CTLST CAT28F102T14I-45T, CAT28F102T14A-90T, CAT28F102T14A-70T, CAT28F102T14A-55T, CAT28F102T14A-45T Datasheet

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CAT28F102
1 Megabit CMOS Flash Memory
FEATURES
Licensed Intel
second source
Fast Read Access Time: 45/55/70/90 ns
Low Power CMOS Dissipation:
–Active: 30 mA max (CMOS/TTL levels) –Standby: 1 mA max (TTL levels) –Standby: 100 µA max (CMOS levels)
High Speed Programming:
0.5 Seconds Typical Chip-Erase
12.0V ± 5% Programming and Erase Voltage
Commercial,Industrial and Automotive
Temperature Ranges
DESCRIPTION
The CAT28F102 is a high speed 64K x 16-bit electrically erasable and reprogrammable Flash memory ideally suited for applications requiring in-system or after-sale code updates. Electrical erasure of the full memory contents is achieved typically within 0.5 second.
It is pin and Read timing compatible with standard EPROM and E2PROM devices. Programming and Erase are performed through an operation and verify algo­rithm. The instructions are input via the I/O bus, using a
64K x 16 Word Organization
Stop Timer for Program/Erase
On-Chip Address and Data Latches
JEDEC Standard Pinouts:
–40-pin DIP –44-pin PLCC –40-pin TSOP
100,000 Program/Erase Cycles
10 Year Data Retention
Electronic Signature
two write cycle scheme. Address and Data are latched to free the I/O bus and address bus during the write operation.
The CAT28F102 is manufactured using Catalyst’s ad­vanced CMOS floating gate technology. It is designed to endure 100,000 program/erase cycles and has a data retention of 10 years. The device is available in JEDEC approved 40-pin DIP, 44-pin PLCC, or 40-pin TSOP packages.
BLOCK DIAGRAM
WE
CE OE
A0–A
15
VOL TAGE VERIFY
© 1998 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
COMMAND REGISTER
SWITCH
ERASE VOL TAGE
SWITCH
PROGRAM VOLTA GE
SWITCH
Y-DECODER
X-DECODER
ADDRESS LATCH
1
CE, OE LOGIC
I/O0–I/O
I/O BUFFERS
DATA
LATCH
1,048,576-BIT
15
Y-GATING
MEMORY
ARRAY
SENSE
AMP
28F101-1
Doc. No. 25038-0A 2/98 F-1
CAT28F102
PIN CONFIGURATION PIN FUNCTIONS
Pin Name Type Function
A0–A
15
Input Address Inputs for
memory addressing
I/O I/O I/O
V
I/O I/O
NC I/O I/O I/O I/O
SS
12
10
PLCC Package (N)
13
15
14
I/O
I/O
6 5 2 1 44 41 40
7 8
11
4
9 10
9
11
8
12 13 14
7
15
6
16
5
17
4
18 19 22 23 24 27 28
20
2
I/O3I/O
DIP Package (P)
PP
CE
15 14 13 12 11 10
SS
OE
1 2 3 4 5 6 7 8 9
9
10
8
11 12
7
13
6
14
5
15
4
16
3
17
2
18
1
19
0
20
V
I/O I/O I/O I/O I/O I/O
I/O I/O
V
I/O I/O I/O I/O I/O I/O I/O I/O
I/O
1
I/O
21
PP
CC
NC
CE
V
3
0
OE
I/O
40 39 38 37 36 35 34 33 32 31 30
29 28 27 26 25 24 23 22 21
NC
V
0
A
V WE NC A A A A A A A V A A A A A A A A
A
43
25
CC
15 14 13 12 11 10 9
SS 8
7 6 5 4 3 2 1
0
WE
42
26
1
A
NC
2
A
14
A15A
39 38 37 36 35 34 33 32 31 30 29
4
A3A
28F101-2
A A A A A V NC A A A A
13 12 11 10 9
SS
8 7 6 5
A
9
A
10
A
11
A
12
A
13
A
14
A
15
NC WE
V
CC
V
PP CE
I/O
15
I/O
14
I/O
13
I/O
12
I/O
11
I/O
10
I/O
9
I/O
8
