Datasheet 74f365, 74f 367 DATASHEETS (Philips)

INTEGRATED CIRCUITS

74F365, 74F367

Hex buffers/drivers

Product specification Supersedes data of 1999 Jan 08 IC15 Data Handbook

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2000 Jun 30

Philips Semiconductors Product specification

DESCRIPTION

PKG DWG #

74F365, 74F367Hex buffers/drivers

FEA TURES

•High-impedance NPN base inputs for reduced loading

(20µA in High and Low states)

•High-speed

•Bus oriented

•3-State buffer outputs sink 64mA

TYPE

74F365, 74F367 5.0ns 36mA

ORDERING INFORMATION

TYPICAL

PROPAGATION

DELA Y

COMMERCIAL RANGE

TYPICAL

SUPPLY CURRENT

(TOTAL)

VCC = 5V ±10%,

T

= 0°C to +70°C

amb

16-pin plastic DIP N74F365N, N74F367N SOT38-4

16-pin plastic SO N74F365D, N74F367D SOT109-1

INPUT AND OUTPUT LOADING AND FAN-OUT TABLE

PINS DESCRIPTION

74F(U.L.)

HIGH/LOW

I0 - I5 Inputs 1.0/0.033 20µA/20µA OE0, OE1 Output enable inputs (active Low) 1.0/0.033 20µA/20µA

Y0 - Y5, Y0 - Y5 Data Outputs 750/106.7 15mA/64mA

NOTE: One (1.0) FAST Unit Load (U.L.) is defined as: 20µA in the High state and 0.6mA in the Low state.

PIN CONFIGURATION

1

0

OE

I0

2

Y0

3

I1

4

Y1

5

I2

6

Y2

7

GND

74F365

VCC

16

OE1

15 14

I5

13

Y5

12

I4

11

Y4

10

I3

98

Y3

SF00899

LOGIC SYMBOL (IEEE/IEC)

74F365 1 15

2

4

6

10

12

14

&

EN

LOAD VALUE

HIGH/LOW

3

5

7

9

11

13

SF00901

LOGIC SYMBOL

PIN CONFIGURA TION

74F365

2 1412

I0 I1 I2 I3 I4 I5

1 OE0

15

V

= Pin 16

CC

GND = Pin 8

OE1

Y0 Y1

53

2000 Jun 30 853–0042 24024

1064

Y2 Y3 Y4 Y5

97 1311

SF00900

OE

I0

Y

0

I1

1

Y

I2

2

Y

GND

2

74F367

VCC

1

0

2 3 4 5 6 7

16 15 14 13 12 11 10

98

SF00905

OE1 I5 Y5 I4 Y I3 Y

4

3

Philips Semiconductors Product specification

Hex buffers/drivers

LOGIC SYMBOL

2 1412

I0 I1 I2 I3 I4 I5

1 OE0

15

V

= Pin 16

CC

GND = Pin 8

LOGIC DIAGRAMS

1

OE

0

15

OE

1

2

I0

I1

4

6

I2

10

I3

12

I4

14

I5

VCC = Pin 16 GND = Pin 8

OE1

Y0 Y1

74F365

3

5

7

9

11

13

74F367

Y2 Y3 Y4 Y5

53

OE0

OE

I0

I1

I2

I3

1

I4

I5

Y0

Y1

Y2

Y3

Y4

Y5

1064

97 1311

1

2

4

6

10

15

12

14

SF00906

74F367

3

5

7

9

11

13

Y0

Y

1

2

Y

Y3

Y

4

Y5

SF01442

LOGIC SYMBOL (IEEE/IEC)

74F367 1 15

2

4

6

10

12

14

EN1 EN2

74F365, 74F367

1

2

3

5

7

9

11

13

SF00907

FUNCTION TABLE for 74F365

INPUTS OUTPUTS

OE0 OE1 In Yn Yn

L L L L H L L H H L X H X Z Z H X X Z Z

H = High voltage level L = Low voltage level X = Don’t care Z = High impedance “off” state

2000 Jun 30

FUNCTION TABLE for 74F367

INPUTS OUTPUTS

OEn In Yn Yn

L L L H L H H L

H X Z Z

H = High voltage level L = Low voltage level X = Don’t care Z = High impedance “off” state

3

Philips Semiconductors Product specification

SYMBOL

PARAMETER

Hex buffers/drivers

74F365, 74F367

ABSOLUTE MAXIMUM RATINGS

(Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.)

SYMBOL

V

CC

V

IN

I

IN

V

OUT

I

OUT

T

amb

T

stg

Supply voltage range –0.5 to +7.0 V Input voltage range –0.5 to +7.0 V Input current range –30 to +5 mA Voltage applied to output in High output state range –0.5 to 5.5 V Current applied to output in Low output state 128 mA Operating free-air temperature range 0 to +70 °C Storage temperature range –65 to +150 °C

PARAMETER RATING UNIT

RECOMMENDED OPERATING CONDITIONS

LIMITS UNIT

MIN TYP MAX

V V V I I I T

CC IH

IL IK OH OL

amb

Supply voltage 4.5 5.0 5.5 V High-level input voltage 2.0 V Low-level input voltage 0.8 V Input clamp current –18 mA High-level output current –15 mA Low-level output current 64 mA Operating free-air temperature range 0 70

o

C

2000 Jun 30

4

Philips Semiconductors Product specification

SYMBOL

PARAMETER

TEST CONDITIONS

1

V

CC

MIN, V

IL

MAX,

VOHHigh-level output voltage

V

CC

MIN, V

IL

MAX,

VOLLow-level output voltage

V

CC

MIN, V

IL

MAX,

74F367

TEST

CONDITIONS

Hex buffers/drivers

74F365, 74F367

DC ELECTRICAL CHARACTERISTICS

Over recommended operating free-air temperature range unless otherwise noted.

