Datasheet 33977 Datasheet (Freescale)

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Page 1

Freescale Semiconductor

Technical Data

Single Gauge Driver

Document Number: MC33977

Rev. 2.0, 1/2007

The 33977 is a Serial Peripheral Interface (SPI) Controlled, stepper motor gauge driver Integrated Circuit (IC). This monolithic IC consists of a dual H-Bridge coil driver and its associated control logic. The HBridge drivers are used to automatically control the speed, direction, and magnitude of current through the coils of a two-phase instrumentation stepper motor, similar to an MMT-licensed AFIC 6405 of Switec MS-X156.xxx motor.

Features

• MMT-Licensed Two-Phase Stepper Motor Compatible

• Switec MS-X15.xxx Stepper Motor Compatible

• Minimal Processor Overhead Required

• Fully Integrated Pointer Movement and Position State Machine with Air Core Movement Emulation

• 4096 Possible Steady State Pointer Positions

• 340° Maximum Pointer Sweep

• Maximum Acceleration of 4500°/s

• Maximum Pointer Velocity of 400°/s

• Analog Microstepping (12 Steps/Degrees of Pointer Movement)

• Pointer Calibration and Return to Zero (RTZ)

• Controlled via 16-Bit SPI Messages

• Internal Clock Capable of Calibration

• Low Sleep Mode Current

• Pb-Free Packaging Designated by suffix code EG

SINGLE GAUGE DRIVER

ORDERING INFORMATION

Device

MC33977DW/R2 MCZ33977EG/R2

33977

DW SUFFIX

EG SUFFIX (Pb-FREE)

98ASB42344B

24-PIN SOICW

Temperature

Range (T

- 40°C to 125°C 24 SOICW

)

Package

PWR

33977

5.0 V

Regulator

MCU

Figure 1. 33977 Simplified Application Diagram

Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products.

VPWR

VDD

RTZ RST CS SCLK SI SO

GND

SIN+ SIN-

COS+ COS-

Motor

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INTERNAL BLOCK DIAGRAM

VPWR

VDD

SCLK

RST

INTERNAL

REGULATOR

COS

SPI

LOGIC

UNDER

AND

OVERVOLTAGE

DETECT

STATE

MACHINE

ILIM

OVERTEMPERATURE

DETECT

SIGMA-DELTA

ADC

H-BRIDGE

AND

CONTROL

SIN

VDD

MULTIPLEXER

COS+ COS-

SIN+ SIN-

OSCILLATOR

AGND

GND (8)

Figure 2. 33977 Simplified Internal Block Diagram

RTZ

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PIN CONNECTIONS

COS+

COS-

SIN+

SINGND GND GND GND

SCLK

NC NC NC NC GND GND GND GND VPWR RST VDD RTZ

Figure 3. 33977 Pin Connections

Table 1. 33977 Pin Definitions

A functional description of each pin can be found in the Functional Pin Descri ption section beginning onpage 10.

Pin Pin Name Pin Function Formal Name Definition

1 2 3 4

5 to 8,

17 to 20

10 SCLK

11 SO

13 RTZ

14 VDD 15 RST

16 VPWR

21, 22, 23, 24

(MS Motor

Pin #)

COS+ (MS #4)

COS- (MS #3)

SIN+ (MS #1)

SIN- (MS #2)

GND

Output

N/A

Input

Output

Input

Multiplexed

Output

Input Input

Input

–

H-Bridge Outputs 0 Each pin is the output of a half-bridge, designed to source or sink current.

Ground Ground pins

Chip Select This pin is connected to a chip select output of a Large Scale Integration

(LSI) Master IC and controls which device is addressed.

Serial Clock This pin is connected to the SCLK pin of the master device and acts as a

bit clock for the SPI port.

Serial Output This pin is connected to the SPI Serial Data Input pin of the Master device

or to the SI pin of the next device in a daisy chain.

Serial Input This pin is connected to the SPI Serial Data Output pin of the Master

device from which it receives output command data.

Return to Zero This is a multiplexed output pin for the non-driven coil, during a Return to

Zero (RTZ) event.

Voltage This SPI and logic power supply input will work with 5.0 V supplies.

Reset This pin is connected to the Master and is used to reset the device, or

place it into a sleep state by driving it to Logic [1]. When this pin is driven to Logic [0], all internal logic is forced to the default state. This input has an internal active pull-up.

Battery Voltage Power supply

No Connect These pins are not connected to any internal circuitry, or any other pin,

and may be connected to the board where convenient.

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ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings Symbol Value Unit

ELECTRICAL RATINGS

Power Supply Voltage

Steady-State Input Pin Voltage SIN± COSI± Continuous Current Per Output ESD Voltage

(1)

(2)

(3)

Human Body Model (HBM)

Machine Model (MM)

Charge Device Model (CDM)

THERMAL RATINGS

Operating Temperature

Ambient

Junction Storage Temperature T Thermal Resistance

Junction-to-Ambient

Junction-to-Lead Peak Package Reflow Temperature During Reflow

(4), (5)

Notes

1. Exceeding voltage limits on Input pins may cause permanent damage to the device.

2. Output continuous output rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperature will require maximum output current computation using package thermal resistances.

3. ESD testing is performed in accordance with the Human Body Model (HBM) (C (C

ZAP

= 200 pF, R

= 0 Ω), and the Charge Device Model (CDM).

ZAP

4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.

5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

PWRSS

OUTMAX

ESD

STG

ΘJA

ΘJL

PPRT

= 100 pF, R

ZAP

-0.3 to 41

-0.3 to 7.0 V 40 mA

±2000 ±2000

±200

-40 to 125

-40 to 150

-55 to 150 °C

°C/W 60 20

Note 5

= 1500 Ω), the Machine Model (MM)

ZAP

°C

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STATIC ELECTRICAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

STATIC ELECTRICAL CHARACTERISTICS

Table 3. Static Electrical Characteristics

Characteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA< 125°C, unless otherwise noted. Typical

values noted reflect the approximate parameter means at T

Characteristic Symbol Min Typ Max Unit

POWER INPUT (VDD)

Battery Supply Voltage Range

Fully Operational Limited Operation

Supply Current

PWR

Gauge Outputs ON, No Output Loads

VPWR Supply Current (All Outputs Disabled)

Reset = Logic [0], V Reset = Logic [0], V

Overvoltage Detection Level Undervoltage Detection Level Logic Supply Voltage Range (5.0 V Nominal Supply) Under VDD Logic Reset VDD Supply Current

Sleep: Reset Logic [0] Outputs Enabled

POWER OUTPUT (SIN-, SIN+, COS-, COS+)

Microstep Output (Measured Across Coil Outputs) SIN± (COS±) (Refer to Pin Definitions onpage 3) R

= 200 Ω, PE6 = 0

OUT

Steps Pin Definitions 6, 18, 0, 12

5, 7, 17, 19 1, 11, 13, 23 4, 8, 16, 20 2, 10, 14, 22 3, 9, 15, 21 3, 9, 15, 21 2, 10, 14, 22 5, 7, 17, 19 1, 11, 13, 23 5, 7, 17, 19 0, 12 6, 18

Full Step Active Output (Measured Across Coil Outputs)

SIN± (COS±), Steps 1,3 (Pin Definitions 0 and 2)

Notes

6. Outputs and logic remain active; however, the larger coil voltage levels may be clipped. The reduction in drive voltage may result in a loss of position control.

7. The logic will reset at some level below the specified Limited Operational minimum.

8. Outputs will disable and must be re-enabled via the PECCR command.

9. Outputs remain active; however, the reduction in drive voltage may result in a loss of position control.

10. See Figure 7.

(6), (7)

DD DD

= 5.0 V = 0 V

(8)

(9)

(10)

= 25°C under nominal conditions unless otherwise noted.

PWR

6.5

4.0

– 26

– 4.0 6.0

PWRSLP1

PWRSLP2

PWROV

PWRUV

DDUV

DDOFF

DDON

ST6

ST5

ST4

ST3

ST2

ST1

ST0

– –

42 15

60 25

26 32 38 V

5.0 5.6 6.2 V

4.5 5.0 5.5 V – – 4.5 V

4.82

0.94 V

0.84 V

0.68 V

0.47 V

0.23 V

0.1

– –

ST6 ST6 ST6 ST6 ST6

1.0

5.3

0.97 V

0.87 V

0.71 V

0.50 V

0.26 V

0.0

ST6 ST6 ST6 ST6 ST6

1.8

6.0

1.0 V

0.96 V

0.8 V

0.57 V

0.31 V

0.1

ST6

ST6 ST6

4.9 5.3 6.0

µA

µV

33977

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ELECTRICAL CHARACTERISTICS

STATIC ELECTRICAL CHARACTERISTICS

Table 3. Static Electrical Characteristics (continued)

Characteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA< 125°C, unless otherwise noted. Typical

values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic Symbol Min Typ Max Unit

POWER OUTPUT (SIN-, SIN+, COS-, COS+) (Continued)

Microstep Full Step Output (Measured from Coil Low Side to Ground)

SIN± (COS±) I

Output Flyback Clamp Output Current Limit (Output - V Overtemperature Shutdown Overtemperature Hysteresis

OUT

= 30 mA

(11)

(12)

ST6

)

CONTROL I/O (SI, SCLK, CS, RST, SO)

Input Logic High Voltage Input Logic Low Voltage Input Logic Voltage Hysteresis

(12)

Input Logic Pull-Down Current (SI, SCLK) Input Logic Pull-Up Current (CS, RST) SO High State Output Voltage (IOH = 1.0 mA) SO Low State Output Voltage (IOL = 1.6 mA) SO Tri-State Leakage Current (CS = 3.5 V) Input Capacitance SO Tri-State Capacitance

(13)

ANALOG TO DIGITAL CONVERTER (RTZ ACCUMULATOR COUNT)

ADC Gain

(12), (14)

Notes

11. Outputs remain active; however, the reduction in drive voltage may result in a loss of position control.

12. This parameter is guaranteed by design; however, it is not production tested.

13. Capacitance not measured. This parameter is guaranteed by design; however, it is not production tested.

14. Reference RTZ Accumulator (Typical) on page 30

V I

LIM

HYST

INHYST

DWN

SOH

SOLK

ADC

SOL

0.0 0.1 0.3 – V

ST6

+ 0.5 V

+ 1.0 V

ST6

40 100 170 mA

155 – 180 °C

8.0 – 16 °C

2.0 – – V – – 0.8 V – 100 – mV

3.0 – 20 µA

5.0 – 20 µA

0.8 V

– – V

– 0.2 0.4 V

-5.0 0.0 5.0 µA – 4.0 12 pF – – 20 pF

100 188 270 Counts/V/

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DYNAMIC ELECTRICAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

Table 4. Dynamic Electrical Characteristics

Characteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA < 125°C, unless otherwise noted. Typical

values noted reflect the approximate parameter means at T

Characteristic Symbol Min Typ Max Unit

POWER OUTPUT AND CLOCK TIMINGS (SIN+, SIN-, COS+, COS-) CS

SIN± (COS±) Output Turn ON Delay Time (Time from Rising CS Enabling Outputs to Steady State Coil Voltages and Currents)

SIN± (COS±) Output Turn OFF Delay Time (Time from Rising CS Disables Outputs to Steady State Coil Voltages and Currents)

Uncalibrated Oscillator Cycle Time Calibrated Oscillator Cycle Time

Calibration Pulse = 8.0 µs, PECCR D4 = Logic [0]

Calibration Pulse = 8.0 µs, PECCR D4 = Logic [1] Maximum Pointer Speed Maximum Pointer Acceleration

SPI INTERFACE TIMING (CS, SCLK, SO, SI, RST)

Recommended Frequency of SPI Operation Falling Edge of CS to Rising Edge of SCLK (Required Setup Time) Falling Edge of SCLK to Rising Edge of CS (Required Setup Time) SI to Falling Edge of SCLK (Required Setup Time) Falling Edge of SCLK to SI (Required Hold Time) SO Rise Time

CL = 200 pF SO Fall Time

CL = 200 pF SI, CS, SCLK, Incoming Signal Rise Time

SI, CS, SCLK, Incoming Signal Fall Time Falling Edge of RST to Rising Edge of RST (Required Setup Time) Rising Edge of CS to Falling Edge of CS (Required Setup Time) Falling Edge of RST to Rising Edge of CS (Required Setup Time)

Notes

15. Maximum specified time for the 33977 is the minimum guaranteed time needed from the microcontroller.

16. The minimum and maximum value will vary proportionally to the internal clock tolerance. These numbers are based on an ideally calibrated clock frequency of 1.0 MHz. These are not 100 percent tested.

