘t’ (= time). The other
characters, depending on their positions,
indicate the name of a signal or the logical
status of that signal. The designations are:
A – Address
C – Clock
D – Input data
H – Logic level high
I – Instruction (program memory contents)
L – Logic level low, or ALE
P – PSEN
t
ALE
LHLL
Q – Output data
R–RD
signal
t – Time
V – V alid
W– WR
signal
X – No longer a valid logic level
Z – Float
Examples: t
= Time for address valid
AVLL
to ALE low.
t
= Time for ALE low to
LLPL
PSEN
low.
ALE
PSEN
RD
PSEN
PORT 0
PORT 2
t
t
AVLL
LLPL
t
LLAX
A0–A7A0–A7
t
AVIV
t
PLPH
t
LLIV
t
PLIV
t
t
PLAZ
t
PXIX
INSTR IN
A0–A15A8–A15
PXIZ
Figure 2. External Program Memory Read Cycle
t
WHLH
t
LLDV
t
LLWL
t
RLRH
SU00006
PORT 0
PORT 2
1992 Jan 08
t
AVLL
t
LLAX
A0–A7
FROM RI OR DPL
t
AVWL
t
t
t
RLAZ
t
AVDV
P2.0–P2.7 OR A8–A15 FROM DPHA0–A15 FROM PCH
RLDV
t
RHDX
DATA INA0–A7 FROM PCLINSTR IN
RHDZ
Figure 3. External Data Memory Read Cycle
11
SU00007
Page 12
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
ALE
t
WHLH
PSEN
WR
PORT 0
PORT 2
t
AVLL
t
t
LLAX
A0–A7
FROM RI OR DPL
t
AVWL
0.8V
t
LLWL
t
QVWX
P2.0–P2.7 OR A8–A15 FROM DPHA8–A15 FROM PCH
WLWH
t
WHQX
t
DW
DATA OUTA0–A7 FROM PCLINSTR IN
Figure 4. External Data Memory Write Cycle
t
t
HIGH
V
IH1
V
IH1
0.8V
t
LOW
r
V
IH1
0.8V0.8V
t
CK
t
f
V
IH1
Figure 5. External Clock Drive XTAL1
SU00213
SU00228
1992 Jan 08
2.4V
0.45V
NOTE:
AC inputs during testing are driven at 2.4V for a logic ‘1’ and 0.45V for a logic ‘0’.
Timing measurements are made at 2.0V for a logic ‘1’ and 0.8V for a logic ‘0’.
2.0V
0.8V
Test Points
2.0V
0.8V
Figure 6. AC Testing Input/Output
2.4V
0.45V0.45V
NOTE:
The float state is defined as the point at which a port 0 pin sinks 3.2mA or sources 400µA at the voltage test levels.
2.0V
0.8V
Float
2.0V
0.8V
2.4V
Figure 7. AC Testing Input, Float Waveform
12
SU00215
SU00216
Page 13
Philips SemiconductorsProduct specification
80C562/83C562Single-chip 8-bit microcontroller
50
(1)
40
30
I
mA
DD
20
(2)
NOTE:
These values are valid only within the frequency
specifications of the device under test.
Figure 8. Supply Current (IDD) as a Function of Frequency at XTAL1 (f
10
0
0
(NC)
CLOCK SIGNAL
f (MHz)
V
DD
RST
XTAL2
XTAL1
V
SS
STADC
124168
V
DD
I
DD
V
DD
V
DD
P0
EA
EW
Figure 9. IDD Test Condition, Active Mode
All other pins are disconnected
(3)
(4)
(1) Maximum operating mode; V
(2) Maximum operating mode; V
(3) Maximum idle mode; V
(4) Maximum idle mode; V
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1992