Page 1
INTEGRATED CIRCUITS
74LV368
Hex buffer/line driver; inverting (3-State)
Product specification
Supersedes data of 1997 Apr 07
IC24 Data Handbook
1998 May 29
Page 2
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
FEA TURES
•Optimized for Low Voltage applications: 1.0 to 3.6V
•Accepts TTL input levels between V
•Typical V
T
amb
•Typical V
T
amb
(output ground bounce) 0.8V @ VCC = 3.3V,
OLP
= 25°C
(output VOH undershoot) 2V @ VCC = 3.3V,
OHV
= 25°C
•Inverting outputs
•Output capability: bus driver
•I
category: SSI
CC
QUICK REFERENCE DATA
GND = 0V; T
SYMBOL
t
PHL/tPLH
C
I
C
PD
NOTES:
1C
is used to determine the dynamic power dissipation (PD in µW)
PD
= CPD V
P
D
f
= input frequency in MHz; CL = output load capacitance in pF;
i
= output frequency in MHz; VCC = supply voltage in V;
f
o
(C
2 The condition is V
= 25°C; tr =tf 2.5 ns
amb
CC
2
V
L
fo) = sum of the outputs.
CC
Propagation delay
nA to nY
Input capacitance 3.5 pF
Power dissipation capacitance per buffer Notes 1, 2 30 pF
2
x fi (CL V
= GND to V
I
= 2.7V and VCC = 3.6V
CC
PARAMETER CONDITIONS TYPICAL UNIT
CL = 15pF
VCC = 3.3V
2
fo) where:
CC
CC
74L V368
DESCRIPTION
The 74LV368 a low–voltage Si–gate CMOS device and is pin and
function compatible with 74HC/HCT368.
The 74LV368 is a hex inverting buffer/line driver with 3–state
outputs. The 3–state outputs (nY) are controlled by the output
enable inputs 1OE
assume a high impedance OFF–state.
and 2OE. A HIGH on nOE causes the outputs to
9.0 ns
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
16-Pin Plastic DIL –40°C to +125°C 74LV368 N 74LV368 N SOT38-4
16-Pin Plastic SO –40°C to +125°C 74LV368 D 74LV368 D SOT109-1
16-Pin Plastic SSOP Type II –40°C to +125°C 74LV368 DB 74LV368 DB SOT338-1
16-Pin Plastic TSSOP Type I –40°C to +125°C 74L V368 PW 74LV368PW DH SOT403-1
1998 May 29 853–1966 19466
2
Page 3
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
PIN CONFIGURATION
V
1OE
1A
1Y
2A
2Y
GND
1
2
3
4
5
6
3A
7
3Y
8
16
CC
15
2OE
14
6A
13
6Y
12
5A
11
5Y
10
4A
9
4Y
LOGIC SYMBOL (IEEE/IEC)
1
2
4
6
10
15
12
14
EN
EN
74LV368
3
5
7
9
11
13
SV00373
PIN DESCRIPTION
PIN
NUMBER
1, 15 1OE to 2OE Output enable inputs (active LOW)
2, 4, 6, 10,
12, 14
3, 5, 7,
9, 11, 13
8 GND Ground (0V)
16 V
SYMBOL FUNCTION
1A to 6A Data inputs
1Y to 6Y Bus outputs
CC
Positive supply voltage
LOGIC SYMBOL
2
4
6
10
1
12
14
15
1A
2A
3A
4A
1OE
5A
6A
2OE
SV00374
1Y
2Y
3Y
4Y
5Y
6Y
SV00375
3
5
7
9
11
13
1998 May 29
3
Page 4
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
FUNCTIONAL DIAGRAM
23
1A 1Y
45
2A 2Y
67
3A 3Y
10 9
4A 4Y
1 1OE
12 11
5A 5Y
14 136A 6Y
15 2OE
74LV368
FUNCTION TABLE
INPUTS OUTPUT
nOE nA nY
L L H
L H L
H X Z
NOTES:
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
Z = High impedance OFF-state
SV00376
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN TYP. MAX UNIT
1
1.0 3.3 3.6 V
CC
CC
–40
–40
–
–
–
–
–
–
+85
+125
500
