Datasheet 74ABT861PW, 74ABT861N, 74ABT861DB, 74ABT861D Datasheet (Philips)

INTEGRATED CIRCUITS

74ABT861

10-bit bus transceiver (3-State)

Product specification
Supersedes data of 1995 Sep 06

IC23 Data Handbook

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1998 Jan 16

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

FEA TURES

•Provides high performance bus interface buffering for wide

data/address paths or buses carrying parity

•Buffered control inputs for light loading, or increased fan-in as

required with MOS microprocessors

•Output capability: +64mA/–32mA

•Latch-up protection exceeds 500mA per Jedec Std 17

•ESD protection exceeds 2000 V per MIL STD 883 Method 3015

and 200 V per Machine Model

•Power-up 3-State

•Inputs are disabled during 3-State mode

QUICK REFERENCE DATA

SYMBOL PARAMETER

t

PLH

t

PHL

C
C
I

CCZ

IN

I/O

Propagation delay
An to Bn or Bn to An

Input capacitance VI = 0V or V
I/O capacitance Outputs disabled; VO = 0V or V
Total supply current Outputs disabled; VCC =5.5V 500 nA

DESCRIPTION

The 74ABT861 bus transceiver provides high performance bus
interface buffering for wide data/address paths of buses carrying
parity.

The 74ABT861 10-bit bus transceiver has NOR-ed transmit and
receive output enables for maximum control flexibility.

CONDITIONS

T

= 25°C; GND = 0V

amb

CL = 50pF; VCC = 5V 3.4 ns

CC

CC

TYPICAL UNIT

4 pF
7 pF

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER

24-Pin Plastic DIP –40°C to +85°C 74ABT861 N 74ABT861 N SOT222-1
24-Pin plastic SO –40°C to +85°C 74ABT861 D 74ABT861 D SOT137-1
24-Pin Plastic SSOP Type II –40°C to +85°C 74ABT861 DB 74ABT861 DB SOT340-1
24-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT861 PW 74ABT861PW DH SOT355-1

PIN CONFIGURATION

1

OEBA

2

A0

3

A1

4

A2

5

A3

6

A4

7

A5

8

A6

9

A7 B7

10 15

A8

11 14A9
12 13GND

TOP VIEW

24

V

CC

23

B0

22

B1

21

B2

20

B3

19

B4

18

B5

17

B6

16

B8
B9
OEAB

PIN DESCRIPTION

PIN NUMBER SYMBOL FUNCTION

13 OEAB

2, 3, 4, 5, 6,

7, 8, 9, 10, 11

23, 22, 21, 20, 19,

18, 17, 16, 15, 14

A0-A9 Data inputs/outputs (A side)

B0-B9 Data inputs/outputs (B side)

1 OEBA

12 GND Ground (0V)
24 V

A side to B side output enable
input (active-Low)

B side to A side output enable
input (active-Low)

Positive supply voltage

CC

SA00278

1998 Jan 16 853-1621 18866

2

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

LOGIC SYMBOL

2345 6789

A0 A1 A2 A3 A4 A5 A6 A7

1

OEBA

13

OEAB
B0 B1 B2 B3 B4 B5 B6 B7

23 22 21 20 19 18 17 16

LOGIC DIAGRAM

OEAB

OEBA

10 11

A8 A9

B8 B9

15 14

SA00279

1010

An Bn

SA00281

LOGIC SYMBOL (IEEE/IEC)

1

EN1(BA)

13

EN2(AB)

223

322
421
520
619
718
817

916
10 15
11 14

1

2

SA00280

FUNCTION TABLE

INPUTS OPERATING

OEAB OEBA MODE

L H A data to B bus
H L B data to A bus
H H Z

H = High voltage level
L = Low voltage level
X = Don’t care
Z = High impedance “off” state

ABSOLUTE MAXIMUM RATINGS

SYMBOL

V

CC

I

IK

V

I

I

OK

V

OUT

I

OUT

T

stg

DC supply voltage –0.5 to +7.0 V
DC input diode current VI < 0 –18 mA
DC input voltage
DC output diode current VO < 0 –50 mA
DC output voltage
DC output current output in Low state 128 mA
Storage temperature range –65 to 150 °C

PARAMETER CONDITIONS RATING UNIT

3

3

1, 2

–1.2 to +7.0 V

output in Off or High state –0.5 to +5.5 V

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.

3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

1998 Jan 16

3

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER LIMITS UNIT

Min Max

V

CC

V
V
V
I

OH

I

OL

∆t/∆v Input transition rise or fall rate 0 5 ns/V

T

amb

DC ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER TEST CONDITIONS T

V

IK

V

OH

V

OL

I

I

OFF

I

PU/PD

IIH + I

IIL + I

I

CEX

I

O

I

CCH

I

CCL

I

CCZ

∆I

CC

NOTES:

1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.

