Datasheet 74ahc245 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

74AHC245; 74AHCT245

Octal bus transceiver; 3-state

Product specification
Supersedes data of 1998 Sep 21
File under Integrated Circuits, IC06

1999 Sep 28

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

FEATURES

• ESD protection:
HBM EIA/JESD22-A114-A
exceeds 2000 V
MM EIA/JESD22-A115-A
exceeds 200 V
CDM EIA/JESD22-C101
exceeds 1000 V

• Balanced propagation delays

• All inputs have a Schmitt-trigger

action

• Inputsacceptsvoltageshigherthan
V

CC

• For AHC only:
operates with CMOS input levels

• For AHCT only:
operates with TTL input levels

• Specified from

−40 to +85 and +125 °C.

DESCRIPTION

The 74AHC/AHCT245 is a
high-speed Si-gate CMOS device.

The 74AHC/AHCT245 is an octal
transceiver featuring non-inverting
3-state bus compatible outputs in
both send and receive directions.

The74AHC245/74AHCT245features
an Output Enable (OE) input for easy
cascading and a send/receive (DIR)
input for direction control.

OE controls the outputs so that the
buses are effectively isolated.

FUNCTION TABLE

See Note 1.

INPUTS INPUTS/OUTPUTS

OE DIR A

L L A = B inputs
L H inputs B = A

HXZZ

Note

1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.

QUICK REFERENCE DATA

GND = 0 V; T

=25°C; tr=tf≤3.0 ns.

amb

SYMBOL PARAMETER CONDITIONS

t

PHL/tPLH

C

I

C

O

propagation delay CL=15pF;
A

to Bn, Bnto A

n

VCC=5V

n

input capacitance VI=VCCor GND 3.5 3.5 pF
output

capacitance

C

PD

power dissipation
capacitance

CL=50pF;
f = 1 MHz;
notes 1 and 2

Notes

1. C

is used to determine the dynamic power dissipation (PDin µW).

PD

PD=CPD× V

2

× fi+ ∑ (CL× V

CC

2

× fo) where:

CC

fi= input frequency in MHz;
fo= output frequency in MHz;
∑ (CL× V

2

× fo) = sum of outputs;

CC

CL= output load capacitance in pF;
VCC= supply voltage in Volts.

2. The condition is VI= GND to VCC.

n

TYPICAL

AHC AHCT

3.5 5.0 ns

4.0 4.0 pF

12 15 pF

B

n

UNIT

1999 Sep 28 2

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

ORDERING INFORMATION

OUTSIDE NORTH

AMERICA

NORTH AMERICA

PINS PACKAGE MATERIAL CODE

PACKAGES

74AHC245D 74AHC245D 20 SO plastic SOT163-1
74AHC245PW 74AHC245PW DH 20 TSSOP plastic SOT360-1
74AHCT245D 74AHCT245D 20 SO plastic SOT163-1
74AHCT245PW 7AHCT245PW DH 20 TSSOP plastic SOT360-1

PINNING

PIN SYMBOL DESCRIPTION

1 DIR direction control
2to9 A

0

to A

7

data inputs/outputs
10 GND ground (0 V)
11 to 18 B
19
20 V

handbook, halfpage

7

to B

0

data inputs/outputs

OE output enable input (active LOW)

CC

DIR

A
A

A
A
A
A
A
A

GND

V

MNA173

20

CC

19

OE
B

18

0

B

17

1

B

16

2

B

15

3

B

14

4

B

13

5

B

12

6

B

11

7

1
2

0

3

1

4

2

5

3
4
5
6
7

245

6
7
8
9

10

DC supply voltage

Fig.1 Pin configuration.

1999 Sep 28 3

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

handbook, halfpage

DIR

1

OE

B

0

B

1

B

2

B

3

B

4

B

5

B

6

B

7

MNA174

19

18

17

16

15

14

13

12

11

handbook, halfpage

19

G3

1

3EN1
3EN2

1

2

4
5
6
7
8

2

MNA175

18

173
16
15
14
13
12
119

A

0

2

A

1

3

A

2

4

A

3

5

A

4

6

A

5

7

A

6

8

A

7

9

Fig.2 Logic symbol.

1999 Sep 28 4

Fig.3 IEEE/IEC logic symbol.

