Datasheet 17510 Datasheet (MOTOROLA)

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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1.2 A 15 V H-Bridge Motor Driver IC
The 17510 is a monolithic H-Bridge designed to be used in portable electronic applications such as digital and SLR cameras to control small DC motors.
The 17510 can operate efficiently with supply voltages as low as 2.0 V to as high as 15 V. Its low R
can provide continuous motor drive currents of 1.2 A and handle peak currents up to 3.8 A. It is easily interfaced to low-cost MCUs via parallel 5.0 V compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz.
This device contains an integrated charge pump and level shifter (for gate drive voltages), integrated shoot-through current protection (cross-conduction suppression logic and timing), and undervoltage detection and shutdown circuitry.
The 17510 has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance).
Features
• 2.0 V to 15 V Continuous Operation
• Output Current 1.2 A (DC), 3.8 A (Peak)
• 450 m R
• 5.0 V TTL-/ CMOS-Compatible Inputs
• PWM Frequencies up to 200 kHz
• Undervoltage Shutdown
• Cross-Conduction Suppression
• Pb-Free Packaging Designated by Suffix Code EJ
H-Bridge MOSFETs
DS(ON)
H-Bridge output MOSFETs (0.45 typical)
DS(ON)
Simplified Application Diagram
17510 Simplified Application Diagram
5.0 V 15 V
V
DD
C1L C1H C2L C2H
C
RES
17510
VM
GOUT
OUT1
Document order number: MPC17510
Rev 1.0, 03/2004
17510
1.2 A 15 V H-BRIDGE MOTOR DRIVER IC
MTB SUFFIX
EJ (Pb-FREE) SUFFIX
CASE 948K-01
24-LEAD TSSOP
ORDERING INFORMATION
Device
MPC17510EJ/R2 -30°C to 65°C 24 TSSOPW
Temperature
Range (T
A
Package
)
EN
MCU
This document contains certain information on a new product. Specifications and information herein are subject to change without notice.
© Motorola, Inc. 2004
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GIN IN1 IN2
MOTOR
OUT2
GND
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C2H C2L C1LC1H GOUT
C
RES
V
DD
IN1 IN2
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EN
GIN
LGND
cale Semiconductor,
Charge Pump
Low-
Voltage
Detector
Level
Shifter
Predriver
Control
Logic
No Connect
Figure 1. 17510 Simplified Internal Block Diagram
H-Bridge
VM
OUT1
OUT2
PGND
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17510 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 2
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OUT1
LGND
C
RES
NC
OUT1
PGND
NC
VM
IN1
IN2
C1H
C1L
TERMINAL FUNCTION DESCRIPTION
Terminal
1, 5 OUT1 Output 1 Driver output 1 terminals.
2 LGND Logic Ground Logic ground.
3 C
4, 7,
20, 22
17, 18 OUT2 Output 2 Driver output 2 terminals.
6, 19 PGND Power Ground Power ground.
8, 21 VM Motor Drive Power Supply Motor power supply voltage input terminals.
9 IN1 Input Control 1 Control signal input 1 terminal.
10 IN2 Input Control 2 Control signal input 2 terminal.
11 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole).
12 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole).
13 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole).
14 C2H Charge Pump 2H Charge pump bucket capacitor 2 (positive pole).
15 GOUT Gate Driver Output Output gate driver signal to external MOSFET switch.
16 EN Enable Control Enable control signal input terminal.
23 V
24
Terminal
Name
RES
NC No Connect No connection to these terminals.
DD
GIN
Formal Name Definition
Charge Pump Output Capacitor Connection
Logic Supply Control circuit power supply terminal.
Gate Driver Input LOW = True control signal for GOUT terminal.
1
2
3
4
5
6
7
8
9
10
11
12
Charge pump reservoir capacitor terminal.
24
23
22
21
20
19
18
17
16
15
14
13
GIN
V
DD
NC
VM
NC
PGND
OUT2
OUT2
EN
GOUT
C2H
C2L
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 17510
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MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent damage to the device.
