Datasheet 24AA64, 24LC64 Datasheet

Page 1
24AA64/24LC64
64K I2C™CMOS Serial EEPROM

DEVICE SELECTION TABLE

Part
Number
24AA64 1.8-5.5V 400 kHz
24LC64 2.5-5.5V 400 kHz I, E
†
100 kHz for Vcc < 2.5V.
Vcc
Range
Max Clock Frequency
†
Temp
Ranges
C
FEATURES
• Low power CMOS technology
- Maximum write current 3 mA at 5.5V
- Maximum read current 400 µA at 5.5V
- Standby current 100 nA typical at 5.5V
• 2-wire serial interface bu s , I
• Cascadable for up to eight devices
• Self-timed ERASE/WRITE cycle
• 32-byte page or byte write modes available
• 5 ms max write cycle time
• Hardware write protect for entire array
• Output slope control to eliminate ground bounce
• Schmitt trigger inputs for noise suppression
• 1,000,000 eras e/write cycles guaranteed
• Electrostatic discharge protection > 4000V
• Data retention > 200 years
• 8-pin PDIP, SOIC (150 and 208 mil) and TSSOP packages
• Temperature ranges:
- Commercial (C): 0° to 70°C
- Industrial (I): -40°Cto +85°C
- Automotive (E) -40°C to +125°C
C compatible

PACKAGE TYPE

8-LEAD PDIP
A0
1
A1
2
A2
3
4
Vss
8-LEAD SOIC
A0 A1 A2
Vss
8-LEAD TSSOP
WP Vcc
A0 A1
1 2
3 4
1 2 3 4

BLOCK DIAGRAM

A0 A1 A2 WP
24xx64
24xx64
24xx64
8
7
6
5
8 7 6 5
8 7 6
5
Vcc
WP SCL
SDA
Vcc WP SCL SDA
SCL SDA Vss A2
HV GENERATOR

DESCRIPTION

I/O
The Microchip Technology Inc. 24AA64/24LC64 (24xx64*) is a 8K x 8 (64K bit) Serial Electrically Eras-
CONTROL
LOGIC
able PROM capable of operation across a broad volt­age range (1.8V to 5.5V). It has been developed for advanced, low power applications such as personal communications or data acquisition. This device also has a page-write capability of up to 32 bytes of data. This device is capable of both random and sequential
I/O
SDA
SCL
reads up to the 64K bound ary . Fu nctional addres s lines allow up to eigh t devi ces on the s ame bus , for up to 51 2 Kbits address space. This device is available in the
VCC VSS
standard 8-pin plastic DIP, 8-pin SOIC (150 and 208 mil), and 8-pin TSSOP.
I
C is a trademark of Philips Corporation.
*24xx64 is used in this document as a generic part number for the 24AA64/24LC64 devices.
2000 Microchip Technology Inc. DS21189D-page 1
MEMORY
CONTROL
LOGIC
XDEC
EEPROM
ARRAY
PAGE LATCHES
YDEC
SENSE AMP
R/W CONTROL
Page 2
24AA64/24LC64

1.0 ELECTRICAL CHARACTERISTICS

1.1 Maximum Ratings*

Vcc.................................................................................................7.0V
All inputs and outputs w.r.t. Vss .............................. -0.6V to Vcc +1.0V
Storage temperature ...................................................-65°C to +150°C
Ambient temp. with power applied ..............................-65°C to +125°C
Soldering temperature of leads (10 seconds) ........................... +300°C
ESD protection on all pins *Notice: Stresses above those listed under “Maximum Ratings” may
cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listi ngs of this spe cificat ion is not implied. Exposure to maximum rating conditions for extended peri­ods may affect device reliability.
.................................................................≥ 4 kV

TABLE 1-1 PIN FUNCTION TABLE

Name Function
A0,A1,A2 User Confi gurable Chip Selects
SS Ground
V SDA Serial Data SCL Serial Clock
WP Write Protect Input
CC +1.8 to 5.5V (24AA64)
V
+2.5 to 5.5V (24LC64)

