Compaq MSB900L, MSB900 User Manual

Detailed Technical USER MANUAL FOR:

3.5”-SBC

MSB900/L

Nordstrasse 11/F CH- 4542 Luterbach Tel.: ++41 (0)32 681 58 00 Fax: ++41 (0)32 681 58 01 Email: support@digitallogic.com Homepage:

http://www.digitallogic.com

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

For internal use only:

File: MSB900_Detailed_V1.0 Path: R:\HANDBUCH\MSB\MSB900\MSB900_Detailed_V1.0.doc

This publication is protected by copyright and all rights are reserved. No part of this document may be reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic, mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.

The software described herein, together with this document, are furnished under a license agreement and may be used or copied only in accordance with the terms of that agreement.

About this Manual and How to Use It

This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board, and describes the system and setup requirements. This document contains information on hardware requirements, interconnections, and details of how to program the system. Please check the Product CD for further information and manuals.

REVISION HISTORY:

Document Version

V1.0 02.2008 DAR Initial document

Date/Initials:

Modification: Remarks, News, Attention:

Attention!

1. All information in this manual, and the product, are subject to change without prior notice.

2. Read this manual prior to installation of the product.

3. Read the security information carefully prior to installation of the product.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

Table of Contents

1. Preface.......................................................................................................................5

1.1. Trademarks ................................................................................................................... 5

1.2. Disclaimer ..................................................................................................................... 5

1.3. Environmental Protection Statement .......................................................................... 5

1.4. Who should use this Product....................................................................................... 5

1.5. Recycling Information .................................................................................................. 6

1.6. Technical Support......................................................................................................... 6

1.7. Limited Two Year Warranty.......................................................................................... 6

1.8. Explanation of Symbols ............................................................................................... 7

1.9. Applicable Documents and Standards........................................................................ 8

1.10. For Your Safety ............................................................................................................. 9

1.11. RoHS Commitment ....................................................................................................... 9

1.11.1. RoHS Compatible Product Design ......................................................................................... 10

1.11.2. RoHS Compliant Production Process .................................................................................... 10

1.11.3. WEEE Application .................................................................................................................. 10

1.12. Swiss Quality .............................................................................................................. 11

1.13. The Swiss Association for Quality and Management Systems ............................... 11

2. Overview..................................................................................................................12

2.1. Standard Features of the MSB900/L.......................................................................... 12

2.2. Unique Features.......................................................................................................... 12

2.3. MSB900 Block Diagram.............................................................................................. 13

2.4. MSB900/MSB900L specifications .............................................................................. 14

2.5. Examples of Ordering Codes..................................................................................... 16

2.6. Related Application Notes.......................................................................................... 16

2.7. Dimensions & Diagrams............................................................................................. 17

2.7.1. MSB900/L .................................................................................................................................. 17

2.7.2. MSB800CON Part Nr 802205.................................................................................................... 21

2.8. MSB900/L Incompatibilities to a standard PC/AT..................................................... 22

2.9. Related Application Notes.......................................................................................... 22

2.10. High Frequency Radiation (to meet EN55022) .......................................................... 22

2.11. Battery-Lifetime .......................................................................................................... 23

2.11.1. External battery assembling (for the MSB900L): ................................................................... 23

3. Bus Signals .............................................................................................................23

3.1. Addressing PCI Devices............................................................................................. 23

3.1.1. MSB900 and MSB900L ............................................................................................................. 23

4. BIOS History............................................................................................................24

5. Detailed System Description .................................................................................25

5.1. Power Requirements .................................................................................................. 25

5.2. Boot Time .................................................................................................................... 25

5.3. CPU, Boards and RAMs.............................................................................................. 26

5.3.1. CPUs of this MICROSPACE Product ........................................................................................ 26

5.3.2. Numeric Coprocessor ................................................................................................................ 26

5.3.3. DDRAM Memory........................................................................................................................ 26

5.4. Interfaces..................................................................................................................... 26

5.4.1. Keyboard AT compatible and PS/2 Mouse................................................................................ 26

5.4.2. Line Printer Port LPT1 ............................................................................................................... 26

5.4.3. Serial Ports COM1-COM2 ......................................................................................................... 27

5.4.4. Floppy Disk Interface ................................................................................................................. 27

5.5. Controllers................................................................................................................... 27

5.5.1. Interrupt Controllers ................................................................................................................... 27

5.6. Timers and Counters.................................................................................................. 28

5.6.1. Programmable Timers ............................................................................................................... 28

5.6.2. RTC (Real Time Clock).............................................................................................................. 28

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5.6.3. Watchdog................................................................................................................................... 28

5.6.4. ROM-BIOS Sockets................................................................................................................... 28

5.6.5. BIOS CMOS Setup .................................................................................................................... 29

5.7. CMOS RAM Map.......................................................................................................... 29

