Datasheet 2moa3 DATASHEETS

TM

HT2 MOA3 S20

HITAG

Revision 1.1

2 Chip Module

August 1997Preliminary Specification

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

Table of Contents

1 Definitions.............................................................................................................................. 3

1.1 Objective of the Specifications..................................................................................................................... 3

1.2 Definition of the Chip Module..................................................................................................................... 3

1.3 Use of the Modules......................................................................................................................................3

2 Specifications.........................................................................................................................4

2.1 Mechanical Properties ................................................................................................................................. 4

2.2 Materials .....................................................................................................................................................4

2.3 Temperature Range .....................................................................................................................................4

2.4 Storage Conditions ...................................................................................................................................... 5

2.5 Delivery Conditions.....................................................................................................................................5

2.6 Electrical Specifications............................................................................................................................... 6

3 Drawing of the Chip Module HT2 MOA3 S20 ..................................................................... 7

3.1 Drawing of the Reel.....................................................................................................................................7

3.2 Module outline suggestion........................................................................................................................... 8

3.3 Splicing Specification..................................................................................................................................9

4 Coil Specifications................................................................................................................ 10

5 Functional Description of HITAG 2 ................................................................................... 12

5.1 Memory Organization........................................................................................................ ........................ 12

5.2 Operation Modes and Configuration.......................................................................................................... 13

5.2.1 Modes of Operation............................................................................................................................13

5.2.2 Status Flow ........................................................................................................................................14

5.2.3 Configuration.....................................................................................................................................15

5.3 Configuration of Delivered HITAG 2 Transponders................................................................................... 16

5.4 Definition of Passwords and Keys..............................................................................................................17

6 Quality Inspection ............................................................................................................... 18

7 Characterisation and Test of the Final Transponder.........................................................19

7.1 Characterisation of the Transponder.......................................................................................................... 19

7.2 Final Test of the Transponder.................................................................................................................... 19

8 Ordering Information..........................................................................................................20

HITAGTM is a trademark of Philips Electronics N.V.

Ht2moa3.doc/HS Page 2 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

1 Definitions

1.1 Objective of the Specifications

This specification lists the parameters to be fulfilled by the HITAG 2 chip module
HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs).

1.2 Definition of the Chip Module

A chip module is an electronically packaged chip covered with a globe top cap. The
HT2 MOA3 S20 is above all used as card module, i.e. for further lamination into contactless
smart cards according to ISO 10536.1.

So the HIT AG 2 chip module HT2 MOA3 S20 is best suited for customers that do not want t o
spend time with micro assembly and therefore start - e.g. ISO card production - with the
HITAG 2 chip module.

1.3 Use of the Modules

The HITAG 2 modules are designed to be connected to a coil and then to be further processed by
packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing
information for the coil-module connection and packaging is given in the specification.

For production of contactless chip cards it is recommended to prepunch card foils to create a
recess for the chip module in the card body.

Ht2moa3.doc/HS Page 3 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

2 Specifications

2.1 Mechanical Properties

Width
(Proposed Punching Outline)

Length
(Proposed Punching Outline)

Overall Thickness 0.45 mm ± 0.03 mm
Film Thickness 0.16 mm ± 0.005 mm
Bondpad Size for

Transponder Coil / Module
Interconnection

7.55 mm

11.75 mm see also drawing in chapter 3

1.9 x 3.5 mm Suitable for Welding/Soldering/
Conductive Gluing

2.2 Materials

Tape 110 µm Glass epoxy
Copper Plating 35 µm ED copper
Bond Plating Ni / Au Suitable for Al and Au wire

bonding
Backside Plating Ni / Au
Glob Top Filled Epoxy Thermal curing

2.3 Temperature Range

Operating -25°C to +85°C For packed transponder,

depending on type of package
Processing 150°C for 30 minutes at a standard lamination

pressure for contactless smart

card plastic materials (e.g. PVC,

PET, ...)
Welding Parameters max. 25 ms @ 500 °C on bond pads
Soldering Parameters max. 3 s @ 390 °C on bond pads

Ht2moa3.doc/HS Page 4 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

2.4 Storage Conditions

Temperature 15 - 30 °C
Relative Humidity 40 - 70 %
Duration 1 year

2.5 Delivery Conditions

Delivery Identification Date of ready for shipment, reel numbers, total quantity of good

modules with the detail of good modules per reel, order number,
product type, no supplier identification on reels, bags and boxes.