A A A A A A A A A
GND
A
A
10
A
11
A
12
A
13
A
14
A
15
NC
WE
V
CC
I/O0–I/O CE Input Chip Enable OE Input Output Enable WE Input Write Enable
V
V
V
NC No Connect
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
1
0
2
1
3
2
4
3
5
4
6
5
7
6
8
7
9
8
10 11
9
12 13 14 15 16 17 18 19 20
15
CC SS PP
TSOP Package (T14)
Reverse TSOP Package (T14R)
I/O Data Input/Output
Voltage Supply Ground Program/Erase
Voltage Supply
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
28F102 TSOP2
V
SS
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
OE I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
V
SS
28F101-3
OE
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
V
PP
CE
Doc. No. 25038-0A 2/98 F-1
2
CAT28F102
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................... –55°C to +95°C
Storage Temperature....................... –65°C to +150°C
Voltage on Any Pin with
Respect to Ground
Voltage on Pin A9 with
Respect to Ground
VPP with Respect to Ground
during Program/Erase
VCC with Respect to Ground
(1)
........... –0.6V to +VCC + 2.0V
(1)
................... –2.0V to +13.5V
(1)
.............. –0.6V to +14.0V
(1)
............ –2.0V to +7.0V
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
Package Power Dissipation
Capability (TA = 25°C).................................. 1.0 W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current
(2)
........................ 100 mA
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Test Method
(3)
N T V I
LTH
END
DR
ZAP
(3)
(3)
(3)(4)
Endurance 100K Cycles/Byte MIL-STD-883, Test Method 1033 Data Retention 10 Years MIL-STD-883, Test Method 1008 ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015 Latch-Up 100 mA JEDEC Standard 17
CAPACITANCE TA = 25°C, f = 1.0 MHz
Limits
Symbol Test Min Max. Units Conditions
(3)
C
IN
(3)
C
OUT
(3)
C
VPP
Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
Input Pin Capacitance 6 pF V Output Pin Capacitance 10 pF V
IN OUT
= 0V
= 0V
VPP Supply Capacitance 25 pF VPP = 0V
3
Doc. No. 25038-0A 2/98 F-1
CAT28F102
D.C. OPERATING CHARACTERISTICS
VCC = +5V ±10%, unless otherwise specified
Limits
Symbol Parameter Min. Max. Unit Test Conditions
I
LI
I
LO
I
SB1
Input Leakage Current ±1 µAV
= VCC or V
IN
SS
VCC = 5.5V, OE = V
Output Leakage Current ±1 µAV
= VCC or VSS,
OUT
VCC = 5.5V, OE = V
VCC Standby Current CMOS 100 µA CE = VCC ±0.5V,
VCC = 5.5V
IH
IH
I
SB2
I
CC1
I
CC2
I
CC3
I
CC4
I
PPS
I
PP1
I
PP2
I
PP3
I
PP4
V V V V V V V V I
ID
V
IL ILC OL IH IHC OH1 OH2 ID
(1)
LO
VCC Standby Current TTL 1 mA CE = VIH, VCC = 5.5V VCC Active Read Current 50 mA VCC = 5.5V, CE = VIL,
I
= 0mA, f = 6 MHz
OUT
(1)
VCC Programming Current 30 mA VCC = 5.5V,
Programming in Progress
(1)
VCC Erase Current 30 mA VCC = 5.5V,
Erasure in Progress
(1)
VCC Prog./Erase Verify Current 30 mA VCC = 5.5V, Program or
Erase Verify in Progress VPP Standby Current ±10 µAVPP = V VPP Read Current 100 µAVPP = V
(1)
VPP Programming Current 50 mA VPP = V
