Datasheet 74AHCT1G07, 74AHC1G07 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

74AHC1G07; 74AHCT1G07

Buffer with open-drain output

Product specification
File under Integrated Circuits, IC06

2000 May 02

Philips Semiconductors Product specification

Buffer with open-drain output

FEATURES

• High noise immunity

• ESD protection:

HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V

• Low power dissipation

• SOT353 package

• Output capability standard (open drain).

QUICK REFERENCE DATA

GND = 0 V; T

=25°C; tr=tf≤3.0 ns.

amb

SYMBOL PARAMETER CONDITIONS

t

PZL

t

PLZ

C
C

I
PD

propagation delay inA to outY CL= 15 pF; VCC= 5 V 2.5 2.8 ns
propagation delay inA to outY CL= 15 pF; VCC= 5 V 4.2 3.9 ns
input capacitance 1.5 1.5 pF
power dissipation capacitance CL= 50 pF; f = 1 MHz;

notes 1 and 2

DESCRIPTION

The74AHC1G/AHCT1G07isahigh-speedSi-gateCMOS
device.

The 74AHC1G/AHCT1G07 provides the non-inverting
buffer.

The output of the 74AHC1G/AHCT1G07 devices is an
open drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or
active-HIGH wired-AND functions. For digital operation
this device must have a pull-up resistor to establish a logic
HIGH-level.

74AHC1G07;

74AHCT1G07

TYPICAL

UNIT

AHC1G AHCT1G

5.0 6.5 pF

Notes

1. C

is used to determine the dynamic power dissipation (PDin µW).

PD

PD=CPD× V

= input frequency in MHz;

f

i

2

× fi+(CL×V

CC

CC

fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in Volts.

2. The condition is VI= GND to VCC.

FUNCTION TABLE

See note 1.

INPUT OUTPUT

inA outY

LL

HZ

Note

1. H = HIGH voltage level;
L = LOW voltage level;
Z = high impedance OFF-state.

2

× fo) where:

2000 May 02 2

Philips Semiconductors Product specification

Buffer with open-drain output

74AHC1G07;

74AHCT1G07

ORDERING AND PACKAGE INFORMATION

PACKAGES

TYPE NUMBER

74AHC1G07GW −40 to +125 °C 5 SC-88A plastic SOT353 AS
74AHCT1G07GW 5 SC-88A plastic SOT353 CS

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
inA 2 data input
GND 3 ground (0 V)
outY 4 data output
V

CC

TEMPERATURE

RANGE

5 DC supply voltage

PINS PACKAGE MATERIAL CODE MARKING

handbook, halfpage

n.c.

inA

GND

1
2

07

3

MNA588

V

5

outY

4

Fig.1 Pin configuration.

CC

handbook, halfpage

inA outY

2

MNA589

Fig.2 Logic symbol.

4

2000 May 02 3

Philips Semiconductors Product specification

Buffer with open-drain output

handbook, halfpage

2

inA

MNA590

Fig.3 IEC logic symbol.

4

outY

handbook, halfpage

74AHC1G07;

74AHCT1G07

outY

inA

GND

Fig.4 Logic diagram.

MNA591

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS

V

CC

V

I

V

O

DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
input voltage 0 − 5.5 0 − 5.5 V
output voltage active mode 0 − V

high-impedance mode 0 − 6.0 0 − 6.0 V

T

amb

operating ambient
temperature

see DC and AC
characteristics per
device

t

, t

r

f

(∆t/∆f)

input rise and fall times
ratios (except for
Schmitt-trigger inputs)

VCC= 3.3 ±0.3 V −−100 −−−ns/V
V

=5±0.5 V −−20 −−20 ns/V

CC

74AHC 74AHCT

UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

0 − V

CC

CC

V

−40 +25 +85 −40 +25 +85 °C

−40 +25 +125 −40 +25 +125 °C

2000 May 02 4

Philips Semiconductors Product specification

Buffer with open-drain output

74AHC1G07;

74AHCT1G07

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

I

I

IK

I

OK

V

O

I

O

I

CC

T

stg

P

D

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. Above 55 °C the value of P

DC supply voltage −0.5 +7.0 V
input voltage −0.5 +7.0 V
DC input diode current VI< −0.5 V; note 1 −−20 mA
DC output clamping diode

VO< −0.5 V; note 1 −±20 mA

current
output voltage active mode; note 1 −0.5 VCC+ 0.5 V

high-impedance mode; note 1 −0.5 7.0 V
DC output sink current VO> −0.5 V −±25 mA
DC VCC or GND current −±75 mA
storage temperature −65 +150 °C
power dissipation per package for temperature range:

− 200 mW

−40 to +125 °C; note 2

derates linearly with 2.5 mW/K.