17. The 33977 shall meet all SPI interface timing requirements specified in the SPI Interface Timing section of this table, over the specified temperature range. Digital interface timing is based on a symmetrical 50 percent duty cycle SCLK Clock Period of 33 ns. The device shall be fully functional for slower clock speeds. Reference

18. The required setup times specified for the 33977 are the minimum time needed from the microcontroller to guarantee correct operation.

19. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.

20. The value is for a 1.0 MHz calibrated internal clock. The value will change proportionally as the internal clock frequency changes.

(16)

(17)

(18)

(19)

= 25°C under nominal conditions unless otherwise noted.

(15)

(18)

DLYON

DLYOFF

CLU

CLC

MAX

SPI

LEAD

LAG

SISU

SIHOLD

RSO

– – 1.0

0.65 1.0 1.7 µs

1.0

0.9

1.1

1.0 – – 400 °/s – – 4500 °/s

– 1.0 2.0 MHz

167 – – ns 167 – – ns

– 25 83 ns – 25 83 ns

– 25 50

FSO

– 25 50

(18)

(18), (20)

(18)

RSI

FIS

RST

– – 50 ns – – 50 ns – – 3.0 µs – – 5.0 µs – – 5.0 µs

Figure 4 and 5.

µs

1.2

1.1

33977

Analog Integrated Circuit Device Data Freescale Semiconductor 7

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ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

Table 4. Dynamic Electrical Characteristics (continued)

Characteristics noted under conditions 4.75 V < VDD < 5.25 V, and - 40°C < TA < 125°C, unless otherwise noted. Typical

values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic Symbol Min Typ Max Unit

SPI INTERFACE TIMING (CS, SCLK, SO, SI, RST) ‘ (CONTINUED)

(24)

(22)

(23)

SOEN

SODIS

VALID

– – 145 ns – 1.3 4.0 µs

– 90 150

Time from Falling Edge of CS to SO Low Impedance Time from Falling Edge of CS to SO High Impedance Time from Rising Edge of SCLK to SO Data Valid

0.2 VDD = SO = 0.8 VDD, CL = 200 pF

Notes

21. The 33977 shall meet all SPI interface timing requirements specified in the SPI Interface Timing section of this table, over the specified temperature range. Digital interface timing is based on a symmetrical 50 percent duty cycle SCLK Clock Period of 33 ns. The device shall be fully functional for slower clock speeds.

22. Time required for output status data to be terminated at SO 1.0 kΩ load on SO.

23. Time required for output status data to be available for use at SO 1.0 kΩ load on SO.

24. Time required to obtain valid data out from SO following the rise of SCLK.

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RST

WRST

0.2 V

TIMING DIAGRAMS

ELECTRICAL CHARACTERISTICS

TIMING DIAGRAMS

SCLK

0.7 V

SCLK

Low-to-High

High-to-Low

0.7 V

0.2 V

LEAD

DD DD

0.7 V

SISU

Valid Don’t Care Valid Don’t CareDon’t Care

SI(HOLD)

RSI

Figure 4. Input Timing Switching Characteristics

FIS

3.5V

0.2 VDD

0.7

SO(DIS)

SO(EN)

VALID

RSI

50%

RSO

0.7 VDD

0.2 VDD

0.7 V

1.0V

FIS

LAG

Figure 5. Valid Data Delay Time and Valid Time Waveforms

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FUNCTIONAL DESCRIPTION

FUNCTIONAL PIN DESCRIPTION

FUNCTIONAL DESCRIPTION

INTRODUCTION

This 33977 is a single-packaged, Serial Peripheral INterface (SPI) controlled, single stepper motor gauge driver integrated circuit (IC). This monolithic stepper IC consists of [deleted two per D. Mortensen] a dual output H-Bridge coil driver [deleted plural s for accurate tense] and the

FUNCTIONAL PIN DESCRIPTION

COSINE POSITIVE (COS0+)

The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.

COSINE NEGATIVE (COS0-)

The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.

SINE POSITIVE (SIN+)

The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.

SINE NEGATIVE (SIN-)

The H-Bridge pins linearly drive the sine and cosine coils of a stepper motor, providing four-quadrant operation.

GROUND (GND)

Ground pins.

CHIP SELECT (CS)

The pin enables communication with the master device. When this pin is in a logic [0] state, the 33977 is capable of transferring information to, and recei vi n g i nf ormation from, the master. The 33977 latches data in from the Input Shift registers to the addressed registers on the rising edge of

The output driver on the SO pin is enabled when CS is logic [0]. When CS is logic high, signals at the SCLK and SI pins are ignored and the SO pin is tri-stated (high impedance). to a logic [0] state when SCLK is logic [0]. pull-up (I of the Static Electrical Characteristics Table.

CS will only be transitioned from a logic [1] state

CS has an internal

) connected to the pin, as specified in the section

CS.

associated control logic. The dual H-Bridge driver is used to automatically control the speed, direction, and magnitude of current through the coils of a two-phase instrumentation stepper motor, similar to an MMT-licensed AFIC 6405 of Switec MS-X 156.xxx motor.

SCLK has an internal pull down (l section of the Static Electrical Characteristics Table. When CS is logic [1], signals at the SCLK and SI pins are ignored and SO is tri-stated (high impedance). Refer to the data transfer

Timing Diagrams on page 9.

), as specified in the

DWN

SERIAL OUTPUT (SO)

The SO data pin is a tri-stateable output from the Shift register. The Status register bits are the first 16 bits shifted out. Those bits are followed by the message bits clocked in FIFO, when the device is in a daisy chain connection or being sent words that are multiples of 16 bits. Data is shifted on the rising edge of the SCLK signal. The SO pin will remain in a high impedance state until the state.

CS pin is put into a logic low

SERIAL INPUT (SI)

The SI pin is the input of the SPI. Serial input information is read on the falling edge of SCLK. A 16-bit stream of serial data is required on the SI pin, beginning with the most significant bit (MSB). Messages that are not multiples of 16 bits (e.g., daisy chained device messages) are ignored. After transmitting a 16-bit word, the (logic [1]) before transmitting a new word. SI information is ignored when

CS is in a logic high state.

CS pin must be de-asserted

RETURN TO ZERO (RTZ)

This is a multiplexed output pin for the non-driven coil, during a Return to Zero (RTZ) event.

VOLTAGE (VDD)

The SPI and logic power supply input will work with 5.0 V supplies.

SERIAL CLOCK (SCLK)

33977

10 Freescale Semiconductor

CS makes any

RESET (RST)

If the master decides to reset the device, or place it into a sleep state, the the RST pin forces all internal logic to the known default state. This input has an internal active pull-up.

RST pin is driven to a Logic [0]. A Logic [0] on

VOLTAGE POWER (VPWR)

This is the power supply pin.

Analog Integrated Circuit Device Data

Page 11

FUNCTIONAL INTERNAL BLOCK DESCRIPTION (OPTIONAL)

FUNCTIONAL DESCRIPTION

SPI Logic

Under and

Overvoltage

Detect

Figure 6. Functional Internal 33977 Block Illustration

SERIAL PERIPHERAL INTERFACE (SPI)

This circuitry manages incoming messages and outgoing

status data.

LOGIC

This design element includes internal logic including state

machines and message decoding.

INTERNAL REFERENCE

This design element is used for step value levels.

UNDER AND OVERVOLTAGE DETECTION

This design element detects when V

normal operating range.

is out of the

PWR

Internal

Reference

Oscillator

RTZ

H-Bridge

and Control

OSCILLATOR

The internal oscillator generates the internal clock for all timing critical features.

H-BRIDGE AND CONTROL

This circuitry contains the output coil drivers and the multiplexers necessary for four quadrant operation and RTZ sequencing. This circuitry is repeated for the Sine and Cosine coils.

• Overtemperature — Each output includes an overtemperature sensing circuit

• ILIM — Each output is current limited

RETURN TO ZERO (RTZ)

This circuitry outputs the voltage present on the non-driven

coil during RTZ operation.

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FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

STATE MACHINE OPERATION

The 33977 is ideal for use in instrumentation systems requiring distributed and flexible stepper motor gauge driving. The device also eases the transition to stepper motors from air core motors by emulating the air core pointer movement with little additional processor bandwidth utilization. The twophase stepper motor has maximum allowable velocities and acceleration and deceleration. The purpose of the stepper motor state machine is to drive the motor with the maximum performance while remaining within the motor’s voltage, velocity, and acceleration constraints.

A requirement of the state machine is to ensure the deceleration phase begins at the correct time and pointer position. When commanded, the motor [will deleted PV] accelerates constantly to the maximum velocity, and then it moves toward the commanded position at the maximum velocity. Eventually, the pointer reaches the calculated location where the movement has to decelerate, safely slowing to a stop at the desired position. During the deceleration phase, the motor does [will deleted PV] not exceed the maximum deceleration.

During normal operation, both stepper motor rotors are microstepped at 24 steps per electrical revolution, illustrated in Figure 7. A complete electrical revolution results in two degrees of pointer movement. There is a second smaller [parentheses removed-unnecessary] state machine in the IC controlling these microsteps. The smaller state machine receives clockwise or counter-clockwise index commands at timed intervals, thereby stepping the motor in the appropriate direction by adjusting the current in each coil. Normalized values are provided in

Table 5.

