Datasheet 2SC5225 Datasheet (HIT)

Page 1
2SC5225
Silicon NPN Epitaxial Transistor
Application
Wide band video output amplifier for color CRT monitor.
High frequency high voltage amplifier.
High speed power switching.
Features
High voltage large current operation.
V
= 80 V, IC = 300 mA
CEO
High fT.
fT = 1.4 GHz
Small output capacitance.
Cob = 3 pF
ADE-208-393
1st. Edition
Page 2
2SC5225
Outline
TO-92 (1)
3
2
1
Absolute Maximum Ratings (Ta = 25°C)
1. Emitter
2. Collector
3. Base
Item Symbol Ratings Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector power dissipation P
CBO
CEO
EBO
C
C
100 V 80 V 3V 300 mA
625 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C
2
Page 3
2SC5225
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Collector to base breakdown
V
(BR)CBO
voltage Collector to emitter breakdown
V
(BR)CEO
voltage Collector to base cutoff current I Emitter to base cutoff current I DC current transfer ratio h
Gain bandwidth product f
CBO
EBO
FE
T
Emitter input capacitance Cib 13 19 pF VEB = 0, IC = 0, f = 1 MHz Collector output capacitance Cob 3 4 pF VCB = 10 V, IE = 0, f = 1 MHz
Collector Power Dissipation Curve
1000
800
100 V IC = 100 µA, IE = 0
80——V I
= 1 mA, RBE =
C
——1 µAVCB = 80 V, IE = 0 ——10µAVEB = 3 V, IC = 0 20 70 VCE = 5 V, IC = 50 mA
Pulse test
1.2 1.4 GHz VCE = 10 V, IC = 50 mA
DC Current Transfer Ratio vs.
Collector Current
100
V = 5V
FE
CE
50
600
400
200
Collector Power Dissipation Pc (mW)
0
50 100 150 200
Ambient Temperature Ta (°C)
20
DS Current Transfer Ratio h
10
1 2 5 10 20 50 100200 500
Collector Current I (mA)
C
3
Page 4
2SC5225
Collector to Emitter Saturation Voltage
vs. Collector Current
500
I / I = 10
200
CE(sat)
V (mV)
CB
100
50
20
Collector to Emitter Saturation Voltage
10
1 2 5 10 20 50 100 200 500
Collector Current I (mA)
C
Collector Output Capacitance vs.
Collector to Base Voltage
10
I = 0
E
f = 1 MHz
5
Collector Current vs.
Base to Emitter Voltage
500
V = 5V
200
CE
100
50
C
20 10
5 2
1
0.5
Collector Current I (mA)
0.2
0.1 0 0.2 0.4 0.6 0.8 1.0
Base to Emitter Voltage V (V)
Emitter Input Capacitance vs.
Emitter to Base Voltage
20
I = 0 f = 1 MHz
10
BE
C
2
1
Collector Output Capacitance Cob (pF)
0.5 1 2 5 10 20 50 Collector to Base Voltage V (V)
CB
5
Emitter Input Capacitance Cib (pF)
2
0.5
12 5
Emitter to Base Voltage V (V)
EB
4
Page 5
Gain Bandwidth Product vs.
1.5
T
1.0
0.5
Gain Bandwidth Product f (GHz)
0
1 2 5 10 20 50 100
Collector Current
V = 10 V
CE
V = 5 V
CE
Collector Current I (mA)
C
2SC5225
5
Page 6
Unit: mm
0.60 Max
0.5 ± 0.1
4.8 ± 0.3
1.27
2.54
0.7
5.0 ± 0.2
2.3 Max
12.7 Min
3.8 ± 0.3
0.5
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-92 (1) Conforms Conforms
0.25 g
Page 7
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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