Product specification
Supersedes data of 1995 Jun 15
IC23 Data Handbook
1998 Feb 11
Page 2
Philips SemiconductorsProduct specification
74ABT2952Octal registered transceiver (3-State)
FEA TURES
•8-bit registered transceiver
•Independent registers for A and B buses
•Output capability: +64mA/–32mA
•Latch-up protection exceeds 500mA per JEDEC Std 17
•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
•Power-up 3-State
•Power-up reset
DESCRIPTION
The 74ABT2952 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT2952 device is an 8-bit registered transceiver. Two 8-bit
back-to-back registers store data flowing in both directions between
two bidirectional buses. Data applied to the inputs is entered and
stored on the rising edge of the Clock (CPXX) provided that the
Clock Enable (CEXX
output buffers, but is only accessible when the Output Enable
(OEXX) is Low. Data flow from A inputs to B outputs is the same as
for B inputs to A outputs.
) is Low. The data is then present at the 3-State
•Live insertion/extraction permitted
QUICK REFERENCE DATA
SYMBOLPARAMETER
t
PLH
t
PHL
C
C
I
CCZ
IN
I/O
Propagation delay
CPBA to An or
CL = 50pF; VCC = 5V5.7ns
CPAB to Bn
Input capacitanceVI = 0V or V
I/O capacitanceOutputs disabled; VO = 0V or V
Total supply currentOutputs disabled; VCC =5.5V110µA
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
24-Pin Plastic DIP–40°C to +85°C74ABT2952 N74ABT2952 NSOT222-1
24-Pin plastic SO–40°C to +85°C74ABT2952 D74ABT2952 DSOT137-1
24-Pin Plastic SSOP Type II–40°C to +85°C74ABT2952 DB74ABT2952 DBSOT340-1
24-Pin Plastic TSSOP Type I–40°C to +85°C74ABT2952 PW7ABT2952PW DHSOT355-1
CONDITIONS
T
= 25°C; GND = 0V
amb
CC
CC
TYPICALUNIT
4pF
7pF
PIN CONFIGURATION
V
1
B7
2
B6
3
B5
4
B4
5
B3
6
B2
7
B1
8
B0
9
OEAB
1015
CPAB
1114CEAB
1213GND
1998 Feb 1 1853-1554 18949
24
23
22
21
20
19
18
17
16
SA00114
CC
A7
A6
A5
A4
A3
A2
A1
A0
OEBA
CPBA
CEBA
PIN DESCRIPTION
PIN
NUMBER
10, 14
11, 13
16, 17, 18,
19, 20, 21,
22, 23
1, 2, 3, 4, 5,
6, 7, 8
9, 15
12GNDGround (0V)
24V
2
SYMBOLNAME AND FUNCTION
CPAB /
CPBA
CEAB /
CEBA
Clock input A to B / Clock input B to A
Clock enable input A to B / Clock
enable input B to A
A0 – A7Data inputs/outputs (A side)
B0 – B7Data outputs/outputs (B side)
OEAB /
OEBA
Output enable inputs
Positive supply voltage
CC
Page 3
Philips SemiconductorsProduct specification
74ABT2952Octal registered transceiver (3-State)
LOGIC SYMBOL
16 17 18 19 20 21 22 23
A0 A1 A2 A3 A4 A5 A6 A7
10
CPAB
11
CEAB
14
CPBA
13
CEBA
B0 B1 B2 B3 B4 B5 B6 B7
87654321
LOGIC SYMBOL (IEEE/IEC)
11
13
15
9
10
14
EN1
EN2
EN3
EN4
C5
C6
OEBA
OEAB
SA00115
FUNCTION TABLE for Register An or Bn
INPUTS
An or BnCPXXCEXX
XXHNCHold data
L
15
9
H
H = High voltage level
↑
↑
L =Low voltage level
↑ =Low–to–High transition
X = Don’t care
XX= AB or BA
NC=No change
INTERNALOPERATING
QMODE
L
L
L
H
Load data
FUNCTION TABLE for Output Enable
INPUTS
OEXX
HXZDisable outputs
L
L
H = High voltage level
L =Low voltage level
X = Don’t care
XX= AB or BA
Z =High impedance “off” state
INTERNALAn or BnOPERATING
QOUTPUTSMODE
L
H
L
H
Enable outputs
16
17
18
19
20
21
22
23
1, 4, 52, 3, 6
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
I
IK
V
I
I
OK
V
OUT
I
OUT
T
stg
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
DC input voltage
DC output diode currentVO < 0–50mA
DC output voltage
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
PARAMETERCONDITIONSRATINGUNIT
3
3
1, 2
8
7
6
5
4
3
2
1
SA00116
–1.2 to +7.0V
output in Off or High state–0.5 to +5.5V
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or V
OH
VCC = 4.5V; IOH = –32mA; VI = VIL or V
Low-level output voltageVCC = 4.5V; IOL = 64mA; VI = VIL or V
OL
Power-up output low
3
voltage
I
Input leakageControl pins VCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
VCC = 5.5V; IO = 1mA; VI = GND or V
IH
IH
IH
IH
CC
2.53.52.5V
3.04.03.0V
2.02.62.0V
0.420.550.55V
0.130.550.55V
currentData pinsVCC = 5.5V; VI = GND or 5.5V5100100µA
I
OFF
IPU/I
I
OZH
I
OZL
I
CEX
I
CCH
I
CCL
I
CCZ
∆I
Power-off leakage currentVCC = 0.0V; VO = 4.5V; VI = 0.0V or 5.5V±5.0±100±100µA
Power-up/down 3-State
PD
output current
4
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
Output High leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
I
O
Output current
1
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
Additional supply current per
CC
input pin
2
VCC = 2.1V; VO = 0.5V; VI = GND or VCC;
VOE = Don’t care
IH
IH
CC
±5.0±50±50µA
5.05050µA
–5.0–50–50µA
5.05050µA
VCC = 5.5V; VO = 2.5V–50–80–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or V
VCC = 5.5V; Outputs 3-State;
VI = GND or V
CC
VCC = 5.5V; one input at 3.4V,
other inputs at VCC or GND
CC
CC
110250250µA
203030mA
110250250µA
0.31.51.5mA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V .
