Datasheet 74AHC2G32, 74AHCT2G32 Datasheet (Philips)

Download

Page 1

查询74AHC2G32供应商查询74AHC2G32供应商

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Rev. 01 — 23 February 2004 Product data sheet

1. General description

The 74AHC2G/AHCT2G32 is a high-speed Si-gate CMOS device. This device provides two 2-input OR gates.

2. Features

■ Symmetrical output impedance

■ High noise immunity

■ ESD protection:

◆ HBM EIA/JESD22-A114-A exceeds 2000 V

◆ MM EIA/JESD22-A115-A exceeds 200 V

◆ CDM EIA/JESD22-C101 exceeds 1000 V.

■ Low power dissipation

■ Balanced propagation delays

■ SOT505-2 and SOT765-1 package

■ Speciﬁed from −40 °Cto+85°C and −40 °C to +125 °C.

3. Quick reference data

Table 1: Quick reference data

GND = 0 V; T

Symbol Parameter Conditions Min Typ Max Unit

Type 74AHC2G

, t

PHL

Type 74AHCT2G

, t

PHL

[1] CPDis used to determine the dynamic power dissipation (PDin µW).

PD=CPD× V fi= input frequency in MHz; fo= output frequency in MHz;

amb

PLH

=25°C; tr=t

propagation delay nA and nB to nY

≤

3.0 ns.

CL=15pF; V

- 3.2 5.5 ns

=5V input capacitance - 1.5 10 pF power dissipation

capacitance

propagation delay nA and nB to nY

CL=50pF; f

= 1 MHz

CL=15pF; V

=5V

[1] [2]

-16-pF

- 3.3 6.9 ns

input capacitance - 1.5 10 pF power dissipation

capacitance

× fi× N+Σ(CL× V

CL=50pF; f

= 1 MHz

× fo) where:

[1] [2]

-17-pF

Page 2

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

CL= output load capacitance in pF; VCC= supply voltage in Volts; N = total load switching outputs; Σ(CL× V

[2] The condition is VI= GND to VCC.

× fo) = sum of the outputs.

4. Ordering information

Table 2: Ordering information

Type number Package

Temperature range Name Description Version

74AHC2G32DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

74AHCT2G32DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

74AHC2G32DC −40 °C to +125 °C VSSOP8 plastic very shrink small outline package; 8 leads;

body width 2.3 mm

74AHCT2G32DC −40 °C to +125 °C VSSOP8 plastic very shrink small outline package; 8 leads;

body width 2.3 mm

SOT505-2

SOT765-1

5. Marking

Table 3: Marking

Type number Marking code

74AHC2G32DP A32 74AHCT2G32DP C32 74AHC2G32DC A32 74AHCT2G32DC C32

6. Functional diagram

Fig 1. Functional diagram. Fig 2. IEC logic symbol.

mna733

5 6

≥ 1

mna734

Product data sheet Rev. 01 — 23 February 2004 2 of 16

Page 3

Philips Semiconductors

Fig 3. Logic diagram (logic driver).

7. Pinning information

7.1 Pinning

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

1B 1Y

2Y 2B

GND 2A

mna732

mna166

7 6 5

Fig 4. Pin conﬁguration.

7.2 Pin description

Table 4: Pin description

Pin Symbol Description

1 1A data input 2 1B data input 3 2Y data output 4 GND ground (0 V) 5 2A data input 6 2B data input 7 1Y data output 8V

supply voltage

Product data sheet Rev. 01 — 23 February 2004 3 of 16

Page 4

Philips Semiconductors

8. Functional description

8.1 Function table

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Table 5: Function table

Input Output nA nB nY

LLL LHH HLH HHH

[1] H = HIGH voltage level;

L = LOW voltage level.

