Datasheet 74AHCT1G14, 74AHC1G14 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

Product specification
File under Integrated Circuits, IC06

1999 Aug 05

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

FEATURES

• Symmetrical output impedance

• High noise immunity

• ESD protection:

HBM EIA/JESD22-A114-A
exceeds 2000 V
MM EIA/JESD22-A115-A
exceeds 200 V

• Low power dissipation

• Balanced propagation delays

• Very small 5 pin package

• Output capability: standard.

APPLICATIONS

• Wave and pulse shapers

• Astable multivibrators

• Monostable multivibrators.

DESCRIPTION

The 74AHC1G/AHCT1G14 is a
high-speed Si-gate CMOS device.

The 74AHC1G/AHCT1G14 provides
the inverting buffer function with
Schmitt-trigger action.These devices
are capable of transforming slowly
changing input signals into sharply
defined, jitter-free output signals.

QUICK REFERENCE DATA

GND = 0 V; T

=25°C; tr=tf≤3.0 ns.

amb

SYMBOL PARAMETER CONDITIONS

t

PHL/tPLH

C

I

propagation
delay inA to outY

input

CL=15pF;
VCC=5V

3.2 4.1 ns

1.5 1.5 pF

capacitance

C

PD

powerdissipation
capacitance

CL=15pF;
f = 1 MHz;

12 13 pF

notes 1 and 2

Notes

1. C

is used to determine the dynamic power dissipation (PDin µW).

PD

PD=CPD× V

2

× fi+(CL×V

CC

2

× fo) where:

CC

fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in Volts.

2. The condition is VI= GND to VCC.

FUNCTION TABLE

See note 1.

INPUT (inA) OUTPUT (outY)

LH

HL

Note

1. H = HIGH voltage level; L = LOW voltage level.

TYPICAL

UNIT

AHC1G AHCT1G

ORDERING INFORMATION

PACKAGES

TYPE NUMBER

TEMPERATURE

RANGE

PINS PACKAGE MATERIAL CODE MARKING

74AHC1G14GW −40 to +85 °C 5 SC-88A plastic SOT353 AF
74AHCT1G14GW 5 SC-88A plastic SOT353 CF

1999 Aug 05 2

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

PINNING

PIN SYMBOL DESCRIPTION

1 n.c. not connected
2 inA data input
3 GND ground (0 V)
4 outY data output
5V

CC

DC supply voltage

handbook, halfpage

handbook, halfpage

n.c

inA

GND

1
2

14

3

MNA022

V

5

CC

outY

4

Fig.1 Pin configuration.

24

MNA024

handbook, halfpage

handbook, halfpage

inA

inA outY

2

MNA023

Fig.2 Logic symbol.

4

outY

MNA025

Fig.3 IEC logic symbol.

1999 Aug 05 3

Fig.4 Logic diagram.

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS

UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

74AHC1G 74AHCT1G

V

CC

V

I

V

O

T

amb

DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
input voltage 0 − 5.5 0 − 5.5 V
output voltage 0 − V
operating ambient

temperature

see DC and AC
characteristics per

−40 +25 +85 −40 +25 +85 °C

0 − V

CC

CC

V

device

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

I

I

IK

I

OK

I

O

I

CC

T

stg

P

D

DC supply voltage −0.5 +7.0 V
input voltage range −0.5 +7.0 V
DC input diode current VI< −0.5 V −−20 mA
DC output diode current VO< −0.5 Vor VO>VCC+ 0.5 V; note 1 −±20 mA
DC output source or sink current −0.5V<VO<VCC+ 0.5 V −±25 mA
DC VCC or GND current −±75 mA
storage temperature −65 +150 °C
power dissipation per package temperature range: −40 to +85 °C;

− 200 mW

note 2

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. Above 55 °C the value of P

derates linearly with 2.5 mW/K.

