Figure 1-1. Blo c k Di a gr a m .......................... .......................................... ...................................................6
Table 10-1. Ordering Information ................................ ....................................... .................. .................46
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CY7C68013
1.0 EZ-USB FX2 Features
Cypress’s EZ-USB FX2 is the world’s first USB 2.0 integrated microcontroller. By integrating the USB 2.0 transceiver, SIE,
enhanced 805 1 microcontroll er, and a programmable peri pheral interfac e in a single chip, Cypr ess has created a ver y costeffective solution that provides superior time-to-market advantages. The ingenious architecture of FX2 results in data transfer
rates of 56 Mbytes per second, the maximum allowable USB 2.0 bandwidth, while still using a low-cost 8051 microcontroller in
a package as small as a 56 SSOP. Because it incorporates the USB 2.0 transceiver, the FX2 is more economical, providing a
smaller footprint solution than USB 2.0 SIE or external transceiver implementations. With EZ-USB FX2, the Cypress Smart SIE
handles most of th e USB 1.1 and 2 .0 protocol in hardware, freeing th e embedded micr ocontroller fo r application-spec ific functions
and decreasing development time to ensure USB compatibility. The General Programmable Interface (GPIF) and Master/Slave
Endpoint FIFO (8- or 16- bit data bus) provides an easy and glue les s int erfa ce to p op ula r in terfaces such as
PCMCIA, and most DSP/processors.
Four packages are defined for the family: 56 SSOP, 56 QFN, 100 TQFP, and 128 TQFP.
24 MHz
Ext. XTAL
High-performance micro
using standard tools
with lower-power options
FX2
ATA, UTOPIA, EPP,
Data (8)
Compatible
Additional I/Os (24)
GPIF
Address (16) / Data Bus (8)
4 kB
FIFO
FIFO and endpoint memory
(master or slave operation)
2
I
C
Master
ADDR (9)
Integrated
full- and high-speed
XCVR
D+
D–
x20
V
CC
PLL
1.5k
connected for
full speed
USB
2.0
XCVR
Enhanced USB core
Simplifies 8051 core
/0.5
/1.0
/2.0
CY
Smart
USB
1.1/2.0
Engine
Address (16)
8051 Core
12/24/48 MHz,
four clocks/cycle
8.5 kB
RAM
“Soft Configuration”
Easy firmware changes
Figure 1-1. Block Diagram
• Single-chip integrated USB 2.0 Transceiver, SIE, and Enhanced 8051 Microprocessor
• Software: 8051 runs from internal RAM, which is:
—Downloaded via USB, or
—Loaded from EEPROM
—External memory device (128-pin configuration only)
• Four programmable BULK/INTERRUPT/ISOCHRONOUS endpoints
—Buffering options: double, triple and quad
• 8- or 16-bit external data interface
• GPIF
—Allows direct connection to most parallel interfaces; 8- and 16-bit
—Programmable waveform descriptors and configuration registers to define waveforms
—Supports multiple Ready (RDY) inputs and Control (CTL) outputs
• Integrated, industry standard 8051 with enhanced features:
—Up to 48-MHz clock rate
—Four clocks per instruction cycle
—Two USARTS
RDY (6)
CTL (6)
8/16
Abundant I/O
including two USARTS
General
programmable I/F
to ASIC/DSP or bus
standards such as
ATAPI, EPP, etc.
Up to 96 MBytes/s
burst rate
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—Three counter/timers
—Expanded interrupt system
—Two data pointers
• Supports bus powered applications by using renumeration
• 3.3V operation
• Smart Serial Interface Engine
• Vectored USB interrupts
• Separate data buffers for the SETUP and DATA portions of a CONTROL transfer
• Integrated I
• 48-MHz, 24-MHz, or 12-MHz 8051 operation
• Four integrated FIFOs
—Brings glue and FIFOs inside for lower system cost
—Automatic conversion to and from 16-bit buses
—Master or slave operation
—FIFOs can use externally supplied clock or asynchronous strobes
—Easy interface to ASIC and DSP ICs
• Special autovectors for FIFO and GPIF interrupts
• Up to 40 general purpose I/Os
• Four package options—128-pin TQFP, 100-pin TQFP, 56-pin QFN and 56-pin SSOP.
2
C-compatible controller, runs at 100 or 400 kHz
2.0 Applications
CY7C68013
• DSL modems
• ATA interface
• Memory card readers
• Legacy conversion devices
• Cameras
• Scanners
• Home PNA
• Wireless LAN
• MP3 players
• Networking.
The “Reference Designs” section of the c ypress website provides additio nal tools for ty pical USB 2.0 app lications. Eac h reference
design comes complete with firmware source and object code, schematics, and documentation. Please visit
http://www.cypress.com for more information.
3.0 Functional Overview
3.1USB Signaling Speed
FX2 operates at two of the three rates defined in the Universal Serial Bus Specification Revision 2.0, dated April 27, 2000:
• Full speed, with a signaling bit rate of 12 Mbps
• High speed, with a si gnaling bit rate of 480 Mbps
FX2 does not support the low-speed signaling mode of 1.5 Mbps.
3.28051 Microprocessor
The 8051 microprocessor embedded in the FX2 family has 256 bytes of register RAM, an expanded interrupt system, three
timer/counters, and two USARTs.
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3.2.18051 Clock Frequency
FX2 has an on-chip oscillator circuit that uses an external 24-MHz (±100 ppm) crystal with the following characteristics:
• Parallel resonant
• Fundamental mode
• 500-µW drive level
• 20–33 pF (5% tolerance) load capacitors.
An on-chip PLL multiplies the 24-MH z oscill ator up to 48 0 MHz, as requi red by the trans ceive r/PHY, and internal counter s divide
it down for use as the 80 51 cloc k. The defau lt 8051 cloc k freq uency is 1 2 MHz. The c lock frequen cy o f the 8051 can b e cha nged
by the 8051 through the CPUCS register, dynamically.
The CLKOUT pin, which can be tri-stated and inverted using internal control bits, outputs the 50% duty cycle 8051 clock, at the
selected 8051 clock frequency—48, 24, or 12 MHz.
3.2.2USARTS
FX2 contains two standard 8051 USARTs, addressed via Special Function Register (SFR) bits. The USART interface pins are
available on separate I/O pins, and are not multiplexed with port pins.
UART0 and UAR T1 can operate using an internal clock at 230 KBaud with no more than 1% ba ud rate error . 230-KBaud operation
is achieved by an internally deriv ed clock sour ce that generates overflow pulses at the appropriat e time. The intern al clock ad justs
for the 8051 clock rate (48, 24, 12 MHz) such that it always presents the correct frequency for 230-KBaud operation.
Note. 1 15-KBau d operatio n is also p ossible by programm ing the 8 051 SMOD0 or SMOD 1 bits to a “1” fo r UART 0 and/or UA RT1,
respectively.
3.2.3Special Function Registers
Certain 8051 SFR addresses are populated to provide fast access to critical FX2 functions. These SFR additions are shown in
Table 3-1. Bold type indicates non-standard, enhanced 8051 registers.
The two SFR rows that end with “0” and “8” contain bit-addressable registers. The four I/O ports A–D use the SFR addresses
used in the standard 8051 for ports 0–3, which are not implemented in FX2.
Because of the faster and more efficient SFR addressing, the FX2 I/O ports are not addressable in external RAM space (using
the MOVX instruction).
3.3I2C-compatible Bus
FX2 supports the I2C-compatible bus as a master only at 100/400 kbps. SCL and SDA pins have open-drain outputs and
hysteresis inputs. These signals must be pulled up to 3.3V, even if no I
2
C-compatible device is connected.
3.4Buses
All packages: 8- or 16-bit “FIFO” bidirectional data bus, multiplexed on I/O ports B and D. 128-pin package: adds 16-bit outputonly 8051 address bus, 8-bit bidirectional data bus.
During the power-u p s equ en ce, in ternal logic checks the I2C-compatible port for the connection of an EEPROM whose first byte
is either 0xC0 or 0xC2. If found, it uses the VID/PID/DID values in the EEPROM in place of the internally stored values (0xC0),
or it boot-loads the EEPROM contents into internal RAM (0xC2). If no EEPROM is detected, FX2 enumerates using internally
stored descriptors. The default ID values for FX2 are VID/PID/DID (0x04B4, 0x8613, 0xxxyy).
Table 3-2. Default ID Values for FX2
Default VID/PID/DID
Vendor ID0x04B4Cypress Semiconductor
Prod ID0x8613EZ-USB FX2
Device release0xXXYYDepends on revision (0x04 for Rev E)
2
Note. The I
detection method does not work properly.