Types of Delivery Chip modules on reel

approx. 15.000 to 20.000
pcs. per reel,
tape width super 35 mm,
pitch 9,5 mm, 2 rows

single chip modules (bulk goods)

Packing and Transport According to documentation

"Packing Method Modules (reel)"
"Packing Method Modules (singulated)"

Bad Module Marking All bad modules (mechanical and

electrical faults) must be punched by
reject hole for customer

Bad positions (reel): <20%

Splicing Specifications Tape material: adhes. tape 15,5 +/- 0,7

mm, thermal resistance at
<190°C by < 100 cN tractive power and
< 30 sec. duration.

Labeling Identification label on the reel and on

carton bag:

- Product type

- Number of the reel

- Total number of positions

- Number of good positions

- Date of sealing (to be checked)

- Two batches per reel only

- Batch number indication (only coded,
to be checked)

500 pcs . per bag
Order-No. 3322 845 04881

see drawings chapter 3

see drawings chapter 3

Ht2moa3.doc/HS Page 5 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

2.6 Electrical Specifications

Symbol min typ max Comment / Conditions

Absolute Maximum Ratings

Junction Temperature T
Input Peak Current I

J

INpeak

-55°C 140°C
30 mA

Latch up Current 100 mA MIL-STD 883D, Method 3023
ESD 2 kV MIL-STD 883D, Method 3015.7,

Human Body

Operating Range

Temperature T

Input Read Only Threshold
Voltage

Input Threshold Voltage
Input Read Voltage
Input Write Voltage

1)

3)

1)

3)

1)

3)

1)

3)

V

V
V
V

A

IN,RO

IN,TH

IN,RD

IN,WR

-40°C 85°C

2,8 Vp3,9 Vpstart modulation in read only

3,1 Vp4,2 Vpstart modulation after SETCC
3,5 Vp4,5 Vpread E²PROM
3,7 Vp4,7 Vpwrite E²PROM

R

ThJunctionAmbient

= 30 mA

I

INpeak

modes

≤ 30 K/W @

Demodulator

Range

3)

V

DEM_R

2,0 V

p

4,0 VpV

- V

INHigh

T0=8 µs, T

INLow

MOD

@ V

=6*T

INHigh

0

= 5,0 V

2)

Modulator

R_MOD linear
R_MOD nonlinear

3)

3)

Resonance Capacitor

3)

R

MODL

R

MODNL

4,5 kΩV
3,6 kΩV

INLow

INLow

≤ 2,0 V
≥ 2,0 V

p

p

p

C

ResInit

189 pF 210 pF 231 pF VIN = 4,0 V

EEPROM

Write Current
Read Current

4)

4)

I

W

I

R

25 µA VDD = 2,8 V
9 µA VDD = 2,8 V

Data Retention Years 10 @ 55°C
Write Endurance Cycles 100.000

1)

2)

3)

4)

tested on silicon level

V

IN

INHigh
INLow

MOD

= V





V
V
T

@ Ri = 10

IN1

− V

... voltage between connection pads



IN2

input voltage before modulation
input voltage during modulation
duration of the modulation

resistance of measurement equipment

Ω

k

p

Ht2moa3.doc/HS Page 6 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

3 Drawing of the Chip Module HT2 MOA3 S20

3.1 Drawing of the Reel

Ht2moa3.doc/HS Page 7 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

3.2 Module outline suggestion

Ht2moa3.doc/HS Page 8 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

3.3 Splicing Specification

Ht2moa3.doc/HS Page 9 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

4 Coil Specifications

The HITAG 2 chip module has to be connected to a coil whose parameters are briefly described
in the following.

Equivalent circuit of the transponder

U
f
X
R
C
C
R
f
L
L

res

resc

pc

pc

c

pc

pc

p

chip

chip

Xpc Rpc Cp

Uc

... voltage at the connection pads
... resonant frequency of the transponder
... parallel reactance of the coil (f = 125 kHz)
... parallel resistance of the coil (f = 125 kHz)
... parasitic capacitance of the package
... capacitance of the chip (Uc > 4 Vpp)
... resistance of the chip
... self resonant frequency of the coil
=
=

Xpc/2πf (f = 125 kHz)

7.72 mH ± x % (Cp = 0, x depends on the coil production process)

Cchip Rchip

C
R
f

chip

pc

resc

= 210 pF ± 10 %
> 45 k



> 750 kHz

Note: The parasitic capacitance of the package (Cp) must be considered.