200
100
ns/V
V
V
°C
70 mA
750
500
mW
400
T
V
CC
V
V
amb
DC supply voltage See Note
Input voltage 0 – V
I
Output voltage 0 – V
O
Operating ambient temperature range
in free air
See DC and AC
characteristics
VCC = 1.0V to 2.0V
tr, t
Input rise and fall times
f
VCC = 2.0V to 2.7V
VCC = 2.7V to 3.6V
NOTES:
1 The LV is guaranteed to function down to V
ABSOLUTE MAXIMUM RATINGS
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
CC
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134); Voltages are referenced to GND (ground = 0V)
SYMBOL
V
CC
±I
IK
±I
OK
±I
O
±I
GND
±I
CC
T
stg
P
TOT
DC supply voltage –0.5 to +4.6 V
DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA
DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA
DC output source or sink current
– bus driver outputs
DC VCC or GND current for types with
,
–bus driver outputs
Storage temperature range –65 to +150 °C
Power dissipation per package
–plastic DIL
–plastic mini-pack (SO)
–plastic shrink mini-pack (SSOP and TSSOP)
PARAMETER CONDITIONS RATING UNIT
–0.5V < VO < VCC + 0.5V 35 mA
for temperature range: –40 to +125°C
above +70°C derate linearly with 12mW/K
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
NOTES:
1 Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2 The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 May 29
4
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Philips Semiconductors Product specification
HIGH l
t
voltage
LOW l
t
voltage
V
V
V
V
Hex buffer/line driver; inverting (3-State)
DC CHARACTERISTICS FOR THE LV FAMILY
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
SYMBOL P ARAMETER TEST CONDITIONS
MIN TYP
V
IH
V
IL
OH
evel Inpu
evel Inpu
HIGH level output
voltage; all outputs
HIGH level output
V
voltage; BUS driver
OH
outputs
LOW level output
OL
voltage; all outputs
LOW level output
V
I
I
voltage; BUS driver
OL
outputs
Input leakage
I
I
current
3-State output
OZ
OFF-state current
Quiescent supply
CC
current; MSI
Additional
CC
quiescent supply
current per input
∆I
NOTE:
1 All typical values are measured at T
VCC = 1.2V 0.9 0.9
VCC = 2.0V 1.4 1.4
VCC = 2.7 to 3.6V 2.0 2.0
VCC = 1.2V 0.3 0.3
VCC = 2.0V 0.6 0.6
VCC = 2.7 to 3.6V 0.8 0.8
VCC = 1.2V; VI = VIH or V
VCC = 2.0V; VI = VIH or V
VCC = 2.7V; VI = VIH or V
VCC = 3.0V; VI = VIH or V
VCC = 3.0V;VI = VIH or V
VCC = 1.2V; VI = VIH or V
VCC = 2.0V; VI = VIH or V
VCC = 2.7V; VI = VIH or V
VCC = 3.0V;VI = VIH or V
VCC = 3.0V;VI = VIH or V
–IO = 100µA 1.2
IL;
–IO = 100µA 1.8 2.0 1.8
IL;
–IO = 100µA 2.5 2.7 2.5
IL;
–IO = 100µA 2.8 3.0 2.8
IL;
–IO = 8mA 2.40 2.82 2.20 V
IL;
IO = 100µA 0
IL;
IO = 100µA 0 0.2 0.2
IL;
IO = 100µA 0 0.2 0.2
IL;
IO = 100µA 0 0.2 0.2
IL;
IO = 8mA 0.20 0.40 0.50 V
IL;
VCC = 3.6V; VI = VCC or GND 1.0 1.0 µA
VCC = 3.6V; VI = VIH or V
VO = VCC or GND
IL;
VCC = 3.6V; VI = VCC or GND; IO = 0 20.0 160 µA
VCC = 2.7V to 3.6V; VI = VCC –0.6V 500 850 µA
= 25°C.
