2SC4959–T13 Kpcs/Reel.Pin3 (Collector) face to perfora-
2SC4959–T23 Kpcs/Reel.Pin1 (Emitter), Pin2 (Base) face
* Please contact with responsible NEC person, if you require evaluation
sample.
Unit sample quantity shall be 50 pcs. (Part No.: 2SC4959)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Collector to Base VoltageVCBO9V
QUANTITYPACKING STYLE
Embossed tape 8 mm wide.
tion side of the tape.
Embossed tape 8 mm wide.
to perforation side of the tape.
PACKAGE DIMENSIONS
in millimeters
2.1 ± 0.1
1.25 ± 0.1
2
–0
+0.1
0.3
2.0 ± 0.2
0.9 ± 0.1
1
0.65 0.65
0.3
PIN CONNECTIONS
Emitter
1.
Base
2.
Collector
3.
Marking
0 to 0.1
3
–0
+0.1
0.3
–0.05
+0.1
0.15
Collector to Emitter VoltageV
Emitter to Base VoltageVEBO2V
Collector CurrentI
Total Power DissipationP
Junction TemperatureTj150°C
Storage TemperatureT
Document No. P10382EJ2V0DS00 (2nd edition)
(Previous No. TD-2410)
Date Published July 1995 P
Printed in Japan
Collector Cutoff CurrentI
Emitter Cutoff CurrentI
DC Current Gainh
Gain Bandwidth Productf
Feed back CapacitanceC
Insertion Power Gain|S
CBO
EBO
21e
FE
T
re
2
|
75150VCE = 3 V, IC = 10 mA
12GHzVCE = 3 V, IC = 10 mA, f = 2.0 GHz
0.40.7pFVCB = 3 V, IE = 0, f = 1 MHz
78.5dBVCE = 3 V, IC = 10 mA, f = 2.0 GHz
0.1
0.1
µ
AVCB = 5 V, IE = 0
µ
AVEB = 1 V, IC = 0
*1
Noise FigureNF1.52.5dBVCE = 3 V, IC = 3 mA, f = 2.0 GHz
*1 Pulse Measurement ; PW ≤ 350 µs, Duty Cycle ≤ 2 % Pulsed.
*2 Measured with 3 terminals bridge, Emitter and Case should be grounded.
hFE Classification
RankT83
MarkingT83
h
FE
75 to 150
TYPICAL CHARACTERISTICS (TA = 25 °C)
*2
TOTAL POWER DISSIPATION
vs.AMBIENT TEMPERATURE
Free Air
200
100
– Total Power Dissipation – mW
T
P
050100150
TA – Ambient Temperature – °CVBE – Base to Emitter Voltage – V
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
50
V
CE
= 3 V
40
30
20
– Collector Current – mA
10
C
I
0
0.51.0
2
Page 3
2SC4959
60
01
500 A
400 A
300 A
200 A
I
B
= 100 A
50
40
30
20
10
23456
0.1
200
100
0
0.20.5 12510 2050 100
5 V
V
CE
= 3 V
14
0.5
12
10
8
6
4
2
12 51020 50
5 V
3 V
V
CE
= 1 V
10
1
8
6
4
2
251050
20
5 V
3 V
VCE = 1 V
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
DC CURRENT GAIN vs.
COLLECTOR CURRENT
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
INSERTION POWER GAIN vs.
COLLECTOR CURRENT
f = 2 GHz
f = 2 GHz
V
CE
– Collector to Emitter Voltage – VIC – Collector Current – mA
I
C
– Collector Current – mA
I
C
– Collector Current – mA
I
C
– Collector Current – mA
h
FE
– DC Current Gain
f
T
– Gain Bandwidth Product – GHz
S
21e
2
– Insertion Power Gain – dB
m
m
m
m
m
4
0.5
3
2
1
0
12 51020
50
0.2
0.51251020
0.3
0.4
0.5
0.6
f = 2 GHz
V
CE
= 3 V
NOISE FIGURE vs.
COLLECTOR CURRENT
FEED-BACK CAPACITANCE vs.
