•Optimized for low voltage applications: 1.0 to 3.6 V
•Accepts TTL input levels between V
•Typical V
T
amb
•Typical V
T
amb
(output ground bounce) < 0.8 V at V
OLP
= 25°C
(output VOH undershoot) > 2 V at V
OHV
= 25°C
= 2.7 V and V
CC
•Asynchronous reset
•Synchronous counting and loading
•Two count enable inputs for n-bit cascading
•Positive-edge triggered clock
•Output capability: standard
•I
category: MSI
CC
CC
CC
= 3.6 V
CC
= 3.3 V,
= 3.3 V,
DESCRIPTION
The 74LV161 is a low-voltage Si-gate CMOS device and is pin and
function compatible with 74HC/HCT161.
The 74LV161 is a synchronous presettable binary counter which
features an internal look-head carry and can be used for high-speed
counting. Synchronous operation is provided by having all flip-flops
clocked simultaneously on the positive-going edge of the clock (CP).
The outputs (Q
LOW level. A LOW level at the parallel enable input (PE
counting action and causes the data at the data inputs (D
loaded into the counter on the positive-going edge of the clock
(providing that the set-up and hold time requirements for PE
Preset takes place regardless of the levels at count enable inputs
(CEP and CET). A low level at the master reset input (MR
four outputs of the flip-flops (Q
levels at CP , PE
asynchronous clear function).
The look-ahead carry simplifies serial cascading of the counters.
Both count enable inputs (CEP and CET) must be HIGH to count.
The CET input is fed forward to enable the terminal count output
(TC). The TC output thus enabled will produce a HIGH output pulse
of a duration approximately equal to a HIGH level output of Q
pulse can be used to enable the next cascading stage. The
maximum clock frequency for the cascaded counters is determined
by the CP to TC propagation delay and CEP to CP set-up time,
according to the following formula:
f
max
to Q3) of the counters may be preset to a HIGH or
0
to Q3) to LOW level regardless of the
0
, CET and CEP inputs (thus providing an
1
(CP to TC) tsu(CEP to CP)
tp
(max)
74L V161
) disables the
to D3) to be
0
are met).
) sets all
. This
0
QUICK REFERENCE DATA
GND = 0 V; T
= 25°C; tr = t
amb
SYMBOL
Propagation delay
CP to Q
t
PHL/tPLH
CP to TC
to Q
MR
MR to TC
CET to TC
f
C
C
max
I
PD
Maximum clock frequency77MHz
Input capacitance3.5pF
Power dissipation capacitance per gateVI = GND to V
NOTES:
is used to determine the dynamic power dissipation (PD in µW)
1. C
PD
= CPD V
P
D
f
= input frequency in MHz; CL = output load capacity in pF;
i
= output frequency in MHz; VCC = supply voltage in V;
f
o
V
(C
L
2
fi (CL V
CC
2
fo) = sum of the outputs.
CC
≤ 2.5 ns
f
PARAMETERCONDITIONSTYPICALUNIT
CL = 15 pF;
= 3.3 V
V
n
n
CC
15
18
15
17
9
2
fo) where:
CC
CC
1
25pF
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICAPKG. DWG. #
16-Pin Plastic DIL–40°C to +125°C74LV161 N74LV161 NSOT38-4
16-Pin Plastic SO–40°C to +125°C74LV161 D74LV161 DSOT109-1
16-Pin Plastic SSOP Type II–40°C to +125°C74LV161 DB74LV161 DBSOT338-1
16-Pin Plastic TSSOP Type I–40°C to +125°C74LV161 PW74LV161PW DHSOT403-1
* =The TC output is HIGH when CET is HIGH and the counter is at terminal count (HHHH)
H =HIGH voltage level
h =HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition
L =LOW voltage level
I=LOW voltage level level one set-up time prior to the LOW-to-HIGH clock transition
q =lower case letters indicate the state of the referenced output one set-up time prior to the LOW-to-HIGH clock transition
X =don’t care
↑ =LOW-to-HIGH clock transition
STATE DIAGRAM
01234
15
14
13
12
5
6
7
891011
SV00573
TYPICAL TIMING SEQUENCE
MR
PE
D
0
D
1
D
2
D
3
CP
CEP
CET
Q
0
Q
1
Q
2
Q
3
TC
reset preset
Typical timing sequence: reset outputs to zero; preset to binary twelve;
count to thirteen, fourteen, fifteen, zero, on and two; inhibit.
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0 V).
SYMBOL
V
I
I
DC supply voltage–0.5 to +4.6V
CC
DC input diode currentVI < –0.5 or VI > VCC + 0.5V20mA
IK
DC output diode currentVO < –0.5 or VO > VCC + 0.5V50mA
OK
DC output source or sink current
I
– standard outputs
O
– bus driver outputs
DC VCC or GND current for types with
I
,
I
GND
T
– standard outputs
– bus driver outputs
CC
Storage temperature range–65 to +150°C
stg
Power dissipation per package
P
TOT
– plastic DIL
– plastic mini-pack (SO)
– plastic shrink mini-pack (SSOP and TSSOP)
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
PARAMETERCONDITIONSRATINGUNIT
1, 2
–0.5V < VO < VCC + 0.5V
for temperature range: –40 to +125°C
above +70°C derate linearly with 12 mW/K
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
74LV161
25
35
50
70
750
500
400
mA
mA
mW
RECOMMENDED OPERATING CONDITIONS
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNIT
V
V
V
T
amb
tr, t
NOTE:
1. The LV is guaranteed to function down to V
DC supply voltageSee Note 11.03.33.6V
CC
Input voltage0–V
I
Output voltage0–V
O
Operating ambient temperature range in free air
Input rise and fall times except for
f
Schmitt-trigger inputs
CC
See DC and AC
characteristics per device
VCC = 1.0V to 2.0V
= 2.0V to 2.7V
V
CC
= 2.7V to 3.6V
V
CC
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1997
All rights reserved. Printed in U.S.A.
1997 May 15
16
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