Page 1
INTEGRATED CIRCUITS
DATA SH EET
For a complete data sheet, please also download:
•The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
•The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
•The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT257
Quad 2-input multiplexer; 3-state
Product specification
Supersedes data of September 1993
File under Integrated Circuits, IC06
1998 Sep 30
Page 2
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
FEATURES
• Non-inverting data path
• 3-state outputs interface directly with system bus
• Output capability: bus driver
• ICC category: MSI
The data inputs from source 0 (1I
when input S is LOW and the data inputs from source 1
(1I1 to 4I1) are selected when S is HIGH. Data appears at
the outputs (1Y to 4Y) in true (non-inverting) form from the
selected inputs.
The “257” is the logic implementation of a 4-pole,
2-position switch, where the position of the switch is
GENERAL DESCRIPTION
The 74HC/HCT257 are high-speed Si-gate CMOS devices
and are pin compatible with low power Schottky TTL
(LSTTL). They are specified in compliance with JEDEC
standard no. 7A.
The 74HC/HCT257 have four identical 2-input multiplexers
with 3-state outputs, which select 4 bits of data from two
sources and are controlled by a common data select
input (S).
determined by the logic levels applied to S. The outputs
are forced to a high impedance OFF-state when OE is
HIGH.
The logic equations for the outputs are:
1Y = OE.(1I1.S +1I0.S)
2Y = OE.(2I1.S + 2I0.S)
3Y = OE.(3I1.S + 3I0.S)
4Y = OE.(4I1.S + 4I0.S)
The “257” is identical to the “258” but has non-inverting
(true) outputs.
QUICK REFERENCE DATA
GND = 0 V; T
=25°C; tr=tf= 6 ns
amb
SYMBOL PARAMETER CONDITIONS
t
PHL
/ t
PLH
propagation delay CL= 15 pF; VCC=5 V
nI
, nI1 to nY 11 13 ns
0
S to nY 14 17 ns
C
I
C
PD
input capacitance 3.5 3.5 pF
power dissipation capacitance per multiplexer notes 1 and 2 45 45 pF
to 4I0) are selected
0
TYPICAL
HC HCT
UNIT
Notes
1. C
is used to determine the dynamic power dissipation (PD in µW):
PD
PD=CPD× V
2
× fi+∑(CL× V
CC
2
× fo) where:
CC
fi= input frequency in MHz
fo= output frequency in MHz
∑ (CL× V
2
× fo) = sum of outputs
CC
CL= output load capacitance in pF
VCC= supply voltage in V
2. For HC the condition is VI= GND to V
CC
For HCT the condition is VI= GND to VCC− 1.5 V
1998 Sep 30 2
Page 3
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
ORDERING INFORMATION
TYPE
NUMBER
74HC257N;
NAME DESCRIPTION VERSION
DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
74HCT257N
74HC257D;
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74HCT257D
74HC257DB;
SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
74HCT257DB
74HC257PW;
TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
74HCT257PW
PIN DESCRIPTION
PIN NO. SYMBOL NAME AND FUNCTION
1 S common data select input
2, 5, 11, 14 1I
3, 6, 10, 13 1I
to 4I
0
to 4I
1
0
1
data inputs from source 0
data inputs from source 1
4, 7, 9, 12 1Y to 4Y 3-state multiplexer outputs
8 GND ground (0 V)
15
16 V
OE 3-state output enable input (active LOW)
CC
positive supply voltage
PACKAGE
page
1I
1I
2I
2I
GND
1Y
2Y
S
1
2
0
3
1
4
5
0
6
1
7
8
Fig.1 Pin configuration.
257
MLB311
16
V
CC
15
OE
4I
14
0
4I
13
1
12
4Y
3I
11
0
3I
10
1
9
3Y
page
1I
2
0
1I
3
1
2I
5
0
2I
6
1
3I
11
10
14
13
15
3I
4I
4I
OE
0
1
0
1
Fig.2 Logic symbol.
1998 Sep 30 3
1
S
MGA835
1Y
2Y
3Y
4Y
4
7
9
12
Fig.3 IEC logic symbol.