3.6ReNumeration
Because the FX2’s configuration is soft, one chip can take on the identities of multiple distinct USB devices.
When first plugged into USB, the FX2 enumerates automatically and downloads firmware and USB descriptor tables over the
USB cable. Next, the FX2 enumerates again, this time as a device defined by the downloaded information. This patented twostep process, called ReNumeration
has occurred.
Two control bits in the USBCS (USB Control and Status) register control the ReNumeration process: DISCON and RENUM. To
simulate a USB disconnect, the firmware sets DISCON to 1. To reconnect, the firmware clears DISCON to 0.
Before reconnecting, the fi rmwa re se t s or clears the RENUM bi t to in dic at e wheth er the firmware o r t he Defa ul t USB Device wil l
handle device requests over endpoint zero: if RENUM = 0, the Default USB Device will handle device requests; if RENUM = 1,
the firmware will.
C-compatible bus SCL and SDA pins must be pulled up, even if an EEPROM is not connected. Otherwise this
™
™
, happens instantl y when the dev ice is plugged in, with no hint tha t the in itial down load ste p
3.7Bus Powered Applications
Bus powered applicat ions requi re the FX2 to enum erate in a un configure d mode with le ss then 100 mA. To do this, the FX2 must
enumerate in the full speed mode and then, when configured, renumerate in high speed mode. For an example of the benefits
and limitations of this renumeration process see the application note titled “Bus Powered Enumeration with FX2”.
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3.8Interrupt System
3.8.1INT2 Interrupt Request and Enable Registers
FX2 implements an autovector feature for INT2 and INT4. There are 27 INT2 (USB) vectors, and 14 INT4 (FIFO/GPIF) vectors.
See FX2 TRM for more details.
3.8.2USB-Interrupt Autovectors
The main USB interrupt is sh ared by 27 interru pt sources . To save the code and processi ng time that normally wou ld be required
to identify the individual USB interrupt source, the FX2 p rovides a second l evel of interrupt vec toring, c alled Aut ovectorin g. When
a USB interrupt is asse rted, the FX2 pushes the program counter onto its stack then jumps to addres s 0x0043, where it expects
to find a “jump” instruction to the USB Interrupt service routine.
The FX2 jump instruction is encoded as follows.
Table 3-3. INT2 USB Interrupts
USB INTERRUPT TABLE FOR INT2
PriorityINT2VEC Value Source Notes
1 00SUDAV SETUP Data Available
2 04 SOF Start of Frame (or microframe)
3 08SUTOK Setup Token Received
4 0CSUSPEND USB Suspend request
5 10USB RESETBus reset
6 14HISPEED Entered high speed operation
7 18 EP0ACK FX2 ACK’d the CONTROL Handshake
8 1C reserved
9 20 EP0-IN EP0-IN ready to be loaded with data
10 24 EP0-OUT EP0-OUT has USB data
11 28 EP1-IN EP1-IN ready to be loaded with data
12 2C EP1-OUT EP1-OUT has USB data
13 30 EP2 IN: buffer available. OUT: buffer has data
14 34 EP4 IN: buffer available. OUT: buffer has data
15 38 EP6 IN: buffer available. OUT: buffer has data
16 3C EP8 IN: buffer available. OUT: buffer has data
17 40 IBN IN-Bulk-NAK (any IN endpoint)
18 44reserved
19 48 EP0PINGEP0 OUT was Pinged and it NAK’d
20 4C EP1PING EP1 OUT was Pinged and it NAK’d
21 50 EP2PING EP2 OUT was Pinged and it NAK’d
22 54 EP4PING EP4 OUT was Pinged and it NAK’d
23 58 EP6PING EP6 OUT was Pinged and it NAK’d
24 5C EP8PING EP8 OUT was Pinged and it NAK’d
25 60 ERRLIMITBus errors exceeded the programmed limit
26 64 reserved
27 68 reserved
28 6C reserved
29 70 EP2ISOERR ISO EP2 OUT PID sequence error
30 74 EP4ISOERR ISO EP4 OUT PID sequence error
31 78 EP6ISOERR ISO EP6 OUT PID sequence error
32 7C EP8ISOERR ISO EP8 OUT PID sequence error
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CY7C68013
If Autovectoring is enabled (AV2EN = 1 in the INTSETUP register), the FX2 substitutes its INT2VEC byte. Therefore, if the high
byte (“page”) of a jump-table address is preloaded at location 0x0044, the automatically-inserted INT2VEC byte at 0x0045 will
direct the jump to the correct address out of the 27 addresses within the page.
3.8.3FIFO/GPIF Interrupt (INT4)
Just as the USB Interrupt is shared among 27 individual USB-interrupt sources, the FIFO/GPIF interrupt is shared among 14
individual FIFO/GPIF sources. The FIFO/GPIF Interrupt, like the USB Interrupt, can employ autovectoring. Table 3-4 shows the
priority and INT4VEC values for the 14 FIFO/GPIF interrupt sources
Table 3-4. Individual FIFO/GPIF Interrupt Sources
PriorityINT4VEC ValueSource Notes
180EP2PFEndpoint 2 Programmable Flag
2 84 EP4PFEndpoint 4 Programmable Flag
388EP6PFEndpoint 6 Programmable Flag
48CEP8PFEndpoint 8 Programmable Flag
590EP2EFEndpoint 2 Empty Flag
694EP4EFEndpoint 4 Empty Flag
798EP6EFEndpoint 6 Empty Flag
89CEP8EFEndpoint 8 Empty Flag
9A0 EP2FFEndpoint 2 Full Flag
10A4EP4FFEndpoint 4 Full Flag
11 A8EP6FFEndpoint 6 Full Flag
12AC EP8FFEndpoint 8 Full Flag
13 B0GPIFDONEGPIF Operation Complete
14 B4GPIFWFGPIF Waveform
If Autovectoring is enabled (AV4EN = 1 in the INTSETUP register), the FX2 substitutes its INT4VEC byte. Therefore, if the high
byte (“page”) of a jump-table address is preloaded at location 0x0054, the automatically-inserted INT4VEC byte at 0x0055 will
direct the jump to the correct address out of the 14 address es within the page . When the ISR occurs, the FX2 p ushes the program
counter onto its stack then jumps to address 0x0053, where it expects to find a “jump” instruction to the ISR Interrupt service
routine.
3.9Reset and Wakeup
3.9.1Reset Pin
An input pin (RESET#) reset s th e chi p. This pin has h ysteresi s and is a ctive LO W. The internal PLL stabil izes approxim ately 200
µs after V
3.9.2Wakeup Pins
The 8051 puts itself and the rest of the chip into a power-down mode by setting PCON.0 = 1. This stops the oscillator and PLL.
When WAKEUP is asserted by e xternal logic , the osc illator res tarts and after th e PLL stabi lizes, a nd the 8051 receives a wak eup
interrupt. This applies whether or not FX2 is connected to the USB.
The FX2 exits the power down (USB suspend) state using one of the following methods:
• USB bus signals resume
• External logic asserts the WAKEUP pin
• External logic asserts the PA3/WU2 pi n.
The second wakeup pin, WU2, can also be configured as a general purpose I/O pin. This allows a simple external R-C network
to be used as a periodic wakeup source.
has reached 3.3V. Typically, an external RC network (R = 100k, C = 0.1 µF) is used to provide the RESET# signal.
CC
3.10Program/Data RAM
3.10.1Size
The FX2 has eight kbytes of internal program/data RAM, where PSEN#/RD# signals are internally ORed to allow the 8051 to
access it as both program and data memory. No USB control registers appear in this space.
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CY7C68013
Two memory maps are shown in the following diagrams:
Figure 3-1 Internal Code Memory, EA = 0
Figure 3-2 External Code Memory, EA = 1.
3.10.2Internal Code Memory, EA = 0
This mode implement s the in tern al ei ght-kbyte block of RAM (starting at 0) as combined code and data memory. When external
RAM or ROM is added, the external read and write strobes are suppressed for memory spaces that exist inside the chip. This
allows the user to connect a 64-kbyte memory without requiring address decodes to keep clear of internal memory spaces.
Only the internal eight kbytes and scratch pad 0.5 kbytes R AM spaces have the following access:
• USB download
• USB upload
• Setup data pointer
2
• I
C-compatible interface boot load.