PPL PPH PPH
,
Programming in Progress
(1)
VPP Erase Current 30 mA VPP = V
PPH
,
Erasure in Progress
(1)
VPP Prog./Erase Verify Current 5 mA VPP = V
, Program or
PPH
Erase Verify in Progress Input Low Level TTL –0.5 0.8 V Input Low Level CMOS –0.5 0.8 V Output Low Level 0.45 V IOL = 5.8mA, VCC = 4.5V Input High Level TTL 2 VCC+0.5 V Input High Level CMOS VCC*0.7 VCC+0.5 V Output High Level TTL 2.4 V IOH = –2.5mA, VCC = 4.5V Output High Level CMOS VCC-0.4 V IOH = –400µA, VCC = 4.5V A9 Signature Voltage 11.4 13.0 V A9 = V A9 Signature Current 200 µAA
= V
9
ID ID
VCC Erase/Prog. Lockout Voltage 2.5 V
Supply Characteristics
VCC VCC Supply Voltage 4.5 5.5 V 28F102-70, 90 VCC VCC Supply Voltage 4.75 5.25 V 28F102-55, -45 V V
Doc. No. 25038-0A 2/98 F-1
VPP During Read Operations 0 6.5 V
PPL
VPP During Read/Erase/Program 11.4 12.6 V
PPH
4
CAT28F102
A.C. CHARACTERISTICS, Read Operation
VCC = +5V ±10%, unless otherwise specified
JEDEC Standard 28F102-45
Vcc=5V+5%
(7)
28F102-55
Vcc=5V+5%
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max Unit
(7)
28F102-70
(7)
28F102- 90
(8)
t
AVAV
t
ELQV
t
AVQV
t
GLQV
t
AXQX
t
RC
t
CE
t
ACC
t
OE
t
OH
Read Cycle Time 45 55 70 90 ns CE Access Time 45 55 70 90 ns Address Access Time 45 55 70 90 ns OE Access Time 20 25 28 35 ns Output Hold from Address 0 0 0 0 ns
OE/CE Chan
t
GLQX
t
ELQX
t
GHQZ
t
EHQZ
t
WHGL
(1)(2)
(1)(6)
t
OLZ
t
LZ
t
DF
(1)(6)
(1)(2)
OE to Output in Low-Z 0 0 0 0 ns CE to Output in Low-Z 0 0 0 0 ns OE High to Output High-Z 15 15 18 20 ns
- CE High to Output High-Z 15 15 25 30 ns Write Recovery Time Before 6 6 6 6 µs
Read
Figure 1. A.C. Testing Input/Output Waveform
2.4 V INPUT PULSE LEVELS REFERENCE POINTS
0.45 V
Figure 2. A.C. Testing Load Circuit (example)
(3)(4)(5)
2.0 V
0.8 V
5108 FHD F03
1.3V
1N914
3.3K
DEVICE UNDER
TEST
CL = 100 pF
Figure 3. High Speed A.C. Testing Input/Output Waveform
3V
2.4 V INPUT PULSE LEVELS REFERENCE POINTS
0.0
0.45 V
Figure 4. High Speed A.C. Testing Load Circuit (example)
DEVICE UNDER
TEST
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) Output floating (High-Z) is defined as the state where the external data line is no longer driven by the output buffer. (3) Input Rise and Fall Times (10% to 90%) < 10 ns. (4) Input Pulse Levels = 0.45V and 2.4V. For high speed input pulse levels 0.0V and 3.0V. (5) Input and Output Timing Reference = 0.8V and 2.0V. For high speed input and output timing reference=1.5V. (6) Low-Z is defined as the state where the external data may be driven by the output buffer but may not be valid. (7) For Load and Reference Points see Figures 3 and 4 (8) For Load and Reference Points see Figures 1 and 2
2.0 V
1.5V
0.8 V
1.3V
OUT
CL INCLUDES JIG CAPACITANCE
(3)(4)(5)
1N914
3.3K
OUT
CL = 100 pF
30
CL INCLUDES JIG CAPACITANCE
5108 FHD F04
5
Doc. No. 25038-0A 2/98 F-1
CAT28F102
A.C. CHARACTERISTICS, Program/Erase Operation
VCC = +5V ±10%, unless otherwise specified.
