Datasheet 2SK3228 Datasheet (HIT)

Page 1
2SK3228
Silicon N Channel MOS FET High Speed Power Switching
Features
R
=6m typ.
DS(on)
Low drive current
4V gate drive device can be driven from 5V source
Outline
ADE-208-765A(Z)
Target specification
2nd. Edition
December 1998
TO–220AB
G
D
3
1. Gate
2. Drain(Flange)
3. Source
1
2
S
Page 2
2SK3228
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Avalanche current IAP* Avalanche energy EAR* Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
3
3
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
80 V ±20 V 75 A 300 A 75 A 50 A 181 mJ 100 W
2
Page 3
2SK3228
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R
(BR)DSS
GSS
DSS
GS(off)
DS(on)
80——V I ——±0.1 µAVGS = ±20V, VDS = 0 ——10µAVDS = 80 V, VGS = 0
1.0 2.5 V ID = 1mA, VDS = 10V*
6.0 7.5 m ID = 40A, VGS = 10V* resistance 8.0 12 m ID = 40A, VGS = 4V* Forward transfer admittance |yfs|5590—S ID = 40A, VDS = 10V* Input capacitance Ciss 9700 pF VDS = 10V Output capacitance Coss 1250 pF VGS = 0 Reverse transfer capacitance Crss 290 pF f = 1MHz Total gate charge Qg 150 nc VDD = 25V Gate to source charge Qgs 30 nc VGS = 25V Gate to drain charge Qgd 30 nc ID = 75A Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
80 ns VGS = 10V, ID = 40A
300 ns RL = 0.75
770 ns
370 ns
1.05 V IF = 75A, VGS = 0
90 ns IF = 75A, VGS = 0 recovery time
Note: 1. Pulse test
= 10mA, VGS = 0
D
diF/ dt =50A/µs
1
1
1
1
3
Page 4
2SK3228
Package Dimensions
Unit: mm
2.79 ±0.2
1.27
18.5 ±0.57.8 ±0.5
1.2±0.1
2.54 ±0.5
10.16±0.2
9.5
8.0
1.27±0.1
1.5 max
0.76 ±0.1
2.54 ±0.5
f 3.6
+ 0.2
– 0.1
6.4
+ 0.1 – 0.08
15.0 ±0.3
14.0 ±0.5
0.5±0.1
2.7 max
4.44±0.2
1.26±0.15
Hitachi Code
EIAJ
JEDEC
TO–220AB
SC–46
4
Page 5
Cautions
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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