Conmed System 5000 Service manual

Service Manual

E L E C T R O S U R G I C A L U N I T

LIMITED WARRANTY

For a period of two years following the date of delivery,

CONMED Corporation warrants the CONMED System

5000™ Electrosurgical Generator against any defects in

material or workmanship and will repair or replace (at

CONMED’s option) the same without charge, provided

that routine maintenance as specified in this manual has

been performed using replacement parts approved by

CONMED. This warranty is void if the product is used in

a manner or for purposes other than intended.

525 French Road

Utica, New York 13502 U.S.A.

U.S. Patent Nos. 4,961,739 - 5,152,762 - 5,626,575-

6,830,569 - 6,835,082 - 6,875,210 - 6,939,347 -

D477,082 - D477,408.

For Technical Service or Return Authorization Phone:

303-699-7600 / 1-800-552-0138 Extension 5274

Fax 303-699-1628

For Customer Service or to order parts phone:

1-800-448-6506 / 315-797-8375 / Fax 315-735-6235

or contact your CONMED Representative.

European Authorized Representative

MDSS GmbH

Schiffgraben 41

D - 30175 Hannover

Germany

The revision level of this manual is specified by the

highest revision letter found on either the inside front cover

or enclosed errata pages (if any).

Manual Number 60-8017-ENG Rev. R 01/08

Unit Serial Number_________________________________

Table of Contents

& List of Illustrations

Section Title Page

3.0 Theory of Operation ................................................................................... 3-1

3.1 Mode Descriptions .................................................................................................. 3-1

3.1.1 Cut Major Modes ..............................................................................................................................3-1

3.1.2 COAG Major Modes .........................................................................................................................

3.1.3 Bipolar Major Modes ........................................................................................................................

3.1.4 Advanced Specialty Modes ................................................................................................................

3.2 System Overview ..................................................................................................... 3-2

3.2.1 High Voltage Power Supply (HVPS) ................................................................................................3-3

3.2.2 RF Amplifier and Transformer ..........................................................................................................

3.2.3 Electrosurgical Outputs .....................................................................................................................3-5

3.2.4 Activation Command Sensing ...........................................................................................................

3.2.5 Automatic Return Monitor (A.R.M.

3.2.6 Low Voltage Power Sources ..............................................................................................................

3.2.7 System Controllers and Monitor .......................................................................................................

3.2.8 Low Voltage Power Monitoring ........................................................................................................

3.2.9 Operator Control Panel .....................................................................................................................

3.2.10 Activation Tones ................................................................................................................................

3.2.11 Activation Relay Connector ...............................................................................................................3-7

™) .............................................................................................3-5

3.3 Optional System Configurations ............................................................................. 3-7

4.0 Maintenance ................................................................................................ 4-1

4.1 General Maintenance Information ........................................................................... 4-1

4.2 Maintenance Personnel ............................................................................................

4.3 Assembly Breakdown/Parts Access .......................................................................... 4-1

4.3.1 Top Cover Removal and Replacement ...............................................................................................4-1

4.3.2 Bezel Removal and Replacement .......................................................................................................

4.3.3 Processor Board Removal and Replacement ......................................................................................4-3

4.3.4 Transformer Board Removal and Replacement ..................................................................................

4.3.5 Output Board Removal and Replacement .........................................................................................

4.3.6 RF Amp Board Removal and Replacement .......................................................................................

4.3.7 Low Voltage Power Supply Module Removal and Replacement ........................................................

4.3.8 High Voltage Power Supply Removal and Replacement ....................................................................

4.3.9 Rear Panel with Board Removal and Replacement ............................................................................

4.3.10 Back Panel Board Removal and Replacement ....................................................................................

4.3.11 Display Boards Removal and Replacement ........................................................................................

4.3.12 Power Transistor Replacement ...........................................................................................................

4.4 Cleaning ................................................................................................................. 4-8

4.5 Periodic Inspection .................................................................................................

4.6 Periodic Performance Testing ............................................................................................................4-9

4.6.1 Chassis Ground Integrity ...................................................................................................................

4.6.2 Displays, Alarms and Commands ......................................................................................................

4.6.3 Output Power ...................................................................................................................................

4.6.4 RF Leakage Measurement ...............................................................................................................

4.6.5 Line Frequency Leakage ..................................................................................................................

4.6.7 Output Coupling Capacitor Check ..................................................................................................

4.7 System Calibration ................................................................................................ 4-14

4.7.1 Calibration Preliminaries .................................................................................................................4-14

4.7.2 Selecting the Mode to Calibrate ......................................................................................................

4.7.3 Calibrating a Monopolar Mode .......................................................................................................

4.7.4 Calibrating Bipolar Modes ..............................................................................................................

3-1 3-2 3-2

3-4

3-5

3-5 3-5 3-6 3-6 3-6

4-1

4-2

4-3 4-4 4-4 4-5 4-6

4-6 4-7 4-7 4-8

4-8

4-9 4-9

4-9 4-10 4-12 4-14

4-16 4-16 4-16

Section Title Page

4.7.5 Calibrating A.R.M.™ ......................................................................................................................4-16

4.7.6 Completing Calibration ...................................................................................................................

4-17

4.8 Last Fault Code Retrieval and Clear ..................................................................... 4-17

4.8.1 Last Fault Code Retrieval ...............................................................................................................4-17

4.8.2 Clearing Last Fault Codes ...............................................................................................................