D

1999 Aug 05 4

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

DC CHARACTERISTICS
Family 74AHC1G

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

SYMBOL PARAMETER

V

OH

HIGH-level output
voltage; all outputs

HIGH-level output
voltage

V

OL

LOW-level output
voltage; all outputs

LOW-level output
voltage

I

I

I

CC

input leakage current VI=VCCor GND 5.5 −− 0.1 − 1.0 µA
quiescent supply

current

C

I

input capacitance − 1.5 10 − 10 pF

TEST CONDITIONS T

OTHER VCC (V)

MIN. TYP. MAX. MIN. MAX.

VI=VIHor VIL;
IO= −50 µA

2.0 1.9 2.0 − 1.9 − V

3.0 2.9 3.0 − 2.9 −

4.5 4.4 4.5 − 4.4 −

V

I=VIH

or VIL;

3.0 2.58 −−2.48 − V

IO= −4.0 mA
V

I=VIH

or VIL;

4.5 3.94 −−3.8 −

IO= −8.0 mA
VI=VIHor VIL;

IO=50µA

2.0 − 0 0.1 − 0.1 V

3.0 − 0 0.1 − 0.1

4.5 − 0 0.1 − 0.1

V

I=VIH

or VIL;

3.0 −− 0.36 − 0.44 V

IO= 4.0 mA
V

I=VIH

or VIL;

4.5 −− 0.36 − 0.44

IO= 8.0 mA

VI=VCCor GND;

5.5 −− 1.0 − 10 µA

IO=0

(°C)

amb

25 −40 to +85

UNIT

1999 Aug 05 5

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

Family 74AHCT1G

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

SYMBOL PARAMETER

V

OH

HIGH-level output
voltage; all outputs

HIGH-level output voltage V

V

OL

LOW-leveloutputvoltage;
all outputs

LOW-level output voltage V

I
I

∆I

I
CC

CC

input leakage current VI=VIHor V
quiescent supply current VI=VCCor GND;

additional quiescent
supply current per input
pin

C

I

input capacitance − 1.5 10 − 10 pF

TEST CONDITIONS T

OTHER VCC (V)

MIN. TYP. MAX. MIN. MAX.

VI=VIHor VIL;

4.5 4.4 4.5 − 4.4 − V

IO= −50 µA

I=VIH

or VIL;

4.5 3.94 −− 3.8 − V

IO= −8.0 mA
VI=VIHor VIL;

4.5 − 0 0.1 − 0.1 V

IO=50µA

I=VIH

or VIL;

4.5 −−0.36 − 0.44 V

IO= 8.0 mA

IL

5.5 −−0.1 − 1.0 µA

5.5 −−1.0 − 10 µA

IO=0
VI= 3.4 V; other

5.5 −−1.35 − 1.5 mA
inputs at
VCCor GND; IO=0

(°C)

amb

25 −40 to +85

UNIT

1999 Aug 05 6

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

TRANSFER CHARACTERISTICS
Type 74AHC1G14

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

TEST CONDITIONS T

SYMBOL PARAMETER

25 −40 to +85

OTHER VCC (V)

MIN. TYP. MAX. MIN. MAX.

V

T+

positive-going threshold see Figs 7 and 8 3.0 −−2.2 − 2.2 V

4.5 −−3.15 − 3.15

5.5 −−3.85 − 3.85

V

T−

negative-going threshold see Figs 7 and 8 3.0 0.9 −− 0.9 − V

4.5 1.35 −− 1.35 −

5.5 1.65 −− 1.65 −

V

H

hysteresis (VT+− VT−) see Figs 7 and 8 3.0 0.3 − 1.2 0.3 1.2 V

4.5 0.4 − 1.4 0.4 1.4

5.5 0.5 − 1.6 0.5 1.6

Type 74AHCT1G14

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

TEST CONDITIONS T

SYMBOL PARAMETER

25 −40 to +85

WAVEFORMS VCC (V)

MIN. TYP. MAX. MIN. MAX.