D

2000 May 02 5

Philips Semiconductors Product specification

Buffer with open-drain output

DC CHARACTERISTICS
74AHC1G family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

amb

(°C)

SYMBOL PARAMETER

V

IH

HIGH-level input
voltage

V

IL

LOW-level input
voltage

V

OL

LOW-level output
voltage

I

I

input leakage
current

I

OZ

3-state output
OFF-state current

I

CC

quiescent supply
current

C

I

input capacitance −−1.5 10 − 10 − 10 pF

TEST CONDITIONS T

25 −40 to +85 −40 to +125

OTHER VCC(V)

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

2.0 1.5 −−1.5 − 1.5 − V

3.0 2.1 −−2.1 − 2.1 − V

5.5 3.85 −−3.85 − 3.85 − V

2.0 −−0.5 − 0.5 − 0.5 V

3.0 −−0.9 − 0.9 − 0.9 V

5.5 −−1.65 − 1.65 − 1.65 V

VI=VIHor VIL;
IO=50µA

2.0 − 0 0.1 − 0.1 − 0.1 V

3.0 − 0 0.1 − 0.1 − 0.1 V

4.5 − 0 0.1 − 0.1 − 0.1 V

V

I=VIH

or VIL;

3.0 −−0.36 − 0.44 − 0.55 V

IO=4mA
V

I=VIH

or VIL;

4.5 −−0.36 − 0.44 − 0.55 V

IO=8mA
VI=VCCor GND 5.5 −−0.1 − 1.0 − 2.0 µA

VI=VIHor VIL;

5.5 −−±0.25 −±2.5 −±10.0 µA

VO=VCCor GND
VI=VCCor GND;

5.5 −−1.0 − 10 − 20 µA

IO=0

74AHC1G07;

74AHCT1G07

UNIT

2000 May 02 6

Philips Semiconductors Product specification

Buffer with open-drain output

74AHCT1G family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

V

IH

HIGH-level input
voltage

V

IL

LOW-level input
voltage

V

OL

LOW-leveloutput
voltage

I

I

input leakage
current

I

OZ

3-state output
OFF-state
current

I

CC

quiescent supply
current

∆I

CC

additional
quiescent supply
current per input
pin

C

I

input
capacitance

TEST CONDITIONS T

25 −40 to +85 −40 to +125

OTHER VCC(V)

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

4.5 to 5.5 2.0 −−2.0 − 2.0 − V

4.5 to 5.5 −−0.8 − 0.8 − 0.8 V

VI=VIHor VIL;

4.5 − 0 0.1 − 0.1 − 0.1 V

IO=50µA
V

I=VIH

or VIL;

4.5 −−0.36 − 0.44 − 0.55 V

IO=8mA
VI=VCCor GND 5.5 −−0.1 − 1.0 − 2.0 µA

VI=VIHor VIL;

5.5 −−±0.25 −±2.5 −±10.0 µA

VO=VCCor GND

VI=VCCor GND;

5.5 −−1.0 − 10 − 20 µA

IO=0
VI= 3.4 V;

4.5 to 5.5 −−1.35 − 1.5 − 1.5 mA
other inputs at
VCCor GND;
IO=0

−−1.5 10 − 10 − 10 pF

amb

(°C)

74AHC1G07;

74AHCT1G07

UNIT

2000 May 02 7

Philips Semiconductors Product specification

Buffer with open-drain output

AC CHARACTERISTICS
Type 74AHC1G07

GND = 0 V; tr=tf≤3.0 ns.

TEST CONDITIONS T

SYMBOL PARAMETER

VCC= 3.0 to 3.6 V; note 1

t
t
t
t

PZL
PLZ
PZL
PLZ

propagation delay
inA to outY

propagation delay
inA to outY

VCC= 4.5 to 5.5 V; note 2
t

t
t
t

PZL
PLZ
PZL
PLZ

propagation delay
inA to outY

propagation delay
inA to outY

WAVEFORMS C

see Figs 5 and 6 15 pF − 3.5 5.6 1.0 6.3 1.0 7.0 ns

see Figs 5 and 6 50 pF − 5.0 8.0 1.0 9.0 1.0 10.0 ns

see Figs 5 and 6 15 pF − 2.5 3.9 1.0 4.6 1.0 4.9 ns

see Figs 5 and 6 50 pF − 3.6 5.5 1.0 6.5 1.0 7.0 ns

74AHC1G07;

74AHCT1G07

(°C)

amb

25 −40 to +85 −40 to +125

L

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

− 5.8 7.9 1.0 8.4 1.0 8.9 ns

− 8.3 11.5 1.0 12.0 1.0 12.5 ns

− 4.2 5.1 1.0 5.6 1.0 6.1 ns

− 6.0 7.5 1.0 8.0 1.0 8.5 ns

UNIT

Notes

1. Typical values at V

CC

= 3.3 V.