4-18

4.9 Displaying Optional System Configuration ........................................................... 4-18

4.10 DACview ..............................................................................................................

4.11 Setting the Clock ..................................................................................................

4.12 Troubleshooting ....................................................................................................

4.12.1 HVPS Troubleshooting Hints .........................................................................................................4-23

4-20 4-21 4-21

4.13 Parts Ordering Information .................................................................................. 4-24

4.14 Fault Codes ...........................................................................................................

4-24

Figure/Title Page

Figure 3.1 RF Controller Block Diagram ................................................................................................................3-3

Figure 3.2 System Block Diagram ...........................................................................................................................

Figure 4.1 Calibration Procedure Flow Chart ........................................................................................................

Figure 4.2 DIP Switch Positions ...........................................................................................................................

Figure 4.3 Module Diagram ...................................................................................................................................

Figure 4.4 A12 Back Panel PCB Assembly .............................................................................................................

Figure 4.5 A9 RF Power Supply PCB Assembly ....................................................................................................

Figure 4.6 A7 RF Transformer PCB Assembly .......................................................................................................

Figure 4.7 A6 RF Amplifier PCB Assembly .........................................................................................................

Figure 4.8 A5 RF Output PCB Assembly ............................................................................................................

Figure 4.9 A4 Microcontroller PCB Assembly ......................................................................................................

Figure 4.10 A2 Display Controller PCB Assembly ...............................................................................................

Figure 4.11 A3 Display Light Panel PCB Assembly .............................................................................................

3-4 4-15 4-18

A-1 A-4 A-7

A-9 A-11 A-14 A-19 A-21 A-23

Table 4.1 Monopolar Cut Mode RF Output Power Accuracy .................................................................................

Table 4.2 Monopolar Coag Mode RF Output Power Accuracy .............................................................................

Table 4.3 Bipolar Mode RF Output Power Accuracy ............................................................................................

Table 4.4 Allowable RF Leakage Current to Ground ............................................................................................

Table 4.5 Allowable RF Leakage Current - Inactive Monopolar Outputs ..............................................................

Table 4.6 Allowable RF Leakage Current - Inactive Bipolar Outputs ...................................................................

Table 4.7 Line Frequency Allowable Leakage - Inactive .........................................................................................

Table 4.8 Line Frequency Allowable Leakage - Active ...........................................................................................

Table 4.9 DIP Switch Settings ...............................................................................................................................

Table 4.10 DACview Channels ..............................................................................................................................

Table 4.11 Troubleshooting ...................................................................................................................................

Table 4.12 Fault Codes ..........................................................................................................................................

Schematic 4.1 Interconnect Diagram ......................................................................................................................

Schematic 4.2 A12 Back Panel PCB .......................................................................................................................

Schematic 4.3a A9 RF Power Supply PCB - Power Factor Controller ....................................................................

Schematic 4.3b A9 RF Power Supply PCB - Forward Converter ...........................................................................

Schematic 4.4 A7 RF Transformer PCB .................................................................................................................

Schematic 4.5 A6 RF Amplifier PCB ...................................................................................................................

Schematic 4.6a A5 RF Output PCB - Interconnect & Switching Isolation ...........................................................

Schematic 4.6b A5 RF Output PCB - Relays & Sensing ......................................................................................

Schematic 4.7a A4 Microcontroller PCB - Controller Interconnect ......................................................................

Schematic 4.7b A4 Microcontroller PCB - Microcontroller ..................................................................................

Schematic 4.7c A4 Microcontroller PCB - RF Controller .....................................................................................

Schematic 4.7d A4 Microcontroller PCB - RF Monitor .......................................................................................

Schematic 4.8 A2 Display Controller PCB ...........................................................................................................

Schematic 4.9 A3 Display Light Panel PCB .........................................................................................................

4-9 4-10 4-10 4-11 4-12 4-12 4-12 4-13 4-19 4-20 4-21 4-25

A-2 A-3 A-5 A-6

A-8 A-10 A-12 A-13 A-15 A-16 A-17 A-18 A-20 A-22

Theory of Operation

Section 3.0

System 5000™ functions and essential circuit information are provided in this section. This section begins with a description of the key parameters for each mode. This is followed by an overview of how the system functions and some key operational information for the modules within the system.

3.1 Mode Descriptions

The key functional parameters for each mode are presented here. Nominal mode specifications are provided in section 1.2.11.

3.1.1 Cut Major Modes

Major mode

CUT PURE 391 KHz None None

Minor Mode

BLEND 1 391 KHz 16 pulses

BLEND 2 391 KHz 11 pulses

BLEND 3 391 KHz 10 pulses

Activation of Pulse Cut will make the selected cut mode, Pure Cut, Blend 1, Blend 2, or Blend 3 active for 70 milliseconds every 600 milliseconds.

NOTE: The low duty cycle of Pulsed Cut mode makes the average power very low – about 12%– when compared with the power displayed on the

RF frequency Modulation: Number of

Pulses, Time on/off

40µs/10µs

28µs/23µs

26µs/24µs

front panel. The period is also long causing most ESU analyzers to provide erratic or erroneous readings. Correct power can be verified by mea suring the peak to peak current and comparing the value with the current measured in the non-pulsed mode.