JEDEC
Standard
28F102-45 28F102-55 28F102-70 28F102-90
VCC = +5V ±5%
VCC = +5V ±5%
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
t
AVAV
t
AVWL
t
WLAX
t
DVWH
t
WHDX
t
ELWL
t
WHEH
t
WLWH
t
WHWL
t
WHWH1
t
WHWH2
t
WHGL
t
WC
t
AS
t
AH
t
DS
t
DH
t
CS
t
CH
t
WP
t
WPH
(2)
- Program Pulse Width 10 10 10 10 µs
(2)
- Erase Pulse Width 9.5 9.5 9.5 9.5 ms
Write Cycle Time 45 55 70 90 ns Address Setup Time 0 0 0 0 ns Address Hold Time 30 30 35 40 ns Data Setup Time 30 30 35 40 ns Data Hold Time 10 10 10 10 ns
CE Setup Time 0 0 0 0 ns CE Hold Time 0 0 0 0 ns WE Pulse Width 30 30 35 40 ns WE High Pulse Width 20 20 20 20 ns
- Write Recovery Time 6 6 6 6 µs Before Read
t
GHWL
- Read Recovery Time 0 0 0 0 µs Before Write
t
VPEL
- VPP Setup Time to CE 100 100 100 100 ns
Erase and Programming Performance
(1)
28F102-45 28F102-55 28F102-70 28F102-90
Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Chip Erase Time
Chip Program Time
Note: (1) Please refer to Supply characteristics for the value of V
switched, V (2) Program and Erase operations are controlled by internal stop timers. (3) ‘Typicals’ are not guaranteed, but based on characterization data. Data taken at 25°C, 12.0V VPP. (4) Minimum byte programming time (excluding system overhead) is 16 µs (10 µs program + 6 µs write recovery), while maximum is 400 µs/
byte (16 µs x 25 loops). Max chip programming time is specified lower than the worst case allowed by the programming algorithm since
most bytes program significantly faster than the worst case byte. (5) Excludes 00H Programming prior to Erasure.
(3)(5)
(3)(4)
can be ground, less than VCC + 2.0V or a no connect with a resistor tied to ground.
PPL
0.5 10 0.5 10 0.5 10 0.5 10 sec 1 6.5 1 6.5 1 6.5 1 6.5 sec
PPH
and V
. The VPP supply can be either hardwired or switched. If VPP is
PPL
Doc. No. 25038-0A 2/98 F-1
6
CAT28F102
FUNCTION TABLE
(1)
Mode CE OE WE V
Read V Output Disable V Standby V Signature (MFG) V Signature (Device) V Program/Erase V Write Cycle V Read Cycle V Output Disable V Standby V
Pins
PP
IL IL IH IL IL IL IL IL IL IH
V
IL
V
IH
XXV
V
IL
V
IL
V
IH
V
IH
V
IL
V
IH
XXV
V
IH
V
IH
V
IH
V
IH
V
IL
V
IL
V
IH
V
IH
V
PPL
X High-Z
PPL
V
PPL
X 0051H A0 = VIH, A9 = 12V
V
PPH
V
PPH
V
PPH
V
PPH PPH
I/O Notes
D
OUT
High-Z 0031H A0 = VIL, A9 = 12V
D
D D
OUT
IN IN
See Command Table During Write Cycle
During Write Cycle High-Z During Write Cycle High-Z During Write Cycle
WRITE COMMAND TABLE
Commands are written into the command register in one or two write cycles. The command register can be altered only when VPP is high and the instruction byte is latched on the rising edge of WE. Write cycles also internally latch addresses and data required for programming and erase operations.