9. Limiting values

Table 6: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

, I

stg

tot

GND

[1]

supply voltage −0.5 +7.0 V input voltage −0.5 +7.0 V input diode current VI< −0.5 V - −20 mA output diode

VO< −0.5 V or VO>VCC+ 0.5 V

[1]

- ±20 mA

current output source or

VO> −0.5 V or VO<VCC+ 0.5 V - ±25 mA

sink current VCCor GND

- ±75 mA

current storage

−65 +150 °C

temperature power dissipation T

=−40 °C to +125 °C - 250 mW

amb

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

10. Recommended operating conditions

Table 7: Recommended operating operations

Symbol Parameter Conditions Min Typ Max Unit

Type 74AHC2G

amb

Product data sheet Rev. 01 — 23 February 2004 4 of 16

supply voltage 2.0 5.0 5.5 V input voltage 0 - 5.5 V output voltage 0 - V operating ambient

temperature

see Section 11 and Section 12 per device

−40 +25 +125 °C

Page 5

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Table 7: Recommended operating operations

…continued

Symbol Parameter Conditions Min Typ Max Unit

tr,t

input rise and fall times

VCC= 3.3 V ± 0.3 V - - 100 ns/V

=5V± 0.5 V - - 20 ns/V

Type 74AHCT2G

V V V T

CC I O amb

r,tf

supply voltage 4.5 5.0 5.5 V input voltage 0 - 5.5 V output voltage 0 - V operating ambient

temperature input rise and fall

see Section 11 and Section 12

−40 +25 +125 °C

per device VCC=5V± 0.5 V - - 20 ns/V

times

11. Static characteristics

Table 8: Static characteristics type 74AHC2G32

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

=25°C

amb

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

LOW-level output voltage

input leakage current VI=VCCor GND; VCC= 5.5 V - - 0.1 µA quiescent supply

current

input capacitance - 1.5 10 pF

VCC= 2.0 V 1.5 - - V

= 3.0 V 2.1 - - V

= 5.5 V 3.85 - - V

VCC= 2.0 V - - 0.5 V

= 3.0 V - - 0.9 V

= 5.5 V - - 1.65 V

VI=VIHor V

IO= −50 µA; VCC= 2.0 V 1.9 2.0 - V

= −50 µA; VCC= 3.0 V 2.9 3.0 - V

= −50 µA; VCC= 4.5 V 4.4 4.5 - V

= −4.0 mA; VCC= 3.0 V 2.58 - - V

= −8.0 mA; VCC= 4.5 V 3.94 - - V

VI=VIHor V

IO=50µA; VCC= 2.0 V - 0 0.1 V

=50µA; VCC= 3.0 V - 0 0.1 V

=50µA; VCC= 4.5 V - 0 0.1 V

= 4.0 mA; VCC= 3.0 V - - 0.36 V

= 8.0 mA; VCC= 4.5 V - - 0.36 V

VI=VCCor GND; IO=0A; V

= 5.5 V

- - 1.0 µA

Product data sheet Rev. 01 — 23 February 2004 5 of 16

Page 6

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Table 8: Static characteristics type 74AHC2G32

…continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

= −40 °C to +85 °C

amb

= −40 °C to +125 °C

amb

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

LOW-level output voltage

input leakage current VI=VCCor GND; VCC= 5.5 V - - 1.0 µA quiescent supply

current input capacitance - - 10 pF

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

VCC= 2.0 V 1.5 - - V

= 3.0 V 2.1 - - V

= 5.5 V 3.85 - - V

VCC= 2.0 V - - 0.5 V

= 3.0 V - - 0.9 V

= 5.5 V - - 1.65 V

VI=VIHor V

IO= −50 µA; VCC= 2.0 V 1.9 - - V

= −50 µA; VCC= 3.0 V 2.9 - - V

= −50 µA; VCC= 4.5 V 4.4 - - V

= −4.0 mA; VCC= 3.0 V 2.48 - - V

= −8.0 mA; VCC= 4.5 V 3.8 - - V

VI=VIHor V

IO=50µA; VCC= 2.0 V - - 0.1 V

=50µA; VCC= 3.0 V - - 0.1 V

=50µA; VCC= 4.5 V - - 0.1 V

= 4.0 mA; VCC= 3.0 V - - 0.44 V

= 8.0 mA; VCC= 4.5 V - - 0.44 V

VI=VCCor GND; IO=0A; V

= 5.5 V

--10µA

VCC= 2.0 V 1.5 - - V

= 3.0 V 2.1 - - V

= 5.5 V 3.85 - - V

VCC= 2.0 V - - 0.5 V

= 3.0 V - - 0.9 V

= 5.5 V - - 1.65 V

VI=VIHor V

IO= −50 µA; VCC= 2.0 V 1.9 - - V

= −50 µA; VCC= 3.0 V 2.9 - - V

= −50 µA; VCC= 4.5 V 4.4 - - V

= −4.0 mA; VCC= 3.0 V 2.40 - - V

= −8.0 mA; VCC= 4.5 V 3.70 - - V

Product data sheet Rev. 01 — 23 February 2004 6 of 16

Page 7

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Table 8: Static characteristics type 74AHC2G32

…continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

LOW-level output voltage

VI=VIHor V

IO=50µA; VCC= 2.0 V - - 0.1 V

=50µA; VCC= 3.0 V - - 0.1 V

=50µA; VCC= 4.5 V - - 0.1 V

= 4.0 mA; VCC= 3.0 V - - 0.55 V

= 8.0 mA; VCC= 4.5 V - - 0.55 V

input leakage current VI=VCCor GND; VCC= 5.5 V - - 2.0 µA quiescent supply

current

VI=VCCor GND; IO=0A; V

= 5.5 V

--40µA

input capacitance - - 10 pF

Table 9: Static characteristics type 74AHCT2G32

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

=25°C

amb

HIGH-level input

VCC= 4.5 V to 5.5 V 2.0 - - V

voltage

LOW-level input

VCC= 4.5 V to 5.5 V - - 0.8 V

voltage

∆I

= −40 °C to +85 °C

amb

HIGH-level output voltage

LOW-level output voltage

input leakage current VI=VIHor VIL; VCC= 5.5 V - - 0.1 µA quiescent supply

current additional quiescent

supply current per input pin

input capacitance - 1.5 10 pF

HIGH-level input

VI=VIHor V

IO= −50 µA; VCC= 4.5 V 4.4 4.5 - V

= −8.0 mA; VCC= 4.5 V 3.94 - - V

VI=VIHor V

IO=50µA; VCC= 4.5 V - 0 0.1 V

= 8.0 mA; VCC= 4.5 V - - 0.36 V

VI=VCCor GND; IO=0A; V

= 5.5 V

VI= 3.4 V; other inputs at V

or GND; IO=0A;

= 5.5 V

- - 1.0 µA

- - 1.35 mA

VCC= 4.5 V to 5.5 V 2.0 - - V

voltage

LOW-level input

VCC= 4.5 V to 5.5 V - - 0.8 V

voltage

HIGH-level output voltage

VI=VIHor V

IO= −50 µA; VCC= 4.5 V 4.4 - - V

= −8.0 mA; VCC= 4.5 V 3.8 - - V

Product data sheet Rev. 01 — 23 February 2004 7 of 16

Page 8

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Table 9: Static characteristics type 74AHCT2G32

…continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

∆I

= −40 °C to +125 °C

amb

LOW-level output voltage

VI=VIHor V

IO=50µA; VCC= 4.5 V - - 0.1 V

= 8.0 mA; VCC= 4.5 V - - 0.44 V

input leakage current VI=VIHor VIL; VCC= 5.5 V - - 1.0 µA quiescent supply

current additional quiescent

supply current per input pin

VI=VCCor GND; IO=0A; V

= 5.5 V

VI= 3.4 V; other inputs at V

or GND; IO=0A;

= 5.5 V

--10µA

- - 1.5 mA

input capacitance - - 10 pF

HIGH-level input

VCC= 4.5 V to 5.5 V 2.0 - - V

voltage

LOW-level input

VCC= 4.5 V to 5.5 V - - 0.8 V

voltage

I I

∆I

LI CC

HIGH-level output voltage

LOW-level output voltage

input leakage current VI=VIHor VIL; VCC= 5.5 V - - 2.0 µA quiescent supply

current additional quiescent

supply current per input pin

input capacitance - - 10 pF

VI=VIHor V

IO= −50 µA; VCC= 4.5 V 4.4 - - V

= −8.0 mA; VCC= 4.5 V 3.70 - - V

VI=VIHor V

IO=50µA; VCC= 4.5 V - - 0.1 V

= 8.0 mA; VCC= 4.5 V - - 0.55 V

VI=VCCor GND; IO=0A; V

= 5.5 V

VI= 3.4 V; other inputs at V

or GND; IO=0A;