Modulation: Frequency & period

20 KHz

50µs

20 KHz

50µs

20 KHz

50µs

3.1.2 COAG Major Modes

Major mode

COAG PINPOINT 391 KHz 4 pulses

Minor Mode RF frequency Modulation: Number

of Pulses, Time on/off

10µs/40µs

STANDARD 562 KHz Single pulse 39 KHz

SPRAY 562 KHz Single pulse 19 KHz

Modulation: Frequency & period

20 KHz

50µs

Activation of Pulse Coag will make the selected coag mode, either Standard or Spray, active for

2.5 milliseconds every 5 milliseconds. Displayed power setting will represent the average power being delivered which is approximately half the power delivered during the pulses.

Standard and Spray Coag modes are fundamental ly different from the Cut modes in that the reso

nant circuit of the RF Amplifier and Transformer combination is excited by the energy of a single pulse, causing the resonant circuit to ring until the energy is dissipated. Circuitry in the amplifier

3-1

provides further damping to dissipate the energy more quickly to minimize RF leakage effects. Spray Coag provides the maximum open circuit voltage for which the system is rated.

3.1.3 Bipolar Major Modes

Major mode

BIPOLAR MACRO 391 KHz None None

Minor Mode

MICRO 391 KHz None None

RF fre quency

Modulation: Number of

Pulses, Time on/off

Modulation: Frequency & period

3.1.4 Advanced Specialty Modes

Specialty Mode Effect

General Normal open surgery mode – Parameters noted above.

Fluids Temporarily increases power upon activation for faster initiation. Duration and power increase

vary with mode and power setting

Lap Limits maximum peak voltage for safer laparoscopic surgery. This action does affect the load

curves when in high impedance tissue, or using normally high voltage modes.

3.2 System Overview

Mains power is converted to electrosurgical output power through the High Voltage Power Supply (HVPS), the RF Amplifier, and the Transformer and Output sections of the system.

Mains power is converted to high voltage direct current power in the HVPS to supply the RF Amplifier. This universal input power factor cor rected, single output, switch mode power supply is adjustable under software control with 10-bit resolution. The HVPS output and power factor correction sections of the HVPS can be enabled or disabled under software control. The HVPS uses a current mode two-switch forward converter topology with short circuit protection and over voltage limiting.

Pulses generated in the RF Controller are ampli fied to electrosurgical power and voltage levels in the RF Amplifier and Transformer portions of the power train. The RF Amplifier and Transformer form a resonant switched mode amplifier with multiple outputs that are selected on a mode-bymode basis using relays on the primary and sec ondary side of the transformers. One transformer is used for monopolar outputs, while the other transformer is for the bipolar output.

Electrosurgical power flows from the RF Amplifier and Transformer sections to the Output section where the power is switched to the specific electrosurgical outputs. The Output section also has circuitry to detect activations from accessories

and the circuitry to perform the Automatic Return Monitor (A.R.M.™) function to ensure the integ rity of the dispersive electrode connection.

The power section also includes a number of out put voltage and current sensors that are used by the RF Controller for control of power delivery and by the Monitor to detect errant output condi tions.

The RF Controller is a Digital Signal Processor (DSP) that generates an RF Amplifier drive sig nal based upon measured parameters compared with settings-based parameters. The pulse train sequence is a settings-based parameter that is dependent on the selected mode. Target power, current limit, voltage limit, and impedance thresh olds are all settings-based parameters derived from a load curve that is specific to the front panel power setting. The RF Controller samples electrosurgical output voltage and output cur rent from sensors over 450,000 times per second and uses these sampled values to calculate output power and sensed impedance. The output power, output current, output voltage, and sensed imped ance are compared with corresponding settingsbased parameters of target power, current limit, voltage limit, and impedance threshold; respec tively; and the RF Controller adjusts the width of individual pulses within each mode-based pulse train sequence in a closed-loop fashion to control corresponding output power. The RF Controller also adjusts the HVPS output more slowly, allow ing adjustment of the RF Amplifier drive pulses

3-2

Voltage

sampled

450,000

times per

second

Current

sampled

450,000

times per

second

Power

setting –

watts

displayed

on the front

panel

Calculate measured resistance

Calculate measured

power

Compare

Desired

Power

Measured

Power

Adjust output

waveform

(power)

Patient

100

120

140

160

180

200

0 500 1000 1500 2000

180

Figure 3.1 RF Controller Block Diagram

to optimize the electrosurgical output waveform. Finally, the RF Controller minimizes RF leakage currents using the CONMED Leakage Abatement System (CLAS™), which imposes a duty cycle on the electrosurgical output when sensed impedance and output voltage exceed settings-based imped

ance thresholds and voltage limits in the Coag modes.

The RF Monitor is also a DSP, but it is used to monitor the system for a variety of conditions that could lead to safety problems, including:

• The Monitor has independent sensors for out put voltage and current, which it uses to cal

culate power for comparison with the power that the RF Controller senses and for com

parison with the generator power setting.

• To ensure that the correct outputs are acti

vated, the Monitor also independently senses current at each of the outputs, look

ing for current flow that would indicate electrosurgical power at outputs other than the selected output.

• The Monitor senses the voltage at the output of the HVPS to ensure that it is reasonable for the power setting.

• The Monitor senses the audio output to ensure that a tone occurs whenever electrosurgical outputs are active.

• The RF Amplifier drive signal is sensed by the Monitor to detect improper frequencies or improper pulse sequences for the selected mode.

• The Monitor independently compares the activation signal with that seen by the System Controller to ensure that the activation signal is consistent.

The Monitor has the capability to independently disable the electrosurgical output if a problem is detected.