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS

UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

74AHC 74AHCT

V

CC

V

I

V

O

T

amb

DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
input voltage 0 − 5.5 0 − 5.5 V
output voltage 0 − V
operating ambient temperature

range

see DC and AC
characteristics per

−40 +25 +85 −40 +25 +85 °C

−40 +25 +125 −40 +25 +125 °C

0 − V

CC

CC

V

device

t

(∆t/∆f) input rise and fall rates VCC= 3.3 V ±0.3 V −−100 −−−ns/V

r,tf

=5V±0.5 V −−20 −−20

V

CC

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground= 0 V).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

I

I

IK

I

OK

I

O

I

CC

T

stg

P

D

DC supply voltage −0.5 +7.0 V
input voltage range −0.5 +7.0 V
DC input diode current VI< −0.5 V; note 1 −−20 mA
DC output diode current VO< −0.5 Vor VO>VCC+ 0.5 V; note 1 −±20 mA
DC output source or sink current −0.5V<VO<VCC+ 0.5 V −±25 mA
DC VCC or GND current −±75 mA
storage temperature range −65 +150 °C
power dissipation per package for temperature range: −40 to +125 °C; note 2 − 500 mW

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. For SO packages: above 70 °C the value of P

derates linearly with 8 mW/K.

D

For TSSOP packages: above 60 °C the value of PDderates linearly with 5.5 mW/K.

1999 Sep 28 5

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

DC CHARACTERISTICS
74AHC family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

V

IH

HIGH-level input
voltage

V

IL

LOW-level input
voltage

V

OH

HIGH-level output
voltage; all
outputs

HIGH-level output
voltage

V

OL

LOW-level output
voltage; all
outputs

LOW-level output
voltage

I

I

input leakage
current

I

OZ

3-state output
OFF current

I

CC

quiescent supply
current

C

I

input capacitance −−310−10 − 10 pF

TEST CONDITIONS T

25 −40 to +85 −40 to +125

amb

(°C)

UNIT

OTHER VCC(V)

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

2.0 1.5 −−1.5 − 1.5 − V

3.0 2.1 −−2.1 − 2.1 −

5.5 3.85 −−3.85 − 3.85 −

2.0 −− 0.5 − 0.5 − 0.5 V

3.0 −− 0.9 − 0.9 − 0.9

5.5 −− 1.65 − 1.65 − 1.65

VI=VIHor VIL;
IO= −50 µA

2.0 1.9 2.0 − 1.9 − 1.9 − V

3.0 2.9 3.0 − 2.9 − 2.9 −

4.5 4.4 4.5 − 4.4 − 4.4 −

V

I=VIH

or VIL;

3.0 2.58 −−2.48 − 2.40 − V

IO= −4.0 mA
V

I=VIH

or VIL;

4.5 3.94 −−3.8 − 3.70 −

IO= −8.0 mA
VI=VIHor VIL;

IO=50µA

2.0 − 0 0.1 − 0.1 − 0.1 V

3.0 − 0 0.1 − 0.1 − 0.1

4.5 − 0 0.1 − 0.1 − 0.1

V

I=VIH

or VIL;

3.0 −− 0.36 − 0.44 − 0.55 V

IO=4mA
V

I=VIH

or VIL;

4.5 −− 0.36 − 0.44 − 0.55

IO=8mA
VI=VCCor GND 5.5 −− 0.1 − 1.0 − 2.0 µA

VI=VIHor VIL;

5.5 −− ±0.25 −±2.5 −±10.0 µA

VO=VCCor GND
VI=VCCor GND;

5.5 −− 4.0 − 40 − 80 µA

IO=0

1999 Sep 28 6

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

74AHCT family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

V

IH

HIGH-level input
voltage

V

IL

LOW-level input
voltage

V

OH

HIGH-level output
voltage; all
outputs

HIGH-level output
voltage

V

OL

LOW-level output
voltage; all
outputs

LOW-level output
voltage

I

I

input leakage
current

I

OZ

3-state output
OFF current

I

CC

quiescent supply
current

∆I

CC

additional
quiescent supply
current per input
pin

C

I

input capacitance −−310−10 − 10 pF

TEST CONDITIONS T

25 −40 to +85 −40 to +125

OTHER VCC(V)

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

4.5 to 5.5 2.0 −−2.0 − 2.0 − V

4.5 to 5.5 −− 0.8 − 0.8 − 0.8 V

VI=VIHor VIL;