Figure 7. Clockwise Microsteps

Table 5. Coil Step Value

33977

Step

Angle

0 1 2 3 4 5 6 7

105 0.966 -0.259 0.259

120 0.866 -0.5 0.0

135 0.707 -0.707 -0.259

150 0.5 -0.866 -0.500

SINE

(Angle)*

0.0 0.0 1.0 0.866 15 0.259 0.965 0.966 30 0.5 0.866 1.0 45 0.707 0.707 0.966 60 0.866 0.5 0.866 75 0.966 0.259 0.707 90 1.0 0.0 0.500

COS (Angle -30)*

PE6=0

COS (Angle -30)*

PE6=1

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Page 13

FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

Table 5. Coil Step Value

165 0.259 -0.966 -0.707

180 0.0 -1.0 -0.866

195 -0.259 -0.966 -0.966

210 -0.5 -0.867 -1.0

225 -0.707 -0.707 -0.966

240 -0.866 -0.5 -0.866

255 -0.966 -0.259 -0.707

270 -1.0 0.0 -0.500

285 -0.966 0.259 -0.259

300 -0.866 0.5 0.0

315 -0.707 0.707 0.259

330 -0.5 0.866 0.500

345 -0.259 0.966 0.707

* Denotes normalized values

The motor is stepped by providing index commands at intervals. The time between steps defines the motor velocity and the changing time defines the motor acceleration.

The state machine uses a table to define the allowed time and the maximum velocity. A useful side effect of the table is that it also allows the direct determination of the position at which the velocity should reduce to stop the motor at the desired position.

Motor motion equations follow: [reworded for efficient use of space]

(The units of position are steps and velocity and acceleration are in steps/second and steps/second

From an initial position of 0 with an initial velocity (u), the motor position (s) at a time (t) is:

s = ut + 1/2 at

For unit steps, the time between steps is:

⇒

t =

- u +

√ u

+ 2a

This defines the time increment between steps when the motor is initially traveling at a velocity u. In the ROM, this time is quantized to multiples of the system clock by rounding upwards, ensuring acceleration never exceeds the allowed value. The actual velocity and acceleration is calculated from the time step actually used. Using:

v2 = u2 + 2as

and

v = u + at

and solving for v in terms of u, s, and t gives:

v = 2/t - u

The correct value of t to use in the equation is the

quantized value obtained above.

From these equations, a set of recursive equations can be generated to give the allowed time step between motor indexes when the motor is accelerating from a stop to its maximum velocity.

Starting from a position p of 0 and a velocity v of 0, these equations define the time interval between steps at each position. To drive the motor at maximum performance, index commands are given to the motor at these intervals. A table is generated giving the time step *t at an index position n.

p0 =

v0 = 0

∆tn =

⎡

-v

n -1

+ √

n -1

+ 2a

⎤

where ⎡ ⎤ indicates rounding up

vn = 2/

∆tn

- V

n -1

pn = n

Note: [chgd for format consistency AND deleted that as PV] For pn = n, on the nth step, the motor [has deleted as PV] indexed by n positions and has been accelerating steadily at the maximum allowed rate. This is critical because it also indicates the minimum distance the motor must travel while decelerating to a stop. For example, the stopping distance is also equal to the current value of n.

The algorithm of pointer movement can be summarized in two steps:

1. The pointer is at the previously commanded position and is not moving.

2. A command to move to a pointer position (other than the current position) has been received. Timed index pulses are sent to the motor driver at an everincreasing rate, according to the time steps in

Table 6,

until:

aThe maximum velocity (default or selected) is

reached after which the step time intervals will no longer decrease.

bThe distance in steps that remain to travel are less

than the current step time index value. The motor then decelerates by increasing the step times according to

Table 6 until the commanded

position is reached. The state machine controls the deceleration so that the pointer reaches the commanded position efficiently.

An example of the velocity table for a particular motor is

provided in

Table 6. This motor’s maximum speed is 4800

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Analog Integrated Circuit Device Data Freescale Semiconductor 13

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FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

microsteps/s (at 12 microsteps/degrees), and its maximum acceleration is 54000 microsteps/s2. The table is quantized to a 1.0 MHz clock.

Table 6. Velocity Table

Velocity

Position

0 1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35

Time Between

Steps (µs)

0.0 0.00 76 380 2631.6 152 257 3891.1 27217 36.7 77 377 2652.5 153 256 3906.3 13607 73.5 78 374 2673.8 154 255 3921.6 11271 88.7 79 372 2688.2 155 254 3937.0

7970 125.5 80 369 2710.0 156 254 3937.0 5858 170.7 81 366 2732.2 157 253 3952.6 4564 219.1 82 364 2747.3 158 252 3968.3 3720 268.8 83 361 2770.1 159 251 3984.1 3132 319.3 84 358 2793.3 160 250 4000.0 2701 370.2 85 356 2809.0 161 249 4016.1 2373 421.4 86 354 2824.9 162 248 4032.3 2115 472.8 87 351 2849.0 163 248 4032.3 1908 524.1 88 349 2865.3 164 247 4048.6 1737 575.7 89 347 2881.8 165 246 4065.0 1594 627.4 90 344 2907.0 166 245 4081.6 1473 678.9 91 342 2924.0 167 244 4098.4 1369 730.5 92 340 2941.2 168 244 4098.4 1278 782.5 93 338 2958.6 169 243 4115.2 1199 834.0 94 336 2976.2 170 242 4132.2 1129 885.7 95 334 2994.0 171 241 4149.4 1066 938.1 96 332 3012.0 172 241 4149.4 1010 990.1 97 330 3030.3 173 240 4166.7

960 1041.7 98 328 3048.8 174 239 4184.1 916 1091.7 99 326 3067.5 175 238 4201.7 877 1140.3 100 324 3086.4 176 238 4201.7 842 1187.6 101 322 3105.6 177 237 4219.4 812 1231.5 102 321 3115.3 178 236 4237.3 784 1275.5 103 319 3134.8 179 265 4255.3 760 1315.8 104 317 3154.6 180 235 4255.3 737 1356.9 105 315 3174.6 181 234 4273.5 716 1396.6 106 314 3184.7 182 233 4291.8 697 1434.7 107 312 3205.1 183 233 4291.8 680 1470.6 108 310 3225.8 184 232 4310.3 663 1508.3 109 309 3236.2 185 231 4329.0 648 1543.2 110 307 3257.3 186 231 4329.0 634 1577.3 111 306 3268.0 187 230 4347.8

Velocity

(µSteps/s)

Velocity Position

Time Between

Steps (µs)

Velocity

(µSteps/s)

Velocity

Position

Time Between

Steps (µs)

Velocity

(µSteps/s)

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14 Freescale Semiconductor

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Table 6. Velocity Table (continued)

Velocity

Position

36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75

Time Between

Steps (µs)

621 1610.3 112 304 3289.5 188 229 4366.8 608 1644.7 113 303 3300.3 189 229 4366.8 596 1677.9 114 301 3322.3 190 228 4386.0 585 1709.4 115 300 3333.3 191 227 4405.3 575 1739.1 116 298 3355.7 192 227 4405.3 565 1769.9 117 297 3367.0 193 226 4424.8 555 1801.8 118 295 3389.8 194 226 4424.8 546 1831.5 119 294 3401.4 195 225 4444.4 538 1858.7 120 293 3413.0 196 224 4464.3 529 1890.4 121 291 3436.4 197 224 4464.3 521 1919.4 122 290 3448.3 198 223 4484.3 514 1945.5 123 289 3560.2 199 222 4504.5 507 1972.4 124 287 3484.3 200 222 4504.5 500 2000.0 125 286 3496.5 201 221 4524.9 493 2028.4 126 285 3508.8 202 221 4524.9 487 2053.4 127 284 3521.1 203 220 4545.5 481 2079.0 128 282 3546.1 204 220 4545.5 475 2105.3 129 281 3558.7 205 219 4566.2 469 2132.2 130 280 3571.4 206 218 4587.2 464 2155.2 131 279 3584.2 207 218 4587.2 458 2183.4 132 278 3597.1 208 217 4608.3 453 2207.5 133 277 3610.1 209 217 4608.3 448 2232.1 134 275 3636.4 210 216 4629.6 444 2252.3 135 274 3649.6 211 216 4629.6 439 2277.9 136 273 3663.0 212 215 4651.2 434 2304.1 137 272 3676.5 213 215 4651.2 430 2325.6 138 271 3690.0 214 214 4672.9 426 2347.4 139 270 3703.7 215 214 4672.9 422 2369.7 140 269 3717.5 216 213 4694.8 418 2392.3 141 268 3731.3 217 212 4717.0 414 2415.5 142 267 3745.3 218 212 4717.0 410 2439.0 143 266 3759.4 219 211 4739.3 406 2463.1 144 265 3773.6 220 211 4739.3 403 2481.4 145 264 3787.9 221 210 4761.9 399 2506.3 146 263 3802.3 222 210 4761.9 396 2525.3 147 262 3816.8 223 209 4784.7 393 2544.5 148 261 3831.4 224 209 4784.7 389 2570.7 149 260 3846.2 225 208 4807.7 386 2590.7 150 259 3861.0 383 2611.0 151 258 3876.0

Velocity

(µSteps/s)

Velocity Position

Time Between

Steps (µs)

Velocity

(µSteps/s)

FUNCTIONAL DEVICE OPERATION

Velocity

Position

OPERATIONAL MODES

Time Between

Steps (µs)

Velocity

(µSteps/s)

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FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

INTERNAL CLOCK CALIBRATION

Timing-related functions on the 33977 (e.g., pointer, velocities, acceleration, and Return to Zero Pointer speeds) depend upon a precise, consistent time reference to control the pointer accurately and reliably. Generating accurate time references on an integrated circuit can be accomplished. There are three methods to generate accurate time references on an integrated circuit:

1. One option is trimming; however, timing tends to be costly due to the large amount of die area requi red for trim pads.

2. Another, but expensive possibility is an externally generated clock signal. This option requires a dedicated pin on the device and controller.

3. A third, and even more expensive approach requires the use of an additional crystal, or resonator.

The internal clock in the 33977 is temperature independent and area efficient; however, it can vary up to 70 percent due to process variation. Using the existing SPI inputs and the precision timing reference already available to the microcontroller, the 33977 allows more accurate clock calibration to within ±10 percent without requiring extra pins, components, or costly circuitry.

Calibrating the internal 1.0 MHz clock is initiated by writing Logic [1] to PECCR bit PE3, illustrated in

Figure 8.

Figure 8. Gauge Enable and Clock Calibration Example

The 8.0 µs calibration pulse is then provided by the

controller to result in a nominal internal 33977 clock speed of

1.0 MHz. The pulse is sent on the

CS pin immediately after

the SPI calibration command is sent. During the calibration, no other SPI lines should be toggled. At the moment the CS

pin transitions from Logic [1] to Logic [0], an internal 7-bit counter counts the number of cycles of an internal, 8.0 MHz clock. The counter stops when the

CS pin transitions from Logic [0] to Logic [1]. The value in the counter represents the number of cycles of the 8.0 MHz clock occurring in the 8.0 µs window; it should range from 32 to 119. An offset is added to this number to help center, or skew, the calibrated result to generate a desired maximum, or normal frequency. The modified counter value is truncated by four bits to generate the calibration divisor, potentially ranging from four to 15. The

8.0 MHz clock is divided by the calibration divisor, resulting in a calibrated 1.0 MHz clock. If the calibration divisor lies outside the range of four to 15, the 33977 flags the CAL bit in the device Status register, indicating the calibration procedure was not successful. A clock calibration is allowed only if the gauge is disabled, or the pointer is not moving as indicated by the Status bit of MOV, illustrated in

Table 16

section of this document.