=

f

res

2(C C).L

π

1

+

chip p pc

Typical values for C

=⇒

125 kHz L =

p

pc

2f C + C

π

()

1

2

()

res chip p

hot laminated cards: Cp = 1.5 pF
moulded tags: Cp = 6.0 pF

Ht2moa3.doc/HS Page 10 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

For a rough estimation ( ± 10 %) of the number of coil windings following formula can be used.
It is assumed that the winding is done in circular form.

N

=

1,85

L

2Uln(

u

)

d

N ... number of windings
L ... inductance [nH]
U ... average coil circumference [cm]
d ... copper diameter [mm]
u ... average coil circumference [mm]

For fine tuning a measurement of the inductance and an according adjustment of the number of
windings is necessary. This process always needs some iterations.

Ht2moa3.doc/HS Page 11 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

5 Functional Description of HITAG 2

5.1 Memory Organization

The memory of the transponder consists of 256 bits EEPROM memory and is organized in 8
pages with 32 bits each.

Depending on the operation mode the EEPROM is organized as described in the following.

Crypto Mode:

Page Content

0 Serial Number
1 32 bit "KEY LOW"
2 16 bit " KEY HIGH", 16 bit reserved
3 8 bit Configuration, 24 Bit Password TAG
4 read/write page
5 read/write page
6 read/write page
7 read/write page

Password Mode:

Page Content

0 Serial Number
1 Password RWD
2 reserved
3 8 bit Configuration, 24 bit Password TAG
4 read/write page
5 read/write page
6 read/write page
7 read/write page

Ht2moa3.doc/HS Page 12 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

5.2 Operation Modes and Configuration

With the Configuration Byte the operation mode and the access rights to the memory can be
selected. During Power-Up of the transponder the Configuration Byte is read from the
transponder’s EEPROM.

If you change the configuration, keys or passwords, you have to place the transponder
directly on the antenna or hold it directly to it (0-distance)! In order to avoid any errors
do not move the tr ans ponde r dur i ng t hi s wr i te pr oce s s a nd be sur e tha t you a r e i n a sa fe
environment without electrical no ise.

5.2.1 Modes of Operation

The HITAG 2 can be operated in several modes.

Crypto Mode:

Mode for writing or reading the transponder with encrypted data transmission.

Password Mode:

Mode for writing or reading the transponder with plain data transmission.
A password check is performed.

Public Mode A (Manchester):

Read only mode emulating Philips Semiconductors´ MIRO transponders resp. µEM H400x
transponders.
The 64 bits of the user Pages 4 and 5 are cyclically transmitted to the read/write device.

Public Mode B (Biphase):

Read only mode according to ISO standards 11784 and 11785 for ani mal identi fi cati on.
The 128 bits of the user Pages 4 to 7 are cyclically transmitted to the read/write device.

Public Mode C (Biphase):

Read only mode emulating the read operation of the PCF793X (with a slightly different Program
Mode Check).
In the Public Mode C the 128 bits of the user Pages 4 to 7 are cyclically transmitted to the
read/write device.

Ht2moa3.doc/HS Page 13 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

5.2.2 Status Flow

After entering the RF-field the transponder waits for a command to start the authentication.
After issuing this command the mutual authentication takes place, followed by read- and write

commands.
In password mode the data transfer occurs plain, in crypto mode data are encrypted.

The halt mode can be entered for muting a transponder.

If the transponder is configured in one of the public modes, these modes are entered automatically
after a certain waiting time and data pages are sent cyclically to the read/write device.

By issuing the command to start the authentication during the waiting time also public mode
transponders can be brought into the authorized state.

Ht2moa3.doc/HS Page 14 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

5.2.3 Configuration

The Configuration Byte is represented by the first 8 bits of Page 3 of the transponder memory.