Pins
First Bus Cycle Second Bus Cycle
Mode Operation Address D
IN
Set Read Write X XX00H Read A
Operation Address D
IN
IN
D
D
OUT
OUT
Read Sig. (MFG) Write X XX90H Read 0000 0031H Read Sig. (Device) Write X XX90H Read 0001 0051H Erase Write X XX20H Write X XX20H Erase Verify Write A
IN
Program Write X XX40H Write A Program Verify Write X XXC0H Read X D
XXA0H Read X D
IN
D
IN
OUT
OUT
Reset Write X XXFFH Write X XXFFH
Note: (1) Logic Levels: X = Logic ‘Do not care’ (VIH, VIL, V
PPL
, V
PPH
)
7
Doc. No. 25038-0A 2/98 F-1
CAT28F102
READ OPERATIONS
Read Mode
A Read operation is performed with both CE and OE low and with WE high. VPP can be either high or low, however, if VPP is high, the Set READ command has to be sent before reading data (see Write Operations). The data retrieved from the I/O pins reflects the contents of the memory location corresponding to the state of the 16 address pins. The respective timing waveforms for the read operation are shown in Figure 5. Refer to the AC Read characteristics for specific timing parameters.
Signature Mode
The signature mode allows the user to identify the IC manufacturer and the type of device while the device resides in the target system. This mode can be activated in either of two ways; through the conventional method of applying a high voltage (12V) to address pin A9 or by sending an instruction to the command register (see Write Operations).
The conventional mode is entered as a regular READ mode by driving the CE and OE pins low (with WE high), and applying the required high voltage on address pin A while all other address lines are held at VIL.
A Read cycle from address 0000H retrieves the binary code for the IC manufacturer on outputs I/O0 to I/O15:
CATALYST Code = 0000 0000 0011 0001 (0031H)
A Read cycle from address 0001H retrieves the binary code for the device on outputs I/O0 to I/O15.
28F102 Code = 0000 0000 0101 0001 (0051H)
Standby Mode
With CE at a logic-high level, the CAT28F102 is placed in a standby mode where most of the device circuitry is disabled, thereby substantially reducing power con­sumption. The outputs are placed in a high-impedance state.
9
Figure 5. A.C. Timing for Read Operation
POWER UP
ADDRESSES
CE (E)
OE (G)
WE (W)
HIGH-Z
DATA (I/O)
STANDBY DEVICE AND
ADDRESS SELECTION
t
WHGL
t
GLQX
ADDRESS STABLE
t
AVAV
(t
)
OLZ
t
(tLZ)
ELQX
t
(t
AVQV
ACC
OUPUTS
ENABLED
(tRC)
t
GLQV
)
(tOE)
DA T A VALID STANDBY
t
EHQZ(tDF
t
GHQZ
t
(tCE)
ELQV
OUTPUT VALID
t
AXQX(tOH
POWER DOWN
)
(tDF)
)
HIGH-Z
Doc. No. 25038-0A 2/98 F-1
28F102 F05
28F102 Fig. 6
8
CAT28F102
WRITE OPERATIONS
The following operations are initiated by observing the sequence specified in the Write Command Table.
Read Mode
The device can be put into a standard READ mode by initiating a write cycle with XX00H on the data bus. The subsequent read cycles will be performed similar to a standard EPROM or E2PROM Read.
Signature Mode
An alternative method for reading device signature (see Read Operations Signature Mode), is initiated by writing the code XX90H into the command register while keep­ing VPP high. A read cycle from address 0000H with CE and OE low (and WE high) will output the device signa­ture.
CATALYST Code = 0000 0000 0011 0001 (0031H)
Figure 6. A.C. Timing for Erase Operation
A Read cycle from address 0001H retrieves the binary code for the device on outputs I/O0 to I/O7.