Rating Symbol Value Unit
Motor Supply Voltage
Charge Pump Output Voltage (Note 1)
Logic Supply Voltage
Signal Input Voltage (EN, IN1, IN2, GIN)
Driver Output Current
Continuous
Peak (Note 2)
ESD Voltage
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Human Body Model (Note 3)
Machine Model (Note 4)
Storage Temperature
Operating Junction Temperature
Operating Ambient Temperature
Power Dissipation (Note 5)
Thermal Resistance
Soldering Temperature (Note 6)
Notes
1. When supplied externally, connect via 3.0 kΩ resistor. = 25°C, 10 ms pulse at 200 ms interval.
2. T
A
3. ESD1 testing is performed in accordance with the Human Body Model (C
4. ESD2 testing is performed in accordance with the Machine Model (C
= 25°C, R
5. T
A
6. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
= 120°C/W, 37 mm x 50 mm Cu area (1.6 mm FR-4 PCB).
JA
θ
T
ZAP
= 200 pF, R
ZAP
V
M
V
C
RES
V
DD
V
IN
I
O
I
OPK
V
ESD1
V
ESD2
T
STG
T
J
T
A
P
D
R
JA
θ
SOLDER
= 100 pF, R
ZAP
ZAP
= 0 Ω).
-0.5 to 16 V
-0.5 to 13 V
-0.5 to 6.0 V
-0.5 to VDD+0.5 V
1.2
3.8
±1900
±130
-65 to 150 °C
-30 to 150 °C
-30 to 65 °C
1.0 W
120 °C/W
260 °C
= 1500 Ω).
cale Semiconductor,
A
V
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17510 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 4
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STATIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions T
= 25°C, VM = 15 V, VDD = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted
A
reflect the approximate parameter means at T
Characteristic Symbol Min Typ Max Unit
POWER
Motor Supply Voltage
Logic Supply Voltage
Capacitor for Charge Pump
Standby Power Supply Current (Note 7)
Motor Supply Standby Current
Logic Supply Standby Current
Logic Supply Current (Note 8)
Low-Voltage Detection Circuit
Detection Voltage (V
Detection Voltage (V
Driver Output ON Resistance (Note 10)
V
= 2.0 V, 8.0 V, 15 V
M
) (Note 9)
DD
)
M
GATE DRIVE
Gate Drive Voltage (Note 11)
No Current Load
Gate Drive Ability (Internally Supplied)
I
= -1.0 mA
C
RES
Gate Drive Output
I
= -50 µA
OUT
= 50 µA
I
IN
CONTROL LOGIC
Logic Input Voltage (EN, IN1, IN2, GIN)
Logic Input Function (4.0 V < V
High-Level Input Voltage
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
EN/
GIN Terminal
< 5.5 V)
DD
= 25°C under nominal conditions unless otherwise noted.
A
V
M
V
DD
C1, C2, C3 0.001 0.1 µF
I
V
MSTBY
I
V
DDSTBY
I
V
DD
DET
V
DD
DET
V
M
R
DS(ON)
V
C
RES
V
C
RES
load
V
GOUT
high
V
GOUT
low
V
IN
V
IH
V
IL
I
IH
I
IL
I
IL
2.0 15 V
4.0–5.5V
–3.34.0mA
1.5
4.0
0.45 0.55
12 13 13.5
10 11.2
V
C
-0.5
RES
LGND
0–
VDDx0.7
-1.0
-200
0.3
2.5
5.0
V
C
-0.1
RES
LGND + 0.1
-50
1.0
1.0
3.5
6.0
V
C
RES
LGND+0.5
V
DD
V
x0.3
DD
1.0
µA
mA
V
V
V
V
V
V
V
µA
µA
µA
Notes
7. Excluding pull-up resistor current, including current of gate-drive circuit.
8. f
= 100 kHz.
IN
9. Detection voltage is defined as when the output becomes high-impedance after V
voltage VC
10. I
= 1.2 A source + sink.
O
11. Input logic signal not present.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 17510
is applied from an external source, VC
RES
RES
= 7.5 V.
drops below the detection threshold. When the gate
DD
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DYNAMIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions T reflect the approximate parameter means at T
Characteristic Symbol Min Typ Max Unit
INPUT (EN, IN1, IN2, GIN)
Pulse Input Frequency
Input Pulse Rise Time (Note 12)
Input Pulse Fall Time (Note 14)
OUTPUT
Propagation Delay Time
Turn-ON Time
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Turn-ON Time
Turn-OFF Time
GOUT Output Delay Time (Note 15)
Turn-ON Time
Turn-OFF Time
Charge Pump Circuit
Oscillator Frequency
Rise Time (Note 16)
Low-Voltage Detection Time
Notes
12. Time is defined between 10% and 90%.
13. That is, the input waveform slope must be steeper than this.
14. Time is defined between 90% and 10%.
15. Load is 500 pF.
16. Time to charge C
to 11 V after application of VDD.