2. This is the increase in supply current for each input at 3.4V.

3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V  10%, a
transition time of up to 100µsec is permitted.

DC supply voltage 4.5 5.5 V
Input voltage 0 V

I

High-level input voltage 2.0 V

IH

Low-level input voltage 0.8 V

IL

CC

High-level output current –32 mA
Low-level output current 64 mA

Operating free-air temperature range –40 +85 °C

LIMITS

T

amb

= +25°C

amb

to +85°C

Min Typ Max Min Max

Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V

VCC = 4.5V; IOH = –3mA; VI = VIL or V

High–level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or V

VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low–level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or V
Input leakage Control pins VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA

I

IH
IH

IH

IH

2.5 3.5 2.5 V

3.0 4.0 3.0 V

2.0 2.6 2.0 V

0.42 0.55 0.55 V

current Data pins VCC = 5.5V; VI = GND or 5.5V ±5.0 ±100 ±100 µA
Power-off leakage current VCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA

Power–up/down 3-State
output current

3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or V

OZH

3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or V

OZL

3

Output high leakage current VCC = 5.5V; VO = 5.5V; VI = GND or V
Output current

1

Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or V

Additional supply current per
input pin

2

VCC = 2.1V; VO = 0.5V; VI = GND or VCC;

VOE = V

CC

IH
IH

CC

±5.0 ±50 ±50 µA

5.0 50 50 µA

–5.0 –50 –50 µA

5.0 50 50 µA
VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA
VCC = 5.5V; Outputs High, VI = GND or V

VCC = 5.5V; Outputs 3-State;
VI = GND or V

CC

Outputs enabled, one input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

Outputs 3-State, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V

CC

CC

0.5 250 250 µA

25 38 38 mA

0.5 50 50 µA

0.5 1.5 1.5 mA

0.01 50 50 µA

0.5 1.5 1.5 mA

= –40°C

V

UNIT

1998 Jan 16

4

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

AC CHARACTERISTICS

GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω

LIMITS

T

= -40 to

SYMBOL PARAMETER WAVEFORM

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

Propagation delay
An to Bn or Bn to An

Output enable time
to High and Low level

Output disable time
from High and Low level

1

2

2

AC WAVEFORMS

VM = 1.5V, VIN = GND to 3.0V

T

= +25oC

amb

V

= +5.0V

CC

Min Typ Max Min Max

1.1

1.0

1.2

2.4

3.1

3.7

3.4

3.2

3.5

4.6

5.3

5.3

4.9

4.9

5.0

6.0

6.5

6.6

amb

+85oC

VCC = +5.0V ±0.5V

1.1

1.0

1.2

2.4

3.1

3.7

5.2

5.2

5.9

6.9

7.5

7.1

UNIT

ns

ns

ns

INPUT

OUTPUT

V

M

t

PLH

V

M

Waveform 1. Input to Output Propagation Delays

TEST CIRCUIT AND WAVEFORM

From Output
Under Test

C

= 50 pF

L

DEFINITIONS

= Load capacitance includes jig and probe capacitance;

C

L

see AC CHARACTERISTICS for value.

500 Ω

500 Ω

Load Circuit

TEST S1

t

pd

t

PLZ/tPZL

t

PHZ/tPZH

open

7 V

open

V

M

t

PHL

V

M

SA00023

OEXX

INPUT

OUTPUT

OUTPUT

V

M

t

PZL

V

M

t

PZH

V

M

V

M

t

t

PLZ

PHZ

3.5V

V

+ 0.3V

OL

V

OL

V

OH

V

OH

0V

SA00282

– 0.3V

Waveform 2. 3-State Output Enable and Disable Times

7 V

S1

Open

GND

1998 Jan 16

SA00012

5

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

DIP24: plastic dual in-line package; 24 leads (300 mil) SOT222-1

1998 Jan 16

6

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

1998 Jan 16

7

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

1998 Jan 16

8

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1

1998 Jan 16

9

Philips Semiconductors Product specification

74ABT86110-bit bus transceiver (3-State)

Data sheet status

Data sheet
status

Objective
specification

Preliminary
specification

Product
specification

Product
status

Development

Qualification

Production

Definition

This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.

[1]

[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone [phone]

 Copyright Philips Electronics North America Corporation 1998

All rights reserved. Printed in U.S.A.

print code Date of release: 05-96
Document order number: 9397-750-03476

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