The System Controller provides the primary con trol interface to the user and other outside sys tems, including the serial interface, the activation relay, tone generation, and displays.

Finally, the Display accepts all user input and provides all user feedback. The Display is controlled by the System Controller through a serial interface and illuminates the LED display elements in a time division multiplexed fashion; the illuminated LED display elements are actually on less than half the time. The Display also provides for user input through the buttons on the control panel, includ ing switch de-bouncing and conditioning.

Figure 3.2 illustrates the key elements of the sys tem in block diagram form.

3.2.1 High Voltage Power Supply (HVPS)

The HVPS is comprised of a Power Factor Control (PFC) section and a Forward Converter (FC) section. The PFC converts Mains power to approximately 400 volts using techniques that ensure the mains current into the supply is sinusoidal and in phase with the mains voltage. By doing so, RMS current and harmonic distor tion are reduced. The Forward Converter then

3-3

Real Time Clock (5K)

Indicators:

Power, Mode,

& bipolar

current

Displays

Keyboard

Modes / Power

Activation

Request

System

Controller

RF Controller

RF Monitor

RF Amp

RF Output

Board

HV Power

Supply

Bip

Mon

RFHVSup

MRF H1 SN MRF H2 SN MRF FT SN

MRF BP ISN

MRF BP VSN

MRF MP ISN

MRF MP VSN

M HVDC

/HV EN

Tone

Mon

WF EN

WFORM

DAMP CNTL

RLY DRV

RF BP IS

RF BP VS

RF MP IS

RF MP VS

HV SET

PFC EN

BIP TONE

ACT TONE

AL TONE

RS232

ACT RLY

Serial Interface

Connector

Activation Relay

Connector

Host

Bus

SPI

Patient

RF INH

Mon

Transformer

Board

VARM

Figure 3.2 System Block Diagram

converts the PFC output to an adjustable DC voltage for use by the RF amplifier.

The System Controller can enable or disable the PFC section of the HVPS. The PFC is normally enabled during operation to ensure a resistive load is presented to the Mains.

The Forward Converter is a switch-mode power converter that adjusts its operating frequency between 25KHz and 100KHz to ensure proper resolution for the commanded output volt age. Isolation between Mains power and the

3-4

HVPS output occurs in the Forward Converter. Forward Converter output voltage is set from the RF Controller by the /HVSET signal. The RF Monitor enables the output of the HVPS. The forward converter includes current limiting on the output and has provisions to shutdown when the output of the Low Voltage Supply exceeds limits.

3.2.2 RF Amplifier and Transformer

The RF Amplifier and Transformer portions use a switch-mode resonant amplifier to convert the power from the HVPS to the RF energy neces

sary for electrosurgery. One may think of the amplifier as a high-speed switch that pulses cur rent through a resonant circuit, which is formed by the monopolar or bipolar transformer together with capacitors and inductors connected to the transformer primary and secondary windings. Two Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) are connected in a paral lel fashion provide the switching. The pulses to drive the gates on the MOSFETs in this arrange ment come from the RF Controller. Adjusting the width of the drive pulses regulates the output power in this arrangement; as the pulses become longer, the output power increases. As noted in the RF Controller discussion, the RF Controller compares the output power with the desired power and adjusts the pulse width to minimize the difference.

A drive of several pulses at a frequency that closely matches the resonant frequency of the amplifier characterize Cut, Blend, and Pinpoint modes, and the output pulses substantially correspond to the drive. Spray and Standard Coag modes, how ever, are characterized by pulses that occur less frequently where the amplifier is allowed to “ring” at its resonant frequency. A damping capability is provided to enhance the surgical effect by damp ing the ringing effect for each drive pulse.

Because the transformer windings and the reso nant frequencies between the cut and coag modes are different, a method of selecting resonating components is implemented using relays. These relays switch in the relevant components for the selected mode based upon commands from the System Controller.

A Balun transformer is provided for the monopolar modes to reduce differences between the source and return currents, thus reducing RF leakage.

Finally, the RF Amplifier and Transformer provide capabilities for sensing RF output current and voltage. These are transformer-isolated representations of the current flowing in the leads and the voltage across the output, which are supplied to the RF Controller and the Monitor processors.

3.2.3 Electrosurgical Outputs

Relays are provided to isolate electrosurgical out puts and select which outputs are active. The System Controller selects the appropriate output relays based upon activation command inputs.

The Monitor utilizes sensors implemented on each electrosurgical output to determine whether cur rent is flowing only to the correct outputs. In the event that current flows in an output that is not selected, the Monitor can independently disable RF.

The System 5000™ output panel connectors are illuminated to aid visibility in low lighting situ ations. This illumination is provided by a single LED on the display board that is distributed to the receptacles through a fiber-optic bundle.

3.2.4 Activation Command Sensing

Each of the Hand Controlled Accessory recep tacles incorporate inputs that are used to sense an activation command from the user. Each monopolar hand controlled accessory receptacle has an input for cut and an input for coag. The bipolar receptacle incorporates a single activation input. Each of these five inputs is isolated from the other electrosurgical outputs and from other low-level circuitry in the system. All are powered by a multiple output isolated power supply. The footswitch activation inputs on the back panel are configured in a similar way and share one of the isolated power supply outputs.

3.2.5 Automatic Return Monitor (A.R.M.™)

The patient return connector interfaces to single and dual dispersive electrodes using a two-pin connector. A.R.M.™ circuitry uses an actively driven impedance measurement circuit, which allows the System Controller to detect the type of dispersive electrode connected and verify its integrity.