Inside FX2Outside FX2
FFFF
E200
E1FF
0.5 kbytes RAM
Data (RD#,WR#)*
E000
7.5 kbytes
US B regs and
4k EP buffers
(RD#,WR#)
(OK to populate
data memory
here—RD#/WR#
strobes are not
active)
48 kbytes
External
Data
Memory
(RD#,WR#)
56 kbytes
External
Code
Memory
(PSEN#)
1FFF
Eight kbytes RAM
Code and Data
(PSEN#,RD#,WR#)*
0000
(Ok to populate
data memory
here—RD#/WR#
strobes are not
active)
DataCode
(OK to populate
program
memory here—
PSEN# strobe
is not active)
*SUDPTR, USB upload/download, I2C-compatible interface boot access
Figure 3-1. Internal Code Memory, EA = 0
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CY7C68013
3.10.3External Code Memory, EA = 1
The bottom eight k bytes of pr ogram me mory is exte rnal, and th erefore the bottom ei ght kbytes of int ernal RAM is access ible onl y
as data memory.
Inside FX2Outside FX2
FFFF
E200
E1FF
0.5 kbytes RAM
Data (RD#,WR#)*
E000
1FFF
7.5 kbytes
USB regs and
4k EP buffers
(RD#,WR#)
(OK to populate
data memory
here—RD#/WR#
strobes are not
active)
48 kbytes
External
Data
Memory
(RD#,WR#)
64 kbytes
External
Code
Memory
(PSEN#)
(Ok to populate
data memory
here—RD#/WR#
strobes are not
active)
DataCode
0000
Eight kbytes
RAM
Data
(RD#,WR#)*
*SUDPTR, USB upload/download, I2C-compatible interface boot access
Figure 3-2. External Code Memory, EA = 1
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3.11Register Addresses
FFFF
4 kbytes EP2-EP8 buffers
F000
EFFF
2 kbytes RESERVED
E800
E7FF
E7C0
E7BF
E780
E77F
E740
E73F
E700
E6FF
E600
E5FF
E480
E47F
E400
E3FF
E200
E1FF
E000
64 bytes EP1IN
64 bytes EP1OUT
64 bytes EP0 IN/OUT
64 bytes RESERVED
256 bytes Registers
384 bytes RESERVED
128 bytes GPIF Waveforms
512 bytes RESERVED
(8 × 512)
512 bytes
8051 xdata RAM
CY7C68013
3.12Endpoint RAM
3.12.1Size
• 3 × 64 bytes(Endpoints 0 and 1)
• 8 × 512 bytes (Endpoints 2, 4, 6, 8)
3.12.2Organization
• EP0Bidirectional endpoint zero, 64-byte buffer
• EP1IN, EP1OUT 64-byte buffers, bulk or interrupt
• EP2,4,6,8 Eight 512-byte buffers, bulk, interrupt, or isochronous. EP2 and 6 can be either double, triple, or quad
3.12.3Setup Data Buffer
A separate eight-byte buffer at 0xE6B8-0xE6BF holds the SETUP data from a CONTROL transfer.
buffered. For high-speed endpoint configuration options, see Figure 3-3.
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3.12.4Endpoint Configurations (High-speed Mode)
EP0 IN&OUT
EP1 IN
EP1 OUT
64
64
64
64
64
64
CY7C68013
64
64
64
64
64
64
64
64
64
64
64
64
EP2
EP4
EP6
EP8
512
512
512
512
512
512
512
512
512
512
EP2EP2
512
512
512
512
EP6EP6
512
512
1024
1024
1024
1024
512
512
EP2
512
512
EP6
512
512
512
EP8EP8
512
EP2
1024
1024
1024
512
512
1024
1024
EP2
1024
1024
Figure 3-3. Endpoint Configuration
Endpoints 0 an d 1 are the same for every co nfigurat ion. Endpo int 0 is t he only CO NTROL endp oint, and endpoi nt 1 can be e ither
BULK or INTERRUPT. T o the left of the vertical line, the user may pick different configurations for EP2&4 and EP6&8, since none
of the 512-byte buffers are combined between these endpoint groups. An example endpoint configuration would be:
EP2—1024 double buffered; EP6—512 quad buffered.
To the right of the vertical line, buffers are shared between EP2–8, and therefore only entire columns may be chosen.
ep064646464
ep1out064 bulk64 int64 int
ep1in064 bulk64 int64 int
ep2064 bulk out (2×)64 int out (2×)64 iso out (2×)
ep4064 bulk out (2×)64 bulk out (2×)64 bulk out (2×)
ep6064 bulk in (2×)64 int in (2×)64 iso in (2×)
ep8064 bulk in (2×)64 bulk in (2×)64 bulk in (2×)
64 int64 int
ep20512 bulk out (2×)512 int out (2×)512 iso out (2×)
ep40512 bulk out (2×)512 bulk out (2×)512 bulk out (2×)
ep60512 bulk in (2×)512 int in (2×)512 iso in (2×)
ep80512 bulk in (2×)512 bulk in (2×)512 bulk in (2×)
Note:
3. Even though these buffers are 64 bytes, they are reported as 512 for USB 2.0 compliance. The user must never transfer packets larger than 64 bytes to EP1.
3.13External FIF O inte rface
3.13.1Architecture
The FX2 slave FIFO architecture has eight 512-byte blocks in the endpoint RAM that directly serve as FIFO memories, and are
controlled by FIFO control signals (such as IFCLK, SLCS#, SLRD, SLWR, SLOE, PKTEND, and flags).
In operation, some of the eight RAM blocks fill or empty from the SIE, while the others are connected to the I/O transfer logic.
The transfer logic takes two forms, the GPIF for internally generated control signals, or the slave FIFO interface for externally
controlled transfers.
3.13.2Master/Slave Control Signals
The FX2 endpoint FIFOS are impleme nte d as eig ht phy sic all y dis tin ct 256x16 RAM blocks. The 8051/SIE can switch any of the
RAM blocks betwee n tw o dom ai ns , th e USB (SIE) domain and the 8051-I/O Unit doma in. This switching is done virtually inst a ntaneously, giving essentially zero transfer time between “USB FIFOS” and “Slave FIFOS.” Since they are physically the same
memory, no bytes are actually transferred between buffers.
At any given time, some RAM blocks are fi lling/ emp tying with USB dat a unde r SIE control, whi le other RA M blocks are avail able
to the 8051 and/or t he I /O control unit. The RAM blocks operate as s in gle -po rt in the USB domain, and dual-port in the 805 1-I/O
domain. The blocks can be configured as single, double, triple, or quad buffered as previously shown.
The I/O control unit implements either an internal-master (M for master) or external-master (S for Slave) interface.
In Master (M) mode, the GPIF internally control s FIFOADR[1 ..0] to select a FIFO. The RDY pins (two in the 56-pin pa ckag e, si x
in the 100-pin and 128-pin packages) can be used as flag inputs from an external FIFO or other logic if desired. The GPIF can
be run from either an internally derived clock or externally supplied clock (IFCLK), at a rate that transfers data up to 96
Megabytes/s (48 MHz).
In Slave (S) mode, the FX2 accepts either an internally derived clock or externally supplied clock (IFCLK, max. frequency 48
MHz) and SLCS#, SL RD, SL WR, SL OE, PKTEND signal s from exte rnal logic. Each endpoint ca n individu ally be selec ted for byte
or word operation by an internal configuration bit, and a Slave FIFO Output Enable signal SLOE enables data of the selected
width. External logic must insure that the output enable signal is inactive when writing data to a slave FIFO. The slave interface
can also operate asynchronously, where the SLRD and SLWR signals act directly as strobes, rather than a clock qualifier as in
synchronous mode. The signals SLRD, SLWR, SLOE and PKTEND are gated by the signal SLCS#.
3.13.3GPIF and FIFO Clock Rates
An 8051 register bit se lec t s one of two frequencies for the internally suppli ed i nte rfac e c lo ck: 30 MHz and 48 MHz. Alternatively,
an externally supp lied clock of 5 M Hz – 48 MHz feedin g the IFCLK pin can b e used as the inte rface clock. IFCLK can be configured
to function as an output clock when the GPIF and FIFOs are internally clocked. An output enable bit in the IFCONFIG register
turns this clock output off, if desired. Another bit within the IFCONFIG register will invert the IFCLK signal whether internally or
externally sourced.
3.14GPIF
The GPIF is a flex ible 8- or 16-bit p arallel i nterface d riven by a user-prog rammabl e finite s tate m achine. It allows the CY7C68 013
to perform local bus mastering, and can implement a wide variety of protocols such as ATA interface, printer parallel port, and
Utopia.
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CY7C68013
The GPIF has six programma ble control output s (CTL), nine addr ess outputs (GPIF ADRx), and six gen eral-purpo se ready input s
(RDY). The data bus width can be 8 or 16 bits. Each GPIF vector defines the state of the control outputs, and determines what
state a ready input (or multiple inputs) must be before proceeding. The GPIF vector can be programmed to advance a FIFO to
the next data va lue , advance an address, etc. A sequence of the GPIF vectors make up a single w ave form th at w ill be ex ec ute d
to perform the desired data move between the CY7C68013 and the external design.
