Datasheet 2SD788C Specification

Page 1
2SD787, 2SD788
Silicon NPN Epitaxial
Application
Low frequency power amplifier
Complementary pair with 2SB738 and 2SB739
Outline
TO-92MOD
1. Emitter
3. Base
3
2
1
Page 2
2SD787, 2SD788
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol 2SD787 2SD788 Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector power dissipation P
CBO
CEO
EBO
C
C
Junction temperature Tj 150 150 °C Storage temperature Tstg –55 to +150 –50 to +150 °C
Electrical Characteristics (Ta = 25°C)
2SD787 2SD788
Item Symbol Min Typ Max Min Typ Max Unit Test conditions
Collector to base breakdown voltage
Collector to emitter breakdown voltage
Emitter to base breakdown voltage
Collector cutoff current I Emitter cutoff current I DC current transfer ratio hFE* Collector to emitter
saturation voltage Gain bandwidth product f
Collector output capacitance
Note: 1. The 2SD787 and 2SD788 are grouped by hFE as follows.
BCDE
100 to 200 160 to 320 250 to 500 400 to 800
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
CBO
EBO
V
CE(sat)
T
20 20 V IC = 10 µA, IE = 0
16 20 V IC = 1 mA, RBE =
6——6 ——VIE = 10 µA, IC = 0
——2 — —2 µAVCB = 16 V, IE = 0 — 0.2 0.2 µAVEB = 6 V, IC = 0
1
100 800 100 800 VCE = 2 V, IC = 0.1 A — 0.3 0.3 V IC = 1 A, IB = 0.1 A
100 100 MHz VCE = 2 V,
Cob 20 20 pF VCB = 10 V, IE = 0,
20 20 V 16 20 V 66V 22A
0.9 0.9 W
I
= 10 mA
C
f = 1 MHz
2
Page 3
2SD787, 2SD788
Maximum Collector Dissipation Curve
1.2
(W)
C
0.8
0.4
Collector Power Dissipation P
0
Ambient Temperature Ta (°C)
Typical Output Characteristics
2.0
1.6
(A)
C
1.2
0.8
Collector Current I
0.4
0
0.4 1.60.8 2.01.2
Collector to Emitter Voltage V
20
IB = 0
15
10
P
C
5 mA
= 0.9 W
(V)
CE
Typical Output Characteristics
100
0.3
80
(mA)
C
60
0.25
0.2
0.15
40
20
Collector Current I
0.1
0.05 mA
IB = 0
CE
841062
(V)
15010050
0
Collector to Emitter Voltage V
Typical Transfer Characteristics
1,000
300
(mA)
100
C
30
10
Collector Current I
3
VCE = 2 V
Ta = 75°C
25
–25
1
0 1.00.2 0.80.4 0.6
Base to Emitter Voltage V
BE
(V)
3
Page 4
2SD787, 2SD788
DC Current Transfer Ratio vs.
10,000
FE
3,000
1,000
300
Pulse V
CE
Collector Current
= 2 V
Ta = 75°C
25
(V)
CE(sat)
(V)
BE(sat)
Saturation Voltage vs. Collector Current
3.0
V
1.0
BE(sat)
0.3 IC = 10 I
0.1
B
100
30
DC Current Transfer Ratio h
10
10 100 1,00030 30031
Collector Current I
–25
Collector to Emitter Saturation Voltage V
(mA)
C
Collector Output Capacitance vs.
Collector to Base Voltage
1,000
(pF)
ob
300
f = 1 MHz I
100
30
Collector Output Capacitance C
10
Collector to Base Voltage V
0.03 V
CE(sat)
0.01
0.003
Base to Emitter Saturation Voltage V
Collector Current IC (mA)
= 0
E
101.0 30.30.1
(V)
CB
3,0001,00030 300100103
4
Page 5
Unit: mm
0.65 ± 0.1
0.75 Max
0.60 Max
0.5 ± 0.1
4.8 ± 0.3
0.7
8.0 ± 0.5
2.3 Max
10.1 Min
3.8 ± 0.3
0.5
1.27
2.54
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-92 Mod — Conforms
0.35 g
Page 6
Cautions
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2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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