TABLE 1-2 DC CHARACTERISTICS

All parameters apply across the rec­ommended opera ting ranges unless otherwise noted.
Parameter Symbol Min Max Units Conditions
A0, A1, A2, SCL, SDA, and WP pins:
High level input voltage V Low level input voltage V
Hysteresis of Schmitt Trigger inputs (SDA, SCL pins)
Low level output voltage V
Input leakage current I
Output leakage current ILO -10 10 µAVOUT = Vss to VCC Pin capacitance
(all inputs/outputs) Operating current I
Standby current I
Note: This parameter is periodically sampled and not 100% tested.
Commercial (C): VCC = +1.8V to 5.5V Tamb = 0°C to +70°C Industrial (I): V Automotive (E): V
IH 0.7 VCC — V IL — 0.3 VCC
V
HYS 0.05 VCC — VVCC > 2.5V (Note)
OL — 0.40 V IOL = 3.0 mA @ VCC = 4.5V
LI -10 1 0 µAVIN = Vss to VCC, WP = VSS
CC = +2.5V to 5.5V Tamb = -40°C to +85°C CC = +2.5V to 5.5V Tamb = -40°C to 125°C
VVVCC ≥ 2.5V
0.2 VCC
CC < 2.5V
V
OL = 2.1 mA @ VCC = 2.5V
I
VIN = Vss or VCC, WP = VCC
CIN, COUT — 10 pF VCC = 5.0V (Note)
Tamb = 25°C, f
CC Write — 3mAVCC = 5.5V
I
CC Read — 400 µA VCC = 5.5V, SCL = 400 kHz
CCS — 1 µA SCL = SDA = VCC = 5.5V
c
A0, A1, A2, WP = V
= 1 MHz
SS

FIGURE 1-1: BUS TIMING DATA

TF
SCL
SDA IN
SDA OUT
WP
DS21189D-page 2 2000 Microchip Technology Inc.
TSU:STA
TSP
TLOW
THD:STA
THIGH
THD:DAT TSU:DAT TSU:STO
TAA
(protected)
(unprotected)
VHYS
TR
TSU:WP
TBUF
THD:WP
Page 3

TABLE 1-3 AC CHARACTERISTICS

24AA64/24LC64
All parameters apply across the spec­ified operating ranges unless other­wise noted.
Commercial (C): VCC = +1.8V to 5.5V Tamb = 0°C to +70°C Industrial (I): V Automotive (E): V
CC = +2.5V to 5.5V Tamb = -40°C to +85°C CC = +2.5V to 5.5V Tamb = -40°C to 125°C
Parameter Symbol Min Max Units Conditions
Clock frequency F
Clock high time T
Clock low time T
SDA and SCL rise time (Note 1)
SDA and SCL fall time T START condition hold time T
START condition setup time T
Data input hold time T Data input setup time T
STOP condition setup time T
WP setup time T
WP hold time T
HD:STA 4000
SU:STA 4700
HD:DAT 0 — ns (Note 2) SU:DAT 250
SU:STO 4000
SU:WP 4000
HD:WP 4000
Output valid from clock (Note 2)
Bus free time: Time the bus must be
T
free before a new transmission can
CLK —
—
HIGH 4000
600
LOW 4700
1300
R —
T
—
F — 300 ns (Note 1)
600
600
100
600
600
1300
AA —
T
—
BUF 4700
1300
100 400
— —
— —
1000
300
— —
— —
— —
— —
— —
— —
3500
900
— —
kHz 1.8V ≤ VCC ≤ 2. 5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
2.5V
≤ VCC ≤ 5.5V
ns 1.8V ≤ VCC ≤ 2.5V
≤ VCC ≤ 5.5V
2.5V
ns 1.8V ≤ VCC ≤ 2.5V
2.5V
≤ VCC ≤ 5.5V
ns 1.8V ≤ VCC ≤ 2.5V
2.5V
≤ VCC ≤ 5.5V
ns 1.8V ≤ VCC ≤ 2.5V
2.5V
≤ VCC ≤ 5.5V
start Output fall time from V
IH
OF 10 250 ns C
T
≤ 100 pF (Note 1)
B
minimum to VIL maximum Input filter spike suppression
SP — 50 ns (Notes 1 and 3)
T
(SDA and SCL pins) Write cycle time (byte or page) T Endurance 1M — cycles 25°C, V
Note 1: Not 100% tested. C
= total capacitance of one bus line in pF.
B
WC — 5
ms
CC = 5.0V, Block Mode (Note 4)
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt trigger inputs which provide improved noise spike
suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please
consult the Total Endurance Model which can be obtained on Microchip’s BBS or website.
2000 Microchip Technology Inc. DS21189D-page 3
Page 4
24AA64/24LC64

