Datasheet 2N5088G Specification

Page 1
2N5088, 2N5089
s
Brochure, BRD8011/D.
Amplifier Transistors
NPN Silicon
Features
http://onsemi.com
3 COLLECTOR
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage
2N5088 2N5089
Collector − Base Voltage
2N5088
2N5089 Emitter − Base Voltage V Collector Current − Continuous I Total Device Dissipation @ TA = 25°C
Derate above 25°C Total Device Dissipation @ TC = 25°C
Derate above 25°C Operating and Storage Junction
Temperature Range
V
CEO
V
CBO
EBO
P
P
TJ, T
C
D
D
−55 to +150 °C
stg
30 25
35 30
3.0 Vdc 50 mAdc
625
5.0
1.5 12
Vdc
Vdc
mW
mW/°C
W
mW/°C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient (Note 1)
Thermal Resistance, Junction−to−Case
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. R
is measured with the device soldered into a typical printed circuit board.
q
JA
R
q
JA
R
q
JC
200 °C/W
83.3 °C/W
2
BASE
1 EMITTER
TO−92 CASE 29 STYLE 1
1
2
3
STRAIGHT LEAD
BULK PACK
1
2
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAM
2N
508x
AYWW G
G
x = 8 or 9 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
3
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 4
ORDERING INFORMATION
Device Package Shipping
2N5088G TO−92
2N2088RLRAG TO−92
2N5089G
2N2089RLRE
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification
1 Publication Order Number:
(Pb−Free)
(Pb−Free)
TO−92
(Pb−Free)
TO−92 2000/Tape & Reel
5000 Units/Bulk
2000/Tape & Reel
5000 Units/Bulk
2N5088/D
Page 2
2N5088, 2N5089
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector− Emitter Breakdown Voltage (Note 2)
(I
= 1.0 mAdc, IB = 0) 2N5088
C
Collector− Base Breakdown Voltage
(IC = 100 mAdc, IE = 0) 2N5088
Collector Cutoff Current
(VCB = 20 Vdc, IE = 0) 2N5088 (VCB = 15 Vdc, IE = 0) 2N5089
Emitter Cutoff Current
(V
= 3.0 Vdc, IC = 0)
EB(off)
(V
= 4.5 Vdc, IC = 0)
EB(off)
ON CHARACTERISTICS
DC Current Gain
(IC = 100 mAdc, VCE = 5.0 Vdc) 2N5088
(IC = 1.0 mAdc, VCE = 5.0 Vdc) 2N5088
(IC = 10 mAdc, VCE = 5.0 Vdc) (Note 2) 2N5088
Collector− Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
Base− Emitter On Voltage
(IC = 10 mAdc, VCE = 5.0 Vdc) (Note 2)
SMALL− SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product
(IC = 500 mAdc, VCE = 5.0 Vdc, f = 20 MHz)
Collector−Base Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Emitter−Base Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
Small−Signal Current Gain
(IC = 1.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz) 2N5088
Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 kW, f = 1.0 kHz) 2N5088
2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.
2N5089
2N5089
2N5089
2N5089
2N5089
2N5089
2N5089
V
(BR)CEO
V
(BR)CBO
I
CBO
I
EBO
h
FE
V
CE(sat)
V
BE(on)
f
C
C
h
NF
30 25
− Vdc
Vdc
35 30
nAdc
50 50
nAdc
50
100
− 300 400
350 450
300 400
900
1200
0.5 Vdc
0.8 Vdc
T
cb
eb
fe
50 MHz
4.0 pF
10 pF
350 450
1400 1800
dB
3.0
2.0
R
S
i
n
e
n
IDEAL
TRANSISTOR
Figure 1. Transistor Noise Model
http://onsemi.com
2
Page 3
2N5088, 2N5089
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25°C)
NOISE VOLTAGE
30
BANDWIDTH = 1.0 Hz
20
IC = 10 mA
RS 0
30
BANDWIDTH = 1.0 Hz
20
RS 0
3.0 mA
1.0 mA