28F102 Code = 0000 0000 0101 0001 (0051H)
Erase Mode
During the first Write cycle, the command XX20H is written into the command register. In order to commence the erase operation, the identical command of XX20H has to be written again into the register. This two-step process ensures against accidental erasure of the memory contents. The final erase cycle will be stopped at the rising edge of WE, at which time the Erase Verify command (XXA0H) is sent to the command register. During this cycle, the address to be verified is sent to the address bus and latched when WE goes low. An inte­grated stop timer allows for automatic timing control over this operation, eliminating the need for a maximum erase timing specification. Refer to AC Characteristics (Program/Erase) for specific timing parameters.
VCC POWER-UP
ADDRESSES
CE (E)
OE (G)
WE (W)
DATA (I/O)
V
V
& STANDBY
5.0V
CC
0V
V
PPH
PP
V
PPL
t
GHWL
HIGH-Z
SETUP ERASE
COMMAND
t
WC
t
CS
t
CH
t
WPH
t
WP
t
DS
t
VPEL
DATA IN = XX20H
ERASE
COMMAND
t
WC
t
DH t
DS
ERASING ERASE VERIFY
t
AS
t
CH
t
CS
t
WHWH2
t
WP
t
DH
DATA IN = XX20H
COMMAND
t
WC
t
WP
t
DS
t
AH
DATA IN = XXA0H
ERASE
VERIFICATION
t
RC
t
CH
t
WHGL
t
DH
t
OLZ
OE
t t
LZ CE
t
VCC POWER-DOWN/
VALID
DATA OUT
STANDBY
t
EHQZ
t
DF
t
OH
28F102 Fig. 6
28F102 F06
9
Doc. No. 25038-0A 2/98 F-1
CAT28F102
Figure 7. Chip Erase Algorithm
START ERASURE
APPLY V
PROGRAM ALL
BYTES TO 0000H
PLSCNT = 0
WRITE ERASE
SETUP COMMAND
WRITE ERASE
PPH
INITIALIZE
ADDRESS
INITIALIZE
COMMAND
(1)
BUS
OPERATION
STANDBY
WRITE
WRITE
COMMAND COMMENTS
VPP RAMPS TO V
(OR VPP HARDWIRED)
ALL BYTES SHALL BE
PROGRAMMED TO 00
BEFORE AN ERASE
OPERATION
INITIALIZE ADDRESS
PLSCNT = PULSE COUNT
ERASE
ERASE
DATA = XX20H
DATA = XX20H
PPH
INCREMENT
ADDRESS
TIME OUT 10ms
WRITE ERASE
VERIFY COMMAND
TIME OUT 6µs
READ DATA
FROM DEVICE
DATA =
FFH?
NO
LAST
ADDRESS?
WRITE READ
COMMAND
YES
YES
NO
NO
INC PLSCNT
= 1000 ?
YES
WRITE
READ
STANDBY
WRITE
ERASE
VERIFY
READ
WAIT
ADDRESS = BYTE TO VERIFY
DATA = XXA0H
STOPS ERASE OPERA TION
WAIT
READ BYTE TO
VERIFY ERASURE
COMPARE OUTPUT TO FF
INCREMENT PULSE COUNT
DATA = 0000H
RESETS THE REGISTER
FOR READ OPERATION
APPLY V
COMPLETED
Note: (1) The algorithm MUST BE FOLLOWED to ensure proper and reliable operation of the device.
Doc. No. 25038-0A 2/98 F-1
PPL
ERASURE
APPLY V
ERASE
ERROR
PPL
STANDBY
10
VPP RAMPS TO V
(OR VPP HARDWIRED)
PPL
28F101-07
CAT28F102
ADDRESSES
CE (E)
OE (G)
WE (W)
DATA (I/O)
V
CC
V
PP
t
WC
t
WC
t
RC
t
AS
t
AH
t
CS
t
CH
t
CS
t
CH
t
CH
t
EHQZ
t
DF
t
GHWL
t
WPH
t
WHWH1
t
WHGL
t
WP
t
DS
HIGH-Z
DATA IN = XX 40H
DATA IN
DATA IN = XX C0H
VALID
DATA OUT
t
DH
t
WP
t
DH
t
DS
t
DS
t
WP
t
DH
t
OLZ
t
OE
t
OH
t
LZ
t
CE
t
VPEL
V
PPH
V
PPL
0V
5.0V
VCC POWER-UP
& STANDBY
SETUP PROGRAM
COMMAND
LATCH ADDRESS
& DATA
PROGRAMMING
PROGRAM
VERIFY
COMMAND
PROGRAM
VERIFICATION
VCC POWER-DOWN/
STANDBY
Erase-Verify Mode
The Erase-verify operation is performed on every byte after each erase pulse to verify that the bits have been erased.
