•Synchronous Reset (SR) overrides counting and parallel loading
•Clock Carry (CC) output to be used as a clock for flip-flops,
register and counters
•3-State outputs for bus organized systems
DESCRIPTION
The 74F569 is a fully synchronous Up/Down binary counter. It
features preset capabilities for programmable operation, carry look
ahead for programmable operation, carry look ahead for easy
cascading, and U/D
maximum flexibility there are both Synchronous and Master Reset
inputs as well as both Clocked Carry (CC
outputs. All state changes except Master Reset are initiated by
rising edge of the clock. A High signal on the Output Enable (OE)
input forces the output buffers into the high impedance state but
does not prevent counting, resetting or parallel loading.
NOTE: One (1.0) FAST Unit Load (U.L.) is defined as: 20µA in the High state and 0.6mA in the Low state.
74F(U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
FUNCTIONAL DESCRIPTION
The 74F569 counts in the modulo-16 binary sequence. From
state 0 (LLLL) it will increment to 15 in the up mode; in the down
mode it will decrement from 15 to 0. The clock inputs of all flip-flops
are driven parallel through a clock buffer. All state changes (except
due to Master Reset) occur synchronously with the Low-to-High
transition of the Clock Pulse (CP
The circuit has five fundamental modes of operation, in order of
precedence: asynchronous reset, synchronous reset, parallel load,
count and hold. Six control inputs–Master Reset (MR
Reset (SR
Count Enable Parallel (CEP
determine the mode of operation, as shown in the Function Table.
A Low signal on MR
forces the flip-flop Q outputs Low. A Low signal on SR
counting and parallel loading and allows the Q output to go Low on
the next rising edge of CP. A Low signal on PE
and allows information on the parallel data (Dn) inputs to be loaded
into the flip-flops on the next rising edge of CP. With MR
PE
Conversely, a High signal on either CEP
The 74F569 uses edge-triggered flip-flops and changing the SR, PE,
CEP
cause errors, provided that the recommended setup and hold times,
with respect to the rising edge of CP, are observed. Two types of
outputs are provided as overflow/underflow indicators. The Terminal
Count (TC
Low, when the counter reaches zero in the down mode, or reaches
maximum 15 in the up mode
High, CEP and CET permit counting when both are Low.
, CET or U/D inputs when the CP is in either state does not
) output is normally High and goes Low provided CET is
will then remain Low until a state change occurs by counting or
or CET is changed.
) input.
), Synchronous
), and the Up/Down (U/D) input –
overrides
overrides counting
, SR, and
and CET inhibits counting.
To implement synchronous multistage counters, the connections
between the TC output and the CEP and CET inputs can provide
either slow or fast carry propagation. Figure 1 shows the
connections for a simple ripple carry, in which the clock period must
be longer than the CP to TC
cumulative CET
CET
to CP setup time of the last stage. This total delay plus setup
time sets the upper limit on clock frequency. For faster clock rates,
the carry look ahead connections in Figure 2 are recommended. In
this scheme the ripple delay through the intermediate stages
commences with the same clock that causes the first stage to tick
over from Max to Min in the up mode, or Min to Max in the down
mode, to start its final cycle. Since this takes 16 clocks to complete,
there is plenty of time for the ripple to progress through the
intermediate stages. The critical timing that limits the clock period is
the CP to TC
of the last stage. The TC
internal race conditions and is therefore not recommended for use
as a clock or asynchronous reset for flip-flops, register or counters.
For such applications, the Clocked Carry (CC
The CC
the CC
output will go Low, when the clock next goes Low and will
stay Low until the clock goes High again; as shown in the CC
Function Table. When the Output Enable (OE) is Low, the parallel
data outputs Q0–Q3 are active and follow the flip-flop Q outputs. A
High signal on OE
does not prevent counting, loading or resetting.
Figure 2. Multistage Counter with Look-Ahead Carry
CC FUNCTION TABLE
INPUTSOUTPUT
SRPECEPCETTC*CPCC
5
6
7
89101112
SF01058
LXXXXXH
XLXXXXH
XXHXXXH
XXXHXXH
XXXXHXH
HHLLL
*=TC is generated internally
H = High voltage level
L = Low voltage level
X = Don’t care
= Low Pulse
FUNCTION TABLE
H = High voltage level
h = High voltage level one setup time prior to the Low-to-High clock transition
L = Low voltage level
l = Low voltage level one setup time prior to the Low-to-High clock transition
X = Don’t care
↑ = Low-to-High clock transition
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
V
V
I
IN
V
OUT
T
T
CC
IN
OUT
amb
stg
Supply voltage–0.5 to +7.0V
Input voltage–0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in High output state–0.5 to +V
pp
p
Operating free-air temperature range0 to +70°C
Storage temperature–65 to +150°C
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
SYMBOLPARAMETERTEST CONDITIONS
VCC = MIN, VIL = MAX,
VIH = MIN, I
OH
= MAX
VCC = MIN, VIL = MAX,
VIH = MIN, I
=
CC
OL
= MAX
IK
= 0.
I
VCC = MAX, VO = 2.7V50µA
VCC = MAX, VO = 0.5V–50µA
VCC = MAX–60–150mA
VCC = MAX
V
I
I
I
IH
I
OZH
I
OZL
I
OS
I
CC
p
p
IK
Input clamp voltageVCC = MIN, II = I
Input current at maximum input voltageVCC = MAX, VI = 7.0V100µA
High-level input currentVCC = MAX, VI = 2.7V20µA
p
Others
CET, PE
Off-state output current,
High-level voltage applied
Off-state output current,
High-level voltage applied
Short-circuit output current
Supply current (total)
NO TAG
I
CCH
I
CCL
I
CCZ
±10%V
±5%V
±10%V
±5%V
MIN
2.4V
CC
2.73.3V
CC
CC
CC
TYP
NO TAG
MAX
0.350.50V
0.350.50V
–0.73–1.2V
–0.6mA
–1.2mA
3860mA
4362mA
4060mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1996
All rights reserved. Printed in U.S.A.
(print code)Date of release: July 1994
Document order number:9397-750-05139
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