•3-State outputs glitch free during power-up and power-down
•Common 3-State output register
•Independent register and 3-State buffer operation
•SSOP Type II Package
DESCRIPTION
The 74F373 is an octal transparent latch coupled to eight 3-State
output devices. The two sections of the device are controlled
independently by enable (E) and output enable (OE
The data on the D inputs is transferred to the latch outputs when the
enable (E) input is HIGH. The latch remains transparent to the data
input while E is HIGH, and stores the data that is present one set-up
time before the HIGH-to-LOW enable transition.
The 3-State output buffers are designed to drive heavily loaded
3-State buses, MOS memories, or MOS microprocessors.
The active-LOW output enable (OE
independent of the latch operation. When OE
transparent data appears at the output.
When OE
which means they will neither drive nor load the bus.
is HIGH, the outputs are in high impedance “off” state,
) controls all eight 3-State buffers
) control gates.
is LOW, latched or
The 74F374 is an 8-bit edge triggered register coupled to eight
3-State output buffers. The two sections of the device are controlled
independently by clock (CP) and output enable (OE
The register is fully edge triggered. The state of the D input, one
set-up time before the LOW-to-HIGH clock transition is transferred
to the corresponding flip-flop’s Q output.
The 3-State output buffers are designed to drive heavily loaded
3-State buses, MOS memories, or MOS microprocessors.
The active-LOW output enable (OE
independent of the register operation. When OE
the register appears at the outputs. When OE
are in high impedance “off” state, which means they will neither drive
nor load the bus.
TYPE
74F3734.5 ns35 mA
TYPETYPICAL f
74F374165 MHz55 mA
PROPAGATION
) controls all eight 3-State buffers
TYPICAL
DELA Y
max
) control gates.
is LOW, the data in
is HIGH, the outputs
TYPICAL SUPPL Y
CURRENT
(TOTAL)
TYPICAL SUPPL Y
CURRENT
(TOTAL)
ORDERING INFORMATION
ORDER CODE
DESCRIPTIONCOMMERCIAL RANGEPKG DWG #
VCC = 5 V ±10%, T
20-pin plastic DIPN74F373N, N74F374NSOT146-1
20-pin plastic SOLN74F373D, N74F374DSOT163-1
20-pin plastic SSOP type IIN74F373DB, N74F374DBSOT339-1
= 0 °C to +70 °C
amb
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINSDESCRIPTION
D0 - D7Data inputs1.0 / 1.020 µA / 0.6 mA
E (74F373)Enable input (active-HIGH)1.0 / 1.020 µA / 0.6 mA
OEOutput enable inputs (active-LOW)1.0 / 1.020 µA / 0.6 mA
NOTE: One (1.0) FAST unit load is defined as: 20 µA in the HIGH state and 0.6 mA in the LOW state.
74F (U.L.)
HIGH / LOW
LOAD VALUE
HIGH/LOW
2002 Nov 20
2
Page 3
Philips SemiconductorsProduct data
74F373/74F374Latch/flip-flop
PIN CONFIGURATION – 74F373
OE
1
Q0
2
D0
3
D1
4
Q1
5
Q2
6
D2
7
D3
8
Q3
9
GND
1011
SF00250
LOGIC SYMBOL – 74F373
34 78 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
11
E
OE
1
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
PIN CONFIGURATION – 74F374
V
20
CC
19
Q7
18
D7
17
D6
16
Q6
15
Q5
14
D5
13
D4
12
Q4
E
OE
1
Q0
2
D0
3
D1
4
Q1
5
Q2
6
D2
7
D3
8
Q3
9
GND
1011
V
20
Q7
19
D7
18
D6
17
Q6
16
Q5
15
D5
14
D4
13
Q4
12
CP
SF00253
CC
IEC/IEE SYMBOL – 74F374
34 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
11
CP
OE
1
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
25 6 9 12 15 16 19
= Pin 20
V
CC
GND = Pin 10
IEC/IEEE SYMBOL – 74F373
1
11
3
4
7
8
13
14
17
18
EN1
EN2
2D
25 6 9 12 15 16 19
V
= Pin 20
CC
SF00251
GND = Pin 10
SF00254
IEC/IEEE SYMBOL – 74F374
1
11
SF00252
2
5
6
9
12
15
16
19
13
14
17
18
1
EN1
C2
3
4
7
8
2D
1
2
5
6
9
12
15
16
19
SF00255
2002 Nov 20
3
Page 4
Philips SemiconductorsProduct data
OPERATING MODE
Enable and read register
Latch and read register