3. For valid test results, data must not be loaded into the flip-flops (or latches) after applying the power.
4. This parameter is valid for any V
transition time of up to 100µsec is permitted.
between 0V and 2.1V , with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a
CC
amb
to +85°C
UNIT
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
f
MAX
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
1998 Feb 1 1
Maximum clock frequency1150250150MHz
Propagation delay
CPBA to An, CPAB to Bn
Output enable time
OEBA to An, OEAB to Bn
Output disable time
OEBA to An, OEAB to Bn
1
3
4
3
4
LIMITS
T
amb
V
CC
= +25°C
= +5.0V
T
= –40°C to +85°C
amb
V
= +5.0V ±0.5V
CC
MinTypMaxMinMax
2.0
2.5
1.0
2.2
2.0
1.5
3.2
3.8
3.2
4.4
3.6
2.8
6.6
7.2
4.8
6.2
7.6
7.1
2.0
2.5
1.0
2.2
2.0
1.5
5
7.6
8.2
5.8
7.5
8.1
7.6
UNIT
ns
ns
ns
Page 6
Philips SemiconductorsProduct specification
74ABT2952Octal registered transceiver (3-State)
AC SETUP REQUIREMENTS
LIMITS
T
SYMBOLPARAMETERWAVEFORM
tS(H)
ts(L)
th(H)
t
(L)
h
ts(H)
ts(L)
th(H)
th(L)
tw(H)
tw(L)
Setup time
An to CPAB or Bn to CPBA
Hold time
An to CPAB or Bn to CPBA
Setup time
CEAB to CPAB, CEBA to CPBA
Hold time
CEAB to CPAB, CEBA to CPBA
CPAB or CPBA pulse width,
High or Low
2
2
2
2
1
= +25°C
amb
V
= +5.0V
CC
MinTypMin
4.5
3.5
0.0
0.0
4.0
3.0
0.0
0.0
3.0
3.5
2.2
1.6
–0.8
–1.4
0.8
0.8
–0.7
–0.7
0.8
0.9
T
= –40°C to +85°C
amb
V
= +5.0V ±0.5V
CC
4.5
3.5
0.0
0.0
4.0
3.0
0.0
0.0
3.0
3.5
UNIT
ns
ns
ns
ns
ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
1/f
MAX
CPBA or
CPAB
An or Bn
Waveform 1. Propagation Delay, Clock Input to Output, Clock
Pulse Width, and Maximum Clock Frequency
An, Bn
CEAB,
CEBA
t
CPAB,
CPBA
Waveform 2. Data Setup and Hold Times
V
M
tw(H)tw(L)
t
PHL
V
M
(H)th(H)ts(L)th(L)
s
V
M
V
M
V
M
V
M
V
t
M
PLH
V
M
SA00087
V
V
M
M
V
M
SA00118
OEAB,
OEBA
An, Bn
V
M
t
PZH
V
M
t
PHZ
V
OH
V
M
VOH –0.3V
0V
SA00119
Waveform 3. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
OEAB,
OEBA
An, Bn
V
M
t
PZL
V
M
t
PLZ
V
M
VOL +0.3V
V
OL
SA00120
Waveform 4. 3–State Output Enable Time to Low Level and
Output Disable Time from Low Level
TEST CIRCUIT AND WAVEFORMS
1998 Feb 1 1
6
Page 7
Philips SemiconductorsProduct specification
74ABT2952Octal registered transceiver (3-State)
From Output
Under Test
C
= 50 pF
L
t
DEFINITIONS
=Load capacitance includes jig and probe capacitance;
SO24: plastic small outline package; 24 leads; body width 7.5 mmSOT137-1
1998 Feb 1 1
9
Page 10
Philips SemiconductorsProduct specification
74ABT2952Octal registered transceiver (3-State)
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mmSOT340-1
1998 Feb 1 1
10
Page 11
Philips SemiconductorsProduct specification
74ABT2952Octal registered transceiver (3-State)
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mmSOT355-1
1998 Feb 1 1
11
Page 12
Philips SemiconductorsProduct specification
74ABT2952Octal registered transceiver (3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03479
yyyy mmm dd
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