Datasheet 74LV 14D NXP Datasheet (NXP)

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Page 1

74LV14

Hex inverting Schmitt trigger

Rev. 6 — 12 December 2011 Product data sheet

1. General description

The 74L V14 is a low-voltage Si-gate CM OS device that is pin and function comp atible with 74HC14 and 74HCT14.

The 74LV14 provides six inverting buffers with Schmitt-trigger input. It is capable of transforming slowly-changing input signals into sharply defined, jitter-free output signals.

The inputs switch at different point s for positive and negative-going signals. The dif ference between the positive voltage V hysteresis voltage V

2. Features and benefits

 Wide operating voltage: 1.0 V to 5.5 V  Optimized for low voltage applications: 1.0 V to 3.6 V  Accepts TTL input levels between V  Typical output ground bounce < 0.8 V at V  Typical HIGH-level output voltage (V

= 25 C

amb

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V  Multiple package options  Specifie d from 40 Cto+85C and from 40 Cto+125C

and the negative voltage VT is defined as the input

T+

= 2.7 V and VCC = 3.6 V

= 3.3 V and T

) undershoot: > 2 V at VCC = 3.3 V and

amb

= 25 C

3. Applications

 Wave and pulse shapers for highly noisy environments  Astable multivibrators  Monostable multivibrators

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NXP Semiconductors

mna204

1A 1Y

2A 2Y

3A 3Y

4A 4Y

5A 5Y

6A 6Y

001aac497

mna025

4. Ordering information

74LV14

Hex inverting Schmitt trigger

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74LV14N 40 Cto+125C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 74LV14D 40 Cto+125C SO14 plastic small outline package; 14 leads;

SOT108-1

body width 3.9 mm

74LV14DB 40 Cto+125C SSOP14 plastic shrink small outline package; 14 leads;

SOT337-1

body width 5.3 mm

74LV14PW 40 Cto+125C TSSOP14 plastic thin shrink small outline package; 14 leads;

SOT402-1

body width 4.4 mm

74LV14BQ 40 Cto+125C DHVQFN14 plastic dual in-line compatible thermal enhanced very

SOT762-1 thin quad flat package; no leads; 14 terminals; body 2.5  3 0.85 mm

5. Functional diagram

Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram for one

Schmitt trigger

Product data sheet Rev. 6 — 12 December 2011 2 of 19

Page 3

NXP Semiconductors

74LV14

1A V

1Y 6A 2A 6Y 2Y 5A 3A 5Y 3Y 4A

GND 4Y

001aah095

1 2 3 4 5 6 7

12 11

14 13

001aah096

74LV14

Transparent top view

(1)

3Y 4A

3A 5Y

2Y 5A

2A 6Y

1Y 6A

GND

6 9

5 10

4 11

3 12

2 13

terminal 1

index area

6. Pinning information

6.1 Pinning

74LV14

Hex inverting Schmitt trigger

(1) The die substrate is attached to the exposed die pad

using conductive die attach material. It can not be used as a supply pin or input.

Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 Fig 5. Pin configuration DHVQFN14

6.2 Pin description

Table 2. Pin description

Symbol Pin Description

1A 1 data input 1Y 2 data output 2A 3 data input 2Y 4 data output 3A 5 data input 3Y 6 data output GND 7 ground (0 V) 4Y 8 data output 4A 9 data input 5Y 10 data output 5A 11 data input 6Y 12 data output 6A 13 data input V

14 supply voltage

Product data sheet Rev. 6 — 12 December 2011 3 of 19

Page 4

NXP Semiconductors

7. Functional description

74LV14

Hex inverting Schmitt trigger

Table 3. Function table

H = HIGH voltage level; L = LOW voltage level.

Input nA Output nY

LH HL

8. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

V I

GND

T P

stg tot

supply voltage 0.5 +7.0 V input clamping current VI < 0.5 V or VI>VCC+0.5V output clamping current VO< 0.5 V or VO>VCC+0.5V output current VO = 0.5 V to (VCC+0.5V) - 25 mA supply current - 50 mA ground current 50 - mA storage temperature 65 +150 C total power dissipation T

DIP14 package SO14 package (T)SSOP14 package DHVQFN14 package

[1]

- 20 mA

[1]

- 50 mA

= 40 C to +125 C

amb

[2]

- 750 mW

[3]

- 500 mW

[4]

- 500 mW

[5]

- 500 mW

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

derates linearly with 12 mW/K above 70 C.

[2] P

tot

derates linearly with 8 mW/K above 70 C.

[3] P

tot

[4] P

derates linearly with 5.5 mW/K above 60 C.

tot

derates linearly with 4.5 mW/K above 60 C.