Some applications may require a guaranteed maximum pointer velocity and acceleration. Guaranteeing these maximums requires the nominal internal clock frequency to

fall below 1.0 MHz. The frequency range of the calibrated clock is always below 1.0 MHz if PECCR bit PE4 is Logic [0] prior to initiating a calibration command, followed by an 8.0 µs reference pulse. The frequency is centered at 1.0 MHz if bit D4 is written Logic [1].

The 33977 can be fooled into calibrating faster or slower than the optimal frequency by sending a calibration pulse longer or shorter than the intended 8.0 µs. As long as the calibration divisor remains between four and 15 there is no calibration flag. For applications requiring a slower calibrated clock, e.g., a motor designed with a gear ratio of 120:1

microsteps/deg), users will have to provide a longer

(8 calibration pulse. The internal oscillator can be slowed with the PECCR command, so the calibration divisor safely falls within the four to 15 range when calibrating with a longer time reference. Fro example, for the 120:1 motor, the pulse would be 12 µs instead of 8.0 µs. The result of this slower calibration is longer step times resulting in generating pointer movements capable of meeting acceleration and velocity requirements. The resolution of the pointer positioning decreases from 0.083 deg/microstep (180:1) to 0.125 deg/microstep (120:1) while the pointer sweep range increases from approximately 340° to over 500°.

Note: A fast calibration could result in violations of the motor acceleration and a velocity maximums, resulting in missed steps.

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FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

POINTER DECELERATION

Constant acceleration and deceleration of the pointer produces relatively choppy movements when compared to those of an air core gauge. Modification of the velocity position ramp during deceleration can create the desired damped movement. This modification is accomplished in the 33977 by adding repetitive steps at several of the last velocity

Velocity

Velocity Position

Position

= 0

rate

Figure 8. Deceleration Ramp

position step values as the pointer decelerates. The default movement in the 33977 uses this ramp modification feature. An example is illustrated in

Figure 9. If the maximum

acceleration and deceleration of the pointer is desired, the repetitive steps can be disabled by writing Logic [1] to the PECCR bit PE5.

Hold Counts

Microsteps

Figure 9. Deceleration Ramp

RETURN TO ZERO CALIBRATION

Many stepper motor applications require [that deleted as PV] the IC detect when the stepper motor stalls after commanded to return to the zero position for calibration purposes. In instrumentation applications, the stalling occurs when the pointer hits the end stop on the gauge bezel, [which is deleted as PV] usually at the zero position. It is important to know [that PV] when the pointer reaches the end stop, it immediately stops without bouncing away. The 33977 device provides the ability to automatically and independently return the pointer to the zero position via the RTZR and RTZCR SPI commands. An automatic RTZ is initiated, using the RZ1 and RZ2 bits, provided the RZ4 is Logic [1]. During an RTZ event, all commands related to the gauge being returned are ignored until the pointer has successfully zeroed, or the RTZR bit RZ1 is written to disable the event. Once an RTZ event is initiated, the device reports back via the SO pin an RTZ event is underway.

The RTZCR command is used to set the RTZ pointer speed, choose an appropriate blanking time, and preload the integration accumulator with an appropriate offset. On reaching the end stop, the device reports back to the microcontroller via the status message [that PV] the RTZ was successful. The RTZ automatically disables, [that will PV] allowing other commands to be valid. In the event the master

determines an RTZ sequence is not working properly, for example, the RTZ taking too long; it can disable the command via the RTZR bit RZ1. [Altered for better read flow]

RTZCR bits RC10:RC5 are written to preload the accumulator with a predetermined value assuring accurate pointer stall detection. This preloaded value can be determined during application development by disabling the

automatic shutdown feature of the device with the RTZR bit RZ4. This operating mode allows the master to monitor the RTZ event, using the accumulator information available via the SO if the device is configured to provide the RTZ Accumulator Status. The unconditional RTZ event can be turned OFF using the RTZR bit RZ1.

If the Position 0 location bit, RZ2, is in the default Logic [0] mode, then during an RTZ event the pointer is returned counterclockwise (CCW) using full steps at a constant speed determined by the RTZCR RC3:RC0 and RC12:RC11 bits written during RTZ configuration, see

Figure 10. Full steps

are used during an RTZ so only coil of the motor is being driven at any time. The coil not being driven is used to determine if the pointer is moving. If the pointer is moving, the flux present in the non-driven coil is processed by integrating the back EMF signal present on the opened pin of the coil while applying a fixed potential to the other end.

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FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

max

MAX

coil

COIL

MAX

max

MAX

max

SINE

2 0 0 3 1

COIL

coil

MAX

max

0 1 2 3 0

Figure 9. FULLSTEPS (Counter Clockwise)

Figure 10. Full Steps (Counterclockwise)

The IC automatically prepares the non-driven coil at each step, waits for a predetermined blanking time, and then processes the signal for the duration of the full step. When the pointer reaches the stop and not longer moves, the dissipating flux is detected. The processed results are placed in the RTZ accumulator, and then compared to a decision threshold. If the signal exceeds the decision threshold, the pointer is assumed to be moving. If the threshold value is not exceeded, the drive sequence is stopped if RTZR bit RZ4 is Logic [0]. If bit RZ4 is Logic [1], the RTZ movement will continue indefinitely until the RTZR bit RZ1 is used to stop the RTZ event.

A pointer [that is PV] not on a full step location, or [that PV] is in magnetic alignment prior to the RTZ event may cause a false RTZ detection. More specifically, an RTZ event beginning from a non-full step position may result in an abbreviated flux value potentially interpreted as a stalled pointer. Advancing the pointed by at least 12 microsteps clockwise (if PE7 = 0) to the nearest full step position (e.g., 0, 6, 12, 18, 24, etc.) prior to initiating an RTZ ensures the magnetic fields line up and increases the chances of a successful pointer stall detection. It is important that the pointer be in a static, or commanded, position before starting the RTZ event. Because the time duration and the number of steps the pointer moves prior to reaching the commanded position can vary depending upon its status at the time a position change is communicated, the master should make sure that the rotor is not moving prior to starting an RTZ. Cessation of movement can be inferred by monitoring the CMD and/or the MOV status bits.

It should be pointed out, the flux value, for an ideal motor with the coils perfectly aligned at 90°, will vary little from full step to full step if all other variables, such as te mperature, are

COSINE

held constant. The full steps are evenly spaced, resulting in equidistant movement as the motor is full stepped.

In comparison, motors [that have deleted PV] whose coils aligned at a 60° angle [will deleted PV] results in two distinct flux values as a the coils are driven in the same full step fashion. This lack of symmetry in the measured flux is due to the difference in the electrical angles between full steps. Clearly stated, the distance the rotor moves changes from full step to full step. This difference can be observed in

Figure 7

and Table 5.

In Figure 7, where PE6 = 0, the difference in microsteps between alternating full steps (one coil at maximum current while the other is at zero) is always six. In contrast, the same figure illustrates PE6 = 1 showing the dif fe ren ce in microsteps between full steps of the 60° coils alternating between four and eight. These expected differences should be taken into account when setting the RTZ threshold.

After completion of an RTZ, the 33977 automatically assigns the zero step position to the full step position at the end-stop location. Because the actual zero position could lie anywhere within the full step where the zero was detected, the assigned zero position could be within a window of ±0.5°. An RTZ can be used to detect stall, even if the pointer rests on the end-stop when RTZ sequence is initiated. However, it is recommended to advance the pointer by at least 12 microsteps to the nearest full step prior to initiating the RTZ.

RTZ OUTPUT

During an RTZ event the non-driven coil is analyzed to determine the state of the motor. The 33977 multiplexes the coil voltages, [chgd PV and provides to read as active voice] providing signal from the non-driven coil to the RTZ pin.

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FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

DEFAULT MODE

Default mode refers to the state of the 33977 after an internal or external reset prior to SPI communication. An internal reset occurs during V

power-up or if V

PWR

falls below 4.0 V. An external reset is initiated by the RST pin driven to Logic [0]. With the exception of the RTZCR full step time, all of the specific pin functions and internal registers will operate as though all of the addressable configuration register bits were set to Logic [0]. This means, for example, [deleted PV that] the outputs will be disabled after a powerup or external reset, and SO flag OD6 and OD8 are set, indicating an undervoltage event. Anytime an external reset is exerted and the default is restored, all configuration parameters [replaced e.g. with such as] such as clock calibration, maximum speed, and RTZ parameters are lost and must be reloaded.

FAULT LOGIC REQUIREMENTS

The 33977 device indicates each of the following faults as

they occur:

• Overtemperature fault

• Undervoltage V

• Overvoltage V

PWR

• Clock Out of Specification [Formalized spec]

These fault bits remain enabled until they are clocked out

of the SO pin with a valid SPI message.

Overcurrent faults are not reports directly; however, it is likely an overcurrent condition will become a thermal issue and be reported.

OVERTEMPERATURE FAULT REQUIREMENTS

The 33977 incorporates overtemperature protection circuitry, shutting off the gauge driver when an excessive temperature is detected. In the event of a thermal overload, the gauge driver is automatically disabled and the fault is flagged via the OT device status bit. The indicating flag

continues to be set until the gauge is successfully re-enacted, provided the junction temperature has fallen below th e hysteresis level.

OVERVOLTAGE FAULT REQUIREMENTS

The device is capable of surviving V the maximum specified in Maximum Ratings, levels resulting in an overvoltage shutdown condition can result in uncertain pointer positions. Therefore, the pointer position should be re-calibrated. The master will be notified of an overvoltage event via the SO pin if the device status is selected. Overvoltage detection and notification occurs regardless of whether the gauge(s) are enabled or disabled.

voltages within

PWR

Table 2. V

PWR

OVERCURRENT FAULT REQUIREMENTS

Outcome currents are limited to safe levels allowing the device to rely on thermal shutdown to protect itself.

UNDERVOLTAGE FAULT REQUIREMENTS

Undervoltage V pointer positions. Therefore, the internal clock and the pointer position may require re-calibration. The state machine continues to operate with V V; however, the coil voltages may be clipped. Notification of an undervoltage event is provided via the SO pin.

conditions may result in uncertain

PWR

voltage levels as low as 4.0

PWR

RESET (SLEEP MODE)

The device can reset internally or externally. If the VDD level falls below the V powers up in the Default mode. See Static Electrical Characteristics table under the sub-heading: Power Input in

Table 3. Similarly, if the RST pin is driven to Logic [0], then

the device resets to its default state. The device consumes the least amount of current (IDD and I is Logic [0]. This is also referred to as the Sleep mode.

level, the device resets and

DDUV

) when the RST pin

PWR

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FUNCTIONAL DEVICE OPERATION

LOGIC COMMANDS AND REGISTERS

SPI PROTOCOL DESCRIPTION

The SPI interface has a full-duplex, three-wire synchronous,16-bit serial synchronous interface data transfer and four I/O lines associated with it: Chip Select

CS), Serial Clock (SCLK), Serial Input (SI), and Serial Output

( (SO). The SI/SO pins of the 33977 follow a first in/first out (D15/D0) protocol with both input and output words transferring the most significant bit first. All inputs are compatible with 5.0 V CMOS logic levels.