2.0 PIN DESCRIPTIONS

2.1 A0, A1, A2 Chip Address Inputs

The A0,A1,A2 inputs are used by the 24xx64 for multi­ple device operation. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true.
Up to eight de vic es may be connected to the same b us by using different chip select bit combinations. These inputs must be connected to either V
CC or VSS.

2.2 SDA Serial Data

This is a bi-directional pin used to transfer addresses and data into and data out of the device. It is an open­drain terminal, therefore , the SDA b us requires a pullup resistor to V 400 kHz)
For normal data transfe r SDA is allowed to ch ange only during SCL low. Changes during SCL high are reserved for indicating the START and STOP condi­tions.
CC (typical 10 kΩ for 100 kHz, 2 kΩ for

2.3 SCL Serial Clock

This input is us ed to synch roniz e th e dat a tr ansfer fro m and to the device.

2.4 WP

This pin can be connected to either Vss, Vcc or left floating. An internal pull-down resistor on this pin will keep the device in the unprotected state if left floating. If tied to Vss or left floating, normal memory operation is enabled (read/write the entire memory 0000-1FFF).
If tied to V operations are not affected.
CC, WRITE operations are inhibited. Read

3.0 FUNCTIONAL DESCRIPTION

The 24xx64 supports a bi-directional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, and a device receiving data as a receiver. The bus must be con­trolled by a master device which generates the serial clock (SCL), controls the bus access, and generates the START and STOP conditions while the 24xx64 works as a slave. Both master and slave can operate as a transmitter or receiver but the master device deter­mines which mode is activated .

4.0 BUS CHARACTERISTICS

The following bus protocol has been defined:
• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable whenever the clock line is H IG H. Chan ges in the data line w hil e t he clo ck line is HIGH will be interpreted as a START or STOP condition.
Accordingly, the following bus conditions have been defined (Figure 4-1).

4.1 Bus not Busy (A)

Both data and clock lines remain HIGH.

4.2 Start Data Transfer (B)

A HIGH to LOW transition of the SDA line while the clock (SCL) is HIG H determines a START condit ion. All commands must be preceded b y a START condi tion .

4.3 Stop Data Transfer (C)

A LOW to HIGH transition of the SDA line while the clock (SCL) is HI G H det ermines a S TOP cond iti on . All operations must end with a STOP condition.

4.4 Data Valid (D)

The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal.
The data on the line must be changed during the LOW period of the cloc k si gnal. T here is on e clock pulse per bit of data.
Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of the data bytes transferred between the START and STOP conditions is determined by the master device.

4.5 Acknowledge

Each receiving device, when addressed, is obliged to generate an acknowledge signal after the reception of each byte. The master device must generate an extra clock pulse which is associated with this acknowledge bit.
Note: The 24xx64 does not generate any
acknowledge bits if an internal program­ming cycle is in progress .
A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the H IGH period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. Dur­ing reads, a master must signal an end of data to the slave b y NOT gener ating an acknowledg e bit on the last byte that has be en clocke d out of the slav e. In thi s case, the slave (24xx64) will leave the data line HIGH to enable the master to generate the STOP condition.
DS21189D-page 4 2000 Microchip Technology Inc.
Page 5
24AA64/24LC64

FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A) (B) (D) (D) (C) (A)
SCL
SDA
START
CONDITION
ADDRESS OR
ACKNOWLEDGE
VALID

FIGURE 4-2: ACKNOWLEDGE TIMING

SCL
SDA
Transmitter must release the SDA line at this point allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data.
Data from transmitter
DA TA
ALLOWED
TO CHANGE
Acknowledge
Bit
987654321 123
Data from transmitter
Receiver must release the SDA line at this point so the Transmitter can continue sending data.
STOP
CONDITION
2000 Microchip Technology Inc. DS21189D-page 5
Page 6
24AA64/24LC64

