Datasheet 74F219 Datasheet (Fairchild)

Page 1
June 1988 Revised September 2000
74F219 64-Bit Random Access Memory with 3-STATE Outputs
74F219 64-Bit Random Access Memory with 3-STATE Outputs
General Description
The 74F219 is a high-speed 64-bit RAM organized as a 16­word by 4-bit array. Address inputs are buffered to mini­mize loading and are fu lly decoded on-chip. The outputs are 3-STATE and are i n the high-impedance sta te when­ever the Chip Sele ct (CS active only in the Read mode. This device is sim ilar to the 74F189 but features non-inverting, rather than inverting, data outputs.
) input is HIGH. The outputs are
Features
■ 3-STATE outputs for data bus applications
■ Buffered inputs minimize loading
■ Address decoding on-chip
■ Diode clamped inputs minimize ringing
■ Available in SOIC (300 mil only)
Ordering Code:
Order Number Package Number Package Description
74F219SC M16B 16-Lead Small Outline Intergrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F219SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F219PC N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Devices also availab le in Tape and Reel. Specify by appending the suffix letter “X” to the o rdering code.
Logic Symbol Connection Diagram
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Unit Loading/Fan Out
74F219
Pin Names Description
A0–A
3
CS WE D
0–D3
O
0–O3
Function Table
CS
L L Write High Impedance L H Read True Stored Data H X Inhibit High Impedance
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial
Block Diagram
U.L.
HIGH/LOW
Address Inputs 1.0/1.0 20 µA/−0.6 mA Chip Select Input (Active LOW) 1.0/2.0 20 µA/−1.2 mA Write Enable Input (Active LOW) 1.0/1.0 20 µA/−0.6 mA Data Inputs 1.0/1.0 20 µA/−0.6 mA 3-STATE Data Outputs 150/40 (33.3) −3 mA/24 mA (20 mA)
Inputs
WE
Operation Condition of Outputs
Input I
Output I
IH/IIL OH/IOL
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Absolute Maximum Ratings(Note 1) Recommended Operating
Storage Temperature −65°C to +150°C Ambient Temperature under Bias Junction Temperature under Bias
Pin Potential to Ground Pin −0.5V to +7.0V
V
CC
Input Voltage (Note 2) Input Current (Note 2)
−55°C to +125°C
−55°C to +150°C
−0.5V to +7.0V
−30 mA to +5.0 mA
Voltage Applied to Output
in HIGH State (with V Standard Output
CC
= 0V)
−0.5V to V
3-STATE Output −0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
Conditions
Free Air Ambient Temperature 0 Supply Voltage
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired . Functional operation
CC
under these conditions is not implied. Note 2: Either voltage lim it or c urrent limit is sufficient to protect inputs.
(mA)
DC Electrical Characteristics
Symbol Parameter
V V V V
V
I
IH
I
BVI
I
CEX
V
I
OD
I
IL
I
OZH
I
OZL
I
OS
I
ZZ
I
CC
IH IL CD OH
OL
ID
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal Input LOW Voltage 0.8 V Recognized as a LOW Signal Input Clamp Diode Voltage −1.2 V Min IIN = −18 mA Output HIGH 10% V Voltage 10% V
Output LOW 10% V Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test All Other Pins Grounded Output Leakage Circuit Current All Other Pins Grounded
Input LOW −0.6 Current −1.2 VIN = 0.5V (CS) Output Leakage Current 50 µAMaxV Output Leakage Current −50 µAMaxV Output Short-Circuit Current −60 −150 mA Max V Bus Drainage Test 500 µA0.0VV Power Supply Current 37 55 mA Max
5% V 5% V
Min
Typ Max
2.5
CC
2.4 IOH = −3 mA
CC
2.7 IOH = −1 mA
CC
2.7 IOH = −3 mA
CC CC
4.75 V 0.0
3.75 µA0.0
Units
0.5 V Min IOL = 24 mA
5.0 µAMaxVIN = 2.7V
7.0 µAMaxVIN = 7.0V
50 µAMaxV
mA Max
V
CC
IOH = −1 mA
VMin
IID = 1.9 µA
V
VIN = 0.5V (An, WE, Dn)
OUT
IOD
OUT OUT OUT OUT
+4.5V to +5.5V
Conditions
= V
CC
= 150 mV
= 2.7V = 0.5V = 0V = 5.25V
74F219
°C to +70°C
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AC Electrical Characteristics
74F219
Symbol Parameter
t t t t t t t t t t
PLH PHL PZH PZL PHZ PLZ PZH PZL PHZ PLZ
Access Time, HIGH or LOW 10.0 18.5 26.0 9.0 32.0 10.0 27.0 An to O
n
Access Time, HIGH or LOW 3.5 6.0 8.5 3.5 10.5 3.5 9.5 CS to O
n
Disable Time, HIGH or LOW 2.0 4.0 6.0 2.0 8.0 2.0 7.0 CS to O
n
Write Recovery Time 6.5 20.0 28.0 6.5 37.5 6.5 29.0 HIGH or LOW, WE to O Disable Time, HIGH or LOW 4.0 7.0 10.0 3.5 12.0 4.0 11.0 WE to O
n
= +25°CT
T
A
V
= +5.0V VCC = +5.0V VCC = +5.0V
CC
= 50 pF CL = 50 pF CL = 50 pF
C
L
Min Typ Max Min Max Min Max
8.0 13.5 19.0 8.0 23.0 8.0 20.0
5.0 9.0 13.0 5.0 15.0 5.0 14.0
3.0 5.5 8.0 2.5 10.0 3.0 9.0
n
6.5 11.0 15.5 6.5 17.5 6.5 16.5
5.0 9.0 13.0 5.0 15.0 5.0 14.0
= −55°C to +125°CTA = 0°C to +70°C
A
AC Operating Requirements
TA = +25°CTA = −55°C to +125°CTA = 0°C to +70°C
Symbol Parameter
tS(H) Setup Time, HIGH or LOW 0 0 0 t
(L) An to WE 000
S
(H) Hold Time, HIGH or LOW 2.0 2.0 2.0
t
H
tH(L) An to WE 2.0 2.0 2.0 t
(H) Setup Time, HIGH or LOW 10.0 11.0 10.0
S
(L) Dn to WE 10.0 11.0 10.0
t
S
tH(H) Hold Time, HIGH or LOW 0 2.0 0 t
(L) Dn to WE 02.00
H
(L) Setup Time, LOW
t
S
CS to WE
tH(L) Hold Time, LOW
to WE
CS
tW(L) WE Pulse Width, LOW 6.0 15.0 6.0 ns
Min Max Min Max Min Max
000
6.0 7.5 6.0
Units
ns
ns
ns
UnitsVCC = +5.0V VCC = +5.0V VCC = +5.0V
ns
ns
ns
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Physical Dimensions inches (millimeters) unless otherwise noted
74F219
16-Lead Small Outline Intergrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M16B
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
74F219
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
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Package Number M16D
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
74F219 64-Bit Random Access Memory with 3-STATE Outputs
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the l abe ling, can be rea­sonably expected to result in a significant injury to the user.
Package Number N16E
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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