Programming Mode
The programming operation is initiated using the pro­gramming algorithm of Figure 9. During the first write cycle, the command XX40H is written into the command register. During the second write cycle, the address of the memory location to be programmed is latched on the falling edge of WE, while the data is latched on the rising edge of WE. The program operation terminates with the next rising edge of WE. An integrated stop timer allows for automatic timing control over this operation, eliminat­ing the need for a maximum program timing specifica­tion. Refer to AC Characteristics (Program/Erase) for specific timing parameters.
Figure 8. A.C. Timing for Programming Operation
Program-Verify Mode
A Program-verify cycle is performed to ensure that all bits have been correctly programmed following each byte programming operation. The specific address is already latched from the write cycle just completed, and stays latched until the verify is completed. The Program­verify operation is initiated by writing XXC0H into the command register. An internal reference generates the necessary high voltages so that the user does not need to modify VCC. Refer to AC Characteristics (Program/ Erase) for specific timing parameters.
11
28F102 F07
Doc. No. 25038-0A 2/98 F-1
CAT28F102
Figure 9. Programming Algorithm
START
PROGRAMMING
APPLY V
PLSCNT = 0
WRITE SETUP
PROG. COMMAND
WRITE PROG. CMD
ADDR AND DAT A
TIME OUT 10µs
PPH
INITIALIZE ADDRESS
(1)
BUS
OPERATION
STANDBY
1ST WRITE
CYCLE
2ND WRITE
CYCLE
COMMAND COMMENTS
VPP RAMPS TO V
(OR VPP HARDWIRED)
INITIALIZE ADDRESS
INITIALIZE PULSE COUNT
PLSCNT = PULSE COUNT
WRITE SETUP
PROGRAM
DATA = XX40H
VALID ADDRESS AND DA T A
WAIT
PPH
INCREMENT
ADDRESS
WRITE PROGRAM
VERIFY COMMAND
TIME OUT 6µs
READ DATA
FROM DEVICE
VERIFY DATA ?
NO
LAST
ADDRESS?
WRITE READ
COMMAND
APPLY V
YES
YES
PPL
NO
INC
PLSCNT
= 25 ?
APPLY V
NO
YES
PPL
1ST WRITE
CYCLE
READ
STANDBY
1ST WRITE
CYCLE
STANDBY
PROGRAM
VERIFY
READ
DATA = XXC0H
WAIT
READ BYTE TO VERIFY
PROGRAMMING
COMPARE DATA OUTPUT
TO DATA EXPECTED
DATA = XX00H
SETS THE REGISTER FOR
READ OPERATION
VPP RAMPS TO V
(OR VPP HARDWIRED)
PPL
PROGRAMMING
COMPLETED
Note: (1) The algorithm MUST BE FOLLOWED to ensure proper and reliable operation of the device.
Doc. No. 25038-0A 2/98 F-1
PROGRAM
ERROR
12
28F101-09
CAT28F102
Abort/Reset
An Abort/Reset command is available to allow the user to safely abort an erase or program sequence. Two consecutive program cycles with XXFFH on the data bus will abort an erase or a program operation. The abort/reset operation can interrupt at any time in a program or erase operation and the device is reset to the Read Mode.
DATA PROTECTION
1. Power Supply Voltage When the power supply voltage (VCC) is less than 2.5V,
the device ignores WE signal.