5.8. EEPROM saved CMOS Setup..................................................................................... 34

5.8.1. EEPROM Memory for Setup...................................................................................................... 35

5.9. Memory & I/O Map....................................................................................................... 35

5.9.1. System Memory Map ................................................................................................................. 35

5.9.2. System I/O map ......................................................................................................................... 36

6. VGA ..........................................................................................................................40

6.1. VGA/LCD Controller of the Geode LX900.................................................................. 40

6.2. Graphic Modes............................................................................................................ 40

7. Video Input ..............................................................................................................41

8. Description of the connectors ...............................................................................41

9. Jumper Locations on the Board ............................................................................53

9.1. The Jumpers on MSB900/L ........................................................................................ 53

9.2. Reload Default BIOS Settings .................................................................................... 53

10. Cable Interfaces ......................................................................................................55

10.1. The Hard Disk Cable 44pin......................................................................................... 55

10.2. The COM1/LPT Serial Interface Cable ....................................................................... 56

10.3. The COM2 Serial Interface Cable............................................................................... 57

11. Thermal Specifications...........................................................................................58

11.1. Thermal Analysis for Case Integration...................................................................... 58

12. Assembly Views......................................................................................................59

12.1. MSB900/L .................................................................................................................... 59

12.2. Mechanical Dimensions ............................................................................................. 61

13. PXE-Boot and PXE-Setup in the BIOS ..................................................................62

14. PXE-License Order .................................................................................................64

15. Index ........................................................................................................................65

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

1. PREFACE

The information contained in this manual has been carefully checked and is believed to be accurate; it is subject to change without notice. Product advances mean that some specifications may have changed. DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or application of any circuit or product described herein.

1.1. Trademarks

DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include names, company logos, and registered trademarks which are, therefore, proprietary to their respective owners.

1.2. Disclaimer

DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITALLOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.

1.3. Environmental Protection Statement

This product has been manufactured to satisfy environmental protection requirements wherever possible. Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled. Final disposal of this product after its service life must be accomplished in accordance with applicable country, state, or local laws or regulations.

1.4. Who should use this Product

 Electrical engineers with know-how in PC-technology.

 Because of the complexity and the variability of PC-technology, we cannot guarantee that the product

will work in any particular situation or set-up. Our technical support will try to help you find a solution.

 Pay attention to electrostatic discharges; use a CMOS protected workplace.

 Power supply must be OFF when working on the board or connecting any cables or devices.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

1.5. Recycling Information

All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances Directive). The product is soldered with a lead free process.

1.6. Technical Support

1. Contact your local DIGITAL-LOGIC Technical Support, in your country.

2. Use the Internet Support Request form at http://support.digitallogic.ch/  embedded products  New Support Request

Support requests are only accepted with detailed information about the product (i.e., BIOS-, Boardversion)!

1.7. Limited Two Year Warranty

DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be free from defects in materials and workmanship for two years following the date of shipment from DIGITALLOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not transferable.

During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.

Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland are re-

quired to register a RMA (Return Material Authorization) number in the Support Center at

http://support.digitallogic.ch/

All other customers must contact their local distributors for returning defective materials.

This limited warranty does not extend to any product which has been damaged as a result of accident, misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or insufficient ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as a result of service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient knowledge of these technologies or has not consulted the product manuals or the technical support of DIGITAL-LOGIC AG and therefore the product has been damaged.

Empty batteries (external and onboard), as well as all other battery failures, are not covered by this manufacturer’s limited warranty.

Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to, any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be liable to the purchaser or any user for any damage, including any incidental or consequential damage, expenses, lost profits, lost savings, or other damages arising out of the use or inability to use the product.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

1.8. Explanation of Symbols

CE Conformity

This symbol indicates that the product described in this manual is in compliance with all applied CE standards.

Caution, Electric Shock!

This symbol and title warn of hazards due to electrical shocks (> 60V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment.

Caution, Electric Shock!

This symbol and title warn of hazards due to electrical shocks (> 32V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment

Warning, ESD Sensitive Device!

This symbol and title inform that electronic boards and their components are sensitive to Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must always be taken while handling and examining this product.

Attention!

This symbol and title emphasize points which, if not fully understood and taken into consideration by the reader, may endanger your health and/or result in damage to your equipment.

Note...

This symbol and title emphasize aspects the user should read through carefully for his, or her, own advantage.

Warning, Heat Sensitive Device!

This symbol indicates a heat sensitive component.

Safety Instructions

This symbol shows safety instructions for the operator to follow.

This symbol warns of general hazards from mechanical, electrical, and/or chemical failure. This may endanger your life/health and/or result in damage to your equipment.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

1.9. Applicable Documents and Standards

The following publications are used in conjunction with this manual. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective organizations.

 Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright

 ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) In-

terface Circuits, January 1, 2001. http://www.ansi.org/

 ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.

http://www.ansi.org/

 ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached

SCSI (SAS), October 30, 2003. http://www.ansi.org/

reserved. http://www.intel.com/labs/media/audio/

 Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August

http://www.vesa.org/summary/sumddcci.htm

http://www.expresscard.org/

 IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information ex-

change between systems–Local and metropolitan area networks–Specific requirements – Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications. http://www.ieee.org

 IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision

Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.

http://www.ieee.org

 PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,

PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

 Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org

1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.

http://www.smbus.org/

1.10. For Your Safety

Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a long, fault-free life. However, this life expectancy can be drastically reduced by improper treatment during unpacking and installation. Therefore, in the interest of your own safety and for the correct operation of your new DIGITAL-LOGIC product, please comply with the following guidelines.

Attention!

All work on this device must only be carried out by sufficiently skilled personnel.

Caution, Electric Shock!

Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is switched off. This applies also to the installation of piggybacks or peripherals. Serious electrical shock hazards can exist during all installation, repair and maintenance operations with this product. Therefore, always unplug the power cable and any other cables which provide external voltage before performing work.

Warning, ESD Sensitive Device!

Electronic boards and their components are sensitive to static electricity. In order to ensure product integrity at all times, be careful during all handling and examinations of this product.

1.11. RoHS Commitment

DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a directive, which restricts the use of six hazardous materials in the manufacturing of various types of electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.

Each European Union member state is adopting its own enforcement and implementation policies using the directive as a guide. Therefore, there could be as many different versions of the law as there are states in the EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have their own regulations for green products, which are similar, but not identical, to the RoHS directive.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:

 Lead

 Mercury

 Cadmium

 Chromium VI

 PBB and PBDE

The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply to the weight of the finished product, or even to a component but to any single substance that could (theoretically) be separated mechanically.

1.11.1. RoHS Compatible Product Design

All DIGITAL-LOGIC standard products comply with RoHS legislation.

Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.

1.11.2. RoHS Compliant Production Process

DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These capabilities are verified by:

1. A confirmation from the supplier indicating that their production processes and resulting devices are

RoHS compliant.

2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned sub-

stances in a produced device will be measured. These measurements are carried out by an accredited laboratory.

1.11.3. WEEE Application

The WEEE directive is closely related to the RoHS directive and applies to the following devices:

 Large and small household appliances  IT equipment  Telecommunications equipment (although infrastructure equipment is exempt in some countries)  Consumer equipment  Lighting equipment – including light bulbs  Electronic and electrical tools  Toys, leisure and sports equipment  Automatic dispensers

It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to properly recycle all electronic products that have reached the end of their life cycle.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

1.12. Swiss Quality

 100% Made in Switzerland

 DIGITAL-LOGIC is a member of "Swiss-Label"

 This product was not manufactured by employees earning

piecework wages

 This product was manufactured in humane work conditions

 All employees who worked on this product are paid

customary Swiss market wages and are insured

 ISO 9000:2001 (quality management system)

1.13. The Swiss Association for Quality and Management Systems

The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment services for all types of industries and services. SQS certificates are accepted worldwide thanks to accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification Network, IQNet, and co-operation contracts/agreements with accredited partners.

www.sqs.ch

The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field of development, manufacturing and sales of embedded computer boards, embedded computer modules and computer systems. The certification is valid for three years at which time an audit is performed for recertification.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

2. OVERVIEW

2.1. Standard Features of the MSB900/L

The MICROSPACE 3.5”-SBC is a miniaturized modular device incorporating the major elements of a PC/AT compatible computer. It includes standard PC/AT compatible elements, such as:

 Powerful GEODE LX-900 600MHz  Legacy BIOS ROM  DDR-SODIMM 200pin socket (for DDR-RAM 256-1024MB)  128k second level cache  Timers  DMA  Real-time clock with CMOS-RAM and battery buffer (only on MSB900, not on MSB900L)  LPT1 parallel port  COM1-, COM2- RS2332 serial port  Speaker interface  PS/2-keyboard and mouse interface (shared on one mini DIN connector)  PATA-IDE hard disk interface  VGA video interface  PCI/104 (one slot), limited I/O connector space  4 Channels USB 2.0  Onboard CF socket Type II

2.2. Unique Features

The MICROSPACE 3.5”-SBC includes all standard PC/AT functions plus unique DIGITAL-LOGIC AG enhancements, such as:

 Two channel LAN Ethernet, INTEL 82551QM (LAN A) and INTEL 82551ER (LAN B)  Boot from LAN (PXE and RPL)  Single 8 - 32Volt supply  Video input (only on MSB900, not available on MSB900L)  Watchdog  EEPROM for setup and configuration  UL approved parts  Optional: interface for operator display (LVDS, COM2, CRT, USB, SMBus)

