Datasheet 74F244SJX, 74F244SJ, 74F244SCX, 74F244SC, 74F244PC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009501 www.fairchildsemi.com
April 1988 Revised July 1999
74F240 • 74F241 • 74F244 Octal Buffers/Line Drivers with 3-STATE Outputs
74F240 • 74F241 • 74F244 Octal Buffers/Line Drivers with 3-STATE Outputs
General Description
The 74F240, 74F241 and 74F244 are octal buffers and line drivers designed to be employ ed as memory and address drivers, clock drivers a nd bus-oriented transmitters/ receiv­ers which provide improved PC and board density.
Features
3-STATE outputs drive bus lines or buffer memory address registers
Outputs sink 64 mA (48 mA mil)
12 mA source current
Input clamp diodes limit high-speed termination effects
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
Connection Diagrams
74F240 74F241
74F244
Order Code Package Number Package Description
74F240SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F240PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 74F241SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F241SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F241PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide 74F244SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74F244PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F240 • 74F241 • 74F244
Logic Symbols
IEEE/IEC
74F240
IEEE/IEC
74F241
IEEE/IEC
74F244
Unit Loading/Fan Out
Note 1: Worst-case 74F240 enabled; 74F 241, 74F244 disabled
Truth Tables
74F240
74F241
74F244
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
Pin Names Description
U.L.
Input I
IH/IIL
HIGH/LOW
Output I
OH/IOL
OE1, OE
2
3-STATE Output Enable Input (Active LOW) 1.0/1.667 20 µA/−1 mA
OE
2
3-STATE Output Enable Input (Active HIGH) 1.0/1.667 20 µA/1 mA
I
0–I7
Inputs (74F240) 1.0/1.667 (Note 1) 20 µA/−1 mA
I
0–I7
Inputs (74F241, 74F244) 1.0/2.667 (Note 1) 20 µA/−1.6 mA
O
0–O7
, O0–O7Outputs 600/106.6 (80) 12 mA/64 mA (48 mA)
OE
1
D
1n
O
1n
OE
2
D
2n
O
2n
HXZHXZ LHLLHL LLHLLH
OE
1
D
1n
O
1n
OE
2
D
2n
O
2n
HXZLXZ LHHHHH LLLHLL
OE
1
D
1n
O
1n
OE
2
D
2n
O
2n
HXZHXZ LHHLHH LLLLLL
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74F240 • 74F241 • 74F244
Absolute Maximum Ratings(Note 2) Recommended Operating
Conditions
Note 2: Absolute maximum ratings are values beyon d which the device
may be damaged or have its useful life impaired . Functional operation under these condit ions is not implied.
Note 3: Either voltage limit or curren t limit is sufficient to protect in puts.
DC Electrical Characteristics
Storage Temperature −65°C to +150°C Ambient Temperature under Bias 55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin 0.5V to +7.0V Input Voltage (Note 3) 0.5V to +7.0V Input Current (Note 3) 30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output 0.5V to V
CC
3-STATE Output 0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the r ated I
OL
(mA)
ESD Last Passing Voltage (Min) 4000V
Free Air Ambi ent Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = 18 mA
V
OH
Output HIGH 10% VCC2.4
VMin
IOH = 3 mA
Voltage 10% VCC2.0 IOH = 15 mA
5% VCC2.7 IOH = 3 mA
V
OL
Output LOW 10% V
CC
0.55 V Min IOL = 64 mA
Voltage
I
IH
Input HIGH
5.0 µAMaxVIN = 2.7V
Current
I
BVI
Input HIGH Current
7.0 µAMaxVIN = 7.0V
Breakdown Test
I
CEX
Output HIGH
50 µAMaxV
OUT
= V
CC
Leakage Current
V
ID
Input Leakage
4.75 V 0.0
IID = 1.9 µA
Test All Other Pins Grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current 1.0
mA Max
VIN = 0.5V (OE1, OE2, OE2, Dn 74F240))
1.6 VIN = 0.5V (Dn (74F241, 74F244))
I
OZH
Output Leakage Current 50 µAMaxV
OUT
= 2.7V
I
OZL
Output Leakage Current 50 µAMaxV
OUT
= 0.5V
I
OS
Output Short-Circuit Current −100 −225 mA Max V
OUT
= 0V
I
ZZ
Bus Drainage Test 500 µA0.0VV
OUT
= 5.25V
I
CCH
Power Supply Current (74F240) 19 29 mA Max VO = HIGH
I
CCL
Power Supply Current (74F240) 50 75 mA Max VO = LOW
I
CCZ
Power Supply Current (74F240) 42 63 mA Max VO = HIGH Z
I
CCH
Power Supply Current
40 60 mA Max VO = HIGH
(74F241, 74F244)
I
CCL
Power Supply Current
60 90 mA Max VO = LOW
(74F241, 74F244)
I
CCZ
Power Supply Current
60 90 mA Max
VO = HIGH Z
(74F241, 74F244)
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74F240 • 74F241 • 74F244
AC Electrical Characteristics
Symbol Parameter
TA = +25°CT
A
= 55°C to +125°CTA = 0°C to +70°C
Units
VCC = +5.0V VCC = 5.0V VCC = 5.0V
CL = 50 pF CL = 50 pF CL = 50 pF
Min Typ Max Min Max Min Max
t
PLH
Propagation Delay 3.0 5.1 7.0 3.0 9.0 3.0 8.0
ns
t
PHL
Data to Output (74F240) 2.0 3.5 4.7 2.0 6.0 2.0 5.7
t
PZH
Output Enable Time (74F240) 2.0 3.5 4.7 2.0 6.5 2.0 5.7
ns
t
PZL
4.0 6.9 9.0 4.0 10.5 4.0 10.0
t
PHZ
Output Disable Time (74F240) 2.0 4.0 5.3 2.0 6.5 2.0 6.3
t
PLZ
2.0 6.0 8.0 2.0 12.5 2.0 9.5
t
PLH
Propagation Delay 2.5 4.0 5.2 2.0 6.5 2.5 6.2
ns
t
PHL
Data to Output (74F241, 74F244) 2.5 4.0 5.2 2.0 7.0 2.5 6.5
t
PZH
Output Enable Time 2.0 4.3 5.7 2.0 7.0 2.0 6.7
ns
t
PZL
(74F241, 74F244) 2.0 5.4 7.0 2.0 8.5 2.0 8.0
t
PHZ
Output Disable Time 2.0 4.5 6.0 2.0 7.0 2.0 7.0
t
PLZ
(74F241, 74F244) 2.0 4.5 6.0 2.0 7.5 2.0 7.0
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74F240 • 74F241 • 74F244
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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74F240 • 74F241 • 74F244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
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74F240 • 74F241 • 74F244 Octal Buffers/Line Drivers with 3-STATE Output s
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circu itry described, no circuit patent license s are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided i n the labe li ng, can be re a­sonably expected to result in a significant injury to the user.
2. A critical componen t in any com ponent o f a l ife supp ort device or system whose failu re to perform can b e rea­sonably expected to c ause th e fa i lure of the li fe s upp or t device or system, or to affect its safety or effectiveness.
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