Datasheet 74AHCT244PW, 74AHCT244DB, 74AHCT244D, 74AHC244PW, 74AHC244DB Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1999 Feb 24
File under Integrated Circuits, IC06

1999 Sep 28

INTEGRATED CIRCUITS

74AHC244; 74AHCT244

Octal buffer/line driver; 3-state

1999 Sep 28 2

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

FEATURES

• ESD protection:
HBM EIA/JESD22-A114-A
exceeds 2000 V
MM EIA/JESD22-A115-A
exceeds 200 V
CDM EIA/JESD22-C101
exceeds 1000 V

• Balanced propagation delays

• All inputs have a Schmitt-trigger

action

• Inputsacceptsvoltageshigherthan
V

CC

• For AHC only:
operates with CMOS input levels

• For AHCT only:
operates with TTL input levels

• Specified from

−40 to +85 and +125 °C.

DESCRIPTION

The 74AHC/AHCT244 is a
high-speed Si-gate CMOS device.

The 74AHC/AHCT244 is an octal
non-inverting buffer/line driver with
3-state outputs.

The 3-state outputs are controlled by
the outputs enable inputs 1OE and
2OE.

AHIGHon nOE causes theoutputsto
assume a high-impedanceOFF state.

FUNCTION TABLE

See note 1.

Note

1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF state.

QUICK REFERENCE DATA

GND = 0 V; T

amb

=25°C; tr=tf≤3.0 ns.

Notes

1. C

PD

is used to determine the dynamic power dissipation (PDin µW).

PD=CPD× V

CC

2

× fi+ ∑ (CL× V

CC

2

× fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
∑ (CL× V

CC

2

× fo) = sum of outputs;
CL= output load capacitance in pF;
VCC= supply voltage in Volts.

2. The condition is VI= GND to VCC.

INPUTS OUTPUT

n

OE nA

n

nY

n

LLL
LHH

HXZ

SYMBOL PARAMETER CONDITIONS

TYPICAL

UNIT

AHC AHCT

t

PHL/tPLH

propagation delay
1Anto 1Yn;
2Anto 2Y

n

CL=15pF;
VCC=5V

3.5 5.0 ns

C

I

input capacitance VI=VCCor GND 3.5 3.5 pF

C

O

output capacitance 4.0 4.0 pF

C

PD

power dissipation
capacitance

CL=50pF;
f = 1 MHz;
notes 1 and 2

10 12 pF

1999 Sep 28 3

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

PINNING

ORDERING INFORMATION

PIN SYMBOL DESCRIPTION

11

OE output enable input (active LOW)

2, 4, 6 and 8 1A

0

to 1A

3

data inputs

3, 5, 7 and 9 2Y

0

to 2Y

3

bus outputs
10 GND ground (0 V)
11, 13, 15 and 17 2A

3

to 2A

0

data inputs
12, 14, 16 and 18 1Y

3

to 1Y

0

data outputs
19 2

OE output enable input (active LOW)

20 V

CC

DC supply voltage

OUTSIDE NORTH

AMERICA

NORTH AMERICA

PACKAGES

PINS PACKAGE MATERIAL CODE

74AHC244D 74AHC244D 20 SO plastic SOT163-1
74AHC244PW 74AHC244PW DH 20 TSSOP plastic SOT360-1
74AHCT244D 74AHCT244D 20 SO plastic SOT163-1
74AHCT244PW 7AHCT244PW DH 20 TSSOP plastic SOT360-1

1999 Sep 28 4

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

Fig.1 Pin configuration.

handbook, halfpage

1OE

1A

0

2Y

0

1A

1

2Y

1

1A

2

2Y

2

1A

3

2Y

3

GND

V

CC

2OE
1Y

0

2A

0

2A

1

1Y

2

1Y

1

2A

2

1Y

3

2A

3

1
2
3
4
5
6
7
8
9

10

11

12

20
19
18
17
16
15
14
13

244

MNA162

Fig.2 IEEE/IEC logic symbol.

handbook, halfpage

12

14

2
4

6
8

18
16

1

EN

MNA169

3

5

11
13

15
17

9
7

19

EN

Fig.3 Logic diagram.

handbook, halfpage

MNA170

1A

3

1A

2

1A

1

1A

0

2

4

6

8

1

1Y

0

1Y

1

18

16

14

12

1Y

2

1Y

3

1OE

2A

3

2A

2

2A

1

2A

0

17

15

13

11

19

2Y

0

2Y

1

3

5

7

9

2Y

2

2Y

3

2OE

1999 Sep 28 5

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

RECOMMENDED OPERATING CONDITIONS

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground= 0 V).