3.2.6 Low Voltage Power Sources

The low voltage power supply is a medical-grade universal input offline triple output switching power supply. The power supply is active anytime Mains power is connected to the unit with the Mains power switch turned on.

3.2.7 System Controllers and Monitor

Three processors are used for system interface & control, RF control, and system monitor func tions. The ESU control section consists of dual channel architecture with two independent chan nels where one is used exclusively for RF output control and the other is used for safety monitor ing. All three of these processors are located on

3-5

the Control board, along with circuitry to isolate them from RF noise.

• System Controller (System Microcontroller): A dedicated microcontroller that handles the entire user interface, Serial Interface, real time clock functions, and enables/disables the power factor control section of the HVPS using the PFC_EN signal. The System Controller can also disable the signal used to drive the RF Amplifier and can terminate RF drive at any time without interaction from either the RF Controller or the Monitor. The System Controller is comprised of an standard architecture microprocessor together with Field Programmable Gate Array (FPGA), which provides interface logic to a variety of signals, a 3.68MHz oscillator, independent voltage regulators, a processor supervisory reset circuit, and other interface logic.

• RF Controller: A DSP that is dedicated to the output and control of RF power using the DAMPCNTRL and RF_DRV outputs. To reduce the effects on the microproces sor circuits on the Controller board from RF noise at the output, DAMPCNTRL and RF_DRV are both differential mode signals running between the RF Controller and the RF Amplifier. The RF Controller is capable of disabling RF output power and put ting the system into a safe state without any interaction from the Monitor or the System Controller. The RF Controller indepen dently monitors the RF output voltage and current for control purposes through several scaled inputs. It sets the output voltage of the HVPS using the HV_SET signal dependent on the output Mode and power selected. The RF Controller controls the fan based upon temperature measurements supplied from the RF Amplifier through the System Controller. The RF Controller is comprised of a DSP, together with circuitry necessary for convert ing the signals used for control purposes between analog and digital form, independent voltage regulators, and other interface logic.

• RF Monitor: A DSP that is dedicated to safety monitoring activities. The Monitor is capable of disabling RF output power and putting the system into a safe state without any interac tion from the RF Controller or the System Controller. To ensure that the Monitor can correctly perform its function, the Monitor is

resistively isolated from the other two proces sors and has independent voltage regulation. The RF Monitor independently monitors a variety of inputs to detect safety problems and has control of disable signals for both the HVPS and RF Amplifier drive. The Monitor is comprised of the same DSP as the RF Controller, together with circuitry necessary for converting the signals monitored between analog and digital form, an FPGA to provide interface logic, independent voltage regula tors, isolation resistors and other interface logic.

3.2.8 Low Voltage Power Monitoring

The low voltage power supply is monitored in hardware and resets the processors if it is out of range. The microprocessor supervisory device on the Controller board monitors +5V and +3.3V and will reset the system should the levels drop approximately 0.3V. The Controller assembly has the circuit that will reset the system should the 3.3V supply exceed 3.6V. The High Voltage power supply has a circuit that will inhibit HVDC should the +5V supply exceed 5.7V.

3.2.9 Operator Control Panel

Keyboard: The main operator input device for choosing operating modes and settings is the membrane keyboard panel. Tactile-feedback mechanical switches allow the operator to set modes and adjust power settings.

Display Panel: Consists of 7-segment displays, discrete dual colored LED’s, and light bars that will display all controls and settings. LED display elements are illuminated in a time division multi plexed fashion; the illuminated LED display ele ments are actually on less than half the time.

Bipolar Current Meter: The System 5000™ has a bargraph display that provides an indication of measured bipolar impedance. A special

tone works in conjunction with this bargraph to indicate when the measured bipolar impedance exceeds a particular limit.

3.2.10 Activation Tones

Tone is generated for all activation requests, fault detection and changes made on the Control Panel. The System Controller generates the tone signal (ACT_TONE, AL_TONE, & BP_TONE), which is amplified by a driver on the Backpanel PCB Assembly. The activation tone and bipolar tone

3-6

are individually adjustable, but alarm tones are not adjustable and are set to generate tone greater than 65 dB.

Circuitry on the Backpanel PCB permits the Monitor to verify the oscillation from voltage measured across the speaker, which provides confirmation that the speaker is indeed generat ing audible tones during activation. RF output is inhibited should the speaker drive current be absent or too low.

3.2.11 Activation Relay Connector

There is an Accessory Relay Connector, which provides a relay closure (SPST switch) that may be used for activating external accessories such as smoke evacuation units.

3.3 Optional System Configurations

An eight-position configuration dipswitch (S2), located on the Controller PCB Assembly (A4) allows a qualified service technician to change some of the factory default settings. With the exception of the DACview switch, the configura tion dipswitch settings are only detected when power is initialized, so any changes to the switch positions must be made with the main power off. Each switch is OFF in the Down position and ON in the UP position. The system detects changes in the DACview switch while power is on, so it is treated differently. Relevant informa tion for the configuration dipswitches appears in Section 4.9.

3-7

This page has been intentionally left blank.

3-8

Maintenance

Section 4.0

This section contains information useful in the maintenance and repair of the System 5000™.

WARNING: High voltages are present at the connections and within the System 5000™. Maintenance personnel should take precautions to protect themselves. Read the safety sum mary in Section 1.1.4 before working on the ESU.