CHIP SELECT (CS)

The CS pin enables communication with the master device.

When this pin is in a Logic [0] state, the 33977 is capable of transferring information to, and receiving information from, the master. The 33977 latches data in from the Input Shift registers to the addressed registers on the rising edge of The output driver on the SO pin is enabled when

CS.

CS is Logic [0]. When CS is logic high, signals at the SCLK and SI pins are ignored and the SO pin is tri-stated (high impedance). CS will only be transitioned from a Logic [1] state to a Logic [0] state when SCLK is Logic [0]. CS has an internal pull-up (IUP) connected to the pin, as specified in the section of the Static Electrical Characteristics table entitled CONTROL I/O, [which is found on page...deleted for consistent format]

Table 3. This pin is also used to calibrate the internal clock.

SERIAL CLOCK (SCLK)

SCLK clocks the Internal Shift registers of the 33977 device. The SI pin accepts data into the Input Shift register on the falling edge of the SCLK signal, while the Serial Output pin (SO) shifts data information out of the SO line driver on the rising edge of the SCLK signal. It is important the SCLK pin be in a Logic [0] state whenever the transition. SCLK has an internal pull-down (l specified in the section Control I/O of the Static Electrical Characteristics, [which is found on page...deleted for consistent format]

Table 3. When CS is Logic [1], signals at

the SCLK and SI pins are ignored and SO is tri-stated (high impedance). Refer to the data transfer timing diagrams in

CS makes any

), as

DWN

Figure 11 and Figure 12. [figure numbers changed due to

template formatting]

It transitions one time per bit transferred at an operating frequency, f the Dynamic Electrical Characteristics

, defined in the SPI Interface Timing section of

SPI

Table 4. It is idle

between command transfers. The pin is 50 percent duty cycle, with CMOS logic levels. This signal is used to shift data to and from the device.

SERIAL OUTPUT (SO)

The SO data pin is a tri-stateable output from the Shift register. This output will remain tri-stated unless the device is selected by a low

CS signal. The output signal generated will have CMOS logic levels and the output will transition on the rising edges of SCLK. The serial output data provides status feedback and fault information for each output and is returned MSB first when the device is addressed.

The Status register bits are the first 16 bits shifted out. Those bits are followed by the message bits clocked in FIFO, when the device is in a daisy chain connection, or being sent words [that are deleted as PV] multiples of 16 bits. Data is shifted on the rising edge of the SCLK signal. The SO pin [will deleted as PV] remains in a high impedance state until

CS pin is put into a logic low state.

the

SERIAL INPUT (SI)

The SI pin is the input of the SPI. This input has an internal active pull-down requiring CMOS logic levels. The serial data transmitted on this line is a 16-bit co ntrol command sent MSB first, controlling the gauge functions. The master ensures data is available on the falling edge of SCLK.

Serial input information is read on the falling edge of SCLK. A 16-bit stream of serial data is required on the SI pin, beginning with the most significant bit (MSB). Messages [that are deleted as PV] not multiples of 16 bits (e.g., daisy chained device messages) are ignored. After transmitting a 16-bit word, the transmitting a new word. SI information is ignored when CS is in a logic high state.

CS pin must be de-asserted (Logic [1]) before

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FUNCTIONAL DEVICE OPERATION

LOGIC COMMANDS AND REGISTERS

This section provides a description of the 33977 SPI

behavior. To follow the explanation below, please refer to

Table 7 and to the timing diagrams illustrated in Figure 11

and Figure 12.

Table 7. Data Transfer Timing

CS (1-to-0) SO pin is enabled CS (0-to-1) 33977 configuration and desired output states are transferred and executed according to the data in the Shift registers

SO Will change state on the rising edge of the SCLK pin signal

SI Will accept data on the falling edge of the SCLK pin signal

Description

Output Shift register is loaded here

Note: SO is tri-stated when CS

is Logic [1]

Figure 11. Single 16-Bit Word SPI Communication

SCLK

Notes:

1. SO is tri-stated when CS

2. D15, D14, D13, , and D0 refer to the first 16 bits of data into the 33977.

3. D15*, D14*, D13*,. . . ., and D0* refer to the most recent entry of program data into the 33977.

4. OD15, OD14, OD13, . . .,and OD0 refer to the first 16 bits of fault and status data out of the 33977.

D12 D11

0D12 OD

is Logic [1].

Figure 12. Multiple 16-Bit Word SPI Communication

DATA INPUT

The Input Shift register captures data at the falling edge of the SCLK. The SCLK pulses exactly 16 times only inside the transmission windows ( the

CS signal goes to Logic [1] again, the contents of the Input Shift register are transferred to the appropriate internal register addressed in bits 15:13. The minimum time should be kept high depends on the internal clock speed, specified in the SPI Interface Timing section of the [Static replaced with Dynamic - correcting table location] Dynamic Electrical Characteristics, the internal clock is able to capture the data from the Input Shift register and transfer it to the internal regist ers.

CS in a Logic [1] state). By the time

Table 4. It must be long enough so

DATA OUTPUT

At the first rising edge of the SCLK [clock deleted to

eliminate redundancy], with

CS at Logic [1], the contents of the selected Status Word register are transferred to the Output Shift register. The first 16 bits clocked out are the status bits. If data continues to clock in before the

CS transitions to Logic [1], the device begins to shift out the data previously clocked in FIFO after the

CS first transitioned to

Logic[1].

COMMUNICATION MEMORY MAPS AND REGISTER DESCRIPTIONS

The 33977 device is capable of interfacing directly with a

microcontroller via the 16-bit SPI protocol specified below.

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FUNCTIONAL DEVICE OPERATION

LOGIC COMMANDS AND REGISTERS

The device is controlled by the microprocessor and reports back status information via the SPI. This section provides a detailed description of all registers accessible via serial interface. The various registers control the behavior of this device.

A message is transmitted by the master beginning with the MSB (D15) and ending with the LSB (D0). Multiple messages can be transmitted in succession to accommodate those applications where daisy chaining is desirable, or to confirm transmitted data, as long as the messages are all multiples of 16 bits. Data is transferred through daisy-chained devices, as illustrated in

Figure 12. If an attempt is made to latch in a

message smaller than 16 bits wide, it is ignored.

Table 8 lists the five registers the 33977 uses to configure

the device, control the state of the [Chgd to two per D. Mortensen] two H-bridge outputs, and determine the type of status information [that is deleted PV] clocked back to the master. The registers are addressed via D15:D13 of the incoming SPI word.

Table 8. Module Memory Map

Address

[15:13]

000 Power, Enable, Calibration, and

Configuration Register

001 Maximum Velocity Register

010 Gauge Position Register

011 Not Used 100 Return to Zero Register

101 Return to Zero Configuration

[The word Zero omitted above in 101 my error]

MODULE MEMORY MAP

Various registers of the 33977 SPI module are addressed by the three MSBs of the 16-bit word received serially. Functions to be controlled include:

• Individual gauge drive enabling

• Power-up/down

• Internal clock calibration

• Gauge pointer position and velocity

• Gauge pointer zeroing

• Air core motor movement emulation

• Status information

Status reporting includes:

• Individual gauge overtemperature condition

PECCR Table

VELR Table

POSR Table

– –

RTZR Table

RTZCR Table

RMPSELR –

– –

• Battery overvoltage

• Battery undervoltage

• Pointer zeroing status

• Internal clock status

• Confirmation of pointer movement commands

• Real time pointer position information

• Real time pointer velocity step information

• Pointer movement direction

• Command pointer position status

• RTZ accumulator value

The following section describes the registers, their

addresses, and their impact on device operation.

ADDRESS 000 - POWER, ENABLE, CALIBRATION, AND CONFIGURATION REGISTER (PECCR)

The Power, Enable, Calibration, and Configuration Register is illustrated in this register allows the master to:

• Enable or disable the output drivers of the gauge controller

• Calibrate the internal clock

• Disable the air core emulation

• Select the direction of the pointer movement during pointer positioning and zeroing

• Configure the device for the desired status information to be clocked out into the SO pin, or

• Send a null command for the purpose of reading the status bits.

This register is also used to place the 33977 into a low

current consumption mode.

The gauge drivers can be enabled by writing Logic [1] to the assigned address bits, PE0. This feature could be used to disable a driver if it is failing. The device can be placed into a standby current mode by writing Logic [0] to PE0. During this state, most current consuming circuits are biased off. When in the Standby mode, the internal clock will remain ON.

The internal state machine utilizes a ROM table of step times defining the duration that the motor will spend at each microstep as it accelerates or decelerates to a commanded position. The accuracy of the acceleration and velocity of the motor is directly related to the accuracy of the internal clock Although the accuracy of the internal clock is temperature independent, the non-calibrated tolerance is +70% to -35%. The 33977 was designed with a feature allowing the internal clock to be software calibrated to a tighter tolerance of ±10%, using the

CS pin and a reference time pulse provided by the

microcontroller.

Calibration of the internal clock is initiated by writing Logic [1] to PE3. The calibration pulse, which must be 8.0 µs for an internal clock speed of 1.0 MHz, will be sent on the immediately after the SPI word is sent. No other SPI lines will be toggled. A clock calibration will be allowed only if the gauge is disabled or the pointer is not moving, as indicated

Table 9. A write to the 33977 using

CS pin

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FUNCTIONAL DEVICE OPERATION

LOGIC COMMANDS AND REGISTERS

by status bits MOV0. Additional details are provided in the

Internal clock Calibration section.

Some applications may require a guaranteed maximum pointer velocity and acceleration. Guaranteeing these fall below 1.0 MHz. The frequency range of the calibrated clock maximums requires [that deleted PV] the nominal internal clock frequency will always be below 1.0 MHz if bit PE4 is Logic [0] when initiating a calibration command, followed by

µs reference pulse. The frequency will be centered at

an 8.0

1.0 MHz if bit PE4 is Logic [1]. Some applications may require a slower calibrated clock due to a lower motor gear reduction ratio. Writing Logic [1] to bit PE2 will slow the internal oscillator by one-third. Slowing the oscillator accommodates a longer calibration pulse without overrunning the internal counter - a condition designed to generate a CAL fault indication. For example, calibration for a clock frequency of 667 kHz would require a calibration pulse of 12

µs. Unless the

internal oscillator is slowed by writing PE2 to Logic [1], a 12

µs calibration pulse may overrun the counter and generate a

CAL fault indication.