LIMITS UNIT

MIN TYP

"10%VCC 2.4 V

"5%VCC 2.7 3.3 V

"10%VCC 2.0 V

"5%VCC 2.0 V

"10%VCC 0.55 V

"5%VCC 0.42 0.55 V

IK

V I

I

IH

I

IL

I

OZH

I

OZL

I

OS

I

CC

V

= MIN, V

= MAX,

VIH = MIN, IOH = –3mA

p

V

= MIN, V

= MAX,

VIH = MIN, IOH = –15mA

V

= MIN, V

p

IK

Input clamp voltage VCC = MIN, II = I

=

VIH = MIN, IOL = MAX

= MAX,

Input current at maximum input voltage VCC = 0.0V, VI = 7.0V 100 µA High-level input current VCC = MAX, VI = 2.7V 20 µA Low-level input current VCC = MAX, VI = 0.5V –20 µA

Off-state output current, High-level voltage applied

Off-state output current, Low-level voltage applied

Short-circuit output current

Supply current (total)

74F365

3

I

CCH

I

CCL

I

CCZ

VCC = MAX, VO = 2.7V 50 µA

VCC = MAX, VO = 0.5V –50 µA

VCC = MAX –100 –225 mA

VCC = MAX 47 62 mA

NOTES:

1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.

2. All typical values are at V

3. Not more than one output should be shorted at a time. For testing I

= 5V, T

CC

techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged

amb

= 25°C.

, the use of high-speed test apparatus and/or sample-and-hold

OS

shorting of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, I

tests should be performed last.

OS

2

MAX

–0.73 –1.2 V

25 35 mA

35 48 mA

AC ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER

t

PLH

t

PHL

t

PZH

t

PZL

t

PZH

t

PZL

t

PHZ

t

PLZ

Propagation delay In to Y

n

Output Enable time to High or Low level

Output Disable time from High to Low level

74F365, 74F367

74F365 Waveform 3

74F367 Waveform 3

Waveform 2

Waveform 4

Waveform 4 Waveform 3

Waveform 4

LIMITS

TA = +25°C TA = -55°C to +125°C

VCC = +5.0V VCC = +5.0V ± 10% UNIT

CL = 50pF, RL = 500Ω CL = 50pF, RL = 500Ω

MIN TYP MAX MIN MAX

2.5

3.0

2.0

4.5

5.5

4.0

5.0

5.5

6.5

4.5

4.0

6.5

7.0

6.5

8.0

7.5

8.5

6.5

2.0

2.5

3.0

2.0

7.0

7.5

8.5

9.0

7.0

ns ns

2000 Jun 30

5

Philips Semiconductors Product specification

Hex buffers/drivers

AC WAVEFORMS

For all waveforms, Vm = 1.5V

In

Y

n

OE

Yn, Yn

Waveform 3. 3-State Output Enable Time to High Level and

V

M

t

PHL

V

M

t

PLH

V

M

SF00912

Waveform 1. For Inverting Outputs

V

M

t

PZH

V

M

t

PHZ

V

M

Output Disable Time from High Level

V

M

VOH -0.3V

SF00913

74F365, 74F367

In

Yn

Waveform 2. For Non-Inverting Outputs

OE

0V

Yn, Yn

Waveform 4. 3-State Output Enable Time to Low Level

and Output Disable Time from Low Level

V

M

t

PLH

V

M

t

PZL

V

M

V

M

t

PHL

M

V

M

t

PLZ

V

M

SF00914

3.5V

VOL +0.3V

SF00915

TEST CIRCUIT AND WAVEFORM

V

CC

V

PULSE

GENERATOR

IN

R

T

Test Circuit for 3-State Outputs

SWITCH POSITION

TEST SWITCH

t

PLZ

t

PZL

closed closed

All other open

DEFINITIONS:

R

= Load resistor;

L

see AC electrical characteristics for value.

= Load capacitance includes jig and probe capacitance;

C

L

see AC electrical characteristics for value.

R

= Termination resistance should be equal to Z

T

pulse generators.

D.U.T.

V

OUT

t

7.0V

R

L

C

R

L

NEGATIVE PULSE

POSITIVE PULSE

90%

10%

V

M

10%

t

THL (tf

t

TLH (tr

90%

V

M

w

V

M

10%

)

t

w

t

TLH (tr

t

THL (tf

)

90%

V

M

90%

10%

AMP (V)

0V

AMP (V)

0V

Input Pulse Definition

INPUT PULSE REQUIREMENTS

V

amplitude

3.0V

M

1.5V

rep. rate

1MHz 500ns

t

w

t

TLHtTHL

2.5ns 2.5ns

SF00777

OUT

of

family

74F

2000 Jun 30

6

Philips Semiconductors Product specification

Hex buffers/drivers

DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4

74F365, 74F367

2000 Jun 30

7

Philips Semiconductors Product specification

Hex buffers/drivers

SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

74F365, 74F367

2000 Jun 30

8

Philips Semiconductors Product specification

Hex buffers/drivers

74F365, 74F367

NOTES

2000 Jun 30

9

Philips Semiconductors Product specification

Hex buffers/drivers

Data sheet status

Objective specification

Preliminary specification

Product specification

Product status

Development

Qualification

Production

74F365, 74F367

Definition

This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

[1]

[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381

 Copyright Philips Electronics North America Corporation 2000

Date of release: 06-00

Document order number: 9397-750 07283

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