Page 1
Features
1N6640U
Aerospace 0.3 A - 75 V switching diode
■ Surface mount hermetic package
■ High thermal conductivity materials
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low forward voltage drop
■ Target radiation qualification:
A
A
LCC-2D
K
K
– 150 krad (Si) low dose rate
– 3 Mrad high dose rate
■ Package weight: 0.12 g
Description
Packaged in LCC-2D this device is intended for
use in low voltage, high frequency inverters, free
wheeling, polarity protection and other aerospace
applications.
Table 1. Device summary
Order code
1N6640UD1 -
1N6640U02D 5101/027/xx Flight part Target
1. Contact ST sales office for information about the specific conditions for products in die form and gold plated version.
ESCC detailed
specification
(1)
Quality level EPPL I
Engineering
model
V
F(AV)
-
0.3 A 75 V 175 °C 1.2 V
RRM
T
j(max)
V
F (max)
September 2011 Doc ID 16971 Rev 2 1/7
www.st.com
7
Page 2
Characteristics 1N6640U
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T
stg
T
T
sol
1. For all variants at Tc ≥ +155 °C per diode, derate linearly to 0A at +175 °C.
2. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed.
Repetitive peak reverse voltage 75 V
Forward rms current 0.5 A
Average forward rectified current
Forward surge current
Storage temperature range -65 to +175 °C
Operating junction temperature range -65 to +175 °C
j
Maximum soldering temperature
(1)
(2)
t
= 8.3 ms sinusoidal,
p
≤ 25 °C
t
amb
300 mA
2A
245 °C
Table 3. Thermal resistance
Symbol Parameter Value Unit
Junction to case
R
th (j-c)
R
Junction to ambient 280
th (j-a)
1. Package mounted on infinite heatsink.
Table 4. Static electrical characteristics
Symbol Parameter Tests conditions Min. Typ. Max. Unit
(1)
V
BR
IR
V
F
1. Pulse test: tp = 10 ms, δ < 2%
2. Pulse test: tp = 680 µs, δ < 2%
Breakdown voltage Tj = 25 °C IR = 10 µA 75 - - V
(1)
Reverse current
(2)
Forward voltage
(1)
60
= 25 °C
T
j
= 150 °C - - 30 µA
T
j
= 25 °C IF = 1 mA 540 - 630
T
j
T
= 25 °C IF = 50 mA 760 - 890
j
= 25 °C IF = 100 mA 820 - 980
T
j
= 25 °C IF = 200 mA 870 - 1100
T
j
= -55 °C IF = 200 mA - - 1200
T
j
V
R
= 50 V
- - 40 nA
°C/W
mV
To evaluate the conduction losses use the following equation:
P = 0.74 x I
2/7 Doc ID 16971 Rev 2
F(AV)
+ 1.00 x I
F2(RMS )
Page 3
1N6640U Characteristics
)
Table 5. Dynamic characteristics
Symbol Parameter
IF = IR = 10 mA - - 9
t
V
t
FR
C
Reverse recovery time
rr
Forward recovery voltage IFM = 200 mA - - 5 V
FP
= 1 A, Vr = 30 V, dI/dt = -15 A/µs - - 20
I
F
Forward recovery time IFM = 200 mA - - 20 ns
Diode capacitance VR = 0 V, V = 50 mV, F = 1 MHz - - 3 pF
j
Figure 1. Forward voltage drop versus
forward current (typical values)
I(A
FM
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Tj=150 °CTj=150 °C
Tj=25 °CTj=25 °C
Tj=-55 °C
V (V)
FM
Test conditions
Min. Typ. Max. Unit
Figure 2. Forward voltage drop versus
forward current (maximum values)
I (A)
FM
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Tj=150 °CTj=150 °C
Tj=25 °CTj=25 °C
Tj=-55 °C
V (V)
FM
ns
Doc ID 16971 Rev 2 3/7
Page 4
Characteristics 1N6640U
Figure 3. Reverse leakage current versus
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
reverse voltage applied
(typical values)
I (nA)
R
Tj=150 °C
Tj=75 °C
Tj=25 °C
V (V)
R
0 1020304050607080
Figure 4. Relative variation of thermal
impedance, junction to case,
versus pulse duration
Z/R
(j-c)
th th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
Single pulse
0.3
0.2
0.1
0.0
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Figure 5. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
10.0
1.0
V
OSC
F=1 MHz
=30 mV
Tj=25 °C
RMS
t (s)
P
V (V)
0.1
1 10 100
R
4/7 Doc ID 16971 Rev 2
Page 5
1N6640U Package information
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 6. Leadless chip carrier 2 (LCC-2D) package dimensions
Pin 2 Cathode
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
(1)
1.86 2.03 2.20 0.073 0.080 0.087
Note 1
Note 1
A
B 4.44 4.57 4.77 0.175 0.180 0.188
C 1.84 1.97 2.10 0.072 0.078 0.083
D 1.53 1.70 1.87 0.060 0.067 0.074
A
B
2
C
D
1
F
Pin 1 Anode
E 0.48 - 0.71 0.019 - 0.028
Note 1
E
E
F - 1.3 - - 0.051 -
G
1
H
I
2
r1
r2
G - 1.67 - - 0.066 -
H - 0.37 - - 0.015 -
.
I - 0.15 - - 0.006 -
r1 - 0.15 - - 0.006 -
r2 - 0.20 - - 0.008 -
Note 1: The anode is identified by metallization in two top internal angles and the index mark.
1. Measurement prior to solder coating the mounting pads on bottom of package
Doc ID 16971 Rev 2 5/7
Page 6
Ordering information 1N6640U
3 Ordering information
Table 7. Ordering information
Order code
ESCC detailed
specification
1N6640UD1 -
1N6640U02D 5101/027/xx Solder dip 40U02D Target
1. Contact ST sales office for information about the specific conditions for products in die form and gold plated
version.
4 Revision history
Table 8. Document revision history
Date Revision Changes
26-Mar-2010 1 First issue.
23-Sep-2011 2 Updated order codes in Ta b l e 1 and Ta b l e 7.
(1)
Package Lead finish Marking EPPL Weight Packing
LCC-2D
Gold 40UD1 -
0.12 g
Waffle
pack
6/7 Doc ID 16971 Rev 2
Page 7
1N6640U
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Doc ID 16971 Rev 2 7/7
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