Some applications may require faster pointer positioning than is provided with the air core motor emulation feature. Writing Logic [1] to bit PE5 will disable the air core emulation for both gauges and provide an acceleration and deceleration at the maximum that the velocity position ramp can provide. Bit PE6 must always be written Logic [0] during all PECCR writes if the device is being used to drive an MMT style motor.

Similarly, this bit must always be written as Logic [1] when being used to control Switec style motors.

The default Pointer Position 0 (PE7 = 0) will be the farthest

counter-clockwise position. A Logic [1] written to bit PE7 will change the location of the position 0 for the gauge to the farthest clockwise position. The pointer will always move towards position 0 when executing an RTZ. Exercise care when writing to PECCR bit PE7 in order to prevent an accidental change of the position 0 location.

Bits PE11:PE9 determine the content of the bits clocked out of the SO pin. When bit PE11 is at Logic [0], the clocked out bits will provide device status. If Logic [1] is written to bit PE11, the bits clocked out of the SO pin, depending upon the state of bits PE10:PE9, provides either:

• Accumulator information and detection status during the RTZ (PE10 Logic [0])

• Real time pointer position location at the time CS goes low (PE10 Logic [1] and PE9 Logic [0]), or

• The real time step position of the pointer as described in the velocity Table 6 (PE10 and PE9 Logic [1]).

Additional details are provided in the SO Communication

section.

If bit PE12 is Logic [1] during a PECCR command, the state of PE11:PE0 is ignored. This is referred to as the null command and can be used to read device status without affecting device operation.

Table 9. Power, Enable, Calibration, and Configuration Register (PECCR)

Address 000

Bits Read Write

D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

– – – – – – – – – – – – –

PE12 PE11 PE10 PE9 0 PE7 PE6 PE5 PE4 PE3 PE2 0 PE0

The bits in Table 9 are write-only.

Pointer Position or Pointer Speed Select (PE9) Bit D9

This bit is recognized only if PE11 and PE10 = 1.

Null Command for Status Read (PE12) Bit D12

• 0 = Disable

• 0 = Gauge Pointer Position

• 1 = Gauge Pointer Speed

• 1 = Enable

(PE8) Bit D8

Status Select (PE11) Bit D11

This bit selects the information clocked out of the SO pin.

• 0 = Device Status (the logic states of PE10, and PE9 are don’t cares)

• 1 = RTZ Accumulator Value, Gauge Pointer position, or Gauge Velocity ramp position (depending upon the logic states of PE10, and PE9)

This bit must be transmitted as Logic [0] for valid PECCR

commands.

Position 0 Location Select (PE7) Bit D7

This bit determines the Position 0 of the gauge. RTZ

direction will always be to the position 0.

• 0 = Position 0 is the most CCW (counterclockwise) position

RTZ Accumulator or Pointer Status Select (PE10) Bit D10

• 1 = Position 0 is the most CW (clockwise) position

This bit is recognized only when PE11 = 1.

• 0 = RTZ Accumulator Value and status

• 1 = Pointer Position or Speed

Motor Type Selection (PE6) Bit D6

• 0 = MMT Style (coil phase difference = 90°)

• 1 = Switec Style (coil phase difference = 60°)

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Air Core Motor Emulation (PE5) Bit D5

This bit is enabled or disabled (acceleration and

deceleration is constant if disabled).

• 0 = Enable

• 1 = Disable

Clock Calibration Frequency Selector (PE4) Bit D4

• 0 = Maximum f =1.0 MHz (for 8.0 µs calibration pulse)

• 1 = Nominal f =1.0 MHz (for 8.0 µs calibration pulse)

Clock Calibration Enable (PE3) Bit D3

This bit enables or disables the clock calibration.

• 0 = Disable

• 1 = Enable

Oscillator Adjustment (PE2) Bit D2

•0 = t

CLU

• 1 = 0.66 x t

CLU

(PE1) Bit D1

This bit must be transmitted as Logic [0] for valid PECCR

commands

Table 10. Maximum Velocity Register (VELR)

Gauge Enable (PE0) Bit D0

This bit enables or disables the output drivers of the

Gauge.

• 0 = Disable

•1 = Enable

ADDRESS 001 - MAXIMUM VELOCITY REGISTER (VELR)

The Gauge Maximum Velocity Register is used to set a maximum velocity for the gauge (refer to contain a position value from 1 - 225 representative of the velocity position value described in the Velocity Table,

Table 6. The table value becomes the maximum velocity until

it is changed to another value. If a maximum value is chosen that is greater than the maximum velocity of the acceleration

table, the maximum table value becomes the maximum velocity.

If the motor is turning at a speed greater than the new maximum, the motor immediately moves down the velocity ramp until the speed falls equal to or below it. Bit V8 must be written to a Logic [1] when changing the maximum velocity of the motor. Bits V12:V10 must be at Logic [0] for valid VELR commands.

Table 4). Bits V7:V0

Bits Read Write

D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

– – – – – – – – – – – – – 0 0 0 0 V8 V7 V6 V5 V4 V3 V2 V1 V0

The bits in Table 10 are write-only.

(V12:V9) Bits D12:D9

These bits must be transmitted as Logic [0] for valid VELR

commands.

Gauge Velocity (V8) Bit D8

Enables the maximum velocity as determined in the V7:

V0.

• 0 = Velocity change disabled

• 1 = Velocity change enabled

Table 11. Gauge Position Register (POSR)

Bits Read Write

D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

– – – – – – – – – – – – – 0 P011 P010 P09 P08 P07 P06 P05 P04 P03 P02 P01 P00

The bits in Table 11 are write-only.

Address 001

(V7:V0) Bits D7:D0

These bits can be used to program the device to limit the maximum velocity of the pointer movement. to one of over 200 speeds listed in the Velocity Table 6. This velocity will remain the maximum of the intended gauge until changed by command. Velocities can range from position 1 (00000001) to position 225 (11111111).

ADDRESSES 010 - GAUGE POSITION REGISTER (POSR)

SI Address 010 (Gauge Position Register) register bits PO11: PO0 are written to when communicating the desired

pointer positions. Commanded positions can range from 0 to 4095

Address 010

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PO012 (D12)

This bits must be transmitted as Logic [0] for valid POSR

commands.

P011:P00 (D11:D0)

Desired pointer position of Gauge. Pointer positions can range from 0 (000000000000) to position 4095 (111111111111). For a stepper motor requiring 12 microsteps per degree of pointer movement, the maximum pointer sweep is 341.25° (4095 ÷ 12).

ADDRESS 100 - GAUGE RETURN TO ZERO REGISTER (RTZR)

Gauge Return to Zero Register (RTZR), Table 12 below, is written to return the gauge pointers to the zero position. During an RTZ event, the pointer is returned to zero using full

Table 12. Gauge Return to Zero Register (RTZR)

Address 100

Bits Read Write

The register bits in Table 12 are write-only.

(RZ12:RZ5) Bits D12:D5

These bits must be transmitted as Logic [0] for valid commands.

(RZ4) Bit D4

This bit is used to enable an unconditional RTZ event.

• 0 = Automatic Return to Zero

• 1 = Unconditional Return to Zero

(RZ3) Bit D3

This bit must be transmitted as Logic [0] for val i d commands.

(RZ2) Bit D2

Return to Zero Direction bit. This bit is used to properly sequence the integrator, depending upon the desired zeroing direction.

• 0 = Return to Zero will occur in the CCW direction

• 1 = Return to Zero will occur in the CW direction

(RZ1) Bit D1

Return to Zero Enable. This bit commands the gauge to return the pointer to zero position.

• 0 = Return to Zero Disabled

• 1 = Return to Zero Enabled

D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

– – – – – – – – – – – – – 0 0 0 0 0 0 0 0 RZ4 0 RZ2 RZ1 0

(PE7 = 0)

=1)

(PE7

steps, where only one coil is driven at any point in time. The back electromotive force (EMF) signal present on the nondriven coil is integrated and its results are stored in an accumulator. A Logic [1] written to bit RZ1 enables a Return to Zero for the Gauge if RZ0 is Logic [0]. A Logic [0] written to

bit RZ1 disables a Return to Zero for the Gauge when RZ0 is

Logic [0].

Bits D12:D5 and D3:D2 must be written Logic [0] for valid RTZR commands. An unconditional RTZ event can be enabled or disabled with Bit RZ4. Writing Logic [0] results in a typical RTZ event, automatically providing a Stop when a stall condition is detected. A Logic [1] will result in RTZ movement, causing a Stop if a Logic [0] is written to bit RZ0. This feature is useful during development and characterization of RTZ requirements.

(RZ0) Bit D0

Return to Zero Enable. This bit must always be written Logic [0].

ADDRESS 101 - GAUGE RETURN TO ZERO CONFIGURATION REGISTER

Gauge Return to Zero Configuration Register (RTZCR) is used to configure the Return to Zero Event, Table 13. It is written to modify the: [listed as bullets for reading ease]

• Step time, or rate at which the pointer moves during an RTZ event

• Integration blanking time, which is the time immediately following the transition of a coil from a driven state to an open state in the RTZ mode

• Threshold of the RTZ integration register

Values used for this register should be selected during development to optimize the RTZ for each application. Selecting an RTZ step rate resulting in consistently successful zero detections depends on a clear understanding of the motor characteristics. Specifically, resonant frequencies exist due to the interaction between the motor and the pointer. This command allows for the selection of an RTZ pointer speed away from these frequencies. Also, some motors require a significant amount of time for the pointer to settle to a steady state position when moving from one full step position to the next. Consistent and accurate integration values require that the pointer be stationary at the end of the full step time.

Bits RC3:RC0, RC12:RC11, and RC4 determine the time spent at each full step during an RTZ event. Bits RC3:RC0 are used to select a ∆t ranging from 0 ms (0000) to 61.44 ms

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(1111) in increments of 4.096 ms (refer to Table 14). The ∆t is multiplied by the factor M, defined by bits RC12:RC11. The product is then added to the blanking time, selected using bit RC4, to generate the full step time. The multiplier selected with RC12:RC11 will be 1

(00), 2 (01), or 4 (10) as illustrated in the equations below. Note that the RC12:RC11 value of 8 (11) is not recommended for use in a product design application, because of the potential for an RTZ accumulator internal overflow, due to the long time step. The blanking time is either 512 µs when RC4 is Logic [0], or 768 µs when it is Logic [1].The full step time is calculated using the following equations:

When D3:D0 (RC3:RC0) = 0000

Full Step (t) = ∆t x M+ blanking (t) (1)

When D3:D0 (RC3:RC0) = 0000

Full Step (t) = blanking (t) + 2.048 ms (2) Note: In equation (2), a 2.048 ms offset is added to the full

step time when the RC3:RC0 = 0000. The full step time default value after a logic reset is 12.80 ms (RC12:RC11 = 00, RC4 = 0, and RC3:RC0 = 0011).

If there are two full steps per degree of pointer movement,

the pointer speed is 1/(Full Step x 2) deg/s.