3.14.1Six Control OUT Signals
The 100- and 128-pin pa ckages bring out all six Control Output pins (CTL0-CTL5). The 8051 programs the GPIF unit to define
the CTL waveforms. The 56-pin package brings out three of these signals, CTL0–CTL2. CTLx waveform edges can be
programmed to make transitions as fast as once per clock (20.8 ns using a 48-MHz clock).
3.14.2Six Ready IN Signals
The 100- and 1 28-pin packages bring out a ll si x R ea dy i npu ts (RDY0–RDY5). The 8051 programs the GPIF unit to tes t the RDY
pins for GPIF branching. The 56-pin package brings out two of these signals, RDY0–1.
3.14.3Nine GPIF Address OUT signals
Nine GPIF address lines are a vailable in the 100- and 12 8-pin pac kages, GP IF ADR[8 ..0]. The GPIF ad dress line s allow index ing
through up to a 512-byte block of RAM. If more address lines are needed, I/O port pins can be used.
3.14.4Long Transfer Mode
In master mode, the 8051 appropriately sets GPIF transaction count registers (GPIFTCB3, GPIFTCB2, GPIFTCB1, or
GPIFTCB0) for unattended transfers of up to 4,294,967,296 bytes. The GPIF automatically throttles data flow to prevent under
or overflow until the full number of requested transactions complete. The GPIF decrements the value in these registers to
represent the current status of the transaction.
3.15USB Uploads and Downloads
The core has the ability to directly edit the data contents of the internal 8-kbyte RAM and of the internal 512-byte scratch pad
RAM via a vendor-specific command. This capability is normally used when “soft” dow nloa din g user code and is av ail able on ly
to and from internal RAM, whether the 8051 is held in reset or running. The available RAM spaces are 8 kbytes from
0x0000–0x1FFF (code/data) and 512 bytes from 0xE000–0xE1FF (scratch pad RAM).
Note: A “loader” running in internal RAM can be used to transfer downloaded data to external memory.
3.16Autopointer Access
FX2 provides two identical autopointers. They are similar to the internal 8051 data pointers, but with an additional feature: they
can optionally increm en t a pointer address after every memory access. This c ap a bil ity is ava ila ble to and from both internal and
external RAM. The autop ointers are ava ilabl e in ext ernal FX2 registe rs, und er contro l of a mo de bit (AUTOPTRSETUP.0). Using
the external FX2 autopointer access (at 0xE67B – 0xE67C) allows the autopointer to access all RAM, internal and external to
the part. Al so, the aut opointers can point to any FX2 regi ster or en dpoint buffer space. When autopoint er access to external
memory is enabled, location 0xE67B and 0xE67C in XDATA and PDATA space cannot be used.
3.17I2C-compatible Controller
FX2 has one I2C-compatible port that is driven by two internal controllers, one that automatically operates at boot time to load
VID/PID/DID and configuration information, and another that the 8051, once running, uses to control external I
devices. The I2C-compatible port operates in master mode only.
3.17.1I2C-compatible Port Pins
The I2C-compatible pi ns SCL and SDA must have external 2.2-kΩ pull-up res istors. External EEPROM dev ice address pins m ust
be configured properly. See Table 3-7 for configuring the device address pins.
2
C-compatible
Document #: 38-08012 Rev. *CPage 17 of 52
CY7C68013
Table 3-7. Strap Boot EEPROM Address Lines to These Values
BytesExample EEPROMA2A1A0
1624LC00
[4]
12824LC01000
25624LC02000
4K24LC32001
8K24LC64001
2
3.17.2I
At power-on reset the I
program/data. The av ailable RAM s paces are 8 kbyt es from 0x0000–0x 1FFF and 512 bytes from 0xE000–0xE1FF. The 8051 will
be in reset. I
C-compatible Interface Boot Load Access
2
C-compatible interface boot loader will load the VID/PID/DID/a configuration byte and up to 8 kbytes of
2
C-compatible interface boot loads only occur after power-on reset.
N/AN/AN/A
3.17.3I
The 8051 can control peripherals connected to the I
compatible master control only, it is never an I
2
C-compatible Interface General Purpose Access
2
C-compatible bus using the I2CTL and I2DAT registers. FX2 provides I2C
2
C-compatible slave.
4.0 Pin Assignments
Figure 4-1 identifies all signals fo r the four packa ge types. The following pages illustrate the individual pi n diagrams, plu s a
combination diagram showing which of the full set of signals are available in the 128-, 100-, and 56-pin packages.
The 56-pin package is the lowest-cost version. The signals on the left edge of the 56-pin package in Figure 4-1 are common to
all versions in the FX2 family. Three modes are available in all package versions: Port, GPIF master, and Slave FIFO. These
modes define th e signals on the right e dge of the di agram. The 8 051 select s the inte rface mode using the IF CONFIG[1:0] reg ister
bits. Port mode is the power-on default configuration.
The 100-pin package adds functionality to the 56-pin package by adding these pins:
• PORTC or alternate GPIFADR[7...0] address signals
• PORTE or alternate GPIFADR8 address signals and 7 more 8051 signals
• 3 GPIF Control signals
• 4 GPIF Ready signals
• Nine 8051 signals (two USARTs, three timer inputs, INT4,and INT5#)
• BKPT, RD#, WR#
The 128-pin packag e is the full version, add ing the 8051 address and dat a buses plus cont rol signals. Note that tw o of the required
signals, RD# and WR# , are pres ent in the 100-pin versio n. In the 1 00-pin a nd 128-p in vers ions, an 8051 c ontrol b it can be set to
pulse the RD# and WR# pins when the 8051 reads from/writes to PORTC.
1312136AGNDPowerN/AAnalog Ground. Connect to ground with as short a path as
1918169DMINUSI/O/ZZUSB D– Signal. Connect to the USB D– signal.
1817158DPLUSI/O/ZZUSB D+ Signal. Connect to the USB D+ signal.
94A0OutputL8051 Address Bus. This bus is driven at all times. When the
95A1OutputL
96A2OutputL
59D0I/O/ZZ8051 Data Bus. This bidirectional bus is high-impedance when
60D1I/O/ZZ
61D2I/O/ZZ
62D3I/O/ZZ
63D4I/O/ZZ
86D5I/O/ZZ
87D6I/O/ZZ
88D7I/O/ZZ
39PSEN#OutputHProgram Store Enable. This active-LOW signal indica tes an 8051
3428BKPTOutputLBreakpoint. This pin goes active (HIGH) when t he 8051 addre ss
99774942 RESET#InputN/AActive LOW Reset. Resets the entire chip. This pin is normally
Note:
5. Unused inputs should not be left floating. Tie either HIGH or LOW as appropriate. Outputs should only be pulled up or down to ensure signals at power-up and
in standby.
[5]
. This signal provides power to the anal og sec tio n of
the chip.
CC
possible.
8051 is addressing internal RAM it reflects the internal address.
inactive, input for bus reads, and output for bus writes. The data
bus is used for external 8051 program and data memory . The data
bus is active only for external bu s accesses, an d is driven LO W in
suspend.
code fetch from external memory. It is active for program memory
fetches from 0x2000–0xFFFF when the EA pin is LOW, or from
0x0000–0xFFFF when the E A pin is HIGH.
bus matches the BPADDRH/L registers and breakpoints are
enabled in the BREAKPT register (BPEN = 1). If the BPPULSE b it
in the BREAKPT register is HIGH, this signal pulses HIGH for eight
12-/24-/48-MHz clocks. If the BPPULSE bit is LOW, the signal
remains HIGH until the 8051 clears the BREAK bit (by writi ng 1 to
it) in the BREAKPT register.
tied to V
capacitor.
through a 100K resistor , and to GND throu gh a 0.1-µF
CC
Document #: 38-08012 Rev. *CPage 24 of 52
CY7C68013
Table 4-1. FX2 Pin Descriptions (continued)
128
TQFP
Port A
100
TQFP
35EAInputN/AExternal Access. This pin determines where the 8051 fetches
1211125XTALINInputN/ACrystal Input. Connect this sig nal to a 24-MHz p aralle l-resonant,
1110114XTALOUTOutputN/ACrystal Output. Connect this signal to a 24-MHz parallel-
1100554 CLKOUTO/Z12 MHz 12-, 24- or 48-MHz clock, phase locked to the 24-MHz i nput clock.
82674033 PA0 or
83684134 PA1 or
84694235 PA2 or
85704336 PA3 or
89714437 PA4 or
90724538 PA5 or
91734639 PA6 or
56
SSOP
56
QFNNameTypeDefaultDescription
INT0#
INT1#
SLOE
WU2
FIFOADR0
FIFOADR1
PKTEND
[5]
I/O/ZI
(PA0)
I/O/ZI
(PA1)
I/O/ZI
(PA2)
I/O/ZI
(PA3)
I/O/ZI
(PA4)
I/O/ZI
(PA5)
I/O/ZI
(PA6)
code between addresse s 0x0000 an d 0x1FFF. If EA = 0 the 8051
fetches this code from its internal RAM. IF EA = 1 the 8051 fetches
this code from external memory.
fundamental mode crystal and load capacitor to GND.