4.1 General Maintenance Information

Although the System 5000™ has been designed and manufactured to high industry standards, it is recommended that periodic inspection and perfor mance testing be performed to ensure continual safe and effective operation.

Ease of maintenance was a primary consideration in the design of the System 5000™. Maintenance features of this unit include microprocessor aided troubleshooting aids and push button calibration, built in fault detection, circuit protection, and easy access to circuitry while the unit is operational. These features, coupled with the warranty, local support, loaner equipment, factory support, toll free phone service to the factory and available fac tory training ensure the user of a minimal mainte nance effort with extensive support available.

4.3.1 Top Cover Removal and Replacement

Top Removal:

1) Remove the two screws located on rear of unit as shown.

2) Pull back and up to remove top.

Cover Screws

4.2 Maintenance Personnel

Only qualified biomedical engineers should perform service on the System 5000™. Refer all servicing to a qualified biomedical engineer. If necessary, your CONMED sales representative will be happy to assist you in getting your equipment serviced.

4.3 Assembly Breakdown/Parts Access

CAUTION: This device contains components that can be damaged by static electricity. Proper handling by grounding of personnel during servicing is mandatory.

Following are instructions for unit disassembly and reassembly instructions.

Side Clips

4-1

Top Replacement:

1) Place top approximately ¾” from front bezel on top of unit.

2) Press forward, aligning lip of front bezel with groove in top and side clips with tabs on cast ing.

3) Re-install screws.

3) Unlatch display ribbon cable, dispersive electrode connector, ReadiPlug™ cable connector and two ground connectors.

4) In most situations, it is not necessary to

remove the four power switch connectors. The bezel can be rotated off to the right side for output board removal. To fully remove the bezel, these connectors must be disconnected.

Slide top forward.

4.3.2 Bezel Removal and Replacement

Bezel Removal

1) Remove Top.

2) Remove two flat-head screws on side of bezel and two pan-head screws on bottom of bezel.

AC Power Switch

White

Blue

Black

Brown

Bezel Replacement:

1) Connect power switch connectors as shown, if required.

2) Connect dispersive electrode connector and ReadiPlug

™ cable connector prior to sliding

bezel into place.

3) Slide bezel into unit. As shown in figure, the output board insulator is positioned between the sheet metal base and the Output Board.

4-2

Insulating Sheet

4) Reconnect cables and replace and tighten screws.

Spring contacts are exposed and can be deformed, causing erratic operation. Handle with care.

4.3.3 Processor Board Removal and Replacement

Processor Board Removal

1) Remove Top.

2) Loosen the two screws holding the board to slots in the brackets.

3) Unlatch the ribbon cable going to the display.

4) Pull board up and out of unit.

Processor Board Replacement:

1) Align board into the two slots of the brackets attached to the heatsinks. Align with con

nector on Output Board and press firmly to engage it fully. Tighten the two screws.

4.3.4 Transformer Board Removal and Replacement

3) Unlatch the ribbon cable and power cable on the top of the board.

4) Pull board towards inside of unit so screws line up with keyholes, then up and out of unit. The power cable to RF Amp must be unplugged to completely remove transformer board.

Transformer Board Replacement

1) Reverse board removal operation.

NOTE: When servicing unit, board can be sup ported in heatsink as shown. This will provide access to the lower boards while the unit is func tional.

Transformer Board Removal

1) Remove Top.

2) Loosen the two screws mounting the board to the keyhole slots on standoffs and two screws mounting the board to the heatsink.

Align slot in board with rib on heatsink.

Route cable through slot.

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4.3.5 Output Board Removal and Replacement

4.3.6 RF Amp Board Removal and Replacement

Output Board Removal

1) Remove Top, Bezel and Processor Board.

Note: It is not necessary to remove power switch connections from the bezel.

2) Remove the seven cables along the rear side of the board and the three screws shown.

Spring contacts are exposed and can be deformed, causing erratic operation. Handle with care.

Output Board Replacement:

1) Prior to replacing board, assure that the insu lator sheet is positioned properly as shown.

RF Amp Board Removal

1) Remove Top, Bezel and Transformer Board.

2) Remove the four screws that attach the heatsink to the sheet metal chassis. One for the handle, one on the back panel, and two below the heatsink. Remove the two screws that attach the board to the sheet metal chassis as shown. Note: These screws are in holes, not slots.

3) Unlatch three cables – two cables from the RF Output Board and a cable from the RF Power Supply Board.

4) Loosen the smaller hex standoff.

5) Slide RF Amp Board with heatsink off the base as shown.

Note: The insulator sheet provides an important dielectric barrier. For safe operation, position over center standoff as shown.

2) Replace board on standoffs.

3) Route cables as they were prior to removal and connect them back to their proper con nectors.

4) Replace and tighten the three screws.

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RF Amp Board Replacement:

1) Slide board with heatsink back into its previ

ous position on the sheet metal chassis. The heatsink has two pins that align into holes on the sheet metal chassis.

2) Tighten hex standoff onto board. It provides an electrical ground to Transformer Board.

3) Reinstall and tighten the six screws and latch the three cables.

4.3.7 Low Voltage Power Supply Module Removal and Replacement

NOTE: This module is not user serviceable at the component level. If faulty, the entire cir

cuit board must be replaced. Replacements are available from CONMED Customer Service. Do not discard the module cover, mount

ing plate and hardware; the replacement part includes only the circuit board.

Low Voltage Power Supply Module Removal:

1) Remove Top Cover.

