74ALS573BOctal transparent latch (3-State)
74ALS574AOctal D flip-flop (3-State)
FEA TURES
•74ALS573B is broadside pinout version of 74ALS373
•74ALS574A is broadside pinout version of 74ALS374
•Inputs and outputs on opposite side of package allow easy
interface to microprocessors
•Useful as an input or output port for microprocessors
•3-State outputs for bus interfacing
•Common output enable
•74ALS563A and 74ALS564A are inverting version of 74ALS573B
and 74ALS574A respectively
DESCRIPTION
The 74ALS573B is an octal transparent latch coupled to eight
3-State output devices. The two sections of the device are controlled
independently by enable (E) and output enable (OE
The 74ALS573B is functionally identical to the 74ALS373 but has a
broadside pinout configuration to facilitate PC board layout and
allow easy interface with microprocessors.
The data on the D inputs is transferred to the latch outputs when the
enable (E) input is High. The latch remains transparent to the data
input while E is High, and stores the data that is present one setup
time before the High-to-Low enable transition.
The 74ALS574A is functionally identical to the 74ALS374 but has a
broadside pinout configuration to facilitate PC board layout and
allow easy interface with microprocessors.
) control gates.
It is an 8-bit edge triggered register coupled to eight 3-State output
buffers. The two sections of the device are controlled independently
by clock (CP) and output enable (OE
The register is fully edge triggered. The state of the D input, one
setup time before the Low-to-High clock transition is transferred to
the corresponding flip-flop’s Q output.
The active-Low output enable (OE
independent of the latch operation. When OE
transparent data appears at the output.
When OE
which means they will neither drive nor load the bus.
is High, the outputs are in high impedance “off” state,
H = High-voltage level
h = High state must be present one setup time before the High-to-Low enable transition
L = Low-voltage level
l= Low state must be present one setup time before the High-to-Low enable transition
NC= No change
X = Don’t care
Z = High impedance “off” state
↓ = High-to-Low enable transition
INTERNAL
Q0 – Q7
Q5
D
Q
E
14
Q
Q6
D
Q
E
13
12
Q7
SC00109
p
LOGIC DIAGRAM – 74ALS574A
VCC = Pin 20
GND = Pin 10
1991 Feb 08
CP
OE
D0
2
D
CP
11
1
D1
3
Q0
D
CP
19
Q
D2
4
Q1
D
CP
18
Q
D3
5
Q2
D
CP
17
Q
D4
6
Q
16
Q3
D
CP
D5
7
D
Q
CP
15
Q4
D6
8
Q5
D
CP
14
Q
D7
9
Q6
D
Q
CP
13
Q7
12
SC00110
Q
4
Page 5
Philips SemiconductorsProduct specification
OPERATING MODE
Latch and read register
Disable outputs
SYMBOL
PARAMETER
UNIT
74ALS573B/74ALS574ALatch/flip-flop
FUNCTION T ABLE – 74ALS574A
INPUTS
OECPDn
OUTPUTS
REGISTER
L↑lLL
L↑hHH
L↑XNCNCHold
H↑XNCZ
H↑DnDnZ
H = High-voltage level
h = High state must be present one setup time before the Low-to-High clock transition
L = Low-voltage level
l= Low state must be present one setup time before the Low-to-High clock transition
NC= No change
X = Don’t care
Z = High impedance “off” state
↑ = Low-to-High clock transition
= Not Low-to-High clock transition
↑
INTERNAL
Q0 – Q7
p
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
V
CC
V
IN
I
IN
V
OUT
I
OUT
T
amb
T
stg
Supply voltage–0.5 to +7.0V
Input voltage–0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in High output state–0.5 to V
Current applied to output in Low output state48mA
Operating free-air temperature range0 to +70°C
Storage temperature range–65 to +150°C
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
1991 Feb 08
11
Page 12
Philips SemiconductorsProduct specification
74ALS573B/74ALS574ALatch/flip–flop
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
1991 Feb 08
12
Page 13
Philips SemiconductorsProduct specification
74ALS573B/74ALS574ALatch/flip–flop
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1997
All rights reserved. Printed in U.S.A.
1991 Feb 08
13
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