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334-15/T2C2-6TWB
Specification
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Datasheet 334-15/T2C2-6TWB Specification

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Page 1
Technical Data Sheet
Features
․Popular T-1 3/4 round package. ․High luminous power. ˙Typical chromaticity coordinates x=0.33y=0.34
according to CIE1931. ˙Bulk, available taped on reel.
˙ESD-withstand voltage: up to 4KV ․The product itself will remain within RoHS compliant version.
Descriptions
˙The series is designed for application required
high luminous intensity.
˙The phosphor filled in the reflector converts the
334-15/T2C2-6TWB
blue emission of InGaN chip to ideal white.
Applications
․Message panels ․Optical Indicators ․Backlighting ․Marker Lights
Device Selection Guide
PART NO.
Material Emitted Color
Chip
Lens Color
334-15/T2C2-6TWB InGaN White Water Clear
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Page 2
Technical Data Sheet
Package Dimensions
334-15/T2C2-6TWB
Notes:
1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified.
2.Lead spacing is measured where the lead emerges from the package.
3.Protruded resin under flange is 1.5mm Max. LED.
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Page 3
Technical Data Sheet
Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Rating Unit
334-15/T2C2-6TWB
Continuous Forward Current I Peak Forward Current(Duty /10 @ 1KHZ) I Reverse Voltage V Operating Temperature T Storage Temperature T Soldering Temperature (T=5 sec) T Power Dissipation P
F
FP
R
opr
stg
sol
d
30
100
5
-40 ~ +85
-40 ~ +100 260 100
Zener Reverse Current Iz 100 Electrostatic Discharge ESD 4K
mA mA
V
℃ ℃ ℃
mW
mA
V
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Page 4
Technical Data Sheet
Color
Group
Luminous Intensity Bins
Voltage Group
Production Designation
334-15/T2C2-□ □ □ □
Electro-Optical Characteristics (Ta=25℃)
334-15/T2C2-6TWB
Parameter Symbol Condition Min. Typ. Max. Units
Forward Voltage V
Zener Reverse Voltage Vz Iz=5mA 5.2 -- -- V
Reverse Current I
Luminous Intensity
Viewing Angle
Chromaticity Coordinates
F
R
I
V
2θ1/2
x -- 0.33 -- --
y
IF=20mA 2.8 -- 3.6 V
VR=5V -- -- 50 uA
IF=20mA 7150 -- 18000 mcd
IF=20mA -- 20 -- deg
IF=20mA
-- 0.34 -- --
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Page 5
Technical Data Sheet
Luminous Intensity Combination (mcd at 20mA)
334-15/T2C2-6TWB
Rank
T 7150 9000 U 9000 11250 V 11250 14250
W 14250 18000
*Measurement Uncertainty of Luminous Intensity: ±10%
Min Max
Forward Voltage Combination (V at 20mA)
Rank 0 1 2 3
Forward Voltage 2.8~3.0 3.0~3.2 3.2~3.4 3.4~3.6
*Measurement Uncertainty of Forward Voltage：±0.1V
Color Combination ( at 20mA)
Group Bins
6 B5+B6+C0
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Page 6
Technical Data Sheet
CIE Chromaticity Diagram
1.0
0.8
0.6
CIE-y
0.4
334-15/T2C2-6TWB
0.2
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Color Ranks (IF=20mA
Color Ranks CIE
X 0.287 0.307 0.311 0.296
B5
Y 0.295 0.315 0.294 0.276 X 0.307 0.33 0.33 0.311
B6
Y 0.315 0.339 0.318
B6
B5
，Ta=25℃)
C0
CIE-x
0.294
Measurement uncertainty of the color coordinates：±0.01
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C0
X 0.33 0.361 0.355 0.33 Y 0.36 0.385 0.35 0.318
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Page 7
Technical Data Sheet
334-15/T2C2-6TWB
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength Forward Current vs. Forward Voltage
1.0
0.8
0.6
0.4
0.2
Relative Intensity(a.u.)
0.0 350 400 450 500 550 600 650 700 750 800
Wavelength(nm)
25
20
15
10
5
Forward Current(mA)
0
2.0 2.5 3.0 3.5 4.0 4.5
Forward Voltage(V)
Relative Intensity vs. Forward Current Forward Current vs. Ambient Temp.
1.5
1.0
0.5
30
25
20
15
10
5
Relative Intensity(a.u.)
0.0
0 5 10 15 20 25
Forward Current(mA)
Forward Current(mA)
0
0 20 40 60 80 100
Ambient Temperature Ta(OC)
Chromaticity Coordinate vs. Forward Current Relative Intensity vs. Angle Displacement
30
O
O
0
10
0
Radiation Angle
O
O
20
O
30
O
40
0.5
0.360
0.350
0.340
0.330
0.320
0.310
Relative Intensity(a.u.)
0.300 0 10 20 30 40 50
y
x
Forward Current(mA)
60
O
1.0
0.5
90
O
Relative Luminusity
0
50
O
O
60
O
70
O
80
O
90
1.0
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Page 8
Technical Data Sheet
Packing Specification
■ Anti-electrostatic bag
Label
Pb
EL ECTROSTATIC ELECTRONAGNETIC MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
■ Inner Carton
334-15/T2C2-6TWB
■ Label Form Specification
CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks of Luminous Intensity and Forward Voltage HUE: Color Rank
■ Outside Carton REF: Reference
LOT No: Lot Number MADE IN TAIWAN: Production Place
■ Packing Quantity
1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
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Page 9
Technical Data Sheet
334-15/T2C2-6TWB
Notes
1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage
the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering DIP Soldering
Temp. at tip of iron
300 Max.℃ (30W Max.)
Preheat temp.
100 Max.℃ (60 sec Max.)
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Soldering time Distance 3mm Min.(From
3 sec Max.
solder joint to epoxy bulb)
Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min. (From
solder joint to epoxy bulb)
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Page 10
Technical Data Sheet
334-15/T2C2-6TWB
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature
and dwell time in the solder wave.
4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for
a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
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ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED
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Page 11
Technical Data Sheet
334-15/T2C2-6TWB
5. Circuit Protection Below the zener reference voltage Vz, all the current flows through LED and as the voltage
rises to Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but
current can’t flow through causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no light up but current can flow through causing others to light up.
6. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED
The temperature surrounding the LED in the application should be controlled. Please refer to
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application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification.
the data sheet de-rating curve.
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Technical Data Sheet
334-15/T2C2-6TWB
7. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs. An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling
LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the
LEDs plastic lens as a result of friction between LEDs during storage and handing.
8. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions
for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http:\\www.everlight.com
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