V

T+

positive-going threshold see Figs 7 and 8 4.5 −−2.0 − 2.0 V

5.5 −−2.0 − 2.0

V

T−

negative-going threshold see Figs 7 and 8 4.5 0.5 −−0.5 − V

5.5 0.6 −− 0.6 −

V

H

hysteresis (VT+− VT−) see Figs 7 and 8 4.5 0.4 − 1.4 0.4 1.4 V

5.5 0.4 − 1.6 0.4 1.6

amb

amb

(°C)

UNIT

(°C)

UNIT

1999 Aug 05 7

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

AC CHARACTERISTICS
Type 74AHC1G14

GND = 0 V; tr=tf≤3.0 ns.

SYMBOL PARAMETER

VCC= 3.0 to 3.6V; note 1

t

PHL/tPLH

propagation delay
inA to outY

V

= 4.5 to 5.5 V; note 2

CC

t

PHL/tPLH

propagation delay
inA to outY

Notes

1. Typical values at V

CC

= 3.3 V.

2. Typical values at VCC= 5.0 V.

Type 74AHCT1G14

GND = 0 V; tr=tf≤3.0 ns.

SYMBOL PARAMETER

TEST CONDITIONS T

amb

(°C)

25 −40 to +85

WAVEFORMS C

L

MIN. TYP. MAX. MIN. MAX.

see Figs 5 and 6 15 pF − 4.2 12.8 1.0 15.0 ns

50 pF − 6.0 16.3 1.0 18.5 ns

see Figs 5 and 6 15 pF − 3.2 8.6 1.0 10.0 ns

50 pF − 4.6 10.6 1.0 12.0 ns

TEST CONDITIONS T

amb

(°C)

25 −40 to +85

WAVEFORMS C

L

MIN. TYP. MAX. MIN. MAX.

UNIT

UNIT

VCC= 4.5 to 5.5 V; note 1

t

PHL/tPLH

propagation delay
inA to outY

Note

1. Typical values at V

CC

see Figs 5 and 6 15 pF − 4.1 7.0 1.0 8.0 ns

50 pF − 5.9 8.5 1.0 10.0 ns

= 5.0 V.

1999 Aug 05 8

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

AC WAVEFORMS

handbook, halfpage

inA INPUT

outY OUTPUT

FAMILY

REQUIREMENTS

AHC1G GND to V

(1)

V

M

V

M

VI INPUT

CC

t

PHL

(1)

t

PLH

MNA033

V

M

INPUT

OUTPUT

50% VCC50% V

AHCT1G GND to 3.0 V 1.5 V 50% V

Fig.5 The input (inA)to output(outY) propagation

delays.

TRANSFER CHARACTERISTIC WAVEFORMS

handbook, halfpage

V

PULSE

GENERATOR

V

M

Definitions for test circuit:

CC
CC

CL= Load capacitance including jig and probe capacitance.
(See Chapter “AC characteristics” for values).

= Termination resistance should be equal to the output

R

T

impedance Z

of the pulse generator.

o

I

V

CC

V

D.U.T.

R

T

O

C

L

MNA101

Fig.6 Load circuitry for switching times.

handbook, halfpage

V

O

V

H

V

T+

V

T−

MNA026

Fig.7 Transfer characteristic.

1999 Aug 05 9

handbook, halfpage

V

Fig.8 The definitions of VT+, VT− and VH.

V

V

O

T+

I

V

T−

V

MNA027

H

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

1.5

handbook, halfpage

I

CC

(mA)

1

0.5

0

01 3

2

MNA401

VI (V)

Fig.9 Typical AHC1G14 transfer characteristics;

VCC= 3.0 V.

handbook, halfpage

5

I

CC

(mA)

4

3

2

1

0

05

1234

MNA402

V

(V)

I

Fig.10 Typical AHC1G14 transfer characteristics;

VCC= 4.5 V.

handbook, halfpage

8

I

CC

(mA)

6

4

2

0

02 6

4

MNA403

VI (V)

Fig.11 Typical AHC1G14 transfer characteristics;

VCC= 5.5 V.