[5] P

tot

9. Recommended operating conditions

Table 5. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

amb

[1] The static characteristics are guaranteed from VCC = 1.2 V to VCC = 5.5 V, but LV devices are guaranteed to function down to

Product data sheet Rev. 6 — 12 December 2011 4 of 19

supply voltage input voltage 0 - V output voltage 0 - V ambient temperature 40 +25 +125 C

= 1.0 V (with input levels GND or VCC).

[1]

1.03.35.5V

CC CC

V V

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NXP Semiconductors

10. Static characteristics

74LV14

Hex inverting Schmitt trigger

Table 6. Static characteristics

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions T

HIGH-level output voltage VI= VT+ or V

T

IO = 100 A; VCC = 1.2 V - 1.2 - - - V

= 100 A; VCC = 2.0 V 1.8 2.0 - 1.8 - V

= 100 A; VCC = 2.7 V 2.5 2.7 - 2.5 - V

= 100 A; VCC = 3.0 V 2.8 3.0 - 2.8 - V

= 100 A; VCC = 4.5 V 4.3 4.5 - 4.3 - V

= 6 mA; VCC = 3.0 V 2.4 2.82 - 2.2 - V

= 12 mA; VCC = 4.5 V 3.6 4.2 - 3.5 - V

LOW-level output voltage VI= VT+ or V

T

IO = 100 A; VCC = 1.2 V - 0 - - - V

= 100 A; VCC = 2.0 V - 0 0.2 - 0.2 V

= 100 A; VCC = 2.7 V - 0 0.2 - 0.2 V

= 100 A; VCC = 3.0 V - 0 0.2 - 0.2 V

= 100 A; VCC = 4.5 V - 0 0.2 - 0.2 V

= 6 mA; VCC = 3.0 V - 0.25 0.40 - 0.50 V

= 12 mA; VCC = 4.5 V - 0.35 0.55 - 0.65 V

input leakage current VI=VCCor GND;

VCC=5.5V

I

supply current VI = VCC or GND; IO = 0 A;

=5.5V

additional supply current per input; VI = VCC  0.6 V;

= 2.7 V to 3.6 V

input capacitance - 3.5 - - - pF

= 40 C to +85 C T

amb

= 40 C

amb

to +125 C

Min Typ

[1]

Max Min Max

- - 1.0 - 1.0 A

- - 20.0 - 40 A

--500-850A

Unit

[1] Typical values are measured at T

Product data sheet Rev. 6 — 12 December 2011 5 of 19

= 25 C.

amb

Page 6

NXP Semiconductors

mna344

PHL

PLH

nA input

nY output

GND

11. Dynamic characteristics

74LV14

Hex inverting Schmitt trigger

Table 7. Dynamic characteristics

GND = 0 V; For test circuit see Figure 7.

Symbol Parameter Conditions T

Min Typ

propagation delay nA to nY; see Figure 6

[2]

VCC = 1.2 V - 80 - - - ns

= 2.0 V - 27 37 - 48 ns

= 2.7 V - 20 28 - 35 ns

= 3.0 V to 3.6 V; CL=15pF

= 3.0 V to 3.6 V

= 4.5 V to 5.5 V - - 18 - 23 ns

power dissipation capacitance

[1] All typical values are measured at T [2] t

is the same as t

PLH

CL=50pF; fi = 1 MHz; VI=GNDtoV

amb

and t

PHL

=25C.

[3] Typical values are measured at nominal supply voltage (V [4] C

is used to determine the dynamic power dissipation (PDin W).

D=CPD

= input frequency in MHz, fo= output frequency in MHz

= output load capacitance in pF

= supply voltage in V

 V

 fi N+(CL V

 fo) where:

N = number of inputs switching

 V

(C

 fo) = sum of the outputs.

= 3.3 V).

[3] [3]

[4]

= 40 C

amb

to +85 C

[1]

Max Min Max

= 40 C

amb

to +125 C

Unit

-13- - -ns

- 15 22 - 28 ns

-15- - -pF

12. Waveforms

Measurement points are given in Table 8.

and VOH are typical voltage output levels that occur with the output load.

Fig 6. The input (nA) to output (nY) propagation de la ys

Product data sheet Rev. 6 — 12 December 2011 6 of 19

Page 7

NXP Semiconductors

001aaa663

DUT

50 pF

1 kΩ

PULSE

GENERATOR

74LV14

Hex inverting Schmitt trigger

Table 8. Measurement points

Supply voltage Input Output V

< 2.7 V 0.5V

0.5V

2.7 V to 3.6 V 1.5 V 1.5 V  4.5 V 0.5V

Test data is given in Table 9. Definitions test circuit:

= Termination resistance should be equal to output impedance Zo of the pulse generator.

= Load resistance.

= Load capacitance including jig and probe capacitance.