It is also correct to drive XTALIN with an external 24 MHz square
wave derived from another clock source.
resonant, fundamental mode crystal and load capacitor to GND.
If an external clock is used to drive XTALIN, leave this pin open.
The 8051 defaults to 12-MHz operation. The 8051 may tri-state
this output by setting CPUCS.1 = 1.
Multiplexe d pin whose function is selected by:
PORTACFG.0
PA0 is a bidirectional IO port pin.
INT0# is the active-LOW 8051 INT0 interrupt input signal, which
is either edge triggered (IT0 = 1) or level triggered (IT0 = 0).
Multiplexe d pin whose function is selected by:
PORTACFG.1
PA1 is a bidirectional IO port pin.
INT1# is the active-LOW 8051 INT1 interrupt input signal, which
is either edge triggered (IT1 = 1) or level triggered (IT1 = 0).
Multiplexed pin whose function is selected by two bits:
IFCONFIG[1:0].
PA2 is a bidirectional IO port pin.
SLOE is an input-only output enable with programmable polarity
(FIFOPOLAR.4) for the slave FIFOs connected to FD[7..0] or
FD[15..0].
Multiplexe d pin whose function is selected by:
WAKEUP.7 and OEA.3
PA3 is a bidirectional I/O port pin.
WU2 is an alterna te source for USB Wakeup, enabled by WU2EN
bit (WAKEUP.1) and polarity set by WU 2POL (W AKEUP.4). If the
8051 is in sus pend and W U2EN = 1 , a tra nsiti on on this pin st art s
up the oscillator and interrupts the 8051 to allow it to exit the
suspend mode. Asserting this pin inh ibi t s the chip from
suspending, if WU2EN=1.
Multiplexe d pin whose function is selected by:
IFCONFIG[1..0].
PA4 is a bidirectional I/O port pin.
FIFOADR0 is an input-only address select for the slave FIFOs
connected to FD[7..0] or FD[15..0].
Multiplexe d pin whose function is selected by:
IFCONFIG[1..0].
PA5 is a bidirectional I/O port pin.
FIFOADR1 is an input-only address select for the slave FIFOs
connected to FD[7..0] or FD[15..0].
Multiplexed pin w hose f unctio n is sele cted by the IFC ONFIG [1:0]
bits.
PA6 is a bidirectional I/O port pin.
PKTEND is an input-on ly packet end with programmable pola rity
(FIFOPOLAR.5) for the slave FIFOs connected to FD[7..0] or
FD[15..0].
Document #: 38-08012 Rev. *CPage 25 of 52
CY7C68013
Table 4-1. FX2 Pin Descriptions (continued)
128
TQFP
Port B
PORT C
100
TQFP
92744740 PA7 or
44342518 PB0 or
45352619 PB1 or
46362720 PB2 or
47372821 PB3 or
54442922 PB4 or
55453023 PB5 or
56463124 PB6 or
57473225 PB7 or
7257PC0 or
7358PC1 or
7459PC2 or
7560PC3 or
7661PC4 or
56
SSOP
56
QFNNameTypeDefaultDescription
I/O/ZI
FLAGD or
SLCS#
I/O/ZI
FD[0]
I/O/ZI
FD[1]
I/O/ZI
FD[2]
I/O/ZI
TXD1 or
FD[3]
I/O/ZI
FD[4]
I/O/ZI
FD[5]
I/O/ZI
FD[6]
I/O/ZI
FD[7]
I/O/ZI
GPIFADR0
I/O/ZI
GPIFADR1
I/O/ZI
GPIFADR2
I/O/ZI
GPIFADR3
I/O/ZI
GPIFADR4
[5]
(PA7)
(PB0)
(PB1)
(PB2)
(PB3)
(PB4)
(PB5)
(PB6)
(PB7)
(PC0)
(PC1)
(PC2)
(PC3)
(PC4)
Multiplexed pin w hose f unctio n is sele cted by the IFC ONFIG [1:0]
and PORTACFG.7 bits.
PA7 is a bidirectional I/O port pin.
FLAGD is a programmable slave-FIFO output status flag signal.
SLCS# gates all other slave FIFO enable/strobes
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB0 is a bidirectional I/O port pin.
FD[0] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB1 is a bidirectional I/O port pin.
FD[1] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB2 is a bidirectional I/O port pin.
FD[2] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB3 is a bidirectional I/O port pin.
FD[3] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB4 is a bidirectional I/O port pin.
FD[4] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB5 is a bidirectional I/O port pin.
FD[5] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB6 is a bidirectional I/O port pin.
FD[6] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
PB7 is a bidirectional I/O port pin.
FD[7] is the bidirectional FIFO/GPIF data bus.
Multiplexe d pin whose function is selected by PORTCCFG.0
PC0 is a bidirectional I/O port pin.
GPIFADR0 is a GPIF address output pin.
Multiplexe d pin whose function is selected by PORTCCFG.1
PC1 is a bidirectional I/O port pin.
GPIFADR1 is a GPIF address output pin.
Multiplexe d pin whose function is selected by PORTCCFG.2
PC2 is a bidirectional I/O port pin.
GPIFADR2 is a GPIF address output pin.
Multiplexe d pin whose function is selected by PORTCCFG.3
PC3 is a bidirectional I/O port pin.
GPIFADR3 is a GPIF address output pin.
Multiplexe d pin whose function is selected by PORTCCFG.4
PC4 is a bidirectional I/O port pin.
GPIFADR4 is a GPIF address output pin.
Document #: 38-08012 Rev. *CPage 26 of 52
CY7C68013
Table 4-1. FX2 Pin Descriptions (continued)
128
TQFP
PORT D
Port E
100
TQFP
7762PC5 or
7863PC6 or
7964PC7 or
102805245 PD0 or
103815346 PD1 or
104825447 PD2 or
105835548 PD3 or
121955649 PD4 or
12296150 PD5 or
12397251 PD6 or
12498352 PD7 or
10886PE0 or
10987PE1 or
56
SSOP
56
QFNNameTypeDefaultDescription
I/O/ZI
GPIFADR5
I/O/ZI
GPIFADR6
I/O/ZI
GPIFADR7
I/O/ZI
FD[8]
I/O/ZI
FD[9]
I/O/ZI
FD[10]
I/O/ZI
FD[11]
I/O/ZI
FD[12]
I/O/ZI
FD[13]
I/O/ZI
FD[14]
I/O/ZI
FD[15]
I/O/ZI
T0OUT
I/O/ZI
T1OUT
[5]
(PC5)
(PC6)
(PC7)
(PD0)
(PD1)
(PD2)
(PD3)
(PD4)
(PD5)
(PD6)
(PD7)
(PE0)
(PE1)
Multiplexe d pin whose function is selected by PORTCCFG.5
PC5 is a bidirectional I/O port pin.
GPIFADR5 is a GPIF address output pin.
Multiplexe d pin whose function is selected by PORTCCFG.6
PC6 is a bidirectional I/O port pin.
GPIFADR6 is a GPIF address output pin.
Multiplexe d pin whose function is selected by PORTCCFG.7
PC7 is a bidirectional I/O port pin.
GPIFADR7 is a GPIF address output pin.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[8] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[9] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[10] is the bidirectional FIFO/GPIF data b us.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[11] is the bidirectional FIFO/GPIF data bus.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[12] is the bidirectional FIFO/GPIF data b us.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[13] is the bidirectional FIFO/GPIF data b us.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[14] is the bidirectional FIFO/GPIF data b us.
Multiplexed pin w hose functio n is select ed by the I FCONFIG[1..0]
and EPxFIFCFG.0 (wordwid e) bits.
FD[15] is the bidirectional FIFO/GPIF data b us.
Multiplexe d pin whose function is selected by the PORTECFG.0
bit.
PE0 is a bidirectional I/O port pin.
T0OUT is an active-HIGH signal from 8051 Timer-counter0.
T0OUT outputs a high level for one CLKOUT clock cycle when
Timer0 overflows. If Timer0 is operated in Mode 3 (two separate
timer/counters), T0OUT i s active wh en the lo w byte timer/ counter
overflows.
Multiplexe d pin whose function is selected by the PORTECFG.1
bit.