Detecting pointer movement is accomplished by integrating the EMF present in the non-driven coil during the RTZ event. The integration circuitry is implemented using a Sigma-Delta converter resulting in the placement of a value in the 15-bit RTZ accumulator at the end of each full step. The value in the RTZ accumulator represents the change in flux

and is compared to a threshold. Values above the threshold indicate a pointer is moving. Values below the threshold indicate a stalled pointer, thereby resulting in the cessation of the RTZ event.

two’s complement. After a full step of integration, a sign bit of 0 is the indicator of an accumulator exceeding the decision threshold of 0, and the pointer is assumed to still be moving. Similarly, if the sign bit is Logic [1] after a full step of integration, the accumulator value is negative and the pointer is assumed to be stopped. The integrator and accumulator are initialized after each full step. If the PECCR command is written to clock out the RTZ accumulator values via the SO, the OD14 bit corresponds to the sign bit of the RTZ accumulator.

preloaded accumulator for specific gauge, pointer, and full step combinations. Bits RC10:RC5 are used to offset the initial RTZ accumulator value, properly detecting a stalled motor. The initial accumulator value at the start of a full step of integration is negative. If the accumulator was correctly preloaded, a free moving pointer will result in a positive value at the end of the integration time, and a stalled pointer will result in a negative value. The preloaded values associated with each combination of bits RC10:RC5 are illustrated in

Table 15. The accumulator should be loaded with a value

resulting in an accumulator MSB to Logic [1] when the motor is stalled. For the default mode, after a power-up or any reset, the 33977 device sets the accumulator value to -1.

Table 13. Return to Zero Register Configuration Register (RTZCR)

The RTZ accumulator bits are signed and represented in

Accurate pointer stall detection depends on a correctly

Address 101

Bits Read Write

D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

– – – – – – – – – – – – –

RC12 RC11 RC10 RC9 RC8 RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0

The bits in Table 13 are write-only.

(RC12:RC11) Bits D12:D11

These bits, along with RC3:RC0 (D3:D0) and RC4 (D4), determine the full step time and, therefore, the rate at which the pointer will move during an RTZ event. The values of D12:D11 determine the multiplier (M) used in equation (1) (refer to the previous page).

RC12:RC11 = M; default value = 00

• 00 = 1

• 01 = 2

• 10 = 4

• 11 = 8 (Not to be used for design)

(RC10:RC5) Bits D10:D5

These bits determine the value preloaded into the RTZ integration accumulator to adjust the detection threshold.

Values range from -1 (00000000) to -1009 (11111111) as shown in

Table 15, the default value = 000000.

(RC4) Bit D4

This bit determines the RTZ blanking time (blanking (t)).

The default value = 0

• 0 = 512 µs

• 1 = 768 µs

(RC3:RC0) Bits D3:D0

These bits, along with RC12:RC11 (D12:D11) and RC4 (D4), determine the time variables used to calculate the full step times with equations (1) or (2) illustrated above. RC3:RC0 determines the ∆t time. The ∆t values range from 0 (0000) to 61.440 ms (1111) and are shown in

Table 14. The

default ∆t is 0 (0011).

Note: Equation (2) (refer to the preceding page) is only used to calculate the full step time if RC3:RC0 = 0000. Use equation (1) for all other combinations of RC3:RC0.

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Table 14. RTZCR Full Step Time

RC3

0 0 0 0 0 0 0 0 0 1 0 1 0 1 0 1

RC2 RC1 RC0 ∆t (ms)

0 0 0.0 0 1 4.096 1 0 8.192 1 1 12.288 0 0 16.384 0 1 20.480 1 0 24.576 1 1 28.672

Table 15. RTZCR Accumulator Offset

RC10

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

. . . . . .

1 1

RC9 RC8 RC7 RC6 RC5 Preload Value Initial Accumulator Value = (-16xPV) -1

. . . . . .

1 1 1 1 63 -1009

Table 14. RTZCR Full Step Time

1 0 1 0 1 0 1 0 1 1 1 1 1 1 1 1

0 0 0 -1 0 1 1 -17 1 0 2 -33 1 1 3 -49

1 0 0 4 -65

0 0 32.768 0 1 36.864 1 0 40.960 1 1 45.056 0 0 49.152 0 1 53.248 1 0 57.344 1 1 61.440

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SO COMMUNICATION

When the CS pin is pulled low, the internal status register, as configured with the PECCR command bits PE11:PE8, is loaded into the output register and the data is clocked out MSB (OD15) first. Following a determines if the shifted-in message was of a valid length (a valid message length is one that is greater than 0 bits and a multiple of 16 bits) and, if so, latches the incoming data into the appropriate registers. At this time, the SO pin is tri-stated and the status register is now able to accept new status information. Fault status information will be latched and held until the Device Status Output register is selected and it is clocked out via the SO. If the message length was determined to be invalid, the fault information will not be cleared and will be transmitted again during the next valid SPI message. Pointer status information bits (e.g., pointer position, velocity, and commanded position status) will always reflect the real time state of the pointer. Any bits clocked out of the SO pin after the first 16 are representative of the initial message bits clocked into the SI pin since the pin first transitioned to a Logic [0]. This feature is useful for daisy-chaining devices as well as message verification. As described above, the last valid write to bits PE11:PE8 of the

Table 16. Device Status Output Register

Bits Read Write

OD15 OD14 OD13 OD12 OD11 OD10 OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0

ST15 DIR ST13 0POS ST11 CMD OV UV CAL OVUV ST5 MOV ST3 RTZ ST1 OT

– – – – – – – – – – – – – – – –

CS transition 0 to 1, the device

PECCR command determines the nature of the status data that is clocked out of the SO pin. There are four different types of status information available:

1. Device Status (Table 16)

2. RTZ Accumulator Status (Table 17)

3. Gauge Pointer Position Status (Table 18)

4. Gauge Pointer Velocity Status (Table 19)

Once a specific status type is selected, it will not change until either the PECCR command bits PE11:PE8 (D11:D8) are written to select another or the device is reset. Each of the Status types and the PECCR bit necessary to select them ar described in the following paragraphs.

DEVICE STATUS INFORMATION

Most recent valid PECCR command resulting in the Device Status output:

D11

x = Don’t Care

D10 D9 D8

x x x

The bits in Table 16 are read-only bits.

(ST15) Bit OD15

This bit has no meaning.

(DIR) Bit OD14

This bit indicates the direction that the Gauge is moving.

• 0 = Toward position 0

• 1 = Away from position 0

(ST13) Bit OD13

This bit has no meaning.

(0POS) Bit OD12

This bit indicates the configured Position 0 for the Gauge.

• 0 = Farthest CCW

• 1 = Farthest CW

(ST11) Bit OD11

This bit has no meaning.

(CMD) Bit OD10

This bit indicates if the Gauge is at the most recently

commanded position.

• 0 = At commanded position

• 1 = Not at commanded position

Overvoltage Indication (OV) Bit OD9

A Logic [1] on this bit indicates V upper limit of V

since the last SPI communication.

PWROV

Refer to the Static Electrical Characteristics

voltage exceeded the

PWR

Table 3 under

POWER INPUT.

An overvoltage event will automatically disable the driver outputs. Because the pointer may not be in the expected position, the master may want to re-calibrate the pointer position with an RTZ command after the voltage returns to a normal level. For an overvoltage event, both gauges must be re-enabled as quickly as this flag returns to Logic [0]. The state machine will continue to operate properly as long as

is within the normal range.

• 0 = Normal range

• 1 = Battery voltage exceeded V

PWROV

Undervoltage Indication (UV) Bit OD8

A Logic [1] on this bit indicates the V V Electrical Characteristics

since the last SPI communication. Refer to the Static

PWRUV

Table 3 under the heading of

voltage fell below

PWR

POWER INPUT. An undervoltage event is just flagged; however, at some voltage level below 4.0 V, the outputs turn OFF and the state machine resets. Because the pointer may

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not be in the expected position, the master may want to recalibrate the pointer position with an RTZ command after the voltage returns to a normal level. For an undervoltage vent, both gauges may need to be re-enabled as quickly as this flag returns to Logic [0]. The state machine will continue to operate properly as long as V

is within the normal range.

• 0 = Normal range

• 1 = Battery voltage fell below V

PWRUV

Calibrated Clock out of Specification (CAL) Bit OD7

Reading Logic [1] on this bit indicates the clock count calibrated to a value outside the expected range given the tolerance specified by t

in the Dynamic Electrical

CLC

Characteristics Table 4 under POWER OUTPUT and CLOCK TIMING.

• 0 = Clock within specification

• 1 = Clock out of specification

Undervoltage or Overvoltage Indication (OVUV) Bit OD6

A Logic [1] on this bit indicates V below the V

since the last SPI communication. Refer

PWRUV

voltage fell to a level

PWR

to the Static Electrical Characteristics table, Table 3 under the subheading INPUT POWER. An undervoltage event is just flagged, while an overvoltage event automatically disables the drive outputs. Because the pointer may not be in the expected position, the master may want to re-calibrate the pointer with an RTZ command after the voltage returns to normal level. For an overvoltage event, both gauges must be re-enabled as soon as this flag returns to Logic [0]. The state machine will continue to operate properly as long as V

within the normal range.

• 0 = Normal range

• 1 = Battery voltage fell below V V

PWROV

PWRUV

or exceeded

(ST5) Bit OD5

This bit has no meaning

Gauge Movement Since last SPI Communication (MOV) Bit OD4

A Logic [1] on this bit indicates the Gauge pointer position has changed since the last SPI command. This information allows the master to confirm the pointer is moving as commanded.

This bit may also be used to determine if the Gauge is

enabled or disabled.

• 0 = Gauge position has not changed since the last SPI command

• 1 = Gauge pointer position has changed since the last SPI command

ST3 (OD3) - This bit has no meaning

RTZ0 Is Enabled or Disabled (RTZ) Bit OD2

A Logic [1] on this bit indicates the gauge is in the process of returning to the zero position as requested with the RTZ command. This bit continues to indicate Logic [1] until the SPI message following a detection of the zero position, or the RTZ feature is commanded OFF using the RTZ message.

• 0 = Return to Zero disabled

• 1 = Return to Zero enabled successfully

(ST1) Bit OD1

This bit has no meaning.

Gauge Driver Junction Overtemperature (OT) Bit OD0

A Logic [1] on this bit indicates that the coil drive circuitry has exceeded the maximum allowable junction temperature since the last SPI communication and that the Gauge has been disabled. It is recommended that the pointer be recalibrated using the RTZ command after re-enabling the gauge using the PECCR command. This bit remains Logic [1] until the gauge is re-enabled.

• 0 = Temperature within range

• 1 = Maximum allowable j uncti on te mperat ure co nditio n is reached

RTZ ACCUMULATOR STATUS INFORMATION

Most recent valid PECCR command resulting in the RTZ

Accumulator status output:

D11

x = Don’t Care

D10 D9 D8

0 x x

[Used headings to distinguish bits and accompanying text.]