0.5V

Fig 7. Load circuit for switching times

Table 9. Test data

Supply voltage Input V

< 2.7 V V

tr, t

 2.5 ns

2.7 V to 3.6 V 2.7 V  2.5 ns  4.5 V V

 2.5 ns

13. Transfer characteristics

Table 10. Transfer characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Figure 8

Symbol Parameter Conditions T

T+

positive-going threshold voltage

= 40 C

amb

to +85 C

Min Typ

[1]

Max Min Max

VCC = 1.2 V - 0.70 - - - V

= 2.0 V 0.8 1.10 1.4 0.8 1.4 V

= 2.7 V 1.0 1.45 2.0 1.0 2.0 V

= 3.0 V 1.2 1.60 2.2 1.2 2.2 V

= 3.6 V 1.5 1.95 2.4 1.5 2.4 V

= 4.5 V 1.7 2.50 3.15 1.7 3.15 V

= 5.5 V 2.1 3.00 3.85 2.1 3.85 V

and Figure 9.

= 40 C

amb

to +125 C

Unit

Product data sheet Rev. 6 — 12 December 2011 7 of 19

Page 8

NXP Semiconductors

mna207

T+

T−

mna208

T+

T−

74LV14

Hex inverting Schmitt trigger

Table 10. Transfer characteristics

…continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Figure 8 and Figure 9.

Symbol Parameter Conditions T

Min Typ

T

[1] All typical values are measured at T

negative-going threshold voltage

VCC = 1.2 V - 0.34 - - - V

= 2.0 V 0.3 0.65 0.9 0.3 0.9 V

= 2.7 V 0.4 0.90 1.4 0.4 1.4 V

= 3.0 V 0.6 1.05 1.5 0.6 1.5 V

= 3.6 V 0.8 1.30 1.8 0.8 1.8 V

= 4.5 V 0.9 1.60 2.0 0.9 2.0 V

= 5.5 V 1.1 2.00 2.6 1.1 2.6 V

hysteresis voltage VCC = 1.2 V - 0.3 - - - V

= 2.0 V 0.2 0.55 0.8 0.2 0.8 V

= 2.7 V 0.3 0.60 1.1 0.3 1.1 V

= 3.0 V 0.4 0.65 1.2 0.4 1.2 V

= 3.6 V 0.4 0.70 1.2 0.4 1.2 V

= 4.5 V 0.4 0.80 1.4 0.4 1.4 V

= 5.5 V 0.6 1.00 1.5 0.6 1.5 V

=25C.

amb

= 40 C

amb

to +85 C

amb

to +125 C

[1]

Max Min Max

= 40 C

Unit

14. Waveforms transfer characteristics

VT+ and VT limits at 70 % and 20 %.

Fig 8. Transfer characteristic Fig 9. Definition of VT+, VT and V

Product data sheet Rev. 6 — 12 December 2011 8 of 19

Page 9

NXP Semiconductors

VI (V)

0 1.20.90.3 0.6

001aaa659

(μA)

VI (V)

021.60.8 1.20.4

001aaa660

100

(μA)

VI (V)

032.41.2 1.80.6

001aaa661

100

200

300

(μA)

74LV14

Hex inverting Schmitt trigger

VCC = 1.2 V. VCC = 2.0 V.

Fig 10. Typical 74LV14 transfer characteristics Fig 11. Typical 74LV14 tr an sfer characteristics

VCC = 3.0 V.

Fig 12. Typical 74LV14 transfer characteristics

Product data sheet Rev. 6 — 12 December 2011 9 of 19

Page 10

NXP Semiconductors

001aah097

VCC (V)

1.0 3.02.51.5 2.0

100

ΔI

CC(AV)

(μA)

(1)

(2)

mna035

-- -

0.8 RC

---------------------

=

15. Application information

The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula:

74LV14

Hex inverting Schmitt trigger

add=fi

Average I

 (trI

= additional power dissipation (W);

add

= input frequency (MHz);

=rise time (ns); 10%to90%;

= fall time (ns); 90 % to 10 %;

I

CC(AV)

CC(AV)+tf

= average additional supply current (A).

differs with positive or negative input transitions, as shown in Figure 13.

CC(AV)

I

)  VCC where:

CC(AV)

An example of a relaxation circuit using the 74LV14 is shown in Figure 14

Fig 13. Average additional supply current as a function of V

Fig 14. Relaxation oscillator

Product data sheet Rev. 6 — 12 December 2011 10 of 19

(1) Positive-going edge. (2) Negative-going edge.

Page 11

NXP Semiconductors

UNIT

max.

1 2

(1) (1)

(1)

Ee M

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT27-1

99-12-27 03-02-13

min.

max.