2) Loosen four screws located in slots and unlatch the two cables.

3) Slide Low Voltage Power Supply Module inward off the slots, then upward to remove.

Circuit Board

4) Remove the cover by removing four screws. Then remove the four standoffs to separate the Low Voltage Power Supply from its mounting plate.

NOTE: When servicing unit, board can be held in heatsink as shown. This will provide access to the lower boards while the unit is functioning.

Low Voltage Power Supply Module Replacement:

1) Replace Low Voltage Power Supply on mounting plate, fasten standoffs, replace cover and tighten screws.

2) Place Low Voltage Power Supply Module into unit on standoffs. Tighten the loose screws and latch the two connectors.

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4.3.8 High Voltage Power Supply Removal and Replacement

High Voltage Power Supply Board Removal

1) Remove Top Cover. Position Transformer Board in its servicing position to gain access to screws. If desired, remove the Low Voltage Power Supply.

2) Unlatch the Mains Power Cable, RF Amp Cable, and Output Board Ribbon Cable.

3) Loosen the two screws holding the edge of the board to the chassis.

4) Remove the screw to the handle, the screw to the back panel, the two screws on the bottom of the heatsink and slide out the heatsink with the board attached.

Note: Observe the position of the insulating sheet under the High Voltage Power Supply. If the insulating sheet is removed, replace it as shown. It is important to maintain its function as a dielectric barrier and to protect the ribbon cable from the leads of the High Voltage Power Supply Board.

Insulating Sheet

4.3.9 Rear Panel with Board Removal and Replacement

High Voltage Power Supply Board Replacement:

1) Slide board with heatsink back into its previ ous position on the sheet metal chassis. The heatsink has two pins that align into holes on the sheet metal chassis.

2) Reinstall and tighten the six screws and latch the three cables.

Rear Panel with Back Panel Board Removal

1) Remove Top Cover.

2) Unlatch the Ribbon Cable.

3) Remove the four screws on the bottom of the Rear Panel, and the three screws shown on the Rear Panel.

4) Slide the Rear Panel with Back Panel Board back toward the handle and then down to remove.

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Rear Panel with Back Panel Board Replacement:

1) Slide Rear Panel with Back Panel Board back into place on the unit.

2) Reinstall and tighten the seven screws and latch the ribbon cable.

4.3.10 Back Panel Board Removal and Replacement

Back Panel Board Removal

1) Remove Top Cover and Rear Panel.

2) Unlatch the Activation Relay and Fan connectors.

3) Remove the four screws for the foot switch connectors, the two nuts on the volume potentiometers and the two screws to the rear panel sheet metal standoffs. This will free the Back Panel Board from the Rear Panel.

Back Panel Board Replacement:

1) Install Back Panel Board to Rear Panel

2) Reinstall and tighten the six screws, two nuts. Latch the RSA and fan cables.

7) Remove the Display Controller Board by separating it from the display board and pulling it off the studs. There are two 40-pin connec tors between these boards that may require separation by prying with a blunt object.

8) Remove the five hex standoffs and pull the Display board off the studs.

Display Boards Replacement

Caution: When reinstalling Boards and display shield, take care to route fiber optic cable as shown to avoid crimping it between the bezel and display shield.

4.3.11 Display Boards Removal and Replacement

Display Boards Removal

1) Remove the Top Cover and Bezel.

2) Remove 8 nuts and two ground cables on the back of the display shield.

3) Disconnect the ribbon cable and remove the sheet metal display shield.

4) Slide the round spacers off their studs.

5) Disconnect the flex circuit connector. Caution: The flex circuit has a short service loop and is fragile; handle with care.

6) Pull to disconnect the fiber optic cable from LED. Caution: The fiber optic cable is frag ile; handle with care.

1) Reinstall boards in the reverse order described above. Latch the flex circuit connector, press fiber optic cable onto the LED and press the Display Controller Board firmly into place on the two 40 pin connectors.

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4.3.12 Power Transistor Replacement

Caution: This device contains components that can be damaged by static electricity. Proper handling by grounding of personnel during servicing is mandatory.

All RF Power Supply and RF Amp components mounted to the heatsink may be replaced.

only components supplied by CONMED.

Follow these instructions for replacement:

1) No thermal compound is necessary, but the mating surfaces of the transistor, insulator pad and surface of casting should be clean. Always replace the insulator pad associated with the transistor. Always fasten or clamp the part to the heat sink surface prior to sol dering it to the board. This will assure good thermal contact is maintained.

2) In order to maintain alignment with the heat sink surface, the leads of these parts have been bent to the proper shape. They should be purchased from CONMED with bent leads.

3) When installing the RF Amp transistors or diodes, be sure to orient the Bellville washer as shown with the convex surface next to the head of the screw. Tighten screws to 5-7 inch pounds.

Use

4) When installing the RF Power Supply transistors or diodes, replace components as shown and ensure the insulating tube is installed over the clip. Locate the part on the clip so that the bend of the clip is approximately centered on the body of the part as shown. Tighten screw to 8-10 in-lbs. When tightening screw, hold the clip to prevent it from rotating. Clamp the part to the heatsink surface prior to soldering to the board.

4.4 Cleaning

The interior of the unit may be vacuumed or blown out as required. The exterior of the unit may be cleaned by wiping it with a cloth that has been dampened (not dripping) with a mild detergent such as Windex® or Formula 409®. Windex® is a registered trademark of the S.C. Johnson Company. Formula 409® is a registered trademark of the Clorox Company.

