The 74LVX174 is a low voltage CMOS HEX
D-TYPE FLIP FLOP WITH CLEAR NON
INVERTING fabricated with sub-micron silicon
gate and double-layer metal wiring C
2
MOS
technology. It is ideal for low power, battery
operated and low noise 3.3V applications.
TSSOPSOP
Table 1: Order Codes
PACKAGET & R
SOP74LVX174MTR
TSSOP74LVX174TTR
Information signals applied to D inputs are
transferred to the Q o utputs on the positive going
edge of the clock pulse.
When the CLE AR
input is held low, the Q outputs
are held low independently of the other inputs.
Power down protection is provided on all inputs
and 0 to 7V can be accepted on inputs with no
regard to the supply voltage.
This device can be used to interface 5V to 3V
system. It combines high speed performance with
the true CMOS low power consumption.
All inputs and outputs are equipped with
protection circuits against static disc harge, giving
them 2KV ESD immunity and transient excess
voltage.
1) Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switching in the sa m e di rection, ei ther HIGH or LOW
2) Param eter guaranteed by design (*) Voltage range is 3.3V ±
0.3V
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Page 5
74LVX174
Table 9: Capacitive Characteristics
Test ConditionValue
= 25°C
SymbolParameter
C
C
Input Capacitance
IN
Power Dissipation
PD
Capacitance
V
CC
(V)
3.351010pF
= 10MHz
3.3
f
IN
T
A
Min.Typ. Max.Min.Max. Min. Max.
23pF
(note 1)
1) CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without
load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I
Figure 4: Test Circuit
-40 to 85°C -55 to 125°C
= CPD x VCC x f
CC(opr)
+ ICC/n (per c ircuit )
IN
Unit
CL =15/50pF or equivalent (i ncludes jig an d probe capac i tance)
R
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