All outputs will be forced Low independently of Clock or Data inputs
by a Low voltage level on the MR
input. The device is useful for
applications where the true output only is required and the CP and
MR
are common to all elements.
• Ideal buffer for MOS microprocessor or memory
• Eight edge–triggered D–type flip–flops
• Buffered common clock
• Buffered asynchronous Master Reset
TYPE
74F273A170MHz25mA
TYPICAL
f
MAX
TYPICAL SUPPL Y CURRENT
• See 74F377A for clock enable version
• See 74F373 for transparent latch version
• See 74F374 for 3–State version
DESCRIPTION
The 74F273 has eight edge–triggered D–type flip–flops with
individual D inputs and Q outputs. The common buffered Clock (CP)
and Master Reset (MR
simultaneously .
The register is fully edge–triggered. The state of each D input, one
setup time before the Low–to–High clock transition, is transferred to
the corresponding flip–flop’s Q output.
H = High voltage level
h = High voltage level one set–up time prior to the Low–to–High clock transition
L = Low voltage level
l= Low voltage level one set–up time prior to the Low–to–High clock transition
X = Don’t care
↑ = Low–to–High clock transition
Q4
12
Q5
15
Q6
16
19
Q7
SF00349
1996 Mar 12
3
Page 4
Philips Semiconductors Product specification
74F273AOctal D flip–flop
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free air temperature range.)
SYMBOL
V
T
V
V
I
OUT
I
OUT
amb
T
CC
IN
IN
stg
Supply voltage–0.5 to +7.0V
Input voltage–0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in High output state–0.5 to V
Current applied to output in Low output state40mA
Operating free air temperature range0 to +70
Low-level output voltageVCC = MIN, VIL = MAX,±10%V
Input clamp voltageVCC = MIN, II = I
Input current at maximum input voltageVCC = 0.0V, VI = 7.0V100µA
High–level input currentVCC = MAX, VI = 2.7V20µA
Low–level input currentVCC = MAX, VI = 0.5V–20µA
Short–circuit output current
Supply current (total)I
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. To reduce the effect of external noise during test.
4. Not more than one output should be shorted at a time. For testing I
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
1996 Mar 12
9
Page 10
Philips SemiconductorsProduct specification
74F273AOctal D flip-flop
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 10-98
Document order number:9397-750-051 13
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