4.5 Periodic Inspection

The System 5000™ should be visually inspected at least every six months. This inspection should include checks for the following:

1) Damage to the power cord and plug.

2) The proper mating and absence of damage to the accessory connectors.

3) Any obvious external or internal damage to the unit.

4) An accumulation of lint or debris within the unit or heatsink.

5) Control Panel cuts, punctures, or dents.

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4.6 Periodic Performance Testing

4.6.3 Output Power

The System 5000™ should be tested for correct performance at least once every year. Every unit is supplied with a serialized Production Test Data Sheet that tabulates the results of the factory tests that were performed on the unit. This data is supplied so that it may be used as a reference for subsequent tests. Recommended periodic perfor

mance tests are listed in the following sections.

4.6.1 Chassis Ground Integrity

Connect a standard ohmmeter between the earth ground prong on the power plug and the Equipotential Ground Connection. Compensate for lead resistance. Confirm less than 0.2 ohms resistance is measured.

4.6.2 Displays, Alarms and Commands

Perform the Preliminary Functional Test procedure described in section 2.3.1 of this manual to verify proper operation of displays, alarms and com

mands.

1) Equipment Requirements:

a) Monopolar Footswitch

b) Bipolar Footswitch

c) Commercial ESU Tester (e.g. Dynatech

454A or equivalent) with 50 and 300 ohm loads for bipolar modes and a 500 ohm load for monopolar modes.

Note: Micro Bipolar is particularly sensitive to the load resistance. A 50 ohm load should be used for checking power to obtain the best results.

2) Use test leads to connect the ESU tester to the unit’s return electrode output and the footswitch controlled active output. Set the Load resistance per mode as indicated in Tables 4.1 and 4.2.

3) Perform the monopolar power tests indicated in Tables 4.1 and 4.2. The acceptance range is given in both Watts and Amps to accom modate available test equipment. It is not nec essary to test for both power and current.

Table 4.1 Monopolar Cut Mode RF Output Power Accuracy

Mode Load (ohms) Power Setting Watts (min) Watts (max) Amps (min) Amps (max)

Pure 500 10 7 13.0 0.118 0.161

Standard

Blend 1 500 10 7 13.0 0.118 0.161

Blend 2 500 10 7 13.0 0.118 0.161

Blend 3 500 10 7 13.0 0.118 0.161

500 20 17 23.0 0.184 0.214

500 50 45 55 0.300 0.332

500 100 90 110 0.424 0.469

500 200 180 220 0.600 0.663

500 300 270 330 0.735 0.812

500 20 17 23.0 0.184 0.214

500 50 45 55 0.300 0.332

500 100 90 110 0.424 0.469

500 200 180 220 0.600 0.663

500 20 17 23.0 0.184 0.214

500 50 45 55 0.300 0.332

500 100 90 110 0.424 0.469

500 200 180 220 0.600 0.663

500 20 17 23.0 0.184 0.214

500 50 45 55 0.300 0.332

500 100 90 110 0.424 0.469

500 200 180 220 0.600 0.663

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Table 4.2 Monopolar Coag Mode RF Output Power Accuracy

Mode Load (ohms) Power Setting Watts (min) Watts (max) Amps (min) Amps (max)

Spray 500 10 7 13.0 0.118 0.161

500 20 17 23.0 0.184 0.214

500 50 45 55 0.300 0.332

500 80 72 88 0.379 0.420

Standard

500 10 7 13.0 0.118 0.161

500 20 17 23.0 0.184 0.214

500 50 45 55 0.300 0.332

500 100 90 110 0.424 0.469

500 120 108 132 0.465 0.514

Mode Load (ohms) Power Setting Watts (min) Watts (max) Amps (min) Amps (max)

Pinpoint 500 10 7 13.0 0.118 0.161

500 20 17 23.0 0.184 0.214

500 50 45 55 0.300 0.332

500 100 90 110 0.424 0.469

500 120 108 132 0.465 0.514

Standard pulse

Spray pulse

500 10 7 13.0 0.118 0.161

500 20 17 23 0.184 0.214

500 60 54 66 0.329 0.363

500 10 7 13.0 0.118 0.161

500 20 17 23 0.184 0.214

500 40 36 44 0.268 0.297

4) Disconnect the ESU tester from the unit.

5) Use test leads to connect the ESU tester to the Bipolar Accessory outputs.

6) Perform the bipolar power tests indicated in Table 4.3. This table only provides the mini mum number of points to be tested.

Table 4.3 Bipolar Mode RF Output Power Accuracy

Mode Load (ohms) Power Setting Watts (min) Watts (max) Amps (min) Amps (max)

Macro Bipolar

Micro Bipolar

4.6.4 RF Leakage Measurement

RF Leakage can present a hazard in the operating room because electrosurgical currents can flow to the patient and operating room staff through unintended paths, which can cause injury. RF

300 10 7 13.0 0.153 0.208

300 20 17 23.0 0.238 0.277

300 50 45 55 0.387 0.428

300 90 81 99 0.520 0.574

50 10 7 13.0 0.374 0.510

50 25 22 28.0 0.663 0.748

50 50 45 55 0.949 1.049

leakage occurs because the total energy in the output voltage waveform is provided with a con ductive path through stray parasitic capacitance distributed within the generator and along the length of the leads. Table 4.4 presents the allowed RF leakage currents to ground.

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