4.5 4.4 4.5 − 4.4 − 4.4 − V

IO= −50 µA

V

I=VIH

or VIL;

4.5 3.94 −−3.8 − 3.70 − V

IO= −8.0 mA
VI=VIHor VIL;

4.5 − 0 0.1 − 0.1 − 0.1 V

IO=50µA

V

I=VIH

or VIL;

4.5 −− 0.36 − 0.44 − 0.55 V

IO=8mA
VI=VIHor V

VI=VIHor VIL;

5.5 −− 0.1 − 1.0 − 2.0 µA

IL

5.5 −− ±0.25 −±2.5 −±10.0 µA
VO=VCCor GND
per input pin;
other inputs at
VCCor GND;
IO=0

VI=VCCor GND;

5.5 −− 4.0 − 40 − 80 µA
IO=0

VI=VCC− 2.1 V

4.5 to 5.5 −− 1.35 − 1.5 − 1.5 mA
other inputs at
VCCor GND;
IO=0

amb

(°C)

UNIT

1999 Sep 28 7

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

AC CHARACTERISTICS
Type 74AHC245

GND = 0 V; tr=tf≤3.0 ns.

SYMBOL PARAMETER

VCC= 3.0 to 3.6 V; note 1

t

PHL/tPLH

propagation delay
Anto Bn; Bnto A

t

PZL/tPZH

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PLZ/tPHZ

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PHL/tPLH

propagation delay
Anto Bn; Bnto A

t

PZL/tPZH

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PLZ/tPHZ

propagation delay
OE to An;
OE to Bn; signal
name DIR

TEST CONDITIONS T

amb

(°C)

25 −40 to +85 −40 to +125

WAVEFORMS C

L

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

see Figs 4 and 6 15 pF − 5.0 8.4 1.0 10.0 1.0 10.5 ns

n

see Figs 5 and 6 − 6.5 13.2 1.0 15.5 1.0 16.5 ns

− 7.5 12.5 1.0 15.5 1.0 16.0 ns

see Figs 4 and 6 50 pF − 6.5 11.9 1.0 13.5 1.0 15.0 ns

n

see Figs 5 and 6 − 9.0 16.7 1.0 19.0 1.0 21.0 ns

− 10.0 15.8 1.0 18.0 1.0 20.0 ns

UNIT

1999 Sep 28 8

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

SYMBOL PARAMETER

= 4.5 to 5.5 V; note 2

V

CC

t

PHL/tPLH

propagation delay
Anto Bn; Bnto A

t

PZL/tPZH

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PLZ/tPHZ

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PHL/tPLH

propagation delay
Anto Bn; Bnto A

t

PZL/tPZH

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PLZ/tPHZ

propagation delay
OE to An;
OE to Bn; signal
name DIR

TEST CONDITIONS T

amb

(°C)

25 −40 to +85 −40 to +125

WAVEFORMS C

L

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

see Figs 4 and 6 15 pF − 3.5 5.5 1.0 6.5 1.0 7.0 ns

n

see Figs 5 and 6 − 4.0 8.5 1.0 10.0 1.0 11.0 ns

− 4.5 7.8 1.0 9.2 1.0 10.0 ns

see Figs 4 and 6 50 pF − 5.0 7.5 1.0 8.5 1.0 9.5 ns

n

see Figs 5 and 6 − 5.0 10.6 1.0 12.0 1.0 13.5 ns

− 6.0 9.7 1.0 11.0 1.0 12.5 ns

UNIT

Notes

1. Typical values at VCC= 3.3 V.

2. Typical values at VCC= 5.0 V.

1999 Sep 28 9

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

Type 74AHCT245

GND = 0 V; tr=tf≤3.0 ns.

SYMBOL PARAMETER

VCC= 4.5 to 5.5 V; note 1

t

PHL/tPLH

propagation delay
Anto Bn; Bnto A

t

PZL/tPZH

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PLZ/tPHZ

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PHL/tPLH

propagation delay
Anto Bn; Bnto A

t

PZL/tPZH

propagation delay
OE to An;
OE to Bn; signal
name DIR

t

PLZ/tPHZ

propagation delay
OE to An;
OE to Bn; signal
name DIR

TEST CONDITIONS T

amb

(°C)

25 −40 to +85 −40 to +125

WAVEFORMS C

L

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

see Figs 4 and 6 15 pF − 3.5 7.7 1.0 8.5 1.0 10.0 ns

n

see Figs 5 and 6 − 5.0 13.8 1.0 15.0 1.0 17.5 ns

− 5.0 14.4 1.0 15.5 1.0 18.0 ns

see Figs 4 and 6 50 pF − 4.5 8.7 1.0 9.5 1.0 11.0 ns

n

see Figs 5 and 6 − 6.0 14.8 1.0 16.0 1.0 18.5 ns

− 6.0 15.4 1.0 16.5 1.0 19.5 ns

UNIT

Note

1. Typical values at V

= 5.0 V.

