Datasheet 2N5462, 2N5461, 2N5460 Datasheet (Fairchild Semiconductor)

Page 1
Discrete POWER & Signal
Technologies
2N5460 / 2N5461 / 2N5462 / MMBF5460 / MMBF5461
2N5460 2N5461
MMBF5460 MMBF5461
2N5462
G
D
G
S
D
P-Channel General Purpose Amplifier
This device is designed primarily for low level audio and general purpose applications with high impedance signal sources. Sourced from Process 89.
Absolute Maximum Ratings* TA = 25°C unless otherwise noted
-
Symbol Parameter Value Units
V
DG
V
GS
I
GF
TJ ,T
stg
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Drain-Gate Voltage - 40 V Gate-Source Voltage 40 V Forward Gate Current 10 mA Operating and Storage Junction Temperature Range -55 to +150
TO-92
SOT-23
Mark: 6E / 61U
S
C
°
Thermal Characteristics TA = 25°C unless otherwise noted
Symbol Characteristic Max Units
2N5460 *MMBF5460
P
D
R
θ
JC
R
θ
JA
*Device mounted on FR-4 PCB 1.6" X 1.6" X 0.06."
ã 1997 Fairchild Semiconductor Corporation
Total Devi ce Dissipation
Derate above 25°C
Ther mal Resist ance, Junction to C ase 83.3 Thermal Resistance, Junction to Ambient 200 357
625
5.0
350
2.8
mW
mW/°C
C/W
°
C/W
°
Page 2
(BR)
µ
)
µ
µ
µ
µ
P-Channel General Purpose Amplifier
(continued)
Electrical Characteristics TA = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
OFF CHARACTERISTICS
V
GSS
I
GSS
V
GS(off
V
GS
ON CHARACTERISTICS
I
DSS
Gate-Source Breakdow n Voltage
I
= 10 µA, VDS = 0
G
Gate Reverse Current VGS = 20 V, VDS = 0
V
= 20 V, VDS = 0, TA = 100°C
Gate-Source Cuto ff Voltage
GS
V
= 15 V, ID = 1.0 µA
DS
Gate-Source Voltage VDS = 15 V, ID = 0.1 mA
V
= 15 V, ID = 0.2 mA
DS
= 15 V, ID = 0.4 mA
V
DS
Zero-Gate Voltage Drain Current* VDS = 15 V, VGS = 0
2N5460 2N5461 2N5462 2N5460 2N5461 2N5462
2N5460 2N5461 2N5462
40 V
5.0
1.0
0.75
1.0
1.8
0.5
0.8
1.5
- 1.0
- 2.0
- 4.0
6.0
7.5
9.0
4.0
4.5
6.0
- 5.0
- 9.0
- 16
nA
A V V V V V V
mA mA mA
2N5460 / 2N5461 / 2N5462 / MMBF5460 / MMBF5461
SMALL SIGNAL CHARACTERISTICS
g
fs
g
os
C
iss
C
rss
NF Noise Figure VDS = 15 V, VGS = 0,
e
n
Forward Transfer Conductance VDS = 15, VGS = 0, f = 1.0 kHz
Output Conductance VDS = 15, VGS = 0, f = 1.0 kHz 75 Input Capacitance VDS = 15, VGS = 0, f = 1.0 MHz 5.0 7.0 pF Reverse Transfer Capacitance VDS = 15, VGS = 0, f = 1.0 MHz 1.0 2.0 pF
R
= 1.0 megohm, f = 100 Hz,
G
BW = 1.0 Hz Equivalent Short-Circuit Input Noise Voltage
VDS = 15 V, VGS = 0, f = 100 Hz,
BW = 1.0 Hz
*Pulse Test: Pulse Width £ 300 ms, Duty Cycle £ 2%
2N5460 2N5461 2N5462
1000 1500 2000
4000 5000 6000
mhos mhos mhos mhos
1.0 2.5 dB
60 115
nV/ÖHz
Page 3
Typical Characteristics (continued)
2N5460 / 2N5461 / 2N5462 / MMBF5460 / MMBF5461
P-Channel General Purpose Amplifier
(continued)
Transfer Characteristics
Common Drain-Source
Transfer Charactersitics
Parameter Interactions
Leakage Current vs. Voltage
Channel Resistance vs.
Temperature
Page 4
Typical Characteristics (continued)
2N5460 / 2N5461 / 2N5462 / MMBF5460 / MMBF5461
P-Channel General Purpose Amplifier
(continued)
Output Conductance vs.
Drain Current
Noise Voltage vs. Frequency Capacitance vs. Voltage
Transconductance vs.