5.0 DEVICE ADDRESSING

A control byte is the first byte received following the start condition from t he master de vice (Figu re 5-1). The control byte consists of a four bit control code; for the 24xx64 this is set as 1010 binary for read and write operations. The next three bits of the control byte are the chip sele ct bits (A2, A1 , A0). The chip select bits allow the use of up to eight 24xx64 devices on the same bus and are used to select which device is accessed. Th e ch ip se lect b its in t h e con t rol byte must correspond to the l ogic le v els on th e correspo nding A2, A1, and A0 pi ns for t he device to respon d. Thes e bits are in effect the three most signific ant bits of the word address.
The last bit of the control byte defines the operation to be performed. When set to a one a read operation is selected, and when set to a zero a write operation is selected. The next two bytes received define the address of the first data byte (Figure 5-2). Because only A12... A0 are used, the upper three address bits are don’t care bits. The upper addre ss bits are t rans­ferred first, followed by the less significant bits.
Following the st ar t cond ition, t he 24xx 64 moni tors t he SDA bus checking the device type identifier being transmitted. Up on rece iving a 1010 co de and ap propri­ate device select bits, the slave device outputs an acknowledge signal on the SDA line. Depending on the state of the R/W write operation.
bit, the 24xx64 will select a read or

FIGURE 5-1: CONTROL BYTE FORMAT

Read/Write Bit
Control Code
1 0 1 0 A2 A1 A0SACKR/W
Slave Address
Start Bit
Chip Select
Bits
Acknowledge Bit
5.1 Contiguous Addressing Across
Multiple Devices
The chip select bits A2, A1, A0 can be used to expand the contiguous address space for up to 512K bits by adding up to eight 24xx64's on the same bus. In this case, software can use A0 of the control byte address bit A13, A1 as address bit A14, and A2 as address bit A15. It is not possible to sequentially read across device boundaries.
as

FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS

CONTROL BYTE ADDRESS HIGH BYTE ADDRESS LOW BYTE
1010
CONTROL
CODE
A2A1A
CHIP
SELECT
BITS
R/W XXX
0
A
12
A11A10A
A 8
9
A
••••••
7
X = Don’t Care Bit
A 0
DS21189D-page 6 2000 Microchip Technology Inc.
Page 7
24AA64/24LC64

6.0 WRITE OPERATIONS

6.1 Byte Write

Following the start condition from the master, the control code (fou r b its ), th e chi p sel ec t (t hree bits), and the R/W bus by the master transmitter. This indicates to the addressed sla ve rec eiver that the addre ss high b yte will follow after it has generated an acknowled ge b it d uring the ninth clock cyc le . Therefore , the next byte transmit­ted by the master is the high-order byte of the word address and will be written into the address pointer of the 24xx64. The next byte is the least significant address byte . After rece iving an other ac kno wledge si g­nal from the 24xx64 the master device will transmit the data word to be written into the addressed memory location. The 24xx64 acknowledges again and the master generates a stop condition. This initiates the internal write cycle, a nd during t his time the 24xx64 w ill not generate acknowledge signals (Figure 6-1). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command but no write cy cl e w i ll oc cu r, no data will be written and the device will immediately accept a new command. After a byte write command, the internal address counter will point to the address location following the one that was just wr itten.
bit (which is a logi c low) are clocked onto the

6.2 Page Write

The write control byte, word address and the first data byte are transmitted to the 24xx64 in the same way as in a byte write. But instead of generating a stop condi­tion, the master transmits up to 31 additional bytes which are tempor ari ly st ored in the on-chip page buffer and will be written into me mory after th e master has transmitted a sto p condition. After receipt of ea ch word, the five lower address pointer bits are internally incre­mented by o ne. If the master shou ld trans mit more than 32 bytes prior to generating the stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, on ce the stop condi tion i s rece ived, an inter­nal write cycle will begin (Figure 6-2). If an attempt is made to write to the arr ay with t he WP pin held h igh, the device will acknowledge the command but no write cycle will occur, no data will be written and the device will immediately accept a new command.