COLLECTOR TO BASE VOLTAGE
f = 1 MHz
NF – Noise Figure – dB
IC – Collector Current – mA
V
CB
– Collector to Base Voltage – V
C
re
– Feed-back Capacitance – pF
3
Page 4
S–PARAMETER
(VCE = 3 V, IC = 1 mA, ZO = 50 Ω)
2SC4959
fS
(GHz)MAGANGMAGANGMAGANGMAGANG
0.2000.9340–15.73.5100164.80.045082.60.9850–8.7
0.4000.9040–29.43.3520150.70.078068.00.9410–17.1
0.6000.8150–43.43.1060138.00.114062.80.8960–23.6
0.8000.7530–56.62.8840126.30.137058.00.8260–29.9
1.0000.6540–68.92.6050115.10.149055.20.7830–34.7
1.2000.5900–79.82.4490105.40.166045.40.7220–38.0
1.4000.5160–90.12.261096.80.177044.80.6790–42.0
1.6000.4590–101.52.078089.40.178045.10.6430–45.2
1.8000.4230–110.81.925083.70.188042.50.6290–46.8
2.0000.3670–123.91.870076.30.190041.90.5880–51.4
2.2000.3370–136.71.779069.90.211043.90.5630–54.3
2.4000.3150–145.51.660064.10.214041.90.5520–57.0
2.6000.3080–159.11.569059.40.207042.80.5450–59.2
2.8000.2930–164.81.519055.30.214045.80.5220–64.5
3.0000.2950–179.61.461050.70.226045.40.4960–61.3
(V
CE = 3 V, IC = 3 mA, ZO = 50 Ω)
fS
(GHz)MAGANGMAGANGMAGANGMAGANG
11S21S12S22
11S21S12S22
0.2000.8020–25.98.8990154.20.037067.20.9420–15.7
0.4000.6780–45.87.4880134.40.076065.60.8040–26.6
0.6000.5440–62.86.1260119.60.086060.90.7060–33.2
0.8000.4430–75.75.1230108.10.105058.40.6250–36.6
1.0000.3540–87.34.305099.10.121055.90.5660–38.3
1.2000.2930–99.73.788091.30.133061.20.5190–41.4
1.4000.2360–108.43.356084.80.144055.40.4950–43.9
1.6000.2000–121.03.010079.10.157056.20.4660–44.5
1.8000.1820–129.52.696074.40.176058.00.4560–44.5
2.0000.1480–151.72.534069.40.194056.10.4310–48.8
2.2000.1370–166.12.382064.00.215056.30.4050–51.9
2.4000.1340175.22.187060.00.213057.80.3990–52.8
2.6000.1640169.72.053055.80.241057.60.3950–52.9
2.8000.1500170.91.966053.00.249055.20.3750–59.2
3.0000.1780147.71.871049.60.275056.60.3740–60.8
4
Page 5
S–PARAMETER
(VCE = 3 V, IC = 5 mA, ZO = 50 Ω)
2SC4959
fS
(GHz)MAGANGMAGANGMAGANGMAGANG
0.2000.6900–33.312.2960147.10.032074.80.8850–19.7
0.4000.5360–54.79.4300125.50.061066.30.7210–30.3
0.6000.4010–70.07.2390111.30.070059.60.6030–34.5
0.8000.3150–82.45.8220101.10.095063.80.5230–36.7
1.0000.2360–93.84.783093.40.109062.30.4870–38.0
1.2000.1850–105.44.170086.40.126061.90.4600–38.8
1.4000.1440–115.83.641080.70.135065.90.4360–40.4
1.6000.1230–134.43.238076.10.156061.20.4170–42.6
1.8000.1040–144.62.891071.40.177062.40.4020–43.9
2.0000.1000–170.62.704067.30.193060.70.3940–45.8
2.2000.1110167.42.533062.60.208060.60.3710–50.3
2.4000.1040158.22.327058.70.226061.60.3500–50.2
2.6000.1180156.32.185054.90.256058.20.3560–51.2
2.8000.1190150.02.091052.60.256056.80.3520–58.1
3.0000.1490142.41.976049.00.286056.60.3410–56.9
(V
CE = 3 V, IC = 10 mA, ZO = 50 Ω)
fS
(GHz)MAGANGMAGANGMAGANGMAGANG
11S21S12S22
11S21S12S22
0.2000.5080–43.617.0900135.90.033063.80.7930–26.2
0.4000.3410–65.311.3980114.20.052068.50.5910–32.9
0.6000.2320–80.78.2250102.00.069069.00.5130–32.9
0.8000.1770–90.86.395093.80.088071.60.4480–32.8
1.0000.1220–108.25.187087.20.106069.30.4180–35.9
1.2000.1010–121.84.439081.60.126070.10.4030–33.3
1.4000.0670–138.23.877076.90.145070.50.3930–36.5
1.6000.0620–167.63.435072.40.159065.50.3680–36.2
1.8000.0660–171.33.065068.80.179065.00.3610–39.5
2.0000.0770146.72.854065.00.206063.90.3480–42.3
2.2000.0990146.52.659060.50.222062.80.3360–46.6
2.4000.1140128.12.440057.00.242060.90.3370–48.8
2.6000.1260136.82.279053.50.266059.90.3170–47.2
2.8000.1020129.62.195050.90.277059.60.3280–55.1
3.0000.1370123.52.080047.90.286058.30.3100–51.2
5
Page 6
2SC4959
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
M4 94.11
6
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