Datasheet 2SC5218 Datasheet (HIT)

Page 1
2SC5218
Silicon NPN Epitaxial
Application
VHF / UHF wide band amplifier
Features
High gain bandwidth product
fT = 9 GHz typ
High gain, low noise figure
PG = 13.0 dB typ, NF = 1.2 dB typ at f = 900 MHz
ADE-208-279
1st. Edition
Outline
MPAK
3
1
2
1. Emitter
2. Base
3. Collector
Page 2
2SC5218
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector power dissipation P
CBO
CEO
EBO
C
C
Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C
Note: Marking is “YK–”.
Attention: This device is very sensitive to electro static discharge.
It is recommended to adopt appropriate cautions when handling this transistor.
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Collector to base breakdown
V
(BR)CBO
voltage Collector cutoff current I
Emitter cutoff current I DC current transfer ratio h
CBO
I
CEO
EBO
FE
Collector output capacitance Cob 0.8 1.4 pF VCB = 5 V, IE = 0,
Gain bandwidth product f
T
Power gain PG 10 13 dB VCE = 5 V, IC = 20 mA,
Noise figure NF 1.2 2.5 dB VCE = 5 V, IC = 5 mA,
15——V I
——1 µAVCB = 12 V, IE = 0 ——1 mAV ——10µAVEB = 1.5 V, IC = 0 50 120 250 VCE = 5 V, IC = 20 mA
6.0 9.0 GHz VCE = 5 V, IC = 20 mA
15 V 9V
1.5 V 50 mA 150 mW
= 10 µA, IE = 0
C
= 9 V, RBE =
CE
f = 1 MHz
f = 900 MHz
f = 900 MHz
2
Page 3
Maximum Collector Dissipation Curve
150
(mW)
C
100
50
Collector Power Dissipation P
0
Ambient Temperature Ta (°C)
2SC5218
DC Current Transfer Ratio vs.
200
FE
160
120
80
40
V = 5 V
DC Current Transfer Ratio h
Pulse Test
0
15010050
0.1
Collector Current
CE
110
Collector Current I (mA)
C
100
Gain Bandwidth Product vs.
Collector Current
CE
T
10
V = 5V
8
6
4
2
Gain Bandwidth Product f (GHz)
0
1
251020 50 100
Collector Current I (mA)
C
Collector Output Capacitance vs.
2.0
1.6
Collector to Base Voltage
I = 0
E
f = 1 MHz
1.2
0.8
0.4
0
Collector Output Capacitance Cob (pF)
0.5 1 2 5 10 20 50 Collector to Base Voltage V (V)
CB
3
Page 4
2SC5218
Power Gain vs. Collector Current
20
V = 5V
CE
f = 900 MHz
16
12
8
Power Gain PG (dB)
4
0
1 2 5 10 20 50 100
Collector Current I (mA)
C
S21 Parameter vs. Collector Current
20
16
2121
12
Noise Figure vs. Collector Current
5
V = 5V
CE
f = 900 MHz
4
3
2
Noise Figure NF (dB)
1
0
1 2 5 10 20 50 100
Collector Current I (mA)
V = 5V
CE
C
f = 1 GHz
8
4
S Parameter |S | (dB)
0
1 2 5 10 20 50 100
Collector Current I (mA)
C
4
Page 5
2SC5218
0
–.2
180°
S11 Parameter vs. Frequency
1
.8
.6
.4
.2
–.6
.6
–.8
.8
CE
1.0
–1
.4
.2
–.4
Condition: V = 5 V , Zo = 50 100 to 1000 MHz (100 MHz step)
(I = 5 mA)
C
(I = 20 mA)
C
S12 Parameter vs. Frequency
90°
120°
150°
–150°
–120°
Condition: V = 5 V , Zo = 50 100 to 1000 MHz (100 MHz step)
–90°
CE
(I = 5 mA) (I = 20 mA)
1.5
1.5
234
–1.5
Scale: 0.04 / div.
60°
–60°
C C
S21 Parameter vs. Frequency
Scale: 6 / div.
90°
2
3
4
5
10
10
5
–10
–5
–4
–3
–2
150°
180°
–150°
120°
–120°
Condition: V = 5 V , Zo = 50
–90°
CE
60°
30°
0°
–30°
–60°
100 to 1000 MHz (100 MHz step)
(I = 5 mA)
C
(I = 20 mA)
C
S22 Parameter vs. Frequency
1
.8
.6
.4
30°
0°
–30°
.2
–.6
.6
.4
–.8
0
.2
–.2
–.4
Condition: V = 5 V , Zo = 50
.8
–1
CE
100 to 1000 MHz (100 MHz step)
1.5
1.5
1.0
234
–1.5
(I = 5 mA)
C
(I = 20 mA)
C
2
3
4
5
10
10
5
–10
–5
–4
–3
–2
5
Page 6
2SC5218
S Parameter (VCE = 5 V, IC = 5 mA, ZO = 50 )
Freq. S11 S21 S12 S22 (MHz) MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG.
100 0.817 –34.7 14.1 156 0.034 72.3 0.916 –19.8 200 0.701 –64.5 11.6 136 0.058 59.8 0.761 –34.8 300 0.602 –88.3 9.32 122 0.073 52.9 0.620 –43.9 400 0.536 –106 7.61 112 0.083 49.8 0.520 –49.3 500 0.495 –120 6.40 105 0.091 48.9 0.447 –52.5 600 0.468 –132 5.50 99.5 0.097 49.3 0.396 –54.5 700 0.447 –141 4.80 94.9 0.104 50.0 0.357 –55.7 800 0.434 –150 4.27 90.9 0.110 50.9 0.327 –56.5 900 0.423 –157 3.83 87.2 0.117 52.1 0.305 –57.5 1000 0.428 –164 3.50 83.9 0.124 53.3 0.287 –58.4
S Parameter (VCE = 5 V, IC = 20 mA, ZO = 50 )
Freq. S11 S21 S12 S22 (MHz) MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG.
100 0.529 –70.4 29.9 136 0.025 64.9 0.716 –39.8 200 0.427 –111 19.0 115 0.038 60.3 0.462 –56.6 300 0.386 –134 13.4 104 0.048 61.8 0.330 –63.2 400 0.370 –150 10.2 98.0 0.058 64.3 0.260 –66.2 500 0.366 –159 8.28 93.7 0.069 66.6 0.214 –67.8 600 0.367 –167 6.96 89.7 0.080 67.8 0.184 –68.8 700 0.364 –174 6.01 87.0 0.091 68.7 0.162 –69.1 800 0.360 –179 5.28 84.2 0.102 69.5 0.146 –69.7 900 0.362 176 4.71 81.7 0.115 69.4 0.133 –70.4 1000 0.364 171 4.27 79.3 0.126 69.6 0.123 –71.5
6
Page 7
Unit: mm
3 – 0.4
+ 0.10 – 0.05
0.95
1.9 ± 0.2
2.95 ± 0.2
0.95
0.65
+ 0.2
1.5 ± 0.15
0.65
0.3
+ 0.2
– 0.6
2.8
– 0.1
1.1
+ 0.10
0.16
– 0.06
0 – 0.1
Hitachi Code JEDEC EIAJ Weight
(reference value)
MPAK — Conforms
0.011 g
Page 8
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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