Product specification
Supersedes data of 1994 May 20
IC23 Data Handbook
1998 Feb 19
Page 2
Philips Semiconductors Product specification
74L VT6463.3V Octal bus transceiver/register (3-State)
FEA TURES
•Combines 74L VT245 and 74LVT574 type functions in one device
•Independent registers for A and B buses
•Multiplexed real–time and stored data
•Output capability: +64mA/–32mA
•TTL input and output switching levels
•Input and output interface capability to systems at 5V supply
•Bus-hold data inputs eliminate the need for external pull-up
resistors to hold unused inputs
•Live insertion/extraction permitted
•No bus current loading when output is tied to 5V bus
•Latch-up protection exceeds 500mA per JEDEC Std 17
•Power-up 3-State
•Power-up reset
•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
QUICK REFERENCE DATA
SYMBOLPARAMETER
t
PLH
t
PHL
C
C
I
CCZ
IN
I/O
Propagation delay
An to Bn or Bn to An
Input capacitance
CP, S, OE, DIR
I/O capacitanceOutputs disabled; V
Total supply currentOutputs disabled; VCC = 3.6V0.13mA
DESCRIPTION
The LVT646 is a high-performance BiCMOS product designed for
V
operation at 3.3V .
CC
This device consists of bus transceiver circuits with 3-State outputs,
D-type flip-flops, and control circuitry arranged for multiplexed
transmission of data directly from the input bus or the internal
registers.
Data on the A or B bus will be clocked into the registers as the
appropriate clock pin goes High.
Output Enable (OE
transceiver function. In the transceiver mode, data present at the
high impedance port may be stored in either the A or B register or
both.
The Select (SAB, SBA) pins determine whether data is stored or
transferred through the device in real–time. The DIR determines
which bus will receive data when the OE
In the isolation mode (OE
the B register and/or data from Bus B may be stored in the A
register.
When an output function is disabled, the input function is still
enabled and may be used to store and transmit data. Only one of
the two buses, A or B may be driven at a time. The examples on the
next page demonstrate the four fundamental bus management
functions that can be performed with the 74LVT646.
CONDITIONS
T
= 25°C; GND = 0V
amb
CL = 50pF; VCC = 3.3V
V
= 0V or 3.0V4pF
I/O
) and DIR pins are provided to control the
is active (Low).
= High), data from Bus A may be stored in
TYPICALUNIT
2.8
2.7
= 0V or 3.0V10pF
I/O
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
24-Pin Plastic SOL–40°C to +85°C74LVT646 D74LVT646 DSOT163-1
24-Pin Plastic SSOP Type II–40°C to +85°C74LVT646 DB74LVT646 DBSOT399-1
24-Pin Plastic TSSOP Type I–40°C to +85°C74LVT646 PW74LVT646PW DHSOT360-1
PIN CONFIGURATION
1
CPAB
2
SAB
3
DIR
4
A0
5
A1
6
A2
7
A3
8
A4
9
A5
10
A6
11
A7
12
GND
24
23
22
21
20
19
18
17
16
15
14
13
SV00045
V
CC
CPBA
SBA
OE
B0
B1
B2
B3
B4
B5
B6
B7
PIN DESCRIPTION
PIN NUMBERSYMBOLFUNCTION
1, 23
CPAB /
CPBA
2, 22SAB / SBA
3DIRDirection control input
4, 5, 6, 7, 8, 9, 10,
11
20, 19, 18, 17, 16,
15, 14, 13
A0 – A7
B0 – B7
21OE
12GNDGround (0V)
24V
CC
A to B clock input / B to A
clock input
A to B select input / B to
A select input
Data inputs/outputs (A
side)