2. Write Inhibit When CE and OE are terminated to the low level, write
mode is not set.
POWER UP/DOWN PROTECTION
The CAT28F102 offers protection against inadvertent programming during VPP and VCC power transitions. When powering up the device there is no power-on sequencing necessary. In other words, VPP and V
CC
may power up in any order. Additionally VPP may be hardwired to V
independent of the state of VCC and
PPH
any power up/down cycling. The internal command register of the CAT28F102 is reset to the Read Mode on power up.
POWER SUPPLY DECOUPLING
To reduce the effect of transient power supply voltage spikes, it is good practice to use a 0.1µF ceramic capacitor between VCC and VSS and VPP and VSS. These high-frequency capacitors should be placed as close as possible to the device for optimum decoupling.
Figure 10. Alternate A.C. Timing for Program Operation
VCC POWER-UP
& STANDBY
ADDRESSES
WE (E)
OE (G)
CE (W)
DATA (I/O)
V
CC
V
PP
5.0V 0V V
PPH
V
PPL
SETUP PROGRAM
COMMAND
t
GHEL
t
DVEH
HIGH-Z
t
WC
t
EHWH
t
VPEL
t
AVEL
t
WLEL
t
EHEL
DATA IN = XX40H
LATCH ADDRESS
& DATA
t
ELAX
t
WLEL
t
EHDX
DATA IN
PROGRAMMING
t
EHWH
t
WLEL
t
EHEH
t
ELEH
t
t
DVEH
EHDX
PROGRAM
VERIFY
COMMAND
t
ELEH
t
DVEH
t
WC
t
DATA IN = XXC0H
EHWH
t
EHGL
VERIFICATION
t
OE
t
EHDX
t
OLZ
t
LZ
t
CE
PROGRAM
t
RC
DATA OUT
VCC POWER-DOWN/
STANDBY
t
EHQZ
t
DF
t
OH
VALID
28F102 F10
13
Doc. No. 25038-0A 2/98 F-1
CAT28F102
ALTERNATE CE-CONTROLLED WRITES
VCC = +5V ±10%, unless otherwise specified.
28F102-45 28F102-55 28F102-70 28F102-90
JEDEC Standard
VCC = +5V ±5%
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
t
AVAV WC
t
AVEL
t
ELAX
t
DVEH
t
EHDX tDH
t
EHGL
t
AS
t
AH
t
DS
- Write Recovery Time Before 6 6 6 6 µs
Write Cycle Time 45 55 70 90 ns Address Setup Time 0 0 0 0 ns Address Hold Time 30 30 35 40 ns Data Setup Time 30 30 35 40 ns Data Hold Time 10 10 10 10 ns
Read
VCC = +5V ±5%
t
GHEL
- Read Recovery Time Before 0 0 0 0 µs Write
t
WLEL
t
EHWHtWH
t
ELEH
t
EHEL
t
VPEL
t
WS
WE Setup Time Before CE 00 0 0 ns WE Hold Time After CE 00 0 0 ns
t
CP
t
CPH
-V
Write Pulse Width 30 30 35 40 ns Write Pulse Width High 20 20 20 20 ns
Setup Time to CE Low 100 100 100 100 ns
PP
ORDERING INFORMATION
Prefix Device # Suffix
28F102 N
Product Number
Optional Company ID
I
Temperature Range
Blank = Commercial (0˚ - 70˚C) I = Industrial (-40˚ - 85˚C) A = Automotive (-40˚ - 105˚C)*
Package
N: PLCC P: PDIP T14: TSOP T14R: TSOP
-90CA T
Speed
45: 45ns 55: 55ns 70: 70ns 90: 90ns
T
Tape & Reel
T: 500/Reel
*-40o to + 125oC is available upon request
Note: (1) The device used in the above example is a CAT28F102NI-90T (PLCC, Industrial Temperature, 90 ns access time, Tape & Reel).
Doc. No. 25038-0A 2/98 F-1
14
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