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. For SO packages: above 70 °C the value of P

D

derates linearly with 8 mW/K.

For TSSOP packages: above 60 °C the value of PDderates linearly with 5.5 mW/K.

SYMBOL PARAMETER CONDITIONS

74AHC 74AHCT

UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

V

CC

DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V

V

I

input voltage 0 − 5.5 0 − 5.5 V

V

O

output voltage 0 − V

CC

0 − V

CC

V

T

amb

operating ambient temperature
range

see DC and AC
characteristics per
device

−40 +25 +85 −40 +25 +85 °C

−40 +25 +125 −40 +25 +125 °C

t

r,tf

(∆t/∆f) input rise and fall rates VCC= 3.3 V ±0.3 V −−100 −−−ns/V

V

CC

=5V±0.5 V −−20 −−20

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

DC supply voltage −0.5 +7.0 V

V

I

input voltage range −0.5 +7.0 V

I

IK

DC input diode current VI< −0.5 V; note 1 −−20 mA

I

OK

DC output diode current VO< −0.5 Vor VO>VCC+ 0.5 V; note 1 −±20 mA

I

O

DC output source or sink current −0.5V<VO<VCC+ 0.5 V −±25 mA

I

CC

DC VCC or GND current −±75 mA

T

stg

storage temperature range −65 +150 °C

P

D

power dissipation per package for temperature range: −40 to +125 °C; note 2 − 500 mW

1999 Sep 28 6

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

DC CHARACTERISTICS
74AHC family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

TEST CONDITIONS T

amb

(°C)

UNIT

OTHER VCC(V)

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

V

IH

HIGH-level input
voltage

2.0 1.5 −−1.5 − 1.5 − V

3.0 2.1 −−2.1 − 2.1 −

5.5 3.85 −−3.85 − 3.85 −

V

IL

LOW-level input
voltage

2.0 −− 0.5 − 0.5 − 0.5 V

3.0 −− 0.9 − 0.9 − 0.9

5.5 −− 1.65 − 1.65 − 1.65

V

OH

HIGH-level output
voltage; all
outputs

VI=VIHor VIL;
IO= −50 µA

2.0 1.9 2.0 − 1.9 − 1.9 − V

3.0 2.9 3.0 − 2.9 − 2.9 −

4.5 4.4 4.5 − 4.4 − 4.4 −

HIGH-level output
voltage

V

I=VIH

or VIL;

IO= −4.0 mA

3.0 2.58 −−2.48 − 2.40 − V

V

I=VIH

or VIL;

IO= −8.0 mA

4.5 3.94 −−3.8 − 3.70 −

V

OL

LOW-level output
voltage; all
outputs

VI=VIHor VIL;
IO=50µA

2.0 − 0 0.1 − 0.1 − 0.1 V

3.0 − 0 0.1 − 0.1 − 0.1

4.5 − 0 0.1 − 0.1 − 0.1

LOW-level output
voltage

V

I=VIH

or VIL;

IO=4mA

3.0 −− 0.36 − 0.44 − 0.55 V

V

I=VIH

or VIL;

IO=8mA

4.5 −− 0.36 − 0.44 − 0.55

I

I

input leakage
current

VI=VCCor GND 5.5 −− 0.1 − 1.0 − 2.0 µA

I

OZ

3-state output
OFF current

VI=VIHor VIL;
VO=VCCor GND

5.5 −− ±0.25 −±2.5 −±10.0 µA

I

CC

quiescent supply
current

VI=VCCor GND;
IO=0

5.5 −− 4.0 − 40 − 80 µA

C

I

input capacitance −−310−10 − 10 pF

1999 Sep 28 7

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

74AHCT family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

TEST CONDITIONS T

amb

(°C)