Drain Current
Page 5
TO-92 Tape and Reel Data and Package Dimensions
TO-92 Packaging Configuration: Figure 1.0
FSCINT Label sample
FAIRCHILD SEMICONDUCTOR CORPORATION
LOT:
CBVK741B019
NSID:
PN2222N
D/C1:
SPEC REV:
D9842
QA REV:
HTB:B
QTY:
10000
SPEC:
B2
(FSCINT)
F63TNR Label sample
LOT: CBVK741B019
FSID: PN222N
D/C1: D9842 QTY1: SPEC REV: D/C2: QTY2: CPN:
QTY: 2000
SPEC:
N/F: F (F63TNR)3
TO-92 TNR/AMMO PACKING INFROMATION
Packing Style Quantity EO L code
Reel A 2,000 D26Z
Ammo M 2,000 D74Z
Unit w eight = 0.22 gm Reel weight with compone nts = 1.04 kg Amm o weight with compo n ents = 1.02 kg Max q uantity p er intermediate bo x = 10,00 0 units
E2,000 D27Z
P2,000 D75Z
(TO-92) BULK PACKING INFORMATION
EOL
CODE
J18Z
J05Z
NO EOL
CODE
DESCRIPTION
TO-18 OPTION STD NO LEAD CLIP
TO-5 OPTION STD NO LEAD CLIP TO-92 STANDARD
STRAIGHT
NO LEADCLIP
LEADCLIP
DIMENSION
327mm x 158mm x 135mm
Immediate Box
Customized Label
QUANTITY
2.0 K / BOX
1.5 K / BOX
2.0 K / BOX
TAPE and REEL OPTION
See Fig 2.0 for various
Reeling Styles
5 Reels per
Intermediate Box
F63TNR Label
Customized Label
AMMO PACK OPTION
See Fig 3.0 for 2 Ammo
Pack Options
5 Ammo boxes per
Intermediate Box
F63TNR Label
BULK OPTION
See Bulk Packing Information table
FSCINT Label
375mm x 267mm x 375mm
Intermediate Box
333mm x 231mm x 183mm
Intermediate Box
Anti-static
Bubble Sheets
FSCINT Label
Customized Label
FSCINT Label
Customized Label
530mm x 130mm x 83mm
FSCINT Label
Intermediate box
2000 units per EO70 box for
std option
C Label
10,000 units maximum
per intermediate box
for std option
ustomized
5 EO70 boxes per intermediate Box
114mm x 102mm x 51mm
Immediate Box
September 1999, Rev. B
Page 6
TO-92 Tape and Reel Data and Package Dimensions, continued
TO-92 Reeling Style Configuration: Figure 2.0
Machine Option “A” (H)
Style “A”, D26Z, D70Z (s/h )
TO-92 Radial Ammo Packaging Configuration: Figure 3.0
FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP
ORDER STYLE
D74Z (M)
Machine Option “E” (J)
Style “E”, D27 Z, D71 Z (s/ h)
FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM
ORDER STYLE
D75Z (P)
FIRST WIRE OFF IS EMITTER (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM
FIRST WIRE OFF IS COLLECTOR (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP
September 1999, Rev. B
Page 7
TO-92 Tape and Reel Data and Package Dimensions, continued
TO-92 Tape and Reel Taping Dimension Configuration: Figure 4.0
P Pd
Ha
H1
HO
P1 F1
User Direction of Feed
TO-92 Reel Configuration: Figure 5.0
Hd
b
d
L1
P2
PO
DO
S
L
W1
WO
ITEM DESCRIPTION
Base of Package to Lead Bend Compon en t He ig ht Lead Clinch He ight Component Base Height Component Alignment ( side/side ) Component Alignment ( front/back ) Compon en t Pi tc h Feed Hole Pitch Hole Center to First Lead Hole Center to Component Center Lead Spread Lead Thickness Cut Lead Length Taped Lead Length Taped Lead Thickness Carrier Tape Thickness Carrier Tape Width Hold - down Tape Width Hold - down Tape position Feed Hole Position Sprocket Hole Diameter Lead Spring Out
t
W2
W
t1
SYMBOL
b Ha HO H1 Pd Hd P PO P1 P2 F1/F2 d L L1 t t1 W WO W1 W2 DO S
DIMENSION
0.098 (m ax )
0.928 (+ /- 0.025)
0.630 (+ /- 0.020)
0.748 (+ /- 0.020)
0.040 (m ax )
0.031 (m ax )
0.500 (+ /- 0.020)
0.500 (+ /- 0.008)
0.150 (+0.009, -0.010)
0.247 (+ /- 0.007)
0.104 (+ /- 0 .010)
0.018 (+0.002, -0.003)
0.429 (m ax )
0.209 (+0.051, -0.052)
0.032 (+ /- 0.006)
0.021 (+ /- 0.006)
0.708 (+0.020, -0.019)
0.236 (+ /- 0.012)
0.035 (m ax )
0.360 (+ /- 0.025)
0.157 (+0.008, -0.007)
0.004 (m ax )
F63TNR Label
Customized La bel
W2
ELECTROSTAT I C
SENSITIVE DEV ICES
D3
Note : All dimensions are in inches.