300 mA
10
20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k
f, FREQUENCY (Hz)
, NOISE VOLTAGE (nV)
n
e
10
7.0
5.0
3.0
Figure 2. Effects of Frequency
10
7.0
5.0
3.0
2.0
1.0
0.7
0.5
, NOISE CURRENT (pA)
n
I
0.3
0.2
RS 0
0.1 10 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k
10 mA
f, FREQUENCY (Hz)
BANDWIDTH = 1.0 Hz
IC = 10 mA
3.0 mA
1.0 mA
300 mA
100 mA
30 mA
10
7.0
, NOISE VOLTAGE (nV)
n
e
5.0
3.0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 IC, COLLECTOR CURRENT (mA)
f = 10 Hz
100 Hz
10 kHz
100 kHz
Figure 3. Effects of Collector Current
20
16
12
8.0
NF, NOISE FIGURE (dB)
4.0
0
10 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k
BANDWIDTH = 10 Hz to 15.7 kHz
IC = 1.0 mA
500 mA
100 mA
10 mA
RS, SOURCE RESISTANCE (OHMS)
1.0 kHz
Figure 4. Noise Current
300 200
BANDWIDTH = 1.0 Hz IC = 10 mA
100
70 50
30
20
10
, TOTAL NOISE VOLTAGE (nV)
T
7.0
V
5.0
3.0 10 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k
RS, SOURCE RESISTANCE (OHMS)
100 mA
3.0 mA
1.0 mA
300 mA
10 mA
Figure 6. Total Noise Voltage
100 Hz NOISE DATA
20
16
12
30 mA
8.0
NF, NOISE FIGURE (dB)
4.0
0
10 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k
http://onsemi.com
3
Figure 5. Wideband Noise Figure
IC = 10 mA
BANDWIDTH = 1.0 Hz
RS, SOURCE RESISTANCE (OHMS)
Figure 7. Noise Figure
3.0 mA
1.0 mA
300 mA
30 mA
100 mA
10 mA
Page 4
4.0
3.0
2.0
1.0
0.7
0.5
0.4
0.3
FE
h , DC CURRENT GAIN (NORMALIZED)
0.2
0.01
VCE = 5.0 V
2N5088, 2N5089
TA = 125°C
25°C
−55 °C
0.05 2.0 3.0 100.02 0.03
IC, COLLECTOR CURRENT (mA)
0.50.2 0.3
Figure 8. DC Current Gain
1.00.1 5.0
1.0
0.8
0.6
0.4
V, VOLTAGE (VOLTS)
0.2
0
0.01
8.0
6.0
4.0
3.0
TJ = 25°C
VBE @ VCE = 5.0 V
V
@ IC/IB = 10
CE(sat)
0.02 0.05 0.1 0.2
IC, COLLECTOR CURRENT (mA)
Figure 9. “On” Voltages
C
ob
C
cb
0.5
C
eb
1.0 2.0 5.0
C
ib
10 20 50 100
TJ = 25°C
−0.4
−0.8
−1.2
, BASE−EMITTER
−1.6
VBE
θ
R
−2.0
TEMPERATURE COEFFICIENT (mV/ C)°
−2.4
0.01 0.02 0.05 0.1 0.2
500
300
200
TJ = 25°C to 125°C
−55 °C to 25°C
1.0 2.0 5.0
0.5
IC, COLLECTOR CURRENT (mA)
10 20 50 100
Figure 10. Temperature Coefficients
2.0
C, CAPACITANCE (pF)
1.0
0.8
0.1 0.2
1.0 2.0 5.0
0.5 VR, REVERSE VOLTAGE (VOLTS)
Figure 11. Capacitance
10 20 50 100
http://onsemi.com
100
VCE = 5.0 V
70
TJ = 25°C
50
, CURRENT−GAIN  BANDWIDTH PRODUCT (MHz)
T
f
1.0 2.0 5.03.0 7.0 IC, COLLECTOR CURRENT (mA)
10 20 30 50 70 100
Figure 12. Current−Gain — Bandwidth Product
4
Page 5
2N5088, 2N5089
TO−92 (TO−226)
PACKAGE DIMENSIONS
CASE 29−11
ISSUE AM
SEATING PLANE
R
T
SEATING PLANE
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
K
XX
V
1
G
H
C
N
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 −−− 12.70 −−− L 0.250 −−− 6.35 −−− N 0.080 0.105 2.04 2.66 P −−− 0.100 −−− 2.54 R 0.115 −−− 2.93 −−− V 0.135 −−− 3.43 −−−
MILLIMETERSINCHES
N
A
B
P
K
XX
G
V
1
C
N
BENT LEAD
TAPE & REEL
AMMO PACK
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
MILLIMETERS
DIM MIN MAX
A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80 J 0.39 0.50 K 12.70 −−− N 2.04 2.66 P 1.50 4.00 R 2.93 −−− V 3.43 −−−
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local Sales Representative
2N5088/D
5
Loading...