Data inputs/outputs (B
side)
Output enable input
(active-low)
Positive supply voltage
1998 Feb 19853-1747 18987
2
Page 3
Philips Semiconductors Product specification
74LVT6463.3V Octal bus transceiver/register (3-State)
LOGIC SYMBOL
3
23
22SBA
21OE
LOGIC DIAGRAM
4567891011
A0 A1 A2 A3 A4 A5 A6 A7
CPAB1
SAB2
DIR
CPBA
B0 B1 B2 B3 B4 B5 B6 B7
20 19 18 17 16 15 14 13
SV00046
LOGIC SYMBOL (IEEE/IEC)
21
3
23
22
1
2
4
5
6
7
8
9
10
11
G3
3EN1 [BA]
3EN2 [AB]
C4
G5
C6
G7
≥1
∇1
6D 7
17
54D
5
1
≥1
2∇
20
19
18
17
16
15
14
13
SV00047
OE
DIR
CPBA
SBA
CPAB
SAB
21
3
23
22
1
2
1of 8 Channels
4
A0
1D
C1
Q
5
A1
6
A2
7
A3
8
A4
9
A5
10
A6
11
A7
DETAIL A X 7
1D
C1
Q
20
B0
19
B1
18
B2
17
B3
16
B4
15
B5
14
B6
13
B7
1998 Feb 19
SV00048
3
Page 4
Philips Semiconductors Product specification
OPERATING MODE
74LVT6463.3V Octal bus transceiver/register (3-State)
REAL TIME BUS TRANSFER
BUS B TO BUS A
A
B
}
OE DIR CPAB CPBA SAB SBA
LLXXXL
REAL TIME BUS TRANSFER
BUS A TO BUS B
AAA
BBB
STORAGE FROM
A, B, OR A AND B
}
OE DIR CPAB CPBA SAB SBA
LHXXLX
OE DIR CPAB CPBA SAB SBA
LH↑XXX
LLX↑XX
HX↑↑XX
FUNCTION TABLE
INPUTSDATA I/O
OEDIRCPABCPBASABSBAAnBn
XX↑XXXInput
X
X
L
H
X
X
Unspecified
output*
InputInput
OutputInput
InputOutput
XXX↑XX
H
H
L
L
L
L
H = High voltage level
L = Low voltage level
X = Don’t care
↑ = Low-to-High clock transition
*The data output function may be enabled or disabled by various signals at the OE
data at the bus pins will be stored on every Low-to-High transition of the clock.
X
X
L
L
H
H
↑
H or L
X
X
X
H or L
↑
H or L
X
H or L
X
X
X
X
X
X
L
H
Unspecified
output*
InputStore B, A unspecified
TRANSFER STORED DA TA
}
Store A, B unspecified
Store A and B data
Isolation, hold storage
Real time B data to A bus
Stored B data to A bus
Real time A data to B bus
Stored A data to B bus
input. Data input functions are always enabled, i.e.,
TO A OR B
}
OE DIR CPAB CPBA SAB SBA
LLX H or L XH
LH H or L XHX
SV00049
1998 Feb 19
4
Page 5
Philips Semiconductors Product specification
I
DC output current
mA
SYMBOL
PARAMETER
UNIT
I
mA
74LVT6463.3V Octal bus transceiver/register (3-State)
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
I
IK
V
I
I
OK
V
OUT
DC supply voltage–0.5 to +4.6V
DC input diode currentVI < 0–50mA
DC input voltage
DC output diode currentVO < 0–50mA
DC output voltage
PARAMETERCONDITIONSRATINGUNIT
3
3
1, 2
–0.5 to +7.0V
Output in Off or High state–0.5 to +7.0V
Output in Low state128
OUT
T
stg
p
Output in High state–64
Storage temperature range–65 to 150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS
MINMAX
V
CC
V
V
V
I
OH
OL
∆t/∆vInput transition rise or fall rate; Outputs enabled10ns/V
T
amb
DC supply voltage2.73.6V
Input voltage05.5V
I
High-level input voltage2.0V
IH
Input voltage0.8V
IL
High-level output current–32mA
Low-level output current32
Low-level output current; current duty cycle ≤ 50%, f ≥ 1kHz64
Operating free-air temperature range–40+85°C
1998 Feb 19
5
Page 6
Philips Semiconductors Product specification
Control pi
6
74LVT6463.3V Octal bus transceiver/register (3-State)
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOLPARAMETERTEST CONDITIONSTemp = -40°C to +85°CUNIT
