Datasheet 2pd601arl-asl Datasheet

Page 1
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
Rev. 01 — 6 November 2008 Product data sheet
1. Product profile

1.1 General description

NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
Table 1. Product overview
Type number
2PD601ARL SOT23 TO-236AB 2PB709ARL 2PD601ASL 2PB709ASL 2PD601ARL/DG SOT23 TO-236AB 2PB709ARL/DG 2PD601ASL/DG 2PB709ASL/DG
[1] /DG: halogen-free.
[1]
Package PNP complement NXP JEDEC

1.2 Features

n General-purpose transistors n Two current gain selections n AEC-Q101 qualified n Small SMD plastic package

1.3 Applications

n General-purpose switching and amplification

1.4 Quick reference data

Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V I h
CEO
C
FE
collector-emitter voltage open base - - 50 V collector current - - 100 mA DC current gain VCE=10V;
I
=2mA
C
group R 210 - 340
h
FE
group S 290 - 460
h
FE
Page 2
NXP Semiconductors

2. Pinning information

Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1 base 2 emitter 3 collector

3. Ordering information

Table 4. Ordering information
Type number
2PD601ARL - plastic surface-mounted package; 3 leads SOT23 2PD601ASL 2PD601ARL/DG 2PD601ASL/DG
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
3
12
[1]
Package Name Description Version
3
1
2
sym021

4. Marking

[1] /DG: halogen-free.
Table 5. Marking codes
Type number Marking code
2PD601ARL SM* 2PD601ASL SK* 2PD601ARL/DG SR* 2PD601ASL/DG SY*
[1] * = -: made in Hong Kong
* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
[1]
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 2 of 9
Page 3
NXP Semiconductors

5. Limiting values

Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
j
T
amb
T
stg
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
collector-base voltage open emitter - 60 V collector-emitter voltage open base - 50 V emitter-base voltage open collector - 6 V collector current - 100 mA peak collector current single pulse;
t
≤ 1ms
p
peak base current single pulse;
t
≤ 1ms
p
total power dissipation T
amb
≤ 25 °C junction temperature - 150 °C ambient temperature −55 +150 °C storage temperature −65 +150 °C
- 200 mA
- 100 mA
[1]
- 250 mW

6. Thermal characteristics

Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance fromjunction to ambient
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

7. Characteristics

Table 8. Characteristics
T
=25°C unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
I
CBO
I
EBO
h
FE
collector-base cut-off current VCB=60V; IE=0A--10nA
emitter-base cut-off current VEB=5V; IC=0A --10nA DC current gain VCE=2V;
h
FE
h
FE
in free air
=60V;IE=0A;
V
CB
T
= 150 °C
j
I
= 100 mA
C
group R VCE=10V;
I
=2mA
C
group S VCE=10V;
I
=2mA
C
[1]
- - 500 K/W
--5µA
[1]
90 - -
210 - 340
290 - 460
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 3 of 9
Page 4
NXP Semiconductors
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
Table 8. Characteristics
T
=25°C unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
V
CEsat
f
T
C
c
[1] Pulse test: tp≤ 300 µs; δ≤0.02.

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard suitable for use in automotive applications.

9. Package outline

…continued
collector-emitter saturation voltage
IC= 100 mA; I
=10mA
B
transition frequency VCE=10V;
I
= 2 mA;
C
[1]
- - 250 mV
100 - - MHz
f = 100 MHz
collector capacitance VCB=10V;
I
=0A;
E=ie
--3pF
f=1MHz
Q101 - Stress test qualification for discrete semiconductors
, and is
3.0
2.8
2.5
1.4
2.1
1.2
12
1.9
Fig 1. Package outline SOT23 (TO-236AB)
1.1
0.9
3
0.45
0.15
0.48
0.38
0.15
0.09
04-11-04Dimensions in mm
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 4 of 9
Page 5
NXP Semiconductors

10. Packing information

2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors

11. Soldering

Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
Type number
[2]
Package Description Packing quantity
[1]
3000 10000
2PD601ARL SOT23 4 mm pitch, 8 mm tape and reel -215 -235 2PD601ASL 2PD601ARL/DG 2PD601ASL/DG
[1] For further information and the availability of packing methods, seeSection 14. [2] /DG: halogen-free.
3.3
2.9
1.9
solder lands
3
1.7
0.7
(3×)
0.5
(3×)
0.6
(3×)
1
0.6
(3×)
Fig 2. Reflow soldering footprint SOT23 (TO-236AB)
2
Dimensions in mm
solder resist
solder paste
occupied area
sot023_fr
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 5 of 9
Page 6
NXP Semiconductors
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
2.2
1.2
(2×)
1.4
(2×)
solder lands
2.6
4.6
1.4
2.8
4.5
Fig 3. Wave soldering footprint SOT23 (TO-236AB)
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
sot023_fw
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 6 of 9
Page 7
NXP Semiconductors
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors

12. Revision history

Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
2PD601AXL_1 20081106 Product data sheet - -
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 7 of 9
Page 8
NXP Semiconductors

13. Legal information

13.1 Data sheet status

2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
[1][2]
Product status
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shallhave no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product typenumber(s) and title. A short data sheet is intended for quick referenceonly and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and
reliable. However,NXP Semiconductors does not give any representations or warranties, expressedor implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
[3]
http://www.nxp.com.
Definition
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyanceor implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referencedbrands, product names, service names and trademarks are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected]
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 8 of 9
Page 9
NXP Semiconductors

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 4
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 4
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 5
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected]
Date of release: 6 November 2008
Document identifier: 2PD601AXL_1
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