2
90%
10%
90%
90%
10%
10%
PULSE
GENERATOR
V
DD
R
L
OUTPUT
D.U.T.
t
(ON)
t
d(ON)
t
(OFF)
t
d(OFF)
t
F
t
r
INPUT
INPUT
OUTPUT
0V
V
DD
R
gen
0V
-10V
Symbol Parameter Min Typ Max Unit Conditions
BV
DSX
Drain-to-Source 300 V VGS = -5V, ID = 100µA
Breakdown Voltage
V
GS(OFF)
Gate-to-Source OFF Voltage –1.0 –3.5 V VDS = 25V, ID= 10µA
∆V
GS(OFF)
Change in V
GS(OFF)
with Temperature 4.5 mV/°CVDS = 25V, ID= 10µA
I
GSS
Gate Body Leakage Current 100 nA VGS = ± 20V, VDS = 0V
I
D(OFF)
Drain-to-Source Leakage Current 10 µAVGS = -10V, VDS = Max Rating
1mAV
GS
= -10V, VDS = 0.8 Max Rating
T
A
= 125°C
I
DSS
Saturated Drain-to-Source Current 200 mA VGS = 0V, VDS = 25V
R
DS(ON)
Static Drain-to-Source 12 Ω VGS = 0V, ID = 150mA
ON-State Resistance
∆R
DS(ON)
Change in R
DS(ON)
with Temperature 1.1 %/°CVGS = 0V, ID = 150mA
G
FS
Forward Transconductance 300 m ID = 150mA, VDS = 10V
C
ISS
Input Capacitance 300 VGS = -10V, VDS = 25V
C
OSS
Common Source Output Capacitance 30 pF f = 1 MHz
C
RSS
Reverse Transfer Capacitance 5
t
d(ON)
Turn-ON Delay Time 10 VDD = 25V,
t
r
Rise Time 15 ns ID = 150mA,
t
d(OFF)
Turn-OFF Delay Time 15 R
GEN
= 25Ω
t
f
Fall Time 20
V
SD
Diode Forward Voltage Drop 1.8 V VGS = -10V, ISD = 150mA
t
rr
Reverse Recovery Time 600 ns VGS = -10V, ISD = 1A
Notes:
1. All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
Package ID (continuous)* ID (pulsed) Power Dissipation
θθ
θθ
θ
jc
θθ
θθ
θ
ja
IDR*I
DRM
@ TA = 25°C °C/W °C/W
TO-92 175mA 500mA 0.74W 125 170 175mA 500mA
TO-243AA 200mA 500mA 1.6
†
15 78
†
200mA 500mA
*
ID (continuous) is limited by max rated Tj.
†
Mounted on FR4 board, 25mm x 25mm x 1.57mm. Significant P
D
increase possible on ceramic substrate.
Electrical Characteristics (@ 25°C unless otherwise specified)
DN2530
Thermal Characteristics
Switching Waveforms and Test Circuit
Ω