1. This data sheet limit may vary among suppliers.
= –40°C to +85°C
amb
4
4
1
LIMITS
MinTypMin
1.5
2.0
0.0
0.0
3.3
3.3
1.0
1.0
–1.0
–1.0
1.0
2.0
1.6
2.4
0.0
0.0
3.3
3.3
ns
ns
ns
1998 Feb 19
7
Page 8
Philips Semiconductors Product specification
74LVT6463.3V Octal bus transceiver/register (3-State)
AC WAVEFORMS
VM = 1.5V, VIN = GND to 2.7V
1/f
CPBA or
CPAB
An or Bn
MAX
1.5V
tw(H)tw(L)
t
PHL
1.5V1.5V
1.5V1.5V
t
PLH
2.7V
V
V
SV00050
0V
OH
OL
Waveform 1. Propagation Delay, Clock Input to Output, Clock
Pulse Width, and Maximum Clock Frequency
2.7V
SBA or SAB
An or Bn
V
M
t
PLH
V
M
t
PHL
V
M
V
M
0V
V
V
SV00121
OH
OL
Waveform 2. Propagation Delay, SAB to Bn or SBA to An, An
to Bn or Bn to An
An
or
Bn
CPBA
or
CPAB
1.5V1.5V
(H)
t
s
t
(H)
h
1.5V1.5V
(L)
t
s
1.5V1.5V
2.7V
0V
t
(L)
h
2.7V
0V
NOTE: The shaded areas indicate when the input is permitted
to change for predictable output performance.
SV00123
Waveform 4. Data Setup and Hold Times
VOH –0.3V
SV00124
2.7V
0V
V
0V
OH
OE, DIR
DIR
An or Bn
1.5V1.5V
t
PZH
1.5V
t
PHZ
Waveform 5. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
SBA or SAB
An or Bn
1.5V1.5V
t
PHL
1.5V1.5V
t
PLH
SV00122
Waveform 3. Propagation Delay, SBA to An or SAB to Bn
1998 Feb 19
2.7V
0V
V
V
3V
VOL +0.3V
V
SV00125
2.7V
0V
OL
, DIR
OE
DIR
OH
An or Bn
OL
1.5V1.5V
t
PZL
1.5V
t
PLZ
Waveform 6. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
8
Page 9
Philips Semiconductors Product specification
74LVT6463.3V Octal bus transceiver/register (3-State)
TEST CIRCUIT AND WAVEFORM
V
CC
PULSE
GENERATOR
V
IN
D.U.T.
R
T
V
OUT
R
L
C
L
R
L
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
C
L
see AC CHARACTERISTICS for value.
= T ermination resistance should be equal to Z
R
T
pulse generators.
Open
6V
GND
OUT
of
6.0V
GND
Open
NEGATIVE
PULSE
POSITIVE
PULSE
FAMILY
74LVT
t
90%
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
(tF)
(tR)t
t
W
90%
V
M
V
M
10%
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
AmplitudeRep. Ratet
t
W
2.7V10MHz500ns 2.5ns 2.5ns
AMP (V)
0V
(tR)
t
TLH
(tF)
THL
AMP (V)
0V
t
R
F
SV00092
1998 Feb 19
9
Page 10
Philips Semiconductors Product specification
74LVT6463.3V Octal bus transceiver/register (3-State)
SO24: plastic small outline package; 24 leads; body width 7.5 mmSOT137-1
1998 Feb 19
10
Page 11
Philips Semiconductors Product specification
74LVT6463.3V Octal bus transceiver/register (3-State)
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mmSOT340-1
1998 Feb 19
11
Page 12
Philips Semiconductors Product specification
74LVT6463.3V Octal bus transceiver/register (3-State)
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mmSOT355-1
1998 Feb 19
12
Page 13
Philips Semiconductors Product specification
74LVT6463.3V Octal bus transceiver/register (3-State)
NOTES
1998 Feb 19
13
Page 14
Philips SemiconductorsProduct specification
74LVT6463.3V Octal bus transceiver/register (3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03544
yyyy mmm dd
14
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