Page 1
Low voltage fast-switching NPN power transistor
Features
■ Very low collector to emitter saturation
volatage
■ High current gain characteristic
■ Fast-switching speed
■ Through-hole IPAK (TO-251) power package
in tube (suffix”-1”)
■ Surface mounting DPAK (TO-252) power
package in tape & reel (suffix”T4”)
Applications
■ Ccfl drivers
■ Voltage regulators
■ Relay drivers
■ High efficiency low voltage switching
applications
2STD1665
3
2
1
IPAK
TO251
( Suffix “-1” )
Figure 1. Internal schematic diagram
DPAK
TO252
( Suffix “T4” )
3
1
Description
The device is manufactured in NPN Planar
Technology by using a “Base Island” layout. The
resulting transistor shows exceptional high gain
performance coupled with very low saturation
voltage.
Table 1. Device summary
Order code Marking Package Packing
2STD1665T4 D1665 DPAK Tape & reel
2STD1665-1 D1665 IPAK Tube
March 2008 Rev 2 1/11
www.st.com
11
Page 2
2STD1665
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/11
Page 3
2STD1665
1 Electrical ratings
Table 2. Absolute maximum rating
Symbol Parameter Value Unit
V
V
V
I
P
T
Collector-base voltage (IE = 0) 150 V
CBO
Collector-emitter voltage (IB = 0)
CEO
Emitter-base voltage (IC = 0) 7 V
EBO
I
Collector current 6 A
C
Collector peak current (tP < 5ms) 20 A
CM
I
Base current 1 A
B
Total dissipation at Tc = 25 °C 15 W
tot
Storage temperature -65 to 150 °C
stg
T
Max. operating junction temperature 150 °C
J
65 V
Table 3. Thermal data
Symbol Parameter Value Unit
R
thj-amb
Thermal resistance junction-case __max 8.33 °C/W
3/11
Page 4
Electrical characteristics 2STD1665
2 Electrical characteristics
(T
= 25 °C unless otherwise specified)
case
Table 4. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
CBO
I
EBO
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
V
CE(sat)
V
BE(sat)
Collector cut-off current
= 0)
(I
E
Emitter cut-off current
= 0)
(I
C
Collector-base
(1)
breakdown voltage
(I
= 0)
E
Collector-emitter
(1)
breakdown voltage
(I
= 0)
B
Emitter-base
(1)
breakdown voltage
(I
= 0)
C
Collector-emitter
(1)
saturation voltage
Base-emitter saturation
(1)
voltage
V
= 120 V
CB
= 120 V TC = 100 °C
V
CB
= 7 V
V
EB
I
= 100 µA
C
= 10 mA
I
C
= 100 µA
I
E
I
= 100 mA IB = 5 mA
C
I
= 1 A IB = 50 mA
C
I
= 2 A IB = 50 mA
C
I
= 6 A IB = 150 mA
C
= 6 A IB = 300 mA
I
C
I
= 4 A IB = 200 mA
C
501nA
µA
10 nA
150 V
65 V
7V
50
mV
50
120
mV
100
200
mV
260
600
mV
230
380
mV
11.15V
V
BE(on)
C
h
CBO
FE
(1)
voltage
DC current gain
Collector-base
capacitance
I
= 4 A V
C
I
= 10 mA V
C
I
= 2 A V
C
= 5 A V
I
C
I
= 10 A V
C
V
CB
Base-emitter On
Resistive load
t
ON
t
s
t
1. Pulsed duration = 300 µs, duty cycle ≤ 1.5%.
f
Turn-on time
Storage time
Fall time
I
= 3 A V
C
I
B1
4/11
= 1 V
CE
= 1 V
CE
= 1 V
CE
= 1 V
CE
= 1 V
CE
= 10 V f = 1 MHz
= 10 V
CC
= -I
= 0.3 A
B2
0.85 1 V
320
150
310
150
175
90
65
30
45 pF
90
800
90
350
ns
ns
ns
Page 5
2STD1665
2.1 Electrical characteristics (curves)
Figure 2. Output characteristics Figure 3. DC current gain
Figure 4. Collector-emitter saturation
voltage
Figure 6. Base-emitter saturation
voltage
Figure 5. Collector-emitter saturation
voltage
Figure 7. Base-emitter on voltage
5/11
Page 6
Electrical characteristics 2STD1665
Figure 8. Switching times resistive
load
Figure 9. Switching times resistive
load
Figure 10. Capacitance
2.2 Test circuit
Figure 11. Resistive load switching and RBSOA test circuit
1) Fast electronic switching
2) Non-inductive resisitor
6/11
Page 7
2STD1665
3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
7/11
Page 8
Package mechanical data 2STD1665
TO-252 (DPAK) mechanical data
DIM.
A 2.20 2.40
A1 0.901.10
A2 0.03 0.23
b 0.64 0.90
b4 5.20 5.40
c 0.45 0.60
c2 0.48 0.60
D 6.00 6.20
D1 5.10
E 6.40 6.60
E1 4.70
e2.28
e1 4.40 4.60
H 9.35 10.10
L1
L1 2.80
L2 0.80
L4 0.60 1
R0.20
V2 0
min. typ max.
o
mm.
o
8
8/11
0068772_G
Page 9
2STD1665
TO-251 (IPAK) mechanical data
DIM.
A 2.20 2.40
A1 0.901.10
b 0.64 0.90
b2 0.95
b4 5.20 5.40
B5
c 0.45 0.60
c2 0.48 0.60
D 6.00 6.20
E 6.40 6.60
e2.28
e1 4.40 4.60
H 16.10
L 9.00 9.40
L1 0.801.20
L2 0.801.00
V1
min. typ max.
mm.
0.3
10
o
0068771_H
9/11
Page 10
Revision history 2STD1665
4 Revision history
Table 5. Document revision history
Date Revision Changes
08-May-2006 1 Initial release
27-Mar-2008 2 New graphics
10/11
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2STD1665
y
y
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