Configuration Byte:

76543210

0: Manchester Code
1: Biphase Code

Bi t 2 B it 1 Version Coding Co di n g i n

HITAG 2-Operation

0 0 Public ModeBbiphase depending on bit 0
0 1 Public ModeAmanchester depending on bit 0
1 0 Public Mode C biphase depending on bit 0

1 1 HITAG 2 depending on bit 0 depending on bit 0
0: password mode
1: crypto mode
0: PAGE 6 and 7 read/write
1: PAGE 6 and 7 read only
0: PAGE 4 and 5 read/write
1: PAGE 4 and 5 read only
THE SETTING OF THIS BIT IS
0: PAGE 3 read/write

1: PAGE 3 read only; Configuration Byte and Password TAG
THE SETTING OF THIS BIT IS

0: PAGE 1 and 2 read/write
1: PAGE 1 no read/no write
PAGE 2 read only (when transponder is in password mode)
PAGE 2 no read/no write (when transponder is in crypto mode)

OTP !

fixed

OTP !

Configuration Byte / Bit 6:

Bit 6 = ‘0’: Page 3 is read/write.
Bit 6 = ‘1’: Page 3 can only be read. This process is irreversible !

ATTENTION: Do not set Bit 6 of the Configu ration Byte to ‘1’ before h aving written the
final data into Page 3 (including the Configuration Byte and Password TAG) of the
transponder.

Configuration Byte / Bit 7:

Bit 7 = ‘0’: Pages 1 and 2 are read/write.
Bit 7 = ‘1’: Pages 1 and 2 are locked against writing. This process is irreversible !

ATTENTION: Do not set Bit 7 of the Configu ration Byte to ‘1’ before h aving written the
final data into Pages 1 and 2 of the transponder.

Ht2moa3.doc/HS Page 15 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

Standard values for the Configuration Byte:

Password Mode: 0x06
Crypto Mode: 0x0E
Public Mode A: 0x02
Public Mode B: 0x00
Public Mode C: 0x04

5.3 Configuration of Delivered HITAG 2 Transponders

HITAG 2 transponders are delivered with the following configuration by Philips Semiconductors:

Unique Serial Number:

Serial Number: Read Only - fixed

Configuration Byte:

0x06: Password Mode (Manchester Code) - can be changed

Page 6 and 7 read/write - can be changed
Page 4 and 5 read/write - can be changed
Page 3 read/write - can be changed
Page 1 and 2 read/write - can be changed

Values for Transport Passwords, Transport Keys:

Password RWD: 0x4D494B52 (= ″MIKR″)
Password TAG: 0xAA4854
Key Low: 0x4D494B52 (= ″MIKR″)
Key High: 0x4F4E (= ″ON″)

RECOMMENDATION:

Before delivering transponders to end users, Pages 1 to 3 should be locked (set Configuration
Byte / Bit 6 to ‘1’ for Page 3 and set Configuration Byte / Bit 7 to ‘1’ for Pages 1 and 2).

Ht2moa3.doc/HS Page 16 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

5.4 Definition of Passwords and Keys

Keys are cryptographic codes, which determine data encryption during data transfer between
read/write device and transponder. They are used to select a HITAG 2 transponder in Crypto
Mode. The 16 bit KEY HIGH and 32 bit KEY LOW form one 48 bit key which has to be
identical on both the transponder and the read/write device.

Passwords are needed to select a HITAG 2 transponder in Password Mode. There is one pair of
passwor ds (Password T AG, Password RWD) w hich has to be identical both on t he transponder
and the read/write device.

Password TAG: Password that the transponder sends to the read/write device and which

may be verified by the latter (depending on the configuration of the
read/write device).

Password RWD: Password that the read/write device sends to the transponder and which is

checked for iden ti ty by the latter.

It is important t hat t he following values are in accordance with each other, i.e. t he respect ive data
on the read/write device and on the transponder have to be identical pairs.

HITAG 2 in Password mode:

on the

read/write

device

Password RWD

as an option (depending on the configuration of the read/write device):

Password TAG

HITAG 2 in Crypto mode:

on the

read/write

device

KEY LOW

KEY HIGH

as an option (depending on the configuration of the read/write device):

Password TAG

on the

transponder

Password RWD

⇔

Password TAG

⇔

on the

transponder

⇔
⇔

⇔

KEY LOW

KEY HIGH

Password TAG

Th e p a s s w ord s and k e ys a re pred e fin e d b y P hilips Semico n d u c tors by me a n s o f d e fin e d Tra ns p ort
Passwords and a Transport Key. They can be written to , which means that they can be changed
(see also Chapter “Configuration of Delivered HITAG 2 Transponders“).

ATTENTION: Passwords and Keys only can be changed if their current values are known!

Ht2moa3.doc/HS Page 17 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

6 Quality Inspection

Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with
AQL1.0.