D4
D1
ITEM DESCRIPTION SYSMBOL MINIMUM MAXIMUM
D2
W1
W3
Reel Diame t er D1 13.975 14.025 Arbor Hol e Di am et er ( Standard) D2 1.160 1.200
Core Diameter D3 3.100 3.300 Hub Recess Inner Diameter D4 2.700 3.100 Hub Recess Depth W1 0.370 0.570 Flange to Flange Inner Width W2 1.630 1.690 Hub to Hub Cente r Width W3 2.090
Note: All dimensions ar e inch es
(Small Hole) D2 0.650 0.700
July 1999, Rev. A
Page 8
TO-92 T ape and Reel Data and Package Dimensions
TO-92 (FS PKG Code 92, 94, 96)
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.1977
1:1
January 2000, Rev. B
Page 9
SOT-23 Tape and Reel Data and Package Dimensions
SOT-23 Packaging Configuration: Figur e 1.0
SOT-23 Packaging Information
Packaging Option Packaging type
Qty per Reel/Tube/Bag Reel Size Box Dimensi on (mm) Max qty per B o x Weight per unit (gm) Weight per Reel (kg)
Note/Comments
Customized Label
Stan dard
(no flow code)
3,000 10,000 7" Dia
187x107x183 343x343x64
24,000 30,000
0.0082 0.0082
0.1175 0.4006
TNR
D87Z
TNR
13"
Antistatic Cover Tape
Human Readable
Label
Embossed
Carrier Tape
343mm x 342mm x 64mm
Intermediate box for L87Z Option
Packaging Description:
SOT-23
parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (anti­static coated). Other option comes in 10,000 units per 13" or 330cm diameter reel. This and some other options are described in the Packaging Information table.
These full reels are individually labeled and placed insi de a st andard intermediat e made of recyclable cor rugated brown paper with a Fairchild logo printi ng. One pizza box contains eight reels maximum. And these intermediate boxes are placed inside a labeled shipping box which comes in diff erent sizes depending on the number of parts shipped.
3P 3P 3P 3P
SOT-23 Unit Orientation
Human Readable Label
Human Readable Label sample
SOT-23 Tape Leader and Trailer
Configuration: F igure 2.0
Carrier Tape
Cover Tape
Trailer Tape 300mm minimum or
75 empty pocke t s
Components
Human readable Label
187mm x 107mm x 183mm
Intermediate Box for Standard Option
Leader Tape 500mm minimum or
125 empty pockets
September 1999, Rev. C
Page 10
SOT-23 Tape and Reel Data and Package Dimensions, continued
SOT-23 Embossed Carrier Tape Confi guration: Figure 3.0
D0P0 P2
T
B0
Wc
D1
E1
W
F
E2
Tc
K0
P1
A0
User Direction of Feed
Dimensions are in millimeter
Pkg type
SOT-23
(8mm)
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
SOT-23 Reel Configuration: Figure 4.0
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
3.15
2.77
8.0
1.55
1.125
1.75
6.25
+/-0.10
+/-0.10
+/-0.3
+/-0.05
+/-0.125
+/-0.10
3.50
min
+/-0.05
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum
B0
20 deg maximum component rotation
Sketch A (Side or Front Sectional View)
Component Rotation
W1 Measured at Hub
A0
Sketch B (Top View)
Component Rotation
4.0 +/-0.1
Typical component cavity center line
Typical component center line
Dim A
Max
4.0 +/-0.1
1.30
0.228 +/-0.013
5.2 +/-0.3
0.5mm maximum
+/-0.10
0.5mm maximum
Sketch C (Top View)
Component lateral movement
0.06 +/-0.02
Dim A
max
Tape Size
8mm 7" Dia
8mm 13" Dia
Reel
Option
Dim N
Diameter Option
7"
See detail AA
B Min
Dim C
13" Diameter Option
See detail AA
W2 max Measured at Hub
W3
Dim D
min
DETAIL AA
Dimensions are in inches and millimeters
Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
7.00
0.059
177.8
13.00 330
1.5
0.059
1.5
512 +0.020/-0.008 13 +0.5/-0.2
512 +0.020/-0.008 13 +0.5/-0.2
0.795
2.165550.331 +0.059/-0.000
20.2
0.795
4.00
20.2
100
8.4 +1.5/0
0.331 +0.059/-0.000
8.4 +1.5/0
0.567
14.4
0.567
14.4
0.311 – 0.429
7.9 – 10.9
0.311 – 0.429
7.9 – 10.9
September 1999, Rev. C
Page 11
SOT-23 Tape and Reel Data and Package Dimensions, continued
SOT-23 (FS PKG Code 49)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gr am): 0.0082
September 1998, Rev. A1
Page 12
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ CoolFET™ CROSSVOLT™
2
E
CMOS
TM
FACT™ FACT Quiet Series™
®
FAST FASTr™ GTO™ HiSeC™
ISOPLANAR™ MICROWIRE™ POP™ PowerTrench
QFET™ QS™
Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8
SyncFET™ TinyLogic™ UHC™ VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. D
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