PE1 is a bidirectional I/O port pin.
T1OUT is an active-HIGH signal from 8051 Timer-counter1.
T1OUT outputs a high level for one CLKOUT clock cycle when
Timer1 overflows. If Timer1 is operated in Mode 3 (two separate
timer/counters), T1OUT i s active wh en the lo w byte timer/ counter
overflows.
Document #: 38-08012 Rev. *CPage 27 of 52
CY7C68013
Table 4-1. FX2 Pin Descriptions (continued)
128
TQFP
100
TQFP
11088PE2 or
11189PE3 or
11290PE4 or
11391PE5 or
11492PE6 or
11593PE7 or
56
SSOP
56
QFNNameTypeDefaultDescription
I/O/ZI
T2OUT
I/O/ZI
RXD0OUT
I/O/ZI
RXD1OUT
I/O/ZI
INT6
I/O/ZI
T2EX
I/O/ZI
GPIFADR8
[5]
(PE2)
(PE3)
(PE4)
(PE5)
(PE6)
(PE7)
Multiplexe d pin whose function is selected by the PORTECFG.2
bit.
PE2 is a bidirectional I/O port pin.
T2OUT is the active-HIGH output signal from 8051 Timer2.
T2OUT is active (HIGH) for one clock cycle when Timer/Counter
2 overflows.
Multiplexe d pin whose function is selected by the PORTECFG.3
bit.
PE3 is a bidirectional I/O port pin.
RXD0OUT is an active-HIGH signal from 8051 UART0. If
RXD0OUT is se lected and U AR T0 is in M ode 0, t his pi n p rovide s
the output data for UART0 only when it is in sync mode. Otherwise
it is a 1.
Multiplexe d pin whose function is selected by the PORTECFG.4
bit.
PE4 is a bidirectional I/O port pin.
RXD1OUT is an active-HIGH output from 8051 UART1. When
RXD1OUT is se lected and U AR T1 is in M ode 0, t his pi n p rovide s
the output dat a for U AR T1 only when it is in s ync mode . In Mod es
1, 2, and 3, this pin is HIGH.
Multiplexe d pin whose function is selected by the PORTECFG.5
bit.
PE5 is a bidirectional I/O port pin.
INT6 is the 8051 INT5 interru pt request inp ut signal. The IN T6 pin
is edge-sensitive, acti ve H IGH.
Multiplexe d pin whose function is selected by the PORTECFG.6
bit.
PE6 is a bidirectional I/O port pin.
T2EX is an active-high input signal to the 8051 Timer2. T2EX
reloads timer 2 on i ts falling edge. T2EX i s active only if the EXEN2
bit is set in T2CON.
Multiplexe d pin whose function is selected by the PORTECFG.7
bit.
PE7 is a bidirectional I/O port pin.
GPIFADR8 is a GPIF address output pin.
4381RDY0 or
SLRD
5492RDY1 or
SLWR
65RDY2InputN/ARDY2 is a GPIF input signal.
76RDY3InputN/ARDY3 is a GPIF input signal.
87RDY4InputN/ARDY4 is a GPIF input signal.
98RDY5InputN/ARDY5 is a GPIF input signal.
Document #: 38-08012 Rev. *CPage 28 of 52
InputN/AMultiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
RDY0 is a GPIF input signal.
SLRD is the input-only read strobe with programmable polarity
(FIFOPOLAR.3) for the slave FIFOs connected to FDI[7..0] or
FDI[15..0].
InputN/AMultiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
RDY1 is a GPIF input signal.
SLWR is the input-only write strobe with programmable polarity
(FIFOPOLAR.2) for the slave FIFOs connected to FDI[7..0] or
FDI[15..0].
CY7C68013
Table 4-1. FX2 Pin Descriptions (continued)
128
TQFP
100
TQFP
69543629 CTL0 or
70553730 CTL1 or
71563831 CTL2 or
6651CTL3OutputHCTL3 is a GPIF control output.
6752CTL4OutputHCTL4 is a GPIF control output.
9876CTL5OutputHCTL5 is a GPIF control output.
32262013 IFCLKI/O/ZZInterface Clock, used for synchronously clocking data into or out
2822INT4InputN/AINT4 is the 8051 INT4 interrupt re quest input s ignal. The INT4 p in
10684INT5#InputN/AINT5# is the 8051 INT5 interrupt request input signal. The INT5
3125T2InputN/AT2 is the active-HIGH T2 input signal to 8051 Timer2, which
3024T1InputN/AT1 is the active-HIGH T1 signal for 8051 Timer1, which provides
2923T0InputN/AT0 is the active-HIGH T0 signal for 8051 Timer0, which provides
5343RXD1InputN/ARXD1is an active-HIGH input signal for 8051 UART1, which
5242TXD1OutputHTXD1is an active-HIGH output pin from 8051 UART1, which
5141RXD0InputN/ARXD0 is the active-HIGH RXD0 input to 8051 UART0, which
5040TXD0OutputHTXD0 is the active-HIGH TXD0 output from 8051 UART0, which
42CS#OutputHCS# is the active-LOW chip select for external memory.
4132WR#OutputHWR# is the active-LOW write strobe output for external memory.
56
SSOP
56
QFNNameTypeDefaultDescription
FLAGA
FLAGB
FLAGC
[5]
OutputHMultiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
CTL0 is a GPIF control output.
FLAGA is a programmable slave-FIFO output status flag signal.
Defaults to programmable for the FIFO selected by the
FIFOADR[1:0] pins.
OutputHMultiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
CTL1 is a GPIF control output.
FLAGB is a programmable slave-FIFO output status flag signal.
Defaults to FULL for th e FIFO selected by the FIFOADR[1:0] pins.
OutputHMultiplexed pin whose function is selected by the following bits:
IFCONFIG[1..0].
CTL2 is a GPIF control output.
FLAGC is a programmable slave-FIFO output status flag signal.
Defaults to EMPTY for the FIFO selected by the FIFOADR[1:0]
pins.
of the slave FIFOs. IFCL K also serves as a tim ing reference for all
slave FIFO control signals and GPIF. When internal clocking,
IFCONFIG.7 = 1, is used the IFCLK pin can be configured to
output 30/48 MHz by bits IFCONFIG.5 and IFCONFIG.6. IFCLK
may be inverted, whether internally or externally sourced, by
setting the bit
IFCONFIG.4 =1.
is edge-sensitive, acti ve H IGH.
pin is edge-sensitive, active LOW.
provides the input to Timer2 when C/T2 = 1. When C/T2 = 0,
Timer2 does not use this pin.
the input to T im er1 when C/T1 is 1. Whe n C/T1 is 0, T im er1 does
not use this bit.
the input to T im er0 when C/T0 is 1. Whe n C/T0 is 0, T im er0 does
not use this bit.
provides data to the UART in all modes.
provides the output clock in sync mode, and the output data in
async mode.
provides data to the UART in all modes.
provides the output clock in sync mode, and the output data in
async mode.
Document #: 38-08012 Rev. *CPage 29 of 52
CY7C68013
Table 4-1. FX2 Pin Descriptions (continued)
128
TQFP
100
TQFP
56
SSOP
56
QFNNameTypeDefaultDescription
[5]
4031RD#OutputHRD# is the active-LOW read strobe output for external memory.
38OE#OutputHOE# is the active-LOW output enable for external memory.
33272114 ReservedInputN/AReserved. Connect to ground.
101795144 WAKEUPInputN/AUSB Wakeup. If the 8051 is in suspend, asserting this pin starts
up the oscillator and interrupts the 8051 to allow it to exit the
suspend mode. Holdi ng WA KEUP assert ed inhibit s the EZ-USB
chip from suspending. This pin has programmable polarity
(WAKEUP.4).
2
36292215 SCLODZClock for the I
2.2K resistor, even if no I
37302316 SDAODZData for I
resistor, even if no I
21655V
1716147V
26201811 V
43332417 V
48383427 V
64493932 V
68535043 V
8166V
10078V
10785V
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
PowerN/AVCC. Connect to 3.3V power source.
C-compatible interface. Connect to VCC with a
2
C-compatible interface. Connect to VCC with a 2.2K
1413NCN/AN/ANo-connect. This pin must be left open.
1514NCN/AN/ANo-connect. This pin must be left open.
1615NCN/AN/ANo-connect. This pin must be left open.
Document #: 38-08012 Rev. *CPage 30 of 52
CY7C68013
5.0 Register Summary
FX2 register bit definitions are described in the FX2 TRM in greater detail.
