•Inputs and outputs on opposite side of package allow easy
interface to microprocessors
•3-State outputs for bus interfacing
•Common output enable
•TTL input and output switching levels
•Input and output interface capability to systems at 5V supply
•Bus-hold data inputs eliminate the need for external pull-up
resistors to hold unused inputs
•Live insertion/extraction permitted
•No bus current loading when output is tied to 5V bus
•Power-up 3-State
•Power-up reset
•Latch-up protection exceeds 500mA per JEDEC Std 17
•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
QUICK REFERENCE DATA
SYMBOLPARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
IN
Propagation delay
CP to Qn
Input capacitanceVI = 0V or 3.0V4pF
Output capacitance
Total supply current
CL = 50pF;
VCC = 3.3V
Outputs disabled;
V
Outputs disabled;
VCC = 3.6V
DESCRIPTION
The 74LVT374 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74LVT374 is an 8-bit, edge triggered register coupled to eight
3-State output buffers. The two sections of the device are controlled
independently by the clock (CP) and Output Enable (OE
gates.
The register is fully edge triggered. The state of each D input, one
set-up time before the Low-to-High clock transition, is transferred to
the corresponding flip-flop’s Q output.
The 3-State output buffers are designed to drive heavily loaded
3-State buses, MOS memories, or MOS microprocessors. The
active-Low Output Enable (OE
independent of the clock operation.
When OE
is High, the outputs are in the High-impedance “OFF” state, which
means they will neither drive nor load the bus.
T
amb
= 0V or 3.0V
I/O
is Low, the stored data appears at the outputs. When OE
CONDITIONS
= 25°C; GND = 0V
74L VT374
) control
) controls all eight 3-State buffers
TYPICALUNIT
3.2
3.5
7pF
0.13mA
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
20-Pin Plastic SOL–40°C to +85°C74LVT374 D74LVT374 DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +85°C74LVT374 DB74LVT374 DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +85°C74LVT374 PW74LVT374PW DHSOT360-1
H = High voltage level
h = High voltage level one set-up time prior to the Low-to-High clock transition
L = Low voltage level
l= Low voltage level one set-up time prior to the Low-to-High clock transition
NC= No change
X = Don’t care
Z = High impedance “off” state
↑ = Low-to-High clock transition
DC supply voltage–0.5 to +4.6V
DC input diode currentVI < 0–50mA
DC input voltage
DC output diode currentVO < 0–50mA
DC output voltage
Storage temperature range–65 to 150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
PARAMETERCONDITIONSRATINGUNIT
3
p
1, 2
–0.5 to +7.0V
3
Output in Off or High state–0.5 to +7.0V
Output in Low state128
Output in High state–64
74LVT374
RECOMMENDED OPERATING CONDITIONS
LIMITS
MINMAX
V
CC
V
I
V
IH
V
IL
I
OH
OL
∆t/∆vInput transition rise or fall rate; outputs enabled10ns/V
T
amb
DC supply voltage2.73.6V
Input voltage05.5V
High-level input voltage2.0V
Input voltage0.8V
High-level output current–32mA
Low-level output current32
Low-level output current; current duty cycle ≤ 50%, f ≥ 1kHz64
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
74LVT374
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03535
yyyy mmm dd
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