6.3 Write Protection

The WP pin allows the user to write protect the entire array (000 0-1F FF) whe n the pin is t ied to Vc c. If t ied to
SS or left floating, the write p rote ction is disa bl ed. Th e
V WP pin is sampled at the ST OP bit for e v ery write com­mand (Figure 1-1) T og gling the WP pin after the STOP bit will hav e no effect on the ex ecution of the write cycl e.

FIGURE 6-1: BYTE WRITE

BUS ACTIVIT Y MASTER
SDA LINE
BUS ACTIVIT Y
X = don’t care bit
S T A R T
S1010 0

FIGURE 6-2: PAGE WRITE

S
T BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
X = don’t care bit
CONTROL
A
R
T
S1010 0
BYTE
A2A1A
0
CONTROL
BYTE
A 2
ADDRESS
HIGH BYTE
XXX
A C K
A1A
ADDRESS
HIGH BYTE
XXX
0
A C K
ADDRESS LOW BYTE DATA BYTE 0
A C K
A C K
ADDRESS LOW BYTE
A C K
DATA
A C K
A C K
S T O P
P
A C K
DATA BYTE 31
S T O P
P
A C K
2000 Microchip Technology Inc. DS21189D-page 7
Page 8
24AA64/24LC64

7.0 ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the stop condition for a write com­mand has been issued from the master, the device ini­tiates the internally timed write cycle. ACK polling can be initiated immedi ately. This invo lves t he master send­ing a star t cond ition fo llowed by the co ntrol byte fo r a write command (R/W the write cycle, then no A CK will be ret urned. If no AC K is returned, then the start bit and control byte must be re-sent. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next read or write command. See Figure 7-1 for flow diagram.
= 0). If the device is still busy with
FIGURE 7-1: ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Contr ol Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
YES
NO
Next
Operation
DS21189D-page 8 2000 Microchip Technology Inc.
Page 9
24AA64/24LC64

8.0 READ OPERATION

Read operations are initiated in the same way as write operations with the exception that the R/W control byte is set to one. There are three basic types of read operations: current address read, random read, and sequential read.

8.1 Current Address Read

The 24xx64 contains an address counter that main­tains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address n (n is any legal address), the next curren t address re ad opera tion w ould acce ss data from address n + 1.
Upon receipt of the cont rol by te with R/W the 24xx64 issues an acknowledge and transmits the eight bit data word. The master will not acknowledge the transfer b ut does gener a te a sto p cond ition a nd the 24xx64 discontinues transmission (Figure 8-1).

FIGURE 8-1: CURRE NT ADDRESS READ

S
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
T
CONTROL
A R T
S
1100
BYTE
AAA 210
1
A C K
bit of the
bit set to one,
DAT A
BYTE
N O
A C K
S T O P
P

8.2 Random Read

Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, first the word address must be set. This is don e by sending the word address t o the 24xx64 as part of a write operation (R/W
bit set to 0). After the word address is sent, the master generates a start condition following the acknowledge. This termi­nates the write operation, but not before the internal address pointer is set. Then the master issues the control byte again b ut with the R/W
bit set to a one. The 24xx64 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer but does generate a stop condition which causes the 24xx64 to discontinue transmission (Figure 8-2). After a random read command, the inter­nal address counter will point to the address location following the one that was just read.

8.3 Sequential Read

Sequential reads are ini tiated in the same w ay as a ra n­dom read except that after the 24xx64 transmits the first data byte, the master issues an acknowledge as opposed to the stop co nditi on us ed in a rand om re ad. This acknowled ge directs the 24xx64 to transmit the next sequentially addressed 8-bit word (Figure 8-3). Following the final byte transmitted to the master, the master will NO T gen erate an ack nowl edge b ut will gen­erate a stop condition. To provide sequential reads the 24xx64 contains an internal address pointer which is incremented by one at the completion of each opera­tion. This address pointer allows the entire memory contents to be serially read during one operation. The internal address pointer w ill automa tically roll o ve r from address 1FFF to address 0000 if the master acknowl­edges the byte received from the array address 1FFF.