amb
74LV368
LIMITS
-40°C to +85°C -40°C to +125°C
1
MAX MIN MAX
5 10 µA
UNIT
V
V
1998 May 29
5
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Philips Semiconductors Product specification
t
gy
Figures, 1, 3
ns
t
enable time
Figures, 2, 3
ns
t
disable time
Figures, 2, 3
ns
Hex buffer/line driver; inverting (3-State)
AC CHARACTERISTICS
GND = 0V; tr = tf = 2.5ns; CL = 50pF; RL = 1KΩ
SYMBOL
PZL/tPLH
PARAMETER WAVEFORM
Propagation delay
nA, to nY
3-State output
PZH/tPZL
nOE to nY
3-State output
PHZ/tPLZ
nOE to nY
NOTE:
1 Unless otherwise stated, all typical values are at T
2 Typical value measured at V
CC
= 3.3V.
amb
CONDITION
VCC(V) MIN TYP1MAX MIN MAX
3.0 to 3.6 – 10
3.0 to 3.6 – 14
3.0 to 3.6 – 19
= 25°C.
74LV368
LIMITS
–40 to +85 °C
1.2 – 55 – – –
2.0 – 19 36 – 44
2.7 – 14 26 – 33
2
21 – 26
1.2 – 75 – – –
2.0 – 26 49 – 60
2.7 – 19 36 – 44
2
29 – 35
1.2 – 90 – – –
2.0 – 32 59 – 70
2.7 – 24 44 – 52
2
36 – 42
LIMITS
–40 to +125 °C
UNIT
AC WAVEFORMS
VM = 1.5V at VCC 2.7V
= 0.5V * VCC at V
V
M
V
and V
OL
output load.
V
= V
X
V
= V
X
= V
V
Y
V
= V
Y
nA, nB INPUT
nY OUTPUT
are the typical output voltage drop that occur with the
OH
+ 0.3V at VCC 2.7V
OL
+ 0.1 * VCC at VCC < 2.7V
OL
– 0.3V at VCC 2.7V
OH
– 0.1VCC at VCC < 2.7V
OH
V
I
GND
V
OH
V
OL
Figure 1.Input (nA) to output (nY) propagation delay
CC
2.7V
V
M
t
PHL t
V
M
PLH
SV00377
OE INPUT
GND
V
OUTPUT
LOW-to-OFF
OFF-to-LOW
V
V
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
GND
V
I
V
M
t
CC
OL
OH
PLZ
t
PHZ
outputs
enabled
V
X
V
Y
outputs
disabled
t
PZL
t
PZH
Figure 2. 3-State enable and disable times
V
M
V
outputs
enabled
SV00344
M
1998 May 29
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Page 7
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
TEST CIRCUIT
S
1
RL = 1k
RL = 1k
SV00895
2 * V
Open
GND
CC
V
CC
PULSE
GENERATOR
V
I
D.U.T.
R
T
V
O
C
Test Circuit for switching times
DEFINITIONS
RL = Load resistor
C
= Load capacitance includes jig and probe capacitance
L
R
= Termination resistance should be equal to Z
T
SWITCH POSITION
TEST S
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
2 V
GND
1
CC
V
CC
< 2.7V V
Figure 3. Load circuitry for switching times
50pF
L
of pulse generators.
OUT
V
I
CC
2.7V2.7–3.6V
74LV368
1998 May 29
7
Page 8
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
74LV368
1997 Apr 02
8
Page 9
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74LV368
1997 Apr 02
9
Page 10
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
74LV368
1997 Apr 02
10
Page 11
Philips Semiconductors Product specification
Hex buffer/line driver; inverting (3-State)
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
74LV368
1997 Apr 02
11
Page 12
Philips Semiconductors Product specification
74LV368Hex buffer/line driver; inverting (3–State)
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96
Document order number: 9397-750-04446
1997 Apr 07
12
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