Datasheet 2N5638 Datasheet (Fairchild Semiconductor)

Page 1
2N5638
N-Channel Switch
• This device is designed for low level analog switchng, sample and hold circuits and chopper stabilized amplifiers.
• Sourced from process 51.
2N5638
1
TO-92
1. Drain 2. Source 3. Gate
Absolute Maximum Ratings *
TC=25°C unless otherwise noted
Symbol Parameter Value Units
V
DG
V
GS
I
GF
T
, T
J
STG
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
1. These ratings are based on a maximum junction temperature of 150 degrees C.
2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics
Drain-Gate Voltage 30 V Gate-Source Voltage -30 V Forward Gate Current 50 mA Operating and Storage Junction Temperature Range -55 ~ +150 °C
TC=25°C unless otherwise noted
Symbol Parameter Test Condition Min. Typ. Max. Units
Off Characteristics
V
(BR)GSS
I
GSS
I
D(off)
Gate-Source Breakdown Voltage VDS = 0, IG = -10µA-30 V Gate Reverse Current VGS = -15V, VDS = 0 -1.0 nA Drain Cutoff Leakage Current VDS = 12V, VGS = 15V 1.0 nA
On Characteristics
I
DSS
r
DS(on)
Zero-Gate Voltage Drain Current * VDS = 20V, IGS = 0 50 mA Drain-Source On Resistance VGS = 0V, ID = 1.0mA 30
Small Signal Characteristics
r
ds(on)
C
iss
C
rss
Drain-Source On Resistance VDS = VGS = 0, f = 1.0kHz 30 Input Capacitance VDS = 0, VGS = 12V, f = 1.0MHz 10 pF Reverse Transfer Capacitance VDS = 0V, VGS = 12V, f = 1.0MHz 4.0 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
* Pulse Test: Pulse Width 300µs, Duty Cycle 1.0%
Trun On Delay Time VDD = 10V, V
= -12, I
V
Rise Time 5.0 ns Trun Off Delay Time 5.0 ns
GS(off)
R
G
= 50
GS(on)
D(on)
= 0
= 12mA
4.0 ns
Fall Time 10 ns
Thermal Characteristics
TA=25°C unless otherwise noted
Symbol Parameter Max. Units
P
D
R
θJC
R
θJA
©2002 Fairchild Semiconductor Corporation Rev. A1, November 2002
Total Device Dissipation Derate above 25°C
350
2.8
mW
mW/°C Thermal Resistance, Junction to Case 125 °C/W Thermal Resistance, Junction to Ambient 357 °C/W
Page 2
Package Dimensions
0.46
±0.10
4.58
+0.25 –0.15
2N5638
TO-92
±0.20
4.58
±0.40
1.27TYP
[1.27
±0.20
3.86MAX
±0.10
1.02
+0.10
–0.05
0.38
14.47
1.27TYP
]
3.60
±0.20
[1.27
±0.20
]
0.38
+0.10 –0.05
(0.25)
(R2.29)
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. A1, November 2002
Page 3
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™
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SPM™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
©2002 Fairchild Semiconductor Corporation Rev. I1
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Semiconductor reserves the right to make changes at any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor . The datasheet is printed for reference information only.
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