Table 17. RTZ Accumulator Status Output Register

Bits Read Write

OD15 OD14 OD13 OD12 OD11 OD10 OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0

RTZ ACC14 ACC13 ACC12 ACC11 ACC10 ACC9 ACC8 ACC7 ACC6 ACC5 ACC4 ACC3 ACC2 ACC1 ACC0

– – – – – – – – – – – – – – – –

The bits in Table 17 are read-only bits. (RTZ) Bit OD15

RTZ Bit Is Enabled or Disabled. Reading Logic [1] on this bit indicates that the Gauge is in the process of returning to the zero position as requested with the RTZ command. This

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bit will continue to indicate Logic [1] until the SPI message following a detection of the zero position, or after the RTZ feature is commanded OFF using the RTZ message.

• 0 = Return to Zero disabled

• 1 = Return to Zero enabled successfully [Corrected original entry above to ACC2]

(ACC14:ACC0) Bits OD14:OD0

These 15 bits are from the RTZ accumulator. They represent the integrated signal present on the non-driven coil during an RTZ event. These bits are Logic [0] after power-on reset, or after the

RST pin transitions from Logic [0] to [1].

After an RTZ event, they will represent the last RTZ accumulator result before the RTZ was stopped.

ACC14 is the MSB and is the sign bit used for zero detection. Negative numbers have MSB Logic [1] and are coded in twos complement.

The analog-to-digital converter's linear input range covers the expected magnitude of motor back e.m.f. signals, which is usually less than 500mV. Input signals greater than this will not cause any damage (the circuit is connected to the motor H-Bridge drivers, and thus is exposed to the full magnitude of the drive voltages), but may cause some small loss of linearity. A typical plot of output vs. input is shown in

Figure 13 for 4ms step times.

GAUGE POINTER POSITION STATUS INFORMATION

Most recent valid PECCR command resulting in the Gauge Pointer Position status output:

D11

omitted “don’t care--because N/A

D10 D9 D8

1 0 0

Figure 13. RTZ Accumulator (Typical)

Table 18. Gauge Pointer Position Status Output Register

Bits Read Write

OD15 OD14 OD13 OD12 OD11 OD10 OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0

ENB DIR DIRC CMD POS11 POS10 POS9 POS8 POS7 POS5 POS5 POS4 POS3 POS2 POS1 POS0

– – – – – – – – – – – – – – – –

The bits in Table 18 are read-only bits.

(ENB) Bit OD15

This bit indicates whether the Gauge is enabled.

• 0 = Disabled

• 1 = Enabled

(DIR) Bit OD14

This bit indicates the direction the Gauge is moving.

• 0 = Toward position 0

• 1 = Away from position 0

(DIRC) Bit OD13

This bit is used to determine whether the direction of the most recent pointer movement is toward the last commanded position or away from it.

• 0 = Direction of the pointer movement is toward the commanded position

• 1 = Direction of the pointer movement is away from the commanded position

(CMD) Bit OD12

This bit indicates whether the gauge is at the most recently

commanded position.

• 0 = At commanded position

• 1 = Not at commanded position

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(POS11:POS0) Bits OD11:OD0

These 12 bits represent the actual position of the pointer

at the time CS transitions to a Logic [0].

GAUGE POINTER VELOCITY STATUS INFORMATION

Most recent valid PECCR command resulting in the

Gauge and 1 Pointer Velocity status output:

Table 19. Gauge Pointer Velocity STatus Output Register

Bits Read Write

OD15 OD14 OD13 OD12 OD11 OD10 OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0

V15 V14 V13 V12 V11 V10 V9 V8 V7 V6 V5 V4 V3 V2 V1 V0

– – – – – – – – – – – – – – – –

D11

x = Don’t Care

D10 D9 D8

FUNCTIONAL DEVICE OPERATION

1 1 x

The bits in Table 19 are read-only bits.

(V15:V8) Bits OD15:OD8

These eight bits have no meaning. Velocity position that identifies it in the un-truncated ramp (e.g., if RS = 2, then the velocity step location will be 3 when the pointer is at the commanded position).

(V7:V0) Bits OD7:OD0

These eight bits represent the step table value, [that

deleted PV] indicating the act ua l ve l oc it y st ep l o ca ti on (refer

Table 19) of the Gauge pointer at the time that the CS

to transitions to a Logic [0].

33977

Analog Integrated Circuit Device Data Freescale Semiconductor 31

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TYPICAL APPLICATIONS

The 33977 is an extremely versatile device that can be used in a variety of applications, Fi gure 1 . The acceleration and deceleration ramps have been designed for applications where smooth movement is of the highest prior it y . These ramps are fixed and the characteristics can be seen in the

6000

5000

4000

3000

SPE E D (usteps

2000

Ide al

Acceleratio n

(4500 deg/s^2)

following figures. For applications where configurable pointer response and damping are desirable, consider the features of the MC33976. Figure 14 shows the characteristics of the acceleration ramp.

76ms

MC33977

Acceleration

1000

0 20000 40000 60000 80000 100000 120000 140000 160000 180000

TIME (us)

Figure 14. Acceleration Response Characteristics

33977

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32 Freescale Semiconductor

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TYPICAL APPLICATIONS

Figure 15 illustrates the deceleration damping characteristics of the device with the hold counts enabled and disabled.

1250

1200

MC33977

without

Hold Counts

MC33977

with

Hold Counts

1150

1100 1050

1000 950

Position (usteps)

900 850

800

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

Time (s)

Figure 15. Deceleration Damping Response Examples

Table 20 provides a step-by-step example of configuring

and using many of the features designed into the IC This

example is intended to familiarize users with some of the device features.

Table 20. 33977 Setup, Configuration, and Usage Example

Step Command Description

a) Enables the gauge

• Bit PE0: Gauge enable bit

2 RTZCR

4 POSR

5 PECCR

PECCR

b) Clock calibration

• Bit PE3: Enables calibration procedure

• Bit PE4: Set clock f = 1.0 MHz maximum or nominal c) Send 8.0 µs pulse on CS to calibrate 1.0 MHz clock a) Set RTZ full step time

• Bit RC3:RC0 b) Set RTZ blanking time

• Bits RC4 c) Preload RTZ accumulator

• Bits RC12:RC11 and RC10:RC5 d) Check SO for an out-of-range clock calibration

• Is Bit CAL Logic [1}? If so, repeat Steps 1 and 2 a) Move pointer to position 12 prior to RTZ b) Check SO to determine if gauge has moved

• Is bit MOV (OD4) Logic [1]? If so, the gauge moved to the first microstep a) Send null command to determine if gauges moved

• Bit PE12 b) Check SO to determine if the gauge has moved

• Is bit MOV (OD4) Logic [1]? If so, the gauge moved another microstep since the last

SPI message. Keep track of movement and if 12 steps are finished, and both gauges are at a static position, the RTZ. Otherwise, repeat steps a) and b).

• Bit CMD (OD10) could also be monitored to determine if the pointer is static.

Reference Table

and/or Figure

Table 9,

Figure 8

Table 13 Table 14

Table 15

Table 9

Table 16

Table 11

Table 9

Table 16

Table 9 Table 9

Table 16

33977

Analog Integrated Circuit Device Data Freescale Semiconductor 33

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TYPICAL APPLICATIONS

Table 20. 33977 Setup, Configuration, and Usage Example

Step Command Description

a) Return the gauge to the zero stop using the RTZ command

• Bit RZ1 enables or disables an RTZ

6 RTZ

7 PECCR

10 VELR

11 POSR

13 POSR

PECCR

RTZ

PECCR

• Bits RZ2 and PE7 select the direction

These will be used if characterizing the RTZ.

a) Check the status of the RTZ by sending the null command to monitor bit RTZ of the

Device Status SO.

• Bit PE12 is the null command b) Is RTZ (OD2) Logic [1]? If not, the gauge is still returning and null command should be

resent.

a) Change the maximum velocity of the gauge

• Bit V8 enables a change to the maximum velocity

• Bits V7:V10 determine the maximum velocity position from Table 6, Velocity Table a) Position gauge pointer

• Bits P011:P00: Desired pointer position b) Check SO for out-of-range V

PWR

• Is bit OVUV (OD6) Logic [1] If so, use UV (OD8) and OV (OD9) to decide whether to

RTZ after valid V

PWR

c) Check SO for overtemperature

• Is bit OT Logic [1]? If so, enable driver again. If OT continues to indicate

overtemperature, shut down the gauge.

• Once OT returns to normal, re-establish the zero reference by RTZ command. a) Return the pointer close to zero position using POSR b) Move pointer position at least 12 microsteps CW to the nearest full step prior to RTZ f) Send null command to see if gauges moved

• Bit PE12 g) Check SO to determine if the gauge moved.

• Is bit MOV (OD4) Logic [1]? If so, the gauge moved another microstep since the last

SPI message. Keep track of movement and if 12 steps are finished, and both gauges are at a static position, then RTZ. Otherwise, repeat steps a) and b).

• Bit CMD (OD10) could also be monitored to determine the pointer is static. a) Return the gauge to the zero stop using the RTZ command.

• Bit RZ1 enables or disables an RTZ

• Bits RZ2 and PE7 select the direction b) Select the RTZ accumulator bits clocking out on the SO bits using bits PE11:PE10

These will be used if characterizing the RTZ.

a) Check the status of the RTZ by sending the null command to monitor SO bit RTZ

• Bit PE12 is the null command b) Is RTZ Logic [0]? If not, the gauge is still returning and null command should be resent a) Disable the gauge driver and go to standby

• Bit PE0:PE1 disable the gauge b) Put the device to sleep

• RST pin is pulled to Logic [0]

Reference Table

and/or Figure

Table 12

Table 9

Table 15b) Select the RTZ accumulator bits to clock out on the SO bits using bits PE11:PE10.

Table 9

Table 16

Table 9 Table 6

Table 11

Table 6

Table 11

Table 9

Table 16

TABLE 9 TABLE 12 TABLE 16

TABLE 9 TABLE 16

TABLE 9

33977

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34 Freescale Semiconductor

Page 35

PACKAGE DIMENSIONS

PACKAGING

PACKAGE DIMENSIONS

For the most current revision of the package, visit www.freescale.com and do a keyword search using the “98A” number listed

below.

DW SUFFIX

EG SUFFIX (PB-FREE)

24-PIN

PLASTIC PACKAGE

98ASB42344B

ISSUE F

33977

Analog Integrated Circuit Device Data Freescale Semiconductor 35

Page 36

REVISION HISTORY

REVISION DATE DESCRIPTION OF CHANGES

1.0

2.0

8/2006 1/2007

• Initial release

• Updated to the current Freescale format

• Revised Internal Block Diagram to enhance readability

• Added parameter Peak Package Reflow Temperature During Reflow and notes

(4)

and

(5)

• Made wording additions to Address 101 - Gauge Return to Zero Configuration Register

on page 25 and (RC12:RC11) Bits D12:D11 on pa ge 26

• Added ADC Gain

(12), (14)

• Added RTZ Accumulator (Typical) on page 30 and accompanying text

to Static Electrical Characteristics table

(4), (5)

on page 4

33977

Analog Integrated Circuit Device Data

36 Freescale Semiconductor

Page 37

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MC33977 Rev. 2.0 1/2007