RES
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Freescale Semiconductor, Inc.
= 25°C, VM = 15 V, VDD = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted
A
= 25°C under nominal conditions unless otherwise noted.
A
f
IN
t
R
t
F
t
PZH
t
PLH
t
PHL
t
TON
t
TOFF
f
OSC
t
V
C
RES
t
VDDDET
on
––200kHz
––1.0
––1.0
100
––10ms
0.3
1.2
0.5
200
0.1
(Note 13)
(Note 13)
1.0
2.0
1.0
10
10
400
1.0
µs
µs
µs
µs
kHz
ms
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17510 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 6
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IN1, IN2, EN
(GIN)
t t
(tTON)
OUTn
(GOUT)
* The last state is “Z”.
PZH*, PLH
Freescale Semiconductor, Inc.
Timing Diagrams
DETon VDDDEToff
V
DD
V
50%
90%
10%
t
PHL
(tTOFF)
DD
1.5 V
I
M
tVDDDET
3.5 V
50%
90%
t
VDDDET
0% (<1.0 µA)
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Figure 2. t
H = High. L = Low. Z = High impedance. X = Don’t care. The
, t
PHL
, and t
PLH
EN IN1 IN2 GIN
HLLXZZ X
HHL XH L X
HLHXLH X
HHHX L L X
LXXXL L L
HXXLXX H
HXXHXX L
GIN terminal and EN terminal are pulled up to V
Timing
PZH
Table 1. Truth Table
INPUT OUTPUT
with internal resistance.
DD
Figure 3. Low-Voltage Detection Timing
OUT1 OUT2 GOUT
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 17510
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SYSTEM/APPLICATION INFORMATION
The 17510 is a monolithic H-Bridge power IC applicable to small DC motors used in portable electronics. The 17510 can operate efficiently with supply voltages as low as 2.0 V to as high as 15 V, and it can provide continuos motor drive currents of 1.2 A while handling peak currents up to 3.8 A. It is easily interfaced to low-cost MCUs via parallel 5.0 V-compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. The 17510 has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance).
Basic protection and operational features (direction, dynamic braking, PWM control of speed and torque, main power supply undervoltage detection and shutdown, logic power supply undervoltage detection and shutdown), in addition to the 1.0 A rms output current capability, make the 17510 a very attractive, cost-effective solution for controlling a broad range of small DC
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motors. In addition, a pair of 17510 devices can be used to control bipolar stepper motors. The 17510 can also be used to excite transformer primary windings with a switched square wave to produce secondary winding AC currents.
INTRODUCTION
As shown in Figure 1,
Diagram, page 2, the 17510 is a monolithic H-Bridge with built-
in charge pump circuitry. For a DC motor to run, the input conditions need to be set as follows: ENable input logic HIGH, one INput logic LOW, and the other INput logic HIGH (to define output polarity). The 17510 can execute dynamic braking by setting both IN1 and IN2 logic HIGH, causing both low-side MOSFETs in the output H-Bridge to turn ON. Dynamic braking can also implemented by taking the ENable logic LOW. The output of the H-Bridge can be set to an open-circuit high­impedance (Z) condition by taking both IN1 and IN2 logic LOW. (refer to Table 1,
The 17510 outputs are capable of providing a continuous DC load current of up to 1.2 A. An internal charge pump supports PWM frequencies to 200 kHz. The EN terminal also controls the charge pump, turning it off when EN = LOW, thus allowing the 17510 to be placed in a power-conserving sleep mode.
17510 Simplified Internal Block
Truth Table, page 7).
FUNCTIONAL TERMINAL DESCRIPTION
OUT1 and OUT2
The OUT1 and OUT2 terminals provide the connection to the internal power MOSFET H-Bridge of the IC. A typical load connected between these terminals would be a small DC motor. These outputs will connect to either VM or PGND, depending on the states of the control inputs (refer to Table 1, page 7).