UNIT

OTHER VCC(V)

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

V

IH

HIGH-level input
voltage

4.5 to 5.5 2.0 −−2.0 − 2.0 − V

V

IL

LOW-level input
voltage

4.5 to 5.5 −− 0.8 − 0.8 − 0.8 V

V

OH

HIGH-level output
voltage; all outputs

VI=VIHor VIL;
IO= −50 µA

4.5 4.4 4.5 − 4.4 − 4.4 − V

HIGH-level output
voltage

V

I=VIH

or VIL;

IO= −8.0 mA

4.5 3.94 −−3.8 − 3.70 − V

V

OL

LOW-level output
voltage; all outputs

VI=VIHor VIL;
IO=50µA

4.5 − 0 0.1 − 0.1 − 0.1 V

LOW-level output
voltage

V

I=VIH

or VIL;

IO=8mA

4.5 −− 0.36 − 0.44 − 0.55 V

I

I

input leakage
current

VI=VIHor V

IL

5.5 −− 0.1 − 1.0 − 2.0 µA

I

OZ

3-state output
OFF current

VI=VIHor VIL;
VO=VCCor GND
per input pin;
other inputs at
VCCor GND;
IO=0

5.5 −− ±0.25 −±2.5 −±10.0 µA

I

CC

quiescent supply
current

VI=VCCor GND;
IO=0

5.5 −− 4.0 − 40 − 80 µA

∆I

CC

additional
quiescent supply
current per input
pin

VI=VCC− 2.1 V
other inputs at
VCCor GND;
IO=0

4.5 to 5.5 −− 1.35 − 1.5 − 1.5 mA

C

I

input capacitance −−310−10 − 10 pF

1999 Sep 28 8

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

AC CHARACTERISTICS
Type 74AHC244

GND = 0 V; tr=tf≤3.0 ns.

Notes

1. Typical values at V

CC

= 3.3 V.

2. Typical values at VCC= 5.0 V.

SYMBOL PARAMETER

TEST CONDITIONS T

amb

(°C)

UNIT

WAVEFORMS C

L

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VCC= 3.0 to 3.6 V; note 1

t

PHL/tPLH

propagation delay
nAnto nY

n

see Figs 4 and 6 15 pF − 5.0 8.4 1.0 10.0 1.0 10.5 ns

t

PZL/tPZH

propagation delay
nOE to nY

n

see Figs 5 and 6 − 6.5 10.6 1.0 12.5 1.0 13.5 ns

t

PLZ/tPHZ

propagation delay
nOE to nY

n

− 5.5 9.7 1.0 11.0 1.0 12.5 ns

t

PHL/tPLH

propagation delay
nAnto nY

n

see Figs 4 and 6 50 pF − 7.0 11.9 1.0 13.5 1.0 15.0 ns

t

PZL/tPZH

propagation delay
nOE to nY

n

see Figs 5 and 6 − 7.5 14.1 1.0 16.0 1.0 18.0 ns

t

PLZ/tPHZ

propagation delay
nOE to nY

n

− 10.0 14.0 1.0 16.0 1.0 17.5 ns

VCC= 4.5 to 5.5 V; note 2
t

PHL/tPLH

propagation delay
nAnto nY

n

see Figs 4 and 6 15 pF − 3.4 5.5 1.0 6.5 1.0 7.0 ns

t

PZL/tPZH

propagation delay
nOE to nY

n

see Figs 5 and 6 − 4.0 7.3 1.0 8.5 1.0 9.5 ns

t

PLZ/tPHZ

propagation delay
nOE to nY

n

− 4.8 7.2 1.0 8.5 1.0 9.0 ns

t

PHL/tPLH

propagation delay
nAnto nY

n

see Figs 4 and 6 50 pF − 5.0 7.5 1.0 8.5 1.0 9.5 ns

t

PZL/tPZH

propagation delay
nOE to nY

n

see Figs 5 and 6 − 5.5 9.3 1.0 10.5 1.0 12.0 ns

t

PLZ/tPHZ

propagation delay
nOE to nY

n

− 7.0 9.2 1.0 10.5 1.0 11.5 ns

1999 Sep 28 9

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

Type 74AHCT244

GND = 0 V; tr=tf≤3.0 ns.

