Datasheet 74ACTQ10SCX, 74ACTQ10SC, 74ACTQ10PC, 74ACTQ10MTCX, 74ACTQ10MTC Datasheet (Fairchild Semiconductor)

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© 2000 Fairchild Semiconductor Corporation DS010892 www.fairchildsemi.com
August 1990 Revised August 2000
74ACTQ10 Quiet Series
Tripl e 3-Input NAND Gate
74ACTQ10 Quiet Series
General Description
The ACTQ10 contains three, 3-in put NAND gat es and uti­lizes Fairchild FACT Quiet Series
technology to guaran-
tee quiet output switching and impr ove d dyna mic thr esh old performance. FACT Quiet Series features GTO
output
control and undershoot corrector in addition to a split ground bus for superior ACMOS performance.
Features
ICC reduced by 50%
Guaranteed simultaneous switching noise level and
dynamic threshold performan ce
Improved latch-up immunity
Outputs source/sink 24 mA
ACTQ 10 has TTL-compatible in put s
Ordering Code:
Device also available in Tape and Reel. Specify by appending s uffix let te r “X” to the ordering code.
Logic Symbol
IEEE/IEC
Connection Diagram
Pin Descriptions
FACT, Qui et Series , FACT Quiet Series, an d GTO are trademarks of Fairchild Semiconductor Corporation.
Order Number Package Number Package Description
74ACTQ10SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow Body 74ACTQ10MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74ACTQ10PC N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Pin Names Descriptions
A
n
, Bn, C
n
Inputs
O
n
Outputs
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74ACTQ10
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which damage to the
device may occur. The databo ok specifications should be met, with out exception, to ensure that the system design is reliable over its power sup­ply, temperature, and output/input loading variables. Fairchild does not rec­ommend operation outside of databook sp ec if ic ations.
DC Electrical Characteristics
Note 2: All outputs loaded; thresholds on input assoc iat ed with output under tes t. Note 3: Maximum test duratio n 2. 0 ms, one output loaded at a time. Note 4: DIP Package . Note 5: Max number of output s d ef ined as (n). Data inputs are 0V to 3V. One output @ GND. Note 6: Max number of data inputs (n) switching. (n-1) inputs switching 0V to 3V. Input-under -te s t swit c hing:
3V to threshold (V
ILD
), 0V to threshold (V
IHD
), f = 1MHZ.
Supply Voltage (VCC) 0.5V to +7.0V DC Input Diode Current (I
IK
)
V
I
= 0.5V 20 mA
V
I
= VCC + 0.5V +20 mA
DC Input Voltage (V
I
) 0.5V to VCC + 0.5V
DC Output Diode Current (I
OK
)
V
O
= 0.5V 20 mA
V
O
= VCC + 0.5V +20 mA
DC Output Voltage (V
O
) 0.5V to VCC + 0.5V
DC Output Source
or Sink Current (I
O
) ± 50 mA
DC V
CC
or Ground Current
per Output Pin (I
CC
or I
GND
) ± 50 mA
Storage Temperature (T
STG
) 65°C to +150°C
DC Latch-Up Source or Sink Current
± 300 mA
Junction Temperature (T
J
)
PDIP 140
°C
Supply Voltage (V
CC
) 4.5V to 5.5V
Input Voltage (V
I
) 0V to V
CC
Output Voltage (VO) 0V to V
CC
Operating Temperature (TA) 40°C to +85°C Minimum Input Edge Rate (
V/t) 125 mV/ns
V
IN
from 0.8V to 2.0V
V
CC
@ 4.5V, 5.5V
Symbol Parameter
V
CC
TA = +25°CTA = 40°C to +85°C
Units Conditions
(V) Typ Guaranteed Limits
V
IH
Minimum HIGH Level 4.5 1.5 2.0 2.0
V
V
OUT
= 0.1V
Input Voltage 5.5 1.5 2.0 2.0 or VCC 0.1V
V
IL
Maximum LOW Level 4.5 1.5 0.8 0.8
V
V
OUT
= 0.1V
Input Voltage 5.5 1.5 0.8 0.8 or VCC 0.1V
V
OH
Minimum HIGH Level 4.5 4.49 4.4 4.4
VI
OUT
= 50 µA
Output Voltage 5.5 5.49 5.4 5.4
VIN = VILor V
IH
4.5 3.86 3.76 V IOH = 24 mA
5.5 4.86 4.76 I
OH
= 24 mA (Note 2)
V
OL
Maximum LOW Level 4.5 0.001 0.1 0.1
VI
OUT
= 50 µA
Output Voltage 5.5 0.001 0.1 0.1
VIN = VILor V
IH
4.5 0.36 0.44 V IOL = 24 mA
5.5 0.36 0.44 IOL = 24 mA (Note 2)
I
IN
Maximum Input Leakage Current 5.5 ± 0.1 ± 1.0 µAVI = VCC, GND
I
CCT
Maximum ICC/Input 5.5 0.6 1.5 mA VI = VCC 2.1V
I
OLD
Minimum Dynamic 5.5 75 mA V
OLD
= 1.65V Max
I
OHD
Output Current (Note 3) 5.5 −75 mA V
OHD
= 3.85V Min
I
CC
Maximum Quiescent Supply Current 5.5 2.0 20.0 µAVIN = VCC or GND
V
OLP
Quiet Output
5.0 1.1 1.5 V
Figures 1, 2
Maximum Dynamic V
OL
(Note 4)(Note 5)
V
OLV
Quiet Output
5.0 0.6 1.2 V
Figures 1, 2
Minimum Dynamic V
OL
(Note 4)(Note 5)
V
IHD
Minimum HIGH Level Dynamic Input Voltage 5.0 1.9 2.2 V (Note 4)(Note 6)
V
ILD
Maximum LOW Level Dynamic Input Voltage 5.0 1.2 0.8 V (Note 4)(Note 6)
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74ACTQ10
AC Electrical Characteristics
Note 7: Voltage Range 5.0 is 5.0V ± 0.5V. Note 8: Skew is defined as t he absolute value of t he difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t
OSHL
) or LOW-to-HIGH (t
OSLH
). Parameter guaranteed by design.
