Datasheet 74f2244 DATASHEETS (Philips)

Page 1
INTEGRATED CIRCUITS
74F2244
Octal buffer with 30Ω equivalent output termination (3-State)
Product specification 1994 Dec 5 IC15 Data Handbook
Philips Semiconductors
Page 2
Philips Semiconductors Product specification
Octal buffer with 30Ω equivalent output termination (3-State)

FEA TURES

•Octal bus interface
•30Ω output termination ideal for driving DRAM
•15mA source current
•SSOP Type II Package

ORDERING INFORMATION

ORDER CODE
DESCRIPTION COMMERCIAL RANGE
= 5V ±10%, T
V
CC
20-pin plastic DIP N74F2244N SOT146-1
20-pin plastic SOL N74F2244D SOT163-1
20-pin plastic SSOP Type II N74F2244DB SOT339-1

DESCRIPTION

The 74F2244 is an octal buffer that is ideal for driving dynamic DRAM with matching impedance. The outputs are all capable of sinking 5mA and sourcing up to 15mA. The device features two output enables, OE outputs.
TYPE
74F2244 4.0ns 30mA
= 0°C to +70°C
amb
a and OEb, each controlling four of the 3–state
TYPICAL
PROPAGATION
DELA Y
DRAWING NUMBER
TYPICAL
SUPPLY CURRENT
(TOTAL)

INPUT AND OUTPUT LOADING AND FAN OUT TABLE

PINS DESCRIPTION
Ian, Ibn Data inputs 1.0/0.33 20µA/0.2mA
OEa, OEb Output enable inputs (active low) 1.0/0.33
Yan, Ybn Data outputs 750/8.33 15mA/5mA
NOTE: One (1.0) FAST unit load is defined as: 20µA in the high state and 0.6mA in the low state.

PIN CONFIGURATION

1
OEa
2
Ia0
3
Yb0
4
Ia1
5
Yb1
6
Ia2
7
Yb2
8
Ia3
9
Yb3
10 11
GND
20
V
19
OEb
18
Ya0
17
Ib0
16
Ya1
15
Ib1
14
Ya2
13
Ib2
12
Ya3 Ib3
SF00227
CC

LOGIC SYMBOL

1
OEa OEb19
V
= Pin 20
CC
GND = Pin 10
74F (U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
20µA/0.2mA
2 4 6 8 17 15 13 11
Ia0 Ia1 Ia2 Ia3 Ib0 Ib1 Ib2 Ib3
Ya0 Ya1 Ya2 Ya3 Yb0 Yb1 Yb2 Yb3
18 16 14 12 3 5 7 9
SF00228
1994 Dec 05 853-1525 14380
2
Page 3
Philips Semiconductors Product specification
SYMBOL
PARAMETER
Octal buffer with 30Ω equivalent output termination (3-State)

IEC/IEEE SYMBOL

1
19
2 4 6 8
17 15 13
11
EN1 EN2
2D
1
2
18 16
14 12 3 5 7 9
SF00229

FUNCTION TABLE

INPUTS OUTPUTS
OEa Ia OEb Ib Ya Yb
L L L L L L L H L H H H
H X H X Z Z
Notes to function table
H = High voltage level L = Low voltage level X = Don’t care Z = High impedance ”off” state

LOGIC DIAGRAM

Ia0
Ia1
Ia2
Ia3
OEa
V
= Pin 20
CC
GND = Pin 10
2
4
6
8
1
18
Ya0
16
Ya1
14
Ya2
12
Ya3
Ib0
Ib1
Ib2
Ib3
OEb
17
15
13
11
10
2
Yb0
5
Yb1
7
Yb2
9
Yb3
SF00236

ABSOLUTE MAXIMUM RATINGS

(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
V
CC
V
IN
I
IN
V
OUT
I
OUT
T
amb
T
stg
Supply voltage –0.5 to +7.0 V Input voltage –0.5 to +7.0 V Input current –30 to +5 mA
Voltage applied to output in high output state –0.5 to V Current applied to output in low output state Operating free air temperature range 0 to +70
Storage temperature range –65 to +150
PARAMETER RATING UNIT
CC
10 mA

RECOMMENDED OPERATING CONDITIONS

LIMITS UNIT
MIN NOM MAX
5 mA
V V V I I I T
Ik OH OL
amb
CC IH IL
PARAMETER
Supply voltage 4.5 5.0 5.5 V High–level input voltage 2.0 V Low–level input voltage 0.8 V Input clamp current –18 mA High–level output current –15 mA Low–level output current Operating free air temperature range 0 +70
V
°C °C
°C
1994 Dec 05
3
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Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
3
Octal buffer with 30Ω equivalent output termination (3-State)