Page 4
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
FUNCTION TABLE
INPUTS OUTPUT
OE S nI
2
1I
0
S1
5
3
1I
2I
1
0
11
6
2I
3I
1
0
14
10
3I
1
13
4I
4I
1
0
HXXX Z
LHXL L
SELECTOR
LHXH H
0
nI
1
nY
LLLX L
LLHX H
15
OE
3-STATE MULTIPLEXER OUTPUTS
1Y
4
2Y
7
3Y
12
4Y
9
MGR280
Notes
1. H = HIGH voltage level
L = LOW voltage level
X = don’t care
Z = high impedance OFF-state
Fig.4 Functional diagram.
Fig.5 Logic diagram.
1998 Sep 30 4
Page 5
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
DC CHARACTERISTICS FOR 74HC
For the DC characteristics see
“74HC/HCT/HCU/HCMOS Logic Family Specifications”
Output capability: bus driver
ICC category: MSI
AC CHARACTERISTICS FOR 74HC
GND = 0 V; t
SYMBOL PARAMETER
/ t
t
PHL
PLH
= 6 ns; CL= 50 pF
r=tf
propagation delay
nI0 to nY;
nI1 to nY
t
/ t
PHL
propagation delay
PLH
S to nY
t
/ t
PZH
3-state output enable time
PZL
OE to nY
t
/ t
PHZ
3-state output disable time
PLZ
OE to nY
t
THL
/ t
output transition time 14 60 75 90 ns 2.0 Fig.6
TLH
.
T
(°C)
amb
74HC
UNIT
+25 −40 to +85 −40 to +125
min. typ. max. min. max. min. max.
36 110 140 165 ns 2.0 Fig.6
13 22 28 33 4.5
10 19 24 28 6.0
47 150 190 225 ns 2.0 Fig.6
17 30 38 45 4.5
14 26 33 38 6.0
33 150 190 225 ns 2.0 Fig.7
12 30 38 45 4.5
10 26 33 38 6.0
41 150 190 225 ns 2.0 Fig.7
15 30 38 45 4.5
12 26 33 38 6.0
5 12 15 18 4.5
4 10 13 15 6.0
TEST CONDITIONS
WAVEFORMS
V
CC
(V)
1998 Sep 30 5
Page 6
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
DC CHARACTERISTICS FOR 74HCT
For the DC characteristics see
“74HC/HCT/HCU/HCMOS Logic Family Specifications”
.
Output capability: bus driver
ICC category: MSI
Note to HCT types
The value of additional quiescent supply current (∆I
) for a unit load of 1 is given in the family specifications.
CC
To determine ∆ICC per input, multiply this value by the unit load coefficient shown in the table below.
INPUT UNIT LOAD COEFFICIENT
nI
0
nI
1
0.40
0.40
OE 1.35
S 0.70
AC CHARACTERISTICS FOR 74HCT
GND = 0 V; t
= 6 ns; CL= 50 pF
r=tf
T
amb
(°C)
TEST CONDITIONS
74HCT
SYMBOL PARAMETER
UNIT
+25 −40 to +85 −40 to +125
min. typ. max. min. max. min. max.
t
/ t
PHL
t
PHL
propagation delay 16 30 38 45 ns 4.5 Fig.6
PLH
nI
to nY
0
nI
to nY
1
/ t
propagation delay
PLH
20 35 44 53 ns 4.5 Fig.6
S to nY
/ t
t
PZH
3-state output enable time
PZL
15 30 38 45 ns 4.5 Fig.7
OE to nY
t
/ t
PHZ
3-state output disable time
PLZ
16 30 38 45 ns 4.5 Fig.7
OE to nY
/ t
t
THL
output transition time 5 12 15 18 ns 4.5 Fig.6
TLH
V
(V)
CC
WAVEFORMS
1998 Sep 30 6
Page 7
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
AC WAVEFORMS
(1) HC: VM= 50%; VI= GND to VCC.
HCT: V
= 1.3 V; VI= GND to 3 V.
M
Fig.6 Waveforms showing the input (nI0, nI1) to
output (nY) propagation delays and the
output transition times.
(1) HC: VM= 50%; VI= GND to VCC.
= 1.3 V; VI= GND to 3 V.
HCT: V
M
Fig.7 Waveforms showing the 3-state enable and
disable times.
1998 Sep 30 7
Page 8
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
pin 1 index
e
b
b
1
9
A
w M
SOT38-1
M
E
A
2
A
1
c
(e )
1
M
H
E
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.7 0.51 3.7
OUTLINE
VERSION
SOT38-1
min.