C11 SBUF1
C26 reserved
C81 T2CONTimer/Counter 2 Control (bit
C91 reserved
CA1 RCAP2LCapture for Timer 2, auto-re-
CB1 RCAP2HCapture for Timer 2, auto- re-
CC1 TL2Timer 2 reload LD7D6D5D4D3D2D1D000000000RW
CD1 TH2Timer 2 reload HD15D14D13D12D11D10D9D800000000RW
CE2 reserved
D01 PSWProgram Statu s Word (b it ad-
Port D (bit addressable)D7D6D5D4D3D2D1D0xxxxxxxxRW
Port E (NOT bit addressable)D7D6D5D4D3D2D1D0xxxxxxxxRW
Port A Output EnableD7D6D5D4D3D2D1D000000000RW
Port B Output EnableD7D6D5D4D3D2D1D000000000RW
Port C Output EnableD7D6D5D4D3D2D1D000000000RW
Port D Output EnableD7D6D5D4D3D2D1D000000000RW
Port E Output EnableD7D6D5D4D3D2D1D000000000RW
Storage Temperature .................................................................................................................................... –65°C to +150°C
Ambient Temperature with Power Supplied........................................................................................................0°C to +70°C
Supply Voltage to Ground Potential..................................................................................................................–0.5V to +4.0V
DC Input Voltage to Any Input Pin ................................................................................................................................. 5.25V
DC Voltage Applied to Outputs in High Z State....................................................................................... –0.5V to V
Power Dissipation...................................................................................................................................................... 936 mW
Max Output Current, per I/O port ............................................................................................................................ ...... 10 mA
Max Output Current, all five I/O ports (128- and 100-pin packages) ............................................................................ 50 mA
7.0 Operating Conditions
TA (Ambient Temperature Under Bias)............................................................................................................... 0°C to +70°C
Supply Voltage..................................................................................................................................................+3.0V to +3.6V
Ground V oltage....................................... ...... ..... ...... ..... ...... .................................................................................................0V
(Oscillator or Crystal Frequency)......................................................................................................24 MHz ± 100 ppm
F
OSC
Parallel Resonant
8.0 DC Characteristics
CC
+ 0.5V
Ta ble 8-1. DC Characteristics
ParameterDescriptionConditionsMin.Typ.Max.Unit
V
V
V
I
V
V
I
I
C
CC
IH
IL
I
OH
OL
OH
OL
IN
Supply Voltage3.03.33.6V
Input HIGH Voltage25.25V
Input LOW Voltage–0.50.8V
Input Leakage Current0< VIN < V
Output Voltage HIGHI
Output LOW VoltageI
= 4 mA2.4V
OUT
= –4 mA0.4V
OUT
CC
±10µA
Output Current HIGH4mA
Output Current LOW4mA
Input Pin CapacitanceExcept D+/D–10pF
D+/D–15pF
I
SUSP
Suspend CurrentConnected250400µA
Disconnected30180µA
I
CC
Supply Current8051 running, connected to USB HS200260mA
8051 running, connected to USB FS90150mA
T
RESET
Reset Time after valid powerVcc min = 3.0V1.91ms
8.1USB Transceiver
USB 2.0-certified in full- and high-speed modes.
Note:
9. Connected to the USB includes 1.5k ohm internal pull-up. Disconnected has the 1.5k ohm internal pull-up excluded.
Document #: 38-08012 Rev. *CPage 37 of 52
9.0 AC Electrical Characteristics
9.1USB Transceiver
USB 2.0-certified in full- and high-speed modes.
9.2Program Memory Read
t
CL
CY7C68013
CLKOUT
[10]
A[15..0]
PSEN#
D[7..0]
OE#
CS#
t
AV
t
STBH
t
DH
t
SOEL
t
SCSL
t
STBL
t
ACC1
[11]
data in
t
AV
Figure 9-1. Program Memory Read Timing Diagram
Ta ble 9-1. Program Memory Read Parameters
ParameterDescriptionMin.Typ.Max.UnitNotes
t
CL
1/CLKOUT Frequency20.83ns48 MHz
41.66ns24 MHz
83.2ns12 MHz
t
AV
t
STBL
t
STBH
t
SOEL
t
SCSL
t
DSU
t
DH
Notes:
10. CLKOUT is shown with positive polarity.
11. t
is computed from the above parameters as follows:
ACC1
(24 MHz) = 3*tCL – tAV –t
t
ACC1
(48 MHz) = 3*tCL – tAV – t
t
ACC1
Delay from Clock to Valid Address010.7ns
Clock to PSEN Low08ns
Clock to PSEN High08ns
Clock to OE Low11.1ns
Clock to CS Low13ns
Data Set-up to Clock9.6ns
Data Hold Time0ns
= 106 ns
DSU
= 43 ns.
DSU
Document #: 38-08012 Rev. *CPage 38 of 52
9.3Data Memory Read
CY7C68013
t
CL
Stretch = 0
CLKOUT
CLKOUT
[10]
A[15..0]
RD#
CS#
OE#
D[7..0]
[10]
A[15..0]
RD#
CS#
D[7..0]
t
AV
DSU
t
ACC1
[12]
t
STBH
t
DH
t
STBL
t
SCSL
t
SOEL
[12]
t
ACC1
t
CL
t
AV
t
data in
Stretch = 1
t
AV
t
DSU
data in
t
DH
Figure 9-2. Data Memory Read Tim ing Diagram
T ab le 9- 2. Data Memory Read Parameters
ParameterDescriptionMin.Typ.Max.UnitNotes
t
CL
1/CLKOUT Frequency20.83ns48 MHz
41.66ns24 MHz
83.2ns12 MHz
t
AV
t
STBL
t
STBH
t
SCSL
t
SOEL
t
DSU
t
DH
Note:
12. t
and t
ACC2
(24 MHz) = 3*tCL – tAV –t
t
ACC2
(48 MHz) = 3*tCL – tAV – t
t
ACC2
(24 MHz) = 5*tCL – tAV –t
t
ACC3
(48 MHz) = 5*tCL – tAV – t
t
ACC3
Delay from Clock to Valid Address10.7ns
Clock to RD LOW11ns
Clock to RD HIGH11ns
Clock to CS LOW13ns
Clock to OE LOW11.1ns
Data Set-up to Clock9.6ns
Data Hold Time0ns
are computed from the above parameters as follows:
ACC3
DSU
DSU
DSU
DSU
= 106 ns
= 43 ns
= 190 ns
= 86 ns.
Document #: 38-08012 Rev. *CPage 39 of 52
9.4Data Memory Write
t
CL
CY7C68013
CLKOUT
A[15..0]
WR#
CS#
D[7..0]
CLKOUT
A[15..0]
WR#
CS#
D[7..0]
t
AV
t
SCSL
t
ON1
t
CL
t
AV
t
t
ON1
STBL
data out
t
STBH
Stretch = 1
data out
t
AV
t
OFF1
t
OFF1
Figure 9-3. Data Memory Write Timing Diagram
T able 9-3. Data Memory Write Parameters
ParameterDescriptionMin.Max.UnitNotes
t
AV
t
STBL
t
STBH
t
SCSL
t
ON1
t
OFF1
Delay from Clock to Valid Address010.7ns
Clock to WR Pulse LOW011.2ns
Clock to WR Pulse HIGH011.2ns
Clock to CS Pulse LOW13.0ns
Clock to Data Turn-on013.1ns
Clock to Data Hold Time013.1ns
Table 9-4. GPIF Synchronous Signals Parameters with Internally Sourced IFCLK
ParameterDescriptionMin.Max.Unit
t
IFCLK
t
SRY
t
RYH
t
SGD
t
DAH
t
SGA
t
XGD
t
XCTL
IFCLK Period20.83ns
RDYX to Clock Set-up Time8.9ns
Clock to RDYX 0ns
GPIF Data to Clock Set-up Time9.2ns
GPIF Data Hold Time0ns
Clock to GPIF Address Propagation Delay7.5ns
Clock to GPIF Data Output Propagation Delay11ns
Clock to CTLX Output Propagation Delay6.7ns
Table 9-5. GPIF Synchronous Signals Parameters with Externally Sourced IFCLK
[15]
ParameterDescriptionMin.Max.Unit
t
IFCLK
t
SRY
t
RYH
t
SGD
t
DAH
t
SGA
t
XGD
t
XCTL
Notes:
13. Dashed lines denote signals with programmable polarity
14. GPIF asynchronous RDY
15. IFCLK must not exceed 48 MHz.
IFCLK Period20.83200ns
RDYX to Clock Set-up Time2.9ns
Clock to RDYX 3.7ns
GPIF Data to Clock Set-up Time3.2ns
GPIF Data Hold Time4.5ns
Clock to GPIF Address Propagation Delay11.5ns
Clock to GPIF Data Output Propagation Delay15ns
Clock to CTLX Output Propagation Delay10.7ns
signals have a minimum set-up time of 50 ns when using internal 48-MHz IFCLK.
