Page 1
INTEGRATED CIRCUITS
74F133
13-input NAND gate
Product specification
Supersedes data of 1989 Oct 16
IC15 Data Handbook
1993 Jul 02
Page 2
Philips Semiconductors Product specification
74F13313-input NAND gate
FEA TURE
PIN CONFIGURATION
•Industrial temperature range available (–40°C to +85°C)
D0
1
D1
TYPE
TYPICAL
PROPAGATION
DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F133 4.0ns 2.0mA
2
D2
3
D3
4
D4
5
D5
6
D6
ORDERING INFORMA TION
DESCRIPTION
COMMERCIAL RANGE
VCC = 5V ±10%, T
= 0°C to +70°C
amb
VCC = 5V ±10%, T
16-pin plastic DIP N74F133N I74F133N SOT38-4
16-pin plastic SO N74F133D I74F133D SOT109-1
INDUSTRIAL RANGE
= –40°C to +85°C
amb
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINS DESCRIPTION 74F (U.L.) HIGH/LOW LOAD VALUE HIGH/LOW
D0–D12 Data inputs 1.0/1.0 20µA/0.6mA
Q Data output 50/33 1.0mA/20mA
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
16
15
14
13
12
11
107
98GND Q
SF00099
V
CC
D12
D11
D10
D9
D8
D7
PKG DWG #
LOGIC SYMBOL
VCC = Pin 16
GND = Pin 8
IEC/IEEE SYMBOL
1
D0
2
D1
3
D2
4
D3
5
D4
6
D5
7
10
11
12
13
14
15
D6
D7
D8
D9
D10
D11
D12
Q
9
SF00100
1
2
3
4
5
6
7
10
11
12
13
14
15
&
9
SF00101
July 2, 1993 853–1 154 10219
2
Page 3
Philips Semiconductors Product specification
T
Operating free-air temperature range
SYMBOL
PARAMETER
UNIT
T
Operating free-air temperature range
74F13313-input NAND gate
LOGIC DIAGRAM
D0 D1 D2 D3 D4 D5
1234567101112131415
= Pin 16
V
CC
GND = Pin 8
D6 D7 D8 D9 D10 D11 D12
9
Q
SF00102
FUNCTION TABLE
INPUTS OUTPUT
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 Q
H H H H H H H H H H H H H L
Any one input = L H
NOTES:
H = High voltage level
L = Low voltage level
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
V
CC
V
IN
I
IN
V
OUT
I
OUT
amb
T
stg
Supply voltage –0.5 to +7.0 V
Input voltage –0.5 to +7.0 V
Input current –30 to +5 mA
Voltage applied to output in High output state –0.5 to V
Current applied to output in Low output state 40 mA
p
p
Storage temperature range –65 to +150 °C
PARAMETER RATING UNIT
CC
Commercial range 0 to +70 °C
Industrial range –40 to +85 °C
V
RECOMMENDED OPERATING CONDITIONS
V
CC
V
IH
V
IL
I
IK
I
OH
I
OL
amb
July 2, 1993
Supply voltage 4.5 5.0 5.5 V
High-level input voltage 2.0 V
Low-level input voltage 0.8 V
Input clamp current –18 mA
High-level output current –1 mA
Low-level output current 20 mA
p
LIMITS
MIN NOM MAX
p
Commercial range 0 +70 °C
Industrial range –40 +85 °C
3
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Philips Semiconductors Product specification
NO TAG
VOHHigh-level output voltage
V
VOLLow-level output voltage
V
ICCSupply current (total)
V
MAX
mA
TEST
CONDITION
74F13313-input NAND gate
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
SYMBOL PARAMETER TEST CONDITIONS
p
p
V
IK
I
I
I
IH
I
IL
I
OS
Input clamp voltage VCC = MIN, II = I
Input current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA
High-level input current VCC = MAX, VI = 2.7V 20 µA
Low-level input current VCC = MAX, VI = 0.5V –0.6 mA
Short-circuit output current
NO TAG
pp
VCC = MIN, VIL = MAX ±10%V
VIH = MIN, IOH = MAX ±5%V
VCC = MIN, VIL = MAX ±10%V
VIH = MIN, IOL = MAX ±5%V
IK
VCC = MAX –60 –150 mA
I
CCH
I
CCL
CC
=
CC
CC
CC
CC
MIN
2.5
2.7 3.4
TYP
NO TAG
MAX
0.35 0.50
0.35 0.50
–0.73 –1.2 V
1.0 2.0
2.5 4.0
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
tests should be performed last.
OS
UNIT
AC ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER
t
PLH
t
PHL
Propagation delay
Dn to Q
Waveform
NO TAG
AC WAVEFORMS
Dn
Q
Waveform 1. Propagation Delay for Data to Outputs
NOTE:
For all waveforms, V
= 1.5V.
M
LIMITS
VCC = +5.0V VCC = +5.0V ± 10% VCC = +5.0V ± 10%
T
= +25°C T
amb
= 0°C to +70°C T
amb
= –40°C to +85°C UNIT
amb
CL = 50pF, RL = 500Ω CL = 50pF, RL = 500Ω CL = 50pF, RL = 500Ω
MIN TYP MAX MIN MAX MIN MAX
2.0
2.5
4.0
4.5
V
M
t
PHL
V
M
7.0
7.5
V
M
t
PLH
1.5
2.0
V
M
SF00098
7.5
8.0
1.5
2.0
7.5
8.0
ns
July 2, 1993
4
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Philips Semiconductors Product specification
74F13313-input NAND gate
TEST CIRCUIT AND WAVEFORMS
V
CC
PULSE
GENERATOR
V
IN
R
T
D.U.T.
V
OUT
R
C
L
L
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
= Load resistor;
R
L
see AC ELECTRICAL CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
C
L
see AC ELECTRICAL CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
pulse generators.
OUT
of
NEGATIVE
PULSE
POSITIVE
PULSE
family
74F
90%
10%
amplitude
t
w
V
M
10%
)
V
90%
M
t
THL (tf
t
TLH (tr
)
t
TLH (tr
t
THL (tf
t
w
Input Pulse Definition
INPUT PULSE REQUIREMENTS
V
rep. rate
M
3.0V
1.5V
1MHz 500ns
10%
)
)
90%
t
w
V
M
V
M
90%
10%
t
TLHtTHL
2.5ns 2.5ns
AMP (V)
0V
AMP (V)
0V
SF00006
July 2, 1993
5
Page 6
Philips Semiconductors Product specification
13-input NAND gate
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
74F133
1993 Jul 02
6
Page 7
Philips Semiconductors Product specification
13-input NAND gate
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74F133
1993 Jul 02
7
Page 8
Philips Semiconductors Product specification
13-input NAND gate
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
74F133
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1993
All rights reserved. Printed in U.S.A.
Date of release: 10-93
Document order number: 9397-750-07371
yyyy mmm dd
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