Optical Properties scratches,

encapsulation failures,
gold discolouration,
delamination

Geometrical Properies width measured with gauge

length measured with gauge
overall thickness measured with micrometer at the center of

Electrical Properties operation basic read/write operations
Shipment Quantity
Packing and Labeling

according to the reference sample
catalogue

the transfer mould cap

Ht2moa3.doc/HS Page 18 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

7 Characterisation and Test of the Final Transponder

7.1 Characterisation of the Transponder

The parameters recommended to be characterised for the transponder are:

Parameter Comment

Resonant frequency f

Threshold value B
Threshold value for READ B
Threshold value for WRITE B

res

TH

RD

WR

Transponder does not modulate
Resonant frequency @ T

Start of modulation
Command READ_PAGE OK
Command WRITE_PAGE OK

= 22°C, @ B

amb

TH

For the measurement of these parameters we recommend to use the test equipment available from

SCEMTEC, Marienheide-Rodt, Germany (Transponder Measurement System STM-1).

This device also supports functional testing (besides parameter testing). Therefore it can also be
used as production test equipment for the final transponder test. For further information please
contact Scemtec GmbH.

7.2 Final Test of the Transponder

In addition to the equipment described in the previous chapter Philips Semiconductors offers a
device for a final functional test of transponders, the HITAGTM Test System HT OT490.
Parameter tests are not supportet by this device.

Basic flow for production and test:

1. Assembly of transponders

2. Functional test and final test of the EEPROM

Since the Keys and Logdata are changed during final test the Configuration and
personalization must take place after the final test. The final test is disabled (not reversible)
by setting the Tag-test mode bit to 0.

For the final test of transponders we recommend to use the

TM

HITAG

Test System HT OT490 of Philips Semiconductors or the

Transponder Measurement System STM-1 of Scemtec.

Ht2moa3.doc/HS Page 19 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

8 Ordering Information

Type Name Description Ordering Number

HT2 MOA3 S20/E/3 HITAG 2 S20 Chip Module, reel 9352 600 62118
HT2 MOA3 S20/E/1 HITAG 2 S20 Chip Module, bulk

9352 602 19122

Ht2moa3.doc/HS Page 20 of 22

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19

Definitions

Data sheet status

Objective specificationThis data sheet conta ins ta rget o r goal specific ations for product deve lopment.
Preliminary specificationThis data s heet conta ins preliminary data; supp lementary data may be

published later.

Product spec ification This data sheet conta ins final product spec ifications.

Limiting values

Limiting values given are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134).
Stress above one o r more of the limiting values may cause pe rmanent da mage to the dev ice.
These are stres s ratings on ly and ope ration of the device at these o r at any othe r conditions
above those g iven in the Characteristics sect ion of the spec ific ation is not implied. Exposu re to
limiting values for extended pe riods may affect dev ice reliability.

Application information

Where application information is given, it is advisory and does not form part of the spec ification.

Life support applications

These products are not designed for use in life support appliances, devices, or systems where
malfunction of these products can reasonably be expected to result in personal injury. Philips
Semiconductors´ customers using or selling these products for use in such applications do so on
their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from
such improper use or sale.

Ht2moa3.doc /HS Page 21 of 22

Philips Semiconductors - a worldwide company

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Tel. [phone], Fax. [phone]

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Bulgaria

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Tel. [phone]

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: see Italy

: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

: Lorong 1, Toa Payoh, SINGAPORE 1231,

: see Austria
: see Italy

: S.A. Philips Pty Ltd., 195-215 Main Road Martindale,

: Al. Vicente Pinzon, 173 - 6th floor,

: Balmes 22, 08007 BARCELONA,

: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

: Allmendstraße 140, CH-8027 ZÜRICH,

: Philips Taiwan Ltd., 2330F, 66,

: Philips Electronics (Thailand) Ltd.,

: Talapasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

: Philips Ukraine, 4 Patrice Lumumba Str., Building B, Floor 7,

: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

: 811 Argues Avenue, SUNNYVALE, CA94088-3409,

: see South America

: see Singapore

: Philips, Trg N. Pasica 5/v, 11000 BEOGRAD,

Philips Semiconductors, Mikron-Weg 1, A-8101 Gratkorn, Austria Fax: +43 / 3124 / 299 - 270

For all other countries apply to

Building BE-p, P.O.Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: [phone]
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