IFCLK Period20.83ns
SLRD to Clock Set-up Time18.7ns
Clock to SLRD Hold Time0ns
SLOE Turn-on to FIFO Data Valid10.5ns
SLOE Turn-off to FIFO Data Hold10.5ns
Clock to FLAGS Output Propagation Delay9.5ns
Clock to FIFO Data Output Propagation Delay11ns
IFCLK Period20.83200ns
SLRD to Clock Set-up Time12.7ns
Clock to SLRD Hold Time3.7ns
SLOE Turn-on to FIFO Data Valid10.5ns
SLOE Turn-off to FIFO Data Hold10.5ns
Clock to FLA GS Output Propag ation Delay13.5ns
Clock to FIFO Data Output Propagation Delay15ns
Ta ble 9-8. Slave FIFO Asynchronous Read Parameters
t
RDpwl
t
XFD
[16]
t
XFLG
N+1
t
OEoff
[13]
ParameterDescriptionMin.Max.Unit
t
RDpwl
t
RDpwh
t
XFLG
t
XFD
t
OEon
t
OEoff
SLRD Pulse Width LOW50ns
SLRD Pulse Width HIGH50ns
SLRD to FLAGS Output Propagation Delay70ns
SLRD to FIFO Data Output Propagation Delay15ns
SLOE Turn-on to FIFO Data Valid10.5ns
SLOE Turn-off to FIFO Data Hold10.5ns
16. Slave FIFO asynchronous parameter values use internal IFCLK setting at 48 MHz.
IFCLK Period20.83ns
SLWR to Clock Set-up Time18.1ns
Clock to SLWR Hold Time0ns
FIFO Data to Clock Set-up Time9.2ns
Clock to FIFO Data Hold Time0ns
Clock to FLAGS Output Propagation Time9.5ns
IFCLK Period20.83200ns
SLWR to Clock Set-up Time12.1ns
Clock to SLWR Hold Time3.6ns
FIFO Data to Clock Set-up Time3.2ns
Clock to FIFO Data Hold Time4.5ns
Clock to FLAGS Output Propagation Time13.5ns
FIFOADR[1:0] to RD/WR/PKTEND Set-up Time10ns
RD/WR/PKTEND to FIFOADR[1:0] Hold Time10ns
10.0 Ordering Information
Table 10-1. Ordering Information
Ordering CodePackage TypeRAM Size# Prog I/Os
CY7C68013-128AC128 TQFP8K4016/8 bit
CY7C68013-100AC100 TQFP8K40–
CY7C68013-56PVC56 SSOP8K24–
CY7C68013-56LFC56 QFN8K24–
CY3681EZ-USB FX2 Xcelerator Development Kit
/Data Busses
8051
Address
Document #: 38-08012 Rev. *CPage 46 of 52
11. 0 Package Diagrams
The FX2 is available in f our packages:
• 56-pin SSOP
• 56-pin QFN
• 100-pin TQFP
• 128-pin TQFP.
CY7C68013
Figure 11-1. 56-lead Shrunk Small Outline Package O56
51-85062-*C
51-85144-*B
Figure 11-2. 56-lead Quad Flatpack No Lead Package (8 X 8 mm) LF56
Document #: 38-08012 Rev. *CPage 47 of 52
CY7C68013
51-85050-*A
Figure 11-3. 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101
Document #: 38-08012 Rev. *CPage 48 of 52
CY7C68013
Figure 11-4. 128-Lead Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A128
51-85101-*B
Document #: 38-08012 Rev. *CPage 49 of 52
CY7C68013
12.0 PCB Layout Recommendations
[17]
The following recommendations should be followed to ensure reliable high-performance operation.
• At least a four-layer impedance controlled boards are required to maintain signal quality.
• Specify impedance targets (ask your board vendor what they can achieve).
• To control impedance, maintain trace widths and trace spacing.
• Minimize stubs to minimize reflected signals.
• Connections between the USB connector shell and signal ground must be done near the USB connector.
• Bypass/flyback caps on VBus, near connector, are recommended.
• DPLUS and DMINUS trac e l eng ths sh ou ld b e k ept to w i thi n 2 mm of eac h o t he r in len gth , w it h pre ferre d l eng th of 20-30 mm.
• Maintain a solid ground plane under the DPLUS and DMINUS traces. Do not allow the plane to be split under these traces.
• It is preferred is to have no vias placed on the DPLUS or DMINUS trace routing.
• Isolate the DPLUS and DMINUS traces from all other signal traces by no less than 10 mm.
13.0 Quad Flat Package No Leads (QFN) Package Design Notes
Electrical contact of the part to the Printed Circuit Board (PCB) is made by soldering the leads on the bottom surface of the
package to the PCB. Hence, special attention is required to the heat transfer area below the package to provide a good thermal
bond to the circu it board. A Copper (Cu) fill is to be des igned into the PCB as a thermal pa d under the pack age. Heat is trans ferred
from the FX2 through the device’s metal paddle on the bottom side of the package. Heat from here, is conducted to the PCB at
the thermal pad. It is then c onduc ted fro m the thermal pa d to th e PCB i nner gro und pl ane by a 5 x 5 array o f via. A via i s a pl ated
through hole in the PCB with a finished diameter of 13 mil. The QFN’s metal die paddle must be soldered to the PCB’s thermal
pad. Solder mask is placed on the board top side over each via to resist solder flow into the via. The mask on the top side also
minimizes outgassi ng duri ng the so lder reflow process.
For further information on this package design please refer to the application note “Surface Mount Assembly of AMKOR’s
MicroLeadFrame (MLF) Technology.” This application note can be downloaded from AMKOR’s website from the following URL
http://www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf. The application note provides detailed information on
board mounting guidelines, soldering flow, rework process, etc.
Figure 13-1 below displa y a c ross -secti onal a rea undern eath t he packa ge. Th e cros s se ction is o f o nly o ne vi a. The solde r p aste
template needs to be designed to allow at least 50% solder coverage. The thickness of the solder paste template should be 5
mil. It is recomm ended tha t “No Clean”, type 3 s older pas te is u sed for moun ting the part. Nit rogen purg e is rec ommended d uring
reflow.
0.017” dia
Solder Mask
Cu Fill
Cu Fill
PCB Material
Via hole for thermally connecting the
QFN to the circuit board ground plane.
0.013” dia
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane
PCB Material
Figure 13-1. Cross-section of the Area Underneath the QFN Package
Figure 13-2 is a plot of the sol de r mask pattern and Figure 13-3 displays a n X-Ra y ima ge of the asse mbly (darker a reas i ndi cate
solder.)
Figure 13-2. Plot of the Solder Mask (White Area)
Note:
17. Source for recommendations: EZ-USB FX2™PCB Design Recommendations, http:///www.cypress.com/ cfup load s/su ppo rt/ app _no tes/ FX2_ P CB .pd f and High
Speed USB Platform Design Guidelines, http://www.usb.org/developers/data/hs_usb_pdg_r1_0.pdf.
Document #: 38-08012 Rev. *CPage 50 of 52
CY7C68013
ng so indemnifies Cypress Semiconductor against all charges.
Figure 13-3. X-ray image of the assembly
Purchase of I2C components from Cypress, or o ne of its s ublicensed Ass ociated C ompanies, c onveys a lice nse under the Philips
I2C Patent Rights to use these compon ents in an I2C system, provide d that the system c onforms to the I2C Standard Specifica tion
as defined by Philips. EZ-USB FX2 and ReNumeration are trademarks, and EZ-USB is a registered trademark, of Cypress
Semiconductor. All product and company names mentioned in this document are the trademarks of their respective holders.
Document Title: CY7C68013 EZ-USB FX2™ USB Microcontroller High-speed USB Peripheral Controller
Document Number: 38-08012
REV.ECN NO.
**11175311/15/01DSGChange from Spec number: 38-00929 to 38-08012
*A11180202/20/02KKUUpdate functional changes between revision D part and revision E part.
*B11548006/26/02KKUAdded new 56-pin Quad Flatpack No Lead package and pinout.
*C12077601/06/03KKUAdded bus powered references and PCB layou t recomm endations and QFN
Issue
Date
Orig. of
ChangeDescription of Change
Changed timing dat a from simula tion dat a to revisio n E characteriza tion dat a.
Revised pin description table to reflect new package.
Corrected Figure 9-8 by moving tsfd parameter location.
Corrected labels on Dplus and Dminus in Table 4-1.
Removed Preliminary from spec title.
package design notes.
Updated QFN package drawing 51-85144 to current revision.
Document #: 38-08012 Rev. *CPage 52 of 52
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