FIGURE 8-2: RANDOM READ

BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
X = Don’t Care Bit
S T A
CONTROL
R
BYTE
T
S1010
AAA 210
0
A C K
ADDRESS
HIGH BYTE
XXX
A C K
ADDRESS
LOW BYTE
S T A R T
S1010
A C K
CONTROL
BYTE
AAA 210
S
DATA
BYTE
1
A C K
T O P
P
N O
A C K

FIGURE 8-3: SE QUENTIAL READ

BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
2000 Microchip Technology Inc. DS21189D-page 9
CONTROL
BYTE
DATA n DATA n + 1 DATA n + 2 DATA n + X
A C K
A C K
A C K
A C K
S T O P
P
N O
A C K
Page 10
24AA64/24LC64
NOTES:
DS21189D-page 10 2000 Microchip Technology Inc.
Page 11
24AA64/24LC64

24xx64 PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
24xx64 — /P
P = Plastic DIP (300 mil Body), 8-lead
Package:
Temperature Range:
24AA64XT
Device:
24LC64XT
SN = Plastic SOIC (150 mil Body, EIAJ standard), 8-lead
SM = Plastic SOIC (208 mil Body, EIAJ standard), 8-lead
ST = TSSOP, 8-lead
Blank = 0°C to +70°C
I=-40°C to +85°C
E=-40°C to +125°C
24AA64
24AA64T
24AA64X
64K bit 1.8V I 64K bit 1.8V I 64K bit 1.8V I in alternate pinout (ST only) 64K bit 1.8V I
2
C Serial EEPROM
2
C Serial EEPROM (Tape and Reel)
2
C Serial EEPROM
2
C Serial EEPROM
in alternate pinout (ST only)
24LC64 24LC64T 24LC64X
64K bit 2.5V I2C Serial EEPROM 64K bit 2.5V I 64K bit 2.5V I in alternate pinout (ST only) 64K bit 2.5V I
2
C Serial EEPROM (Tape and Reel)
2
C Serial EEPROM
2
C Serial EEPROM
in alternate pinout (ST only)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 786-7277
3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/ cn) to receive the most current information on our products.
2000 Microchip Technology Inc. DS21189D-page 11
Page 12
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
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Atlanta
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Microchip Technology Inc. Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175
Detroit
Microchip Technology Inc. Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260
Los Angel e s
Microchip Technology Inc. 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338
New York
Microchip Technology Inc. 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
AMERICAS (continued)
Toronto
Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253
ASIA/PACIFIC
Beijing
Microchip Technology, Beijing Unit 915, 6 Chaoyangmen Bei Dajie Dong Erhuan Road, Dongcheng District New China Hong Kong Manhattan Building Beijing 100027 PRC Tel: 86-10-85282100 Fax: 86-10-85282104
Hong Kong
Microchip Asia Pacific Unit 2101, Tower 2 Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431
India
Microchip Technology Inc. India Liaison Office No. 6, Legacy, Convent Road Bangalore 560 025, India Tel: 91-80-229-0061 Fax: 91-80-229-0062
Japan
Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222-0033 Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea 168-1, Y oungbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934
Shanghai
Microchip Technology Unit B701, Far East International Plaza, No. 317, Xianxia Road Shanghai, 200051 P.R.C Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
ASIA/PACIFIC (continued)
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore 188980 Tel: 65-334-8870 Fax: 65-334-8850
Taiwan, R.O.C
Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel : 886 -2 -27 17- 71 75 Fax: 886-2-2545- 013 9
EUROPE
Denmark
Microchip Technology Denmark ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK- 2750 Denmark Tel : 45 442 0 9895 Fax: 45 4420 9910
France
Arizona Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 München, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5858 Fax: 44-118 921-5835
01/05/00
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro
devices, Serial EEPROMs and microperipheral products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
®
8-bit MCUs, KEELOQ
®
code hopping
All rights reserved. © 2000 Microchip Technology Incorporated. Printed in the USA. 1/00 Printed on recycled paper.
Information contained in this publi c ation regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is giv en and no liability is assumed by Microchip T echnology Incorpora ted with respect to the accuracy or use of such information, or infringe ment of patents or othe r intellec tual property rights arising from such use or otherwis e. Use of Microchi p’s produc ts as critical components in life s upport systems is not authorize d exc ept with express written appro val by M i crochip. No licenses are co nve yed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Mi crochip T echnology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
DS21189D-page 12 2000 Microchip Technology Inc.
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