A
1 2
max.
0.15
IEC JEDEC EIAJ
050G09 MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEe M
0.32
0.23
0.013
0.009
REFERENCES
(1) (1)
D
21.8
21.4
0.86
0.84
1998 Sep 30 8
8
6.48
6.20
0.26
0.24
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
9.5
0.2542.54 7.62
8.3
0.37
0.010.100.0200.19
0.33
ISSUE DATE
w
92-10-02
95-01-19
Z
max.
2.2
0.087
(1)
Page 9
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
SO16: plastic small outline package; 16 leads; body width 3.9 mm
D
c
y
Z
16
pin 1 index
1
e
9
8
w M
b
p
SOT109-1
E
H
E
A
2
A
1
L
detail X
A
X
v M
A
Q
(A )
L
p
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT109-1
A
A1A2A3b
max.
0.25
1.75
0.10
0.010
0.069
0.004
p
1.45
1.25
0.057
0.049
IEC JEDEC EIAJ
076E07S MS-012AC
0.25
0.01
0.49
0.36
0.019
0.014
0.25
0.19
0.0100
0.0075
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1) (1)
cD
10.0
4.0
9.8
3.8
0.39
0.16
0.15
0.050
0.38
REFERENCES
1998 Sep 30 9
eHELLpQZywv θ
1.27
6.2
5.8
0.244
0.228
1.05
0.041
1.0
0.4
0.039
0.016
0.7
0.25
0.6
0.028
0.01 0.004
0.020
EUROPEAN
PROJECTION
0.25 0.1
0.01
0.7
0.3
0.028
0.012
ISSUE DATE
95-01-23
97-05-22
o
8
o
0
Page 10
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
D
c
y
Z
16
pin 1 index
9
A
2
A
E
H
E
1
SOT338-1
A
X
v M
A
Q
(A )
L
p
L
A
3
θ
1
e
DIMENSIONS (mm are the original dimensions)
mm
OUTLINE
VERSION
SOT338-1
A
max.
2.0
0.21
0.05
p
1.80
1.65
IEC JEDEC EIAJ
0.25
0.38
0.25
UNIT A1A2A3b
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
8
b
p
cD
0.20
0.09
REFERENCES
MO-150AC
w M
0 2.5 5 mm
scale
(1)E(1)
6.4
5.4
6.0
0.65 1.25
5.2
1998 Sep 30 10
detail X
eHELLpQZywv θ
7.9
7.6
1.03
0.63
0.9
0.7
EUROPEAN
PROJECTION
0.130.2 0.1
(1)
1.00
0.55
ISSUE DATE
94-01-14
95-02-04
o
8
o
0
Page 11
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
D
c
y
Z
16
pin 1 index
9
A
2
18
w M
b
e
p
A
1
E
H
E
L
detail X
SOT403-1
A
X
v M
A
Q
(A )
3
A
θ
L
p
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A1A2A
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
A
max.
0.15
mm
1.10
OUTLINE
VERSION
SOT403-1 MO-153
0.05
0.95
0.80
IEC JEDEC EIAJ
0.25
b
3
p
0.30
0.19
0.2
0.1
(1)E(2) (1)
cD
5.1
4.5
4.3
0.65
4.9
REFERENCES
1998 Sep 30 11
eHELLpQZywv θ
6.6
6.2
0.75
0.50
0.4
0.3
EUROPEAN
PROJECTION
0.13 0.10.21.0
0.40
0.06
ISSUE DATE
94-07-12
95-04-04
o
8
o
0
Page 12
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO, SSOP and TSSOP
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO, SSOP
and TSSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method.
Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering can be used for all SO packages. Wave
soldering is not recommended for SSOP and TSSOP
packages, because of the likelihood of solder bridging due
to closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering is used - and cannot be avoided for
SSOP and TSSOP packages - the following conditions
must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder
thieves at the downstream end.
Even with these conditions:
• Only consider wave soldering SSOP packages that
have a body width of 4.4 mm, that is
SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
• Do not consider wave soldering TSSOP packages
with 48 leads or more, that is TSSOP48 (SOT362-1)
and TSSOP56 (SOT364-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
1998 Sep 30 12
Page 13
Philips Semiconductors Product specification
Quad 2-input multiplexer; 3-state 74HC/HCT257
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less
than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Sep 30 13
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