= 5.5 V

--40µA

- - 1.5 mA

Product data sheet Rev. 01 — 23 February 2004 8 of 16

Page 9

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

12. Dynamic characteristics

Table 10: Dynamic characteristics type 74AHC2G32

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); tr = t

Symbol Parameter Conditions Min Typ Max Unit

= 25 °C

amb

PHL

, t

propagation delay

PLH

nA and nB to nY

power dissipation

see Figure 5

= 3.0 V to 3.6 V; CL=15pF

= 4.5 V to 5.5 V; CL=15pF

= 3.0 V to 3.6 V; CL= 50 pF - 6.3 11.4 ns

= 4.5 V to 5.5 V; CL= 50 pF - 4.6 7.5 ns

CL= 50 pF; fi= 1 MHz

[1]

- 4.4 7.9 ns

[2]

- 3.2 5.5 ns

[3] [4]

-16- pF

capacitance

= −40 °C to +85 °C

amb

PHL

, t

amb

, t

propagation delay

PLH

nA and nB to nY

= −40 °C to +125 °C

propagation delay

PLH

nA and nB to nY

see Figure 5

= 3.0 V to 3.6 V; CL= 15 pF 1.0 - 9.5 ns

= 4.5 V to 5.5 V; CL= 15 pF 1.0 - 6.5 ns

= 3.0 V to 3.6 V; CL= 50 pF 1.0 - 13.0 ns

= 4.5 V to 5.5 V; CL= 50 pF 1.0 - 8.5 ns

see Figure 5

= 3.0 V to 3.6 V; CL= 15 pF 1.0 - 10.0 ns

= 4.5 V to 5.5 V; CL= 15 pF 1.0 - 7.0 ns

= 3.0 V to 3.6 V; CL= 50 pF 1.0 - 14.5 ns

= 4.5 V to 5.5 V; CL= 50 pF 1.0 - 9.5 ns

≤

3.0 ns; see Figure 6.

[1] Typical values are measured at VCC= 3.3 V. [2] Typical values are measured at VCC= 5.0 V. [3] CPDis used to determine the dynamic power dissipation (PDin µW).

PD=CPD× V fi= input frequency in MHz; fo= output frequency in MHz; CL= output load capacitance in pF; VCC= supply voltage in Volts; N = total load switching outputs; Σ(CL× V

[4] The condition is VI= GND to VCC.

Product data sheet Rev. 01 — 23 February 2004 9 of 16

× fi× N+Σ(CL× V

× fo) = sum of the outputs.

× fo) where:

Page 10

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Table 11: Dynamic characteristics type 74AHCT2G32

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); tr = t

Symbol Parameter Conditions Min Typ Max Unit

= 25 °C

amb

PHL

, t

propagation delay

PLH

nA and nB to nY

power dissipation

see Figure 5

= 4.5 V to 5.5 V; CL=15pF

= 4.5 V to 5.5 V; CL=50pF

CL= 50 pF; fi= 1 MHz

[1]

- 3.3 6.9 ns

[1]

- 4.8 7.9 ns

[2] [3]

-17-pF

capacitance

= −40 °C to +85 °C

amb

PHL

, t

amb

, t

propagation delay

PLH

nA and nB to nY

= −40 °C to +125 °C

propagation delay

PLH

nA and nB to nY

see Figure 5

= 4.5 V to 5.5 V; CL= 15 pF 1.0 - 8.0 ns

= 4.5 V to 5.5 V; CL= 50 pF 1.0 - 9.0 ns

see Figure 5

= 4.5 V to 5.5 V; CL= 15 pF 1.0 - 9.0 ns

= 4.5 V to 5.5 V; CL= 50 pF 1.0 - 10.0 ns

≤

3.0 ns; see Figure 6.

[1] Typical values are measured at VCC= 5.0 V. [2] CPDis used to determine the dynamic power dissipation (PDin µW).

PD=CPD× V fi= input frequency in MHz; fo= output frequency in MHz; CL= output load capacitance in pF; VCC= supply voltage in Volts; N = total load switching outputs; Σ(CL× V

[3] The condition is VI= GND to VCC.

