Page 1
DATA SH EET
DISCRETE SEMICONDUCTORS
M3D883
BOTTOM VIEW
2PC4617M series
NPN general purpose transistors
Product data sheet 2003 Jul 15
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NXP Semiconductors Product data sheet
NPN general purpose transistors 2PC4617M series
FEATURES
• Leadless ultra small plastic package
mm × 0.6 mm × 0.5 mm)
(1
• Board space 1.3 × 0.9 mm
• Power dissipation comparable to SOT23.
APPLICATIONS
• General purpose small signal DC applications
• Low and medium frequency AC applications
• Mobile communications, digital (still) cameras, PDAs,
PCMCIA cards.
DESCRIPTION
NPN general purpose transistor in a SOT883 leadless ultra
small plastic package.
complement: 2PA1776M series.
PNP
MARKING
T YPE NUMBER MARKING CODE
2PC4617QM D7
2PC4617RM D8
2PC4617SM D9
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
V
I
I
CEO
C
CM
collector-emitter voltage 50 V
collector current (DC) 100 mA
peak collector current 200 mA
PINNING
PIN DESCRIPTION
1 base
2 emitter
3 collector
handbook, halfpage
2
1
Bottom view
3
1
MAM475
3
2
Fig.1 Simplified outline (SOT883) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
V
I
I
I
P
CBO
CEO
EBO
C
CM
BM
tot
collector-base voltage open emitter − 50 V
collector-emitter voltage open base − 50 V
emitter-base voltage open collector − 5 V
collector current (DC) − 100 mA
peak collector current − 200 mA
peak base current − 200 mA
total power dissipation T
amb
≤ 25 °C
note 1 − 250 mW
note 2 − 430 mW
T
stg
T
j
T
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
2. Device mounted on a FR4 printed-circuit board, sin gle- sid ed copper, mounting pad for collector 1 cm2.
2003 Jul 15 2
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NXP Semiconductors Product data sheet
NPN general purpose transistors 2PC4617M series
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
2. Device mounted on a FR4 printed-circuit board, sin gle- sid ed copper, mounting pad for collector 1 cm2.
CHARACTERISTICS
T
= 25 °C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CBO
I
EBO
h
FE
V
CEsat
C
c
f
T
thermal resistance from junction to ambient in free air
note 1 500 K/W
note 2 290 K/W
collector-base cut-off curren t VCB = 30 V; IE = 0 − 100 nA
VCB = 30 V; IE = 0; Tj = 150 °C − 5 μA
emitter-base cut-off current VEB = 4 V; IC = 0 − 100 nA
DC current gain VCE = 6 V; IC = 1 mA
2PC4617QM 120 270
2PC4617RM 180 390
2PC4617SM 270 560
collector-emitter saturation voltage IC = 50 mA; IB = 5 mA; note 1 − 200 mV
collector capacitance IE = ie = 0; VCB = 12 V; f = 1 MHz − 1.5 pF
transition frequency VCE = 12 V; IC = 2 mA;
f
= 100 MHz
100 − MHz
Note
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
2003 Jul 15 3
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NXP Semiconductors Product data sheet
L
3
NPN general purpose transistors 2PC4617M series
PACKAGE OUTLINE
eadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm SOT88
L
2
b
e
1
e
1
E
L
1
3
b
1
A
A
1
D
0 0.5 1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
max.
0.03
1
bb
0.20
0.12
IEC JEDEC JEITA
1
0.55
0.47
DE
0.62
0.55
eLL
1.02
0.35 0.65
0.95
REFERENCES
e
1
0.30
0.22
0.30
0.22
1
EUROPEAN
PROJECTION
ISSUE DATE
03-02-05
03-04-03
A
UNIT
0.50
mm
0.46
Note
1. Including plating thickness
OUTLINE
VERSION
SOT883 SC-101
2003 Jul 15 4
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NXP Semiconductors Product data sheet
NPN general purpose transistors 2PC4617M series
DATA SHEET STATUS
DOCUMENT
STATUS
Objective data sheet Development This document contains data from the objective specification for product
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or comple ting a design.
2. The product status of device(s) desc ribed in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
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specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
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accepts no liability for inclusion and/or use of NXP
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Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modificati on .
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
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products are sold subject to the general terms and
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http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
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Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC
the device. Limiting values are stress ratings only an d
operation of the device at these or any other conditions
2003 Jul 15 5
60134) may cause permanent damage to
Page 6
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors . No changes were
made to the content, except for the legal definitions and disclaimers.
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this documen t d oes not form part of any quotation or contract, is believe d t o b e a ccur ate a nd re li a ble and may be chan ged
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under patent- or other industri al or intellectual property rights.
Printed in The Netherlands 613514/01/pp6 Date of release: 2003 Jul 15 Document order number: 9397 750 11484
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