CC

1999 Sep 28 10

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

AC WAVEFORMS

GND

V

V

V

M

INPUT

CC

V

OH

OL

I

FAMILY

VI INPUT

REQUIREMENTS

AHC GND to V

CC

handbook, halfpage

An, Bn INPUT

Bn, An OUTPUT

50% V

AHCT GND to 3.0 V 1.5 V 50% V

Fig.4 The input (An,Bn) to output (Bn,An) propagation delays.

GND

V

CC

V

OL

V

OH

GND

V

I

handbook, full pagewidth

OEn INPUT

OUTPUT
LOW-to-OFF
OFF-to-LOW

OUTPUT

HIGH-to-OFF
OFF-to-HIGH

t

PLH

OUTPUT

50% V

V

M

t

PLZ

t

PHZ

outputs

enabled

V

M

V

M

V

CC
CC

VOL + 0.3 V

M

VOH − 0.3 V

outputs

disabled

V

M

t

PHL

V

M

MNA176

t

PZL

V

M

t

PZH

V

M

outputs
enabled

MNA177

FAMILY

AHC GND to V

VI INPUT

REQUIREMENTS

CC

AHCT GND to 3.0 V 1.5 V 50% V

V

INPUT

50% V

M

V

M

OUTPUT

50% V

CC

CC
CC

Fig.5 The 3-state output enable and disable times.

1999 Sep 28 11

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

handbook, full pagewidth

TEST S

t

PLH/tPHL

t

PLZ/tPZL

t

PHZ/tPZH

open
V

CC

GND

PULSE

GENERATOR

1

S1

V

CC

V

I

R

D.U.T.

T

V

O

C

1000 Ω

L

MNA183

Fig.6 Load circuitry for switching times.

V

CC

open
GND

1999 Sep 28 12

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

PACKAGE OUTLINES

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

20

Z

1

y

pin 1 index

D

c

11

A

2

A

1

10

e

w M

b

p

E

H

E

detail X

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT163-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E04 MS-013AC

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

13.0

7.6

7.4

0.30

0.29

1.27

0.050

12.6

0.51

0.49

REFERENCES

1999 Sep 28 13

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

D

c

y

Z

20

pin 1 index

11

A

2

A

1

110

w M

b

e

p

E

H

E

L

detail X

SOT360-1

A

X

v M

A

Q

(A )

3

A

θ

L

p

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

0.15

mm

1.10

OUTLINE
VERSION

SOT360-1 MO-153AC

0.05

0.95

0.80

IEC JEDEC EIAJ

0.25

b

3

p

0.30

0.19

(1)E(2) (1)

cD

0.2

6.6

4.5

0.1

REFERENCES

6.4

4.3

0.65

1999 Sep 28 14

eHELLpQZywv θ

6.6

6.2

0.75

0.50

0.4

0.3

EUROPEAN

PROJECTION

0.13 0.10.21.0

0.5

0.2

ISSUE DATE

93-06-16
95-02-04

o

8

o

0

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a verybriefinsight to a complextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages.Wave soldering isnot alwayssuitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing, stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating,soldering andcooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswith leads onfoursides,the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement andbefore soldering,the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Sep 28 15

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable

SOLDERING METHOD

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable forSSOP andTSSOP packages with a pitch (e) equal to or larger than0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Sep 28 16

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

NOTES

1999 Sep 28 17

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

NOTES

1999 Sep 28 18

Philips Semiconductors Product specification

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

NOTES

1999 Sep 28 19

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
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Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
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Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

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Indonesia: PT Philips Development Corporation,SemiconductorsDivision,
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Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
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Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

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Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
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Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
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2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
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Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

68

Printed in The Netherlands 245002/02/pp20 Date of release: 1999 Sep 28 Document order number: 9397 750 06297