2. Typical values at VCC= 5.0 V.

Type 74AHCT1G07

GND = 0 V; tr=tf≤3.0 ns.

SYMBOL PARAMETER

VCC= 4.5 to 5.5 V; note 1

t
t
t
t

PZL
PLZ
PZL
PLZ

propagation delay
inA to outY

propagation delay
inA to outY

Note

1. Typical values at V

CC

= 5.0 V.

TEST CONDITIONS T

25 −40 to +85 −40 to +125

WAVEFORMS C

L

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

amb

(°C)

UNIT

see Figs 5 and 6 15 pF − 2.8 4.6 1.0 5.3 1.0 5.6 ns

− 3.9 5.6 1.0 6.1 1.0 6.6 ns

see Figs 5 and 6 50 pF − 4.0 6.5 1.0 7.5 1.0 8.0 ns

− 5.5 8.0 1.0 8.5 1.0 9.0 ns

2000 May 02 8

Philips Semiconductors Product specification

Buffer with open-drain output

AC WAVEFORMS

handbook, full pagewidth

inA input

outY output

FAMILY

AHC1G GND to V

VI INPUT

REQUIREMENTS

CC

AHCT1G GND to 3.0 V 1.5 V 50% V

V

I

GND

V

CC

V

OL

(1)

V

M

INPUT

50% VCC50% V

(1)

V

M

t

PLZ

(2)

V

M

OUTPUT

CC
CC

VOL + 0.3 V

t

PZL

74AHC1G07;

74AHCT1G07

(2)

V

M

MNA592

handbook, full pagewidth

TEST S1

t

PLH/tPHL

t

PLZ/tPZL

t

PHZ/tPZH

open
V

CC

GND

Fig.5 The input inA to output outY propagation delays.

S1

V

CC

V

CC

V

PULSE

GENERATOR

Definitions for test circuit:
CL= Load capacitance including jig and probe capacitance (see Chapter “AC characteristics”).
RT= Termination resistance should be equaltothe output impedance Z0of the pulse generator.

I

R

D.U.T.

T

V

O

RL =
1000 Ω

C

L

MNA232

open
GND

Fig.6 Load circuitry for switching times.

2000 May 02 9

Philips Semiconductors Product specification

Buffer with open-drain output

74AHC1G07;

74AHCT1G07

PACKAGE OUTLINE

Plastic surface mounted package; 5 leads SOT353

D

y

E

H

E

AB

45

X

v M

A

132

e

1

DIMENSIONS (mm are the original dimensions)

A

UNIT

mm

A

1.1

0.8

max

0.1

1

b

p

0.30

0.25

0.20

0.10

b

p

e

cD

2.2

1.8

A

wBM

0 1 2 mm

scale

E

1.35

1.15

(2)

1.3

e

0.65

H

E

1

2.2

0.45

2.0

0.15

e

A

1

detail X

L

Qywv

p

0.25

0.15

0.2 0.10.2

Q

L

p

c

OUTLINE

VERSION

SOT353

IEC JEDEC EIAJ

REFERENCES

2000 May 02 10

EUROPEAN

PROJECTION

ISSUE DATE

97-02-28SC-88A

Philips Semiconductors Product specification

Buffer with open-drain output

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave solderingis not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

74AHC1G07;

74AHCT1G07

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 May 02 11

Philips Semiconductors Product specification

Buffer with open-drain output

74AHC1G07;

74AHCT1G07

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4)
(5)

suitable

suitable
suitable

(1)

.

2000 May 02 12

Philips Semiconductors Product specification

Buffer with open-drain output

74AHC1G07;

74AHCT1G07

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswill be
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to resultin personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyoftheseproducts,conveysnolicenceortitle
under any patent, copyright, or mask work right to these
products,andmakesnorepresentations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 May 02 13

Philips Semiconductors Product specification

Buffer with open-drain output

74AHC1G07;

74AHCT1G07

NOTES

2000 May 02 14

Philips Semiconductors Product specification

Buffer with open-drain output

74AHC1G07;

74AHCT1G07

NOTES

2000 May 02 15

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TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

69

Printed in The Netherlands 613507/01/pp16 Date of release: 2000 May 02 Document order number: 9397 750 07041