Datasheet 2SD756A, 2SD756 Datasheet (HIT)

Page 1
2SD755, 2SD756, 2SD756A
Silicon NPN Epitaxial
Application
Low frequency high voltage amplifier
Complementary pair with 2SB715, 2SB716 and 2SB716A
Outline
TO-92MOD
1. Emitter
3. Base
3
2
1
Page 2
2SD755, 2SD756, 2SD756A
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol 2SD755 2SD756 2SD756A Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector power dissipation P
CBO
CEO
EBO
C
C
Junction temperature Tj 150 150 150 °C Storage temperature Tstg –55 to +150 –55 to +150 –55 to +150 °C
Electrical Characteristics (Ta = 25°C)
2SD755 2SD756 2SD756A
Item Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test conditions
Collector to emitter breakdown voltage
Collector to base breakdown voltage
Collector cutoff current I DC current transfer ratio h
Base to emitter voltage V
Collector to emitter saturation voltage
Gain bandwidth product f
Collector output capacitance
Note: 1. The 2SD755, 2SD756 and 2SD756A are grouped by h
DEF
2SD755 250 to 500 400 to 800 600 to 1200 2SD756 250 to 500 400 to 800 — 2SD756A 250 to 500
V
V
CBO
h
V
T
100 — 120 — 140 — V IC = 1 mA,
(BR)CEO
100 — 120 — 140 — V IC = 10 µA, IE = 0
(BR)CBO
0.5 0.5 0.5 µAVCB = 100 V, IE = 0
*1250 — 1200 250 — 800 250 — 500 VCE = 12 V,
FE1
125 — 125 — 125 — VCE = 12 V,
FE2
0.75 — 0.75 0.75 V VCE = 12 V,
BE
0.2 0.2 0.2 V IC = 10 mA,
CE(sat)
350 350 — 350 — MHz VCE = 12 V,
Cob 1.6 1.6 1.6 pF VCB = 25 V, IE = 0,
100 120 140 V 100 120 140 V 555V 50 50 50 mA 750 750 750 mW
RBE =
IC = 2 mA
IC = 10 mA
IC = 2 mA
IB = 1 mA
IC = 5 mA
f = 1 MHz
as follows.
FE1
2
Page 3
2SD755, 2SD756, 2SD756A
Maximum Collector Dissipation Curve
750
500
250
Collector Power Dissipation Pc (mW)
0 50 100 150
Ambient Temperature Ta (°C)
Typical Transfer Characteristics
10
VCE = 12 V
3
(mA)
1.0
C
Ta = 100°C75
50 25 –250
0.3
0.1
1,200
FE
1,000
10
(mA)
C
Collector Current I
800
600
400
Typical Output Characteristics
10 µA
8
8
6
6
4
4
2
2
IB = 0
0 1020304050
Collector to Emitter Voltage VCE (V)
DC Current Transfer Ratio vs.
Collector Current
VCE = 12 V
Ta = 100°C
75 50 25
0
–25
Collector Current I
0.03
0.01
0.2 0.3 0.4 0.5 0.6 0.7 0.8 Base to Emitter Voltage VBE (V)
200
DC Current Transfer Ratio h
0
0.01 0.03 0.1 0.3 1.0 3 10 30 Collector Current I
(mA)
C
3
Page 4
2SD755, 2SD756, 2SD756A
1,000
(MHz)
T
300
100
30
10
Gain Bandwidth Product f
0.01 0.03 0.1 0.3 1.0 3 10 30
Collector Output Capacitance vs.
50
(pF)
ob
20
10
5
Collector to Base Voltage
f = 1 MHz
= 0
I
E
Gain Bandwidth Product vs.
Collector Current
VCE = 12 V
Collector Current I
(mA)
C
100
50
(mA)
C
20
10
Area of Safe Operation
IC
(DC Operation)
(max)
Pc = 750 mW
Ta = 25°C
(50 V, 15 mA)
2
1.0
Collector Output Capacitance C
0.5 1 3 10 30 100
Collector to Base Voltage VCB (V)
5
(100 V, 6 mA) (120 V, 5 mA)
Collector Current I
2
(140 V, 4 mA)
2SD755
1
5 10 20 50 100 200 500
Collector to Emitter Voltage VCE (V)
2SD756
2SD756A
4
Page 5
Unit: mm
0.65 ± 0.1
0.75 Max
0.60 Max
0.5 ± 0.1
4.8 ± 0.3
0.7
8.0 ± 0.5
2.3 Max
10.1 Min
3.8 ± 0.3
0.5
1.27
2.54
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-92 Mod — Conforms
0.35 g
Page 6
Cautions
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2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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