1.73

1.13

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

0.2542.54 7.62

8.25

7.80

10.0

8.3

2.24.2 0.51 3.2

0.068

0.044

0.021

0.015

0.77

0.73

0.014

0.009

0.26

0.24

0.14

0.12

0.010.1 0.3

0.32

0.31

0.39

0.33

0.0870.17 0.02 0.13

050G04 MO-001 SC-501-14

(e )

seating plane

w M

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

DIP14: plastic dual in-line package; 14 leads (300 mil)

SOT27-1

16. Package outline

74LV14

Hex inverting Schmitt trigger

Fig 15. Package outline SOT27-1 (DIP14)

Product data sheet Rev. 6 — 12 December 2011 11 of 19

Page 12

NXP Semiconductors

UNIT

max.

A1A2A

(1)E(1)

(1)

eHELLpQZywv θ

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8 0

o o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT108-1

w M

detail X

v M

(A )

076E06 MS-012

pin 1 index

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.35

0.34

0.16

0.15

0.05

1.05

0.041

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

99-12-27 03-02-19

0 2.5 5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

74LV14

Hex inverting Schmitt trigger

Fig 16. Package outline SOT108-1 (SO14)

Product data sheet Rev. 6 — 12 December 2011 12 of 19

Page 13

NXP Semiconductors

UNIT A1A2A3b

(1)E(1)

eHELLpQZywv θ

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

0.21

0.05

1.80

1.65

0.25

0.38

0.25

0.20

0.09

6.4

6.0

5.4

5.2

0.65 1.25 0.2

7.9

7.6

1.03

0.63

0.9

0.7

1.4

0.9

8 0

o o

0.13 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT337-1

99-12-27 03-02-19

(1)

w M

v M

detail X

(A )

MO-150

pin 1 index

0 2.5 5 mm

scale

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm

SOT337-1

max.

74LV14

Hex inverting Schmitt trigger

Fig 17. Package outline SOT337-1 (SSOP14)

Product data sheet Rev. 6 — 12 December 2011 13 of 19

Page 14

NXP Semiconductors

UNIT A1A2A

(1)E(2) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.72

0.38

8 0

o o

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT402-1 MO-153

99-12-27 03-02-18

w M

0.25

detail X

(A )

v M

0 2.5 5 mm

scale

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

max.

1.1

pin 1 index

74LV14

Hex inverting Schmitt trigger

Fig 18. Package outline SOT402-1 (TSSOP14)

Product data sheet Rev. 6 — 12 December 2011 14 of 19

Page 15

NXP Semiconductors

terminal 1 index area

0.51

UNIT

0.2

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

3.1

2.9

1.65

1.35

2.6

2.4

1.15

0.85

0.30

0.18

0.05

0.00

0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT762-1 MO-241 - - -- - -

0.5

0.3

0.1v0.05

0 2.5 5 mm

scale

SOT762-1

DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm

(1)

max.

detail X

02-10-17 03-01-27

terminal 1 index area

ACCB

(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

(1)

Hex inverting Schmitt trigger

74LV14

Fig 19. Package outline SOT762-1 (DHVQFN14)

Product data sheet Rev. 6 — 12 December 2011 15 of 19

Page 16

NXP Semiconductors

74LV14

Hex inverting Schmitt trigger

17. Abbreviations

Table 11. Abbreviations

Acronym Description

CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic

18. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74LV14 v.6 20111212 Product data sheet - 74LV14 v.5 Modifications: 74LV14 v.5 20110105 Product data sheet - 74LV14 v.4 74LV14 v.4 20090702 Product data sheet - 74LV14 v .3 74LV14 v.3 20071220 Product data sheet - 74LV14 v .2 74LV14 v.2 19980420 Product specification - 74LV14 v.1 74LV14 v.1 19970203 Product specification - -

• Legal pages updated.

Product data sheet Rev. 6 — 12 December 2011 16 of 19

Page 17

NXP Semiconductors

74LV14

Hex inverting Schmitt trigger

19. Legal information

19.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) d escribed i n this docu ment may have changed si nce this d ocument was p ublished and may dif fer in case of multiple devices. The latest product statu s

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

19.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

19.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is open for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

, unless otherwise

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Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neit her qua lif ied nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, custome r (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct claims result ing from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

19.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

20. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected]

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21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Recommended operating conditions. . . . . . . . 4

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

13 Transfer characteristics . . . . . . . . . . . . . . . . . . 7

14 Waveforms transfer characteristics. . . . . . . . . 8

15 Application information. . . . . . . . . . . . . . . . . . 10

16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16

19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17

19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17

19.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

20 Contact information. . . . . . . . . . . . . . . . . . . . . 18

21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected]

Date of release: 12 December 2011

Document identifier: 74LV14