Disable outputs
74F373/74F374Latch/flip-flop
LOGIC DIAGRAM FOR 74F373
D0
3
D1
4
D2
7
D3
8
D4
13
D5
14
D6
17
D7
18
V
= Pin 20
CC
GND = Pin 10
OE
Q0
D
Q
E
2
D
Q
E
11
E
1
Q1
D
Q
E
5
Q2
D
Q
E
6
Q3
D
E
9
D
Q
E
12
Q4
LOGIC DIAGRAM FOR 74F374
VCC = Pin 20
GND = Pin 10
CP
OE
D0
3
D
CP
11
1
D1
4
Q0
D
CP
2
Q
D2
7
Q1
D
CP
5
Q
D3
8
Q2
D
CP
6
Q
D4
13
Q
9
Q3
D
CP
D5
14
D
Q
CP
12
Q4
FUNCTION TABLE FOR 74F373
INPUTS
OEEDn
INTERNAL
REGISTER
LHLLL
LHHHH
L↓lLL
L↓hHH
LLXNCNCHold
HLXNCZ
HHDnDnZ
NOTES:
H =High-voltage level
h =HIGH state must be present one set-up time before the HIGH-to-LOW enable transition
L =Low-voltage level
l=LOW state must be present one set-up time before the HIGH-to-LOW enable transition
NC=No change
X =Don’t care
Z =High impedance “off” state
↓ =HIGH-to-LOW enable transition
OUTPUTS
Q0 - Q7
Q5
Q5
D
E
15
D6
17
D
CP
15
Q
Q
D
Q
Q
Q6
Q6
Q
E
16
D7
18
D
CP
16
19
Q7
SF00256
Q
19
Q7
SF00257
p
2002 Nov 20
4
Page 5
Philips SemiconductorsProduct data
OPERATING MODE
Load and read register
Disable outputs
SYMBOL
PARAMETER
UNIT
74F373/74F374Latch/flip-flop
FUNCTION TABLE FOR 74F374
INPUTSINTERNALOUTPUTS
OECPDnREGISTERQ0 – Q7
L↑lLL
L↑hHH
L↑XNCNCHold
H↑XNCZ
H↑DnDnZ
NOTES:
H =High-voltage level
h =HIGH state must be present one set-up time before the LOW-to-HIGH clock transition
L =Low-voltage level
l=LOW state must be present one set-up time before the LOW-to-HIGH clock transition
NC=No change
X =Don’t care
Z =High impedance “off” state
↑ =LOW-to-HIGH clock transition
=Not LOW-to-HIGH clock transition
↑
p
ABSOLUTE MAXIMUM RATINGS
Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.
SYMBOL
V
CC
V
IN
I
IN
V
OUT
I
OUT
T
amb
T
stg
Supply voltage–0.5 to +7.0V
Input voltage –0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in HIGH output state–0.5 to V
Current applied to output in LOW output state48mA
Operating free air temperature range0 to +70°C
Storage temperature range–65 to +150°C
PARAMETERRATINGUNIT
RECOMMENDED OPERATING CONDITIONS
V
V
V
I
I
I
T
CC
IH
IL
Ik
OH
OL
amb
Supply voltage
HIGH-level input voltage2.0––V
LOW-level input voltage––0.8V
Input clamp current–––18mA
HIGH-level output current–––3mA
LOW-level output current––24mA
Operating free air temperature range0– +70°C
CC
LIMITS
MINNOMMAX
4.55.05.5V
V
2002 Nov 20
5
Page 6
Philips SemiconductorsProduct data
SYMBOL
PARAMETER
UNIT
VOHHIGH-level output voltage
CC
,
IL
,
VOLLOW-level output voltage
CC
,
IL
,
74F373/74F374Latch/flip-flop
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
MINTYP2MAX
2.4V
2.73.4V
0.350.50V
0.350.50V
–0.73 –1.2V
3560mA
V
I
I
I
IH
I
IL
I
OZH
I
OZL
I
OS
I
CC
TEST
CONDITIONS
p
p
IK
Input clamp voltageVCC = MIN, II = I
VCC = MIN, VIL = MAX,
VIH = MIN, IOH = MAX
VCC = MIN, VIL = MAX,
VIH = MIN, IOL = MAX
IK
Input current at maximum input voltageVCC = MAX, VI = 7.0 V100µA
High-level input currentVCC = MAX, VI = 2.7 V20µA
Low-level input currentVCC = MAX, VI = 0.5 V–0.6mA
Off-state output current, high-level voltage appliedVCC = MAX, V
= 2.7 V50µA
O
Off-state output current, low-level voltage appliedVCC = MAX, VO = 0.5 V–50µA
Short-circuit output current
Supply current (total)
3
74F373
VCC = MAX–60–150mA
VCC = MAX
1
±10%V
±5%V
±10%V
±5%V
CC
CC
CC
CC
74F3745786mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5 V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25 °C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
= +25 °CT
amb
SYMBOLPARAMETERTESTVCC = +5.0 VVCC = +5.0 V ± 10%UNIT
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
III
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Preliminary data
Product data
http://www.semiconductors.philips.com.
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com .Fax: +31 40 27 24825