PGND and LGND
The power and logic ground terminals (PGND and LGND) should be connected together with a very low-impedance
cale Semiconductor,
connection.
C
RES
The C
Frees
reservoir capacitor (output of the charge pump). Alternatively this terminal can also be used as an input to supply gate-drive voltage from an external source via a series current-limiting resistor. The voltage at the C
three times the V
utilizes a voltage tripler circuit. The the IC to supply gate drive for the internal power MOSFET
H-Bridge.
VM
The VM terminals carry the main supply voltage and current into the power sections of the IC. This supply then becomes controlled and/or modulated by the IC as it delivers the power to the load attached between OUT1 and OUT2. All VM
terminal provides the connection for the external
RES
terminal will be approximately
voltage, as the internal charge pump
DD
RES
V
C
voltage is used by
RES
Truth Table,
terminals must be connected together on the printed circuit board with as short as possible traces offering as low impedance as possible between terminals.
VM has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input terminals.
IN1, IN2, and EN
The IN1, IN2, and EN terminals are input control terminals used to control the outputs. These terminals are 5.0 V CMOS­compatible inputs with hysteresis. The IN1, IN2, and EN work together to control OUT1 and OUT2 (refer to Table 1,
Table).
GIN
The GIN input controls the GOUT terminal. When GIN is set logic LOW, GOUT supplies a level-shifted high-side gate drive signal to an external MOSFET. When GOUT is set to GND potential.
C1L and C1H, C2L and C2H
These two pairs of terminals, the C1L and C1H and the C2L and C2H, connect to the external bucket capacitors required by the internal charge pump. The typical value for the bucket capacitors is 0.1 µF.
GIN is set logic HIGH,
Truth
17510 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 8
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GOUT
The GOUT output terminal provides a level-shifted, high-side
gate drive signal to an external MOSFET with C
V
DD
The VDD terminal carries the 5.0 V supply voltage and
current into the logic sections of the IC. V
Typical Application
Figure 4 shows a typical application for the 17510.
MCU
CEMF Snubbing Techniques
Care must be taken to protect the IC from potentially damaging CEMF spikes induced when commutating currents in inductive loads. Typical practice is to provide snubbing of voltage transients by placing a capacitor or zener at the supply terminal (VM) (see Figure 5
).
DD
Figure 4. 17510 Typical Application Diagram
iss
has an
up to 500 pF.
APPLICATIONS
5.0 V
17510
V
C1L C1H C2L C2H C
RES
EN GIN IN1 IN2
GND
undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input terminals.
VM
DD
GOUT
OUT1
OUT2
Motor
5.0 V 15 V
17510
VM
V
DD
C1L
OUT1
C1H C2L C2H C
RES
OUT2
Solenoid
5.0 V 15 V
17510
V
DD
C1L
OUT1
C1H C2L C2H C
RES
OUT2
VM
GND
Figure 5. CEMF Snubbing Techniques
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 17510
GND
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PACKAGE DIMENSIONS
MTB SUFFIX
EJ (Pb-FREE) SUFFIX
24-LEAD TSSOP WIDE BODY
PLASTIC PACKAGE
CASE 948K-01
ISSUE O
24X REFK
S
M
0.10 (0.004) V
S
U0.15 (0.006) T
2X L/2
SEATING PLANE
L
U0.15 (0.006) T
N
PIN 1 IDENT.
S
D
N
DETAIL E
A
-V-
C
G
0.25 (0.010)
M
F
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0.10 (0.004)
-T-
cale Semiconductor,
U
T
1324
121
H
S
B
-U-
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCIN G PER ANSI Y14.5M, 1982.
2. CONTROLLING D IMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUD E INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT IN CLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFE RENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-.
DIM MIN MAX MIN MAX
A 7.70 7.90 0.303 0.311 B 5.50 5.70 0.216 0.224 C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006
-W-
F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015
J 0.09 0 .20 0.004 0. 008 J1 0.09 0.16 0. 004 0.006 K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 7.60 BSC 0.299 BSC M 0 8 0 8
°°°°
INCHESMILLIMETERS
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17510 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 10
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NOTES
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 17510
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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied
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copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners.
© Motorola, Inc. 2004
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MPC17510
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