× fi× N+Σ(CL× V

× fo) = sum of the outputs.

× fo) where:

13. Waveforms

nA, nB input

nY output

GND

PHL

PLH

mna224

74AHC2G32: VM= 0.5 x VCC; VI= GND to VCC. 74AHCT2G32: input VM= 1.5 V and output VM= 0.5 x VCC; VI= GND to 3.0 V.

Fig 5. The input (nA and nB) to output (nY) propagation delays.

Product data sheet Rev. 01 — 23 February 2004 10 of 16

Page 11

Philips Semiconductors

GENERATOR

Deﬁnitions for test circuit: CL = Load capacitance including jig and probe capacitance (See Section 12 for the value). RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.

Fig 6. Load circuitry for switching times.

PULSE

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

D.U.T.

mna101

Product data sheet Rev. 01 — 23 February 2004 11 of 16

Page 12

Philips Semiconductors

14. Package outline

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm

pin 1 index

detail X

v M

(A3)

SOT505-2

DIMENSIONS (mm are the original dimensions)

UNIT

max.

1.1

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE VERSION

SOT505-2 - - -

0.15

0.00

A2A3b

0.95

0.25

0.75

IEC JEDEC JEITA

0.38

0.22

ceD

0.18

0.08

w M

(1)E(1)

3.1

2.9

REFERENCES

2.5 5 mm0

scale

0.65

4.1

3.9

0.47

0.33

wyv

0.13 0.10.20.5

EUROPEAN

PROJECTION

(1)

0.70

0.35

ISSUE DATE

8° 0°

02-01-16

Fig 7. Package outline TSSOP8

Product data sheet Rev. 01 — 23 February 2004 12 of 16

Page 13

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm

pin 1 index

detail X

(A3)

v M

SOT765-1

DIMENSIONS (mm are the original dimensions)

UNIT

max.

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT765-1 MO-187

0.15

0.00

A2A3b

0.85

0.12

0.60

IEC JEDEC JEITA

0.27

0.17

0.23

0.08

w M

ceD

2.1

1.9

REFERENCES

(1)E(2)

2.4

2.2

2.5 5 mm0

scale

0.5

3.2

3.0

0.40

0.15

0.21

0.19

EUROPEAN

PROJECTION

wyv

0.13 0.10.20.4

(1)

0.4

0.1

ISSUE DATE

02-06-07

8° 0°

Fig 8. Package outline VSSOP8

Product data sheet Rev. 01 — 23 February 2004 13 of 16

Page 14

Philips Semiconductors

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

15. Revision history

Table 12: Revision history

Document ID Release date Data sheet status Change notice Order number Supersedes

74AHC_AHCT2G32_1 20040223 Product data - 9397 750 12532 -

Product data sheet Rev. 01 — 23 February 2004 14 of 16

Page 15

Philips Semiconductors

16. Data sheet status

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

Level Data sheet status

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

II Preliminary data Qualiﬁcation This data sheetcontains data from thepreliminary speciﬁcation.Supplementary datawill be published

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

[1]

Product status

17. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty thatsuchapplications will be suitable for the speciﬁed use without further testing or modiﬁcation.

[2] [3]

Deﬁnition

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

at a laterdate. Philips Semiconductors reserves the right to changethe speciﬁcation without notice, in order to improve the design and supply the best possible product.

right to make changes atany time in order to improve thedesign, manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

18. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, andmakes norepresentations or warrantiesthat these productsare free frompatent, copyright, or maskwork right infringement, unless otherwise speciﬁed.

19. Contact information

For additional information, please visit http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: [email protected]

Product data sheet Rev. 01 — 23 February 2004 15 of 16

Page 16

Philips Semiconductors

20. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Functional description . . . . . . . . . . . . . . . . . . . 4

8.1 Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

10 Recommended operating conditions. . . . . . . . 4

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9

13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 15

17 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

19 Contact information . . . . . . . . . . . . . . . . . . . . 15

74AHC2G32; 74AHCT2G32

Dual 2-input OR gate

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Published in The Netherlands

Date of release: 23 February 2004

Document order number: 9397 750 12532