Note

1. Typical values at V

CC

= 5.0 V.

AC WAVEFORMS

SYMBOL PARAMETER

TEST CONDITIONS T

amb

(°C)

UNIT

WAVEFORMS C

L

25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VCC= 4.5 to 5.5 V; note 1

t

PHL/tPLH

propagation delay
nAnto nY

n

see Figs 4 and 6 15 pF − 3.5 7.4 1.0 8.5 1.0 9.5 ns

t

PZL/tPZH

propagation delay
nOE to nY

n

see Figs 5 and 6 − 3.5 10.4 1.0 12.0 1.0 13.0 ns

t

PLZ/tPHZ

propagation delay
nOE to nY

n

− 5.0 9.4 1.0 10.0 1.0 12.0 ns

t

PHL/tPLH

propagation delay
nAnto nY

n

see Figs 4 and 6 50 pF − 5.0 8.4 1.0 9.5 1.0 10.5 ns

t

PZL/tPZH

propagation delay
nOE to nY

n

see Figs 5 and 6 − 5.5 11.4 1.0 13.0 1.0 14.5 ns

t

PLZ/tPHZ

propagation delay
nOE to nY

n

− 7.0 11.4 1.0 13.0 1.0 14.5 ns

Fig.4 The input (nAn) to output (nYn) propagation delays.

handbook, halfpage

MNA171

nAn INPUT

nYn OUTPUT

t

PLH

t

PHL

GND

V

I

V

M

V

M

V

M

V

M

V

OH

V

OL

FAMILY

VI INPUT

REQUIREMENTS

V

M

INPUT

V

M

OUTPUT

AHC GND to V

CC

50% V

CC

50% V

CC

AHCT GND to 3.0 V 1.5 V 50% V

CC

1999 Sep 28 10

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

Fig.5 The 3-state output enable and disable times.

handbook, full pagewidth

MNA172

t

PLZ

t

PHZ

outputs

disabled

outputs
enabled

VOH − 0.3 V

VOL + 0.3 V

outputs

enabled

OUTPUT
LOW-to-OFF
OFF-to-LOW

OUTPUT

HIGH-to-OFF
OFF-to-HIGH

nOE INPUT

V

I

V

CC

V

M

V

OL

V

OH

GND

GND

t

PZL

t

PZH

V

M

V

M

FAMILY

VI INPUT

REQUIREMENTS

V

M

INPUT

V

M

OUTPUT

AHC GND to V

CC

50% V

CC

50% V

CC

AHCT GND to 3.0 V 1.5 V 50% V

CC

Fig.6 Load circuitry for switching times.

TEST S

1

t

PLH/tPHL

open

t

PLZ/tPZL

V

CC

t

PHZ/tPZH

GND

handbook, full pagewidth

open
GND

V

CC

V

CC

V

I

V

O

MNA183

D.U.T.

C

L

R

T

1000 Ω

PULSE

GENERATOR

S1

1999 Sep 28 11

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

PACKAGE OUTLINES

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

10

20

w M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

1999 Sep 28 12

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

UNIT A1A2A

3

b

p

cD

(1)E(2) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

6.6

6.4

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.5

0.2

8
0

o
o

0.13 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1 MO-153AC

93-06-16
95-02-04

w M

b

p

D

Z

e

0.25

110

20

11

pin 1 index

θ

A

A

1

A

2

L

p

Q

detail X

L

(A )

3

H

E

E

c

v M

A

X

A

y

0 2.5 5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

A

max.

1.10

1999 Sep 28 13

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a verybriefinsight to a complextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages.Wave soldering isnot alwayssuitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing, stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating,soldering andcooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswith leads onfoursides,the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement andbefore soldering,the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Sep 28 14

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable forSSOP andTSSOP packages with a pitch (e) equal to or larger than0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1999 Sep 28 15

Philips Semiconductors Product specification

Octal buffer/line driver; 3-state 74AHC244; 74AHCT244

NOTES

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

68

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

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Middle East: see Italy

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Printed in The Netherlands 245002/03/pp16 Date of release: 1999 Sep 28 Document order number: 9397 750 06296