DC ELECTRICAL CHARACTERISTICS

(Over recommended operating free-air temperature range unless otherwise noted.)
TEST LIMITS
CONDITIONS
VCC = MIN, IOH = –3mA
V
OH
High-level output voltage
VIL = MAX, VIH = MIN IOH =
–15mA
V
OL
Low-level output voltage
VCC = MIN, VIL = MAX,
IOL = MAX
VIH = MIN, ±5%V V I
I
I
IH
I
IL
I
OZH
I
OZL
I
OS
I
CC
IK
Input clamp voltage VCC = MIN, II = I
IK
Input current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA High–level input current VCC = MAX, VI = 2.7V 20 µA Low–level input current VCC = MAX, VI = 0.5V –0.2 mA Off–state output current,
high–level voltage applied Off–state output current,
low–level voltage applied Short–circuit output current
Supply current (total) I
VCC = MAX, V
VCC = MAX, VO = 0.5V –50
VCC = MAX -60 -150 mA
I
CCH CCLVCC
I
CCZ
= MAX 45 65 mA
= 2.7V 50
O
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
= 5V, T
CC
amb
= 25°C.
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, I
tests should be performed last.
OS
1
±10%V
C
±5%V ±10%V
C
±5%V ±10%V
C
MIN TYP2MAX
2.5 V
C
2.7 3.4 V
CC
2.0 V
C
2.0 V
CC
C
CC
0.50 V
0.42 0.50 V
–0.73 -1.2 V
µA
µA
20 30 mA
26 40 mA

AC ELECTRICAL CHARACTERISTICS

T
= +25°C T
amb
SYMBOL PARAMETER TEST VCC = +5.0V
CONDITION CL = 50pF, RL = 500Ω CL = 50pF, RL = 500Ω
MIN TYP MAX MIN MAX
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
1994 Dec 05
Propagation delay Ian, Ibn to Yn
Output enable time to high or low level
Output disable time from high or low level
Waveform 1 Waveform 2
Waveform 3 Waveform 2
Waveform 3
4
3.0
2.5
2.5
3.0
1.5
1.5
4.5
4.5
4.5
5.0
3.5
2.5
LIMITS
7.0
7.0
7.5
8.0
6.0
5.5
= 0°C to +70°C
amb
VCC = +5.0V ± 10%
2.5
2.5
2.0
3.0
1.0
1.0
8.0
7.5
8.0
8.5
6.0
5.5
UNIT
ns
ns
ns
Page 5
Philips Semiconductors Product specification
Octal buffer with 30Ω equivalent output termination (3-State)

AC WAVEFORMS

For all waveforms, VM = 1.5V.
Ian, Ibn
Yn
V
M
t
PLH
V
M
t
PHL
V
M
Waveform 1. Propagation delay for data to outputs
OEn
V
M
t
PZH
Yn
V
M
t
PHZ
V
M
V
M
SF00231
VOH–0.3V
0V
OEn
Yn
Waveform 3. 3-State output enable time to low level
V
M
t
PZL
and output disable time from low level
V
M
t
PLZ
V
M
3.5V
VOL+0.3V
SF00234
Waveform 2. 3-State output enable time to high level
and output disable time from high level

TEST CIRCUIT AND WAVEFORMS

SWITCH POSITION
TEST SWITCH
, t
t
PLZ
PZL
closed
openAll other
V
PULSE
GENERATOR
IN
Test circuit for 3-State outputs
DEFINITIONS:
= Load resistor; see AC electrical characteristics for
R
L
value.
C
= Load capacitance includes jig and probe
L
capacitance; see AC electrical characteristics for value
R
= T ermination resistance should be equal to Z
T
pulse generators.
V
CC
V
D.U.T.
R
T
OUT
C
L
SF00233
t
7.0V NEGATIVE
PULSE
R
L
R
L
POSITIVE PULSE
90%
10%
V
M
10%
t
THL (tf
t
TLH (tr
90%
V
M
w
V
M
10%
)
)
t
)
TLH (tr
t
)
THL (tf
90%
V
M
t
w
90%
10%
AMP (V)
0V
AMP (V)
0V
Input pulse definition
INPUT PULSE REQUIREMENTS
V
1.5V
rep. rate
M
1MHz 500ns 2.5ns
amplitude
3.0V
t
w
t
TLHtTHL
2.5ns
SF000235
OUT
of
family
74F
1994 Dec 05
5
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Philips Semiconductors Product specification
74F2244Octal buffer with 30Ω equivalent output termination (3-State)

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

1994 Dec 05
6
Page 7
Philips Semiconductors Product specification
74F2244Octal buffer with 30Ω equivalent output termination (3-State)

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1994 Dec 05
7
Page 8
Philips Semiconductors Product specification
74F2244Octal buffer with 30Ω equivalent output termination (3-State)

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

1994 Dec 05
8
Page 9
Philips Semiconductors Product specification
74F2244Octal buffer with 30Ω equivalent output termination (3-State)
NOTES
1994 Dec 05
9
Page 10
Philips Semiconductors Product specification
74F2244Octal buffer with 30Ω equivalent output termination (3-State)

DEFINITIONS

Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICA TIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1994
All rights reserved. Printed in U.S.A.
(print code) Date of release: July 1994 Document order number: 9397-750-05198
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