1999 Aug 05 10

handbook, halfpage

5

I

CC

(mA)

4

3

2

1

0

05

1234

MNA404

V

(V)

I

Fig.12 Typical AHCT1G14transfer characteristics;

VCC= 4.5 V.

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

APPLICATION INFORMATION

The slow input rise and fall times cause additional power
dissipation, this can be calculated using the following

handbook, halfpage

8

I

CC

(mA)

6

4

2

0

02 6

MNA405

4

VI (V)

formula:
Pad=fi×(tr× I

CC(AV)+tf×ICC(AV)

) × VCC where:
Pad= additional power dissipation (µW);
fi= input frequency (MHz);
tr= input rise time (ns); 10% to 90%;
tf= input fall time (ns); 90% to 10%;
I

= average additional supply current (µA).

CC(AV)

Average ICC differs with positive or negative input
transitions, as shown in Figs 14 and 15.

AHC1G/AHCT1G14 used in relaxation oscillator circuit,
see Fig.16.

Note to the application information:

1. All valuesgiven are typicalunless otherwise specified.

Fig.13 Typical AHCT1G14transfer characteristics;

VCC= 5.5 V.

200

handbook, halfpage

I

CC(AV)

(µA)

150

100

50

0

0 2.0 4.0 6.0

positive-going

negative-going

MNA036

edge

edge

VCC (V)

200

handbook, halfpage

I

CC(AV)

(µA)

150

100

50

0

0462

MNA058

positive-going

edge

negative-going

edge

V

(V)

CC

Fig.14 Average ICC for AHC1G Schmitt-trigger

devices; linear change of VI between

0.1VCCto 0.9VCC.

1999 Aug 05 11

Fig.15 Average ICC for AHCT1G Schmitt-trigger

devices; linear change of VI between

0.1VCCto 0.9VCC.

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

C

≈=

-------------------------- -

0.55 RC×

1

≈=

---

-------------------------- -

T

0.60 RC×

R

MNA035

1

1

handbook, halfpage

For AHC1G:

For AHCT1G:

1

f

--­T

f

Fig.16 Relaxation oscillator using the

AHC1G/AHCT1G14.

1999 Aug 05 12

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

PACKAGE OUTLINE

Plastic surface mounted package; 5 leads SOT353

D

y

45

132

e

1

e

b

p

wBM

A

A

1

E

H

E

detail X

Q

L

p

AB

X

v M

A

c

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

A

UNIT

mm

A

1.1

0.8

OUTLINE
VERSION

SOT353

max

0.1

1

b

cD

p

0.30

0.20

IEC JEDEC EIAJ

0.25

0.10

2.2

1.8

(2)

E

1.35

1.3

1.15

REFERENCES

e

e

1

0.65

1999 Aug 05 13

H

2.2

2.0

L

Qywv

p

E

0.45

0.15

0.25

0.15

0.2 0.10.2

EUROPEAN

PROJECTION

ISSUE DATE

97-02-28SC-88A

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

SOLDERING
Introduction to soldering surface mount packages

Thistext gives averybrief insight toa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages.Wave solderingis notalways suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboardby screenprinting,stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wavewith high upwardpressure followed bya
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leadsonfour sides, thefootprintmust
be placedat a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Aug 05 14

Philips Semiconductors Product specification

Inverting Schmitt trigger 74AHC1G14; 74AHCT1G14

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable

SOLDERING METHOD

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is onlysuitable for SSOP and TSSOPpackages with a pitch (e) equal toor larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Aug 05 15

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Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

67

SCA

Printed in The Netherlands 245002/01/pp16 Date of release: 1999 Aug 05 Document order number: 9397 750 05741