Capacitance
V
CC
TA = +25°CT
A
= 40°C to +85°C
Symbol Parameter (V)
C
L
= 50 pF CL = 50 pF
Units
(Note 7) Min Typ Max Min Max
t
PLH
Propagation Delay 5.0 2.0 6.0 7.5 2.0 8.5 ns
t
PHL
Propagation Delay 5.0 2.0 6.0 7.5 2.0 8.5 ns
t
OSHL
Output to Output
5.0 0.5 1.0 1.0 ns
t
OSLH
Skew (Note 8)
Symbol Parameter Typ Units Conditions
C
IN
Input Capacitance 4.5 pF VCC = OPEN
C
PD
Power Dissipation Capacitance 85 pF VCC = 5.0V
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74ACTQ10
FACT Noise Characteristics
The setup of a noise characteristics measurement is critical to the accuracy and repeatability of the tests. The following is a brief description of the setup used to measure the noise characteristics of FACT
.
Equipment:
Hewlett Packard Model 8180A Word Generator PC-163A Test Fixture Tektronics Model 7854 Oscilloscope
Procedure:
1. Verify Test Fixture Loading: Standard Load 50 pF, 500
Ω.
2. Deskew the HFS generator so that no two channels have greater than 15 0 ps skew between them. This requires that the oscilloscope be deskewed first. It is important to deskew the HFS generator channels before testing. This will ensure that the outputs sw itch simultaneously.
3. Terminate all inputs and outputs to ens ure pro per load ­ing of the outputs a nd that the input levels a re at the correct voltage.
4. Set the HFS ge nerato r to togg le all bu t one out put at a frequency of 1 MHz. Greater fre quencies will increa se DUT heating and effect the results of the measure­ment.
V
OHV
and V
OLP
are measured with respect to ground reference.
Input pulses have the following characteristics: f = 1MHz, t
r
= 3ns, tf =
3 ns, skew < 150 ps.
FIGURE 1. Quiet Output Noise Voltage Waveforms
5. Set the HFS gene rator input lev els at 0V LOW a nd 3V HIGH for ACTQ devices and 0V LOW and 5V HIGH for AC devices. Verify levels with an oscilloscope.
V
OLP/VOLV
and V
OHP/VOHV
:
Determine the quiet output pin that demonstrates the greatest noise levels. The worst case pin will usually be the furthest from the gr ound pin. Monitor th e o utp ut volt­ages using a 50
coaxial cable plugged into a standa rd
SMB type connector on the te st fixture. Do not use an active FET probe.
Measure V
OLP
and V
OLV
on the quiet output du ring the
worst case transition for active and enable. Measure V
OHP
and V
OHV
on the quiet output during the worst
case transition.
Verify that the GND reference recorded on the oscillo­scope has not drifted to ensure the accuracy and repeat­ability of the measurements.
V
ILD
and V
IHD
:
Monitor one of the switching outputs using a 50
coaxial
cable plugged into a standard SMB type connec tor on the test fixture. Do not use an active FET probe.
First increase the input LOW voltage level , V
IL
, until the
output begins to oscillate or steps ou t a min of 2 ns. Oscillation is defined as noise on the output LOW level that exceeds V
IL
limits, or on output HIGH levels that
exceed V
IH
limits. The input LOW voltage level at which
oscillation occurs is defined as V
ILD
.
Next decrease the input HIGH voltage level, V
IH
, until
the output begins to oscillate or step s out a min of 2 ns. Oscillation is defined as noise on the output LOW level that exceeds V
IL
limits, or on output HIGH levels that
exceed V
IH
limits. The input HIGH voltage level at which
oscillation occurs is defined as V
IHD
.
Verify that the GND reference recorded on the oscillo­scope has not drifted to ensure the accuracy and repeat­ability of the measurements.
FIGURE 2. Simultaneous Switching Test Circuit
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74ACTQ10
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow Body
Package Number M14A
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74ACTQ10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
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74ACTQ10 Quiet Series
Tripl e 3-Input NAND Gate
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the labe l ing, can be re a­sonably expected to result in a significant injury to the user.
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the l ife support device or system, or to affect its safety or effectiveness.
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