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

2.3. MSB900 Block Diagram

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

2.4. MSB900/MSB900L specifications

CPU Specification

CPU GEODE LX900 CPU Core Supply 1.25V very low powered Mode Real / Protected Compatibility x86 Word Size 32Bits Secondary Cache 128kB Physical Addressing 32 lines Virtual Addressing 16GB Clock Rates 600MHz Socket Standard Soldered BGA

Chipset Specification

Northbridge AMD LX900 Southbridge AMD CS5536 LAN 2x 10/100Mbit Intel 82551QM (LAN A), Intel 82551ER (LAN B) Audio Stereo In and Stereo Line-Out Codec AD1985 up to 96kHz sampling rate, 16Bit (Analog Devices) Firewire IEEE1394 Not on board Video 16MByte Video-DDRAM

Power Management: Specification

The LX900 supports ACPI and APM Version 1.2

The following ACPI Sleep States are supported:

- S1 (Standby)

- S3 (Suspend to RAM) not available

- S4 (Hibernation)

DMA: Specification

8237A comp. 4 channel 8bit

3 channel 16bit

Interrupts: Specification

8259 comp. 8 + 7 levels

PC compatible

Timers: Specification

8254 comp. 3 programmable counters/timers

Memory: Specification

SODIMM SODIMM200pin DDR PC2700 333MHz 256-1024MByte

Video Specification

Controller GEODE LX900 BUS 32Bit high speed 33MHz PCI bus Enhanced BIOS VGA / LCD BIOS Memory 2-16MByte shared RAM CRT-Monitor VGA, SVGA up to 1920x1440 Video Input MSB900: yes, 1 channel

MSB900L: no

Drivers WIN2000, XP

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

Mass Storage Specification

FD Floppy disk interface not supported HD E-IDE interface, AT-type, for max. 2 hard disks, 44pin connector,

for 1.3, 1.8 and 2.5" hard disk with 44 pins IDE

Standard AT Interfaces: Specification

Serial COM1

COM1/2 available on headers onboard.

SuperIO Chip W83627HF from WINBOND Parallel LPT1 printer interface mode: SPP (output), EPP (bidir.) Keyboard AT or PS/2-keyboard Mouse PS/2 Speaker No speaker RTC Integrated into the chipset, RTC with CMOS-RAM 256Byte Backup current RTC-backup MSB900 Onboard 3.6Volt Lithium 400mAh available

RTC-backup MSB900L External connection, no onboard battery available

BUS Specification

PCI/104 PCI 32Bit Bus, 1 slot Clock 33MHz defined by the GEODE

USB Specification

USB 2.0 Transfer rate 480MBps, 12.5MBps / 1.5MBps Channels 4

Peripheral Extension Specification

ISA Not supported PCI MSB900 With PCI/104 BUS (1 slot), limited I/O space

PCI MSB900L Not available

Power Supply Specification

Working Power Rise Time Unspecified Power consumption MSB900/L with HD, MS/KB (PS/2), CRT Monitor

Standby power consumption MSB900/L:

Physical Characteristics Specification

Dimensions Length: 146 mm

Weight 160g PCB Thickness 1.6mm / 0.0625 inches nominal PCB Layer Multilayer

Name FIFO IRQs Addr. Standard Option

yes

COM2

For DSub-connectors, option MSB800-CON is needed.

<5 µA

8-32Volt ± 5% (peak 36Volt)

Windows XP Desktop: type 8.5-10W

Windows Standby: 2.5W (without MS/KB wakeup function) Windows Standby: 4.5W (with PS/2 wakeup function)

Depth: 102 mm Height: 20 mm

yes

IRQ4 IRQ3

3F8 2F8

RS232C RS232C

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

Operating Environment Specification

Relative humidity 5-90%, non-condensing Vibration 5-2000Hz, 0.1G Shock 1G Temperature MSB900*:

Operating: Standard version: -25°C to +70°C Extended version: -40°C to +85°C Storage: -55°C to +85°C * = with passive cooler

MSB900L**: Operating: Standard version: 0°C to +60°C

Storage: -55°C to +85°C ** = without passive cooler

EMI/EMC (IEC1131-2 refer MIL 461/462)

ESD Electro Static Discharge IEC 801-2, EN55101-2, VDE 0843/0847 Part 2

REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9. (not tested) EFT Electric Fast Transient (Burst) IEC 801-4, EN50082-1, VDE 0843 Part 4

SIR Surge Immunity Requirements IEC 801-5, IEEE587, VDE 0843 Part 5

High-frequency Radiation EN55022

Compatibility Specification

MSB900/L Mechanically compatible to 3.5inch industrial embedded com-

All information is subject to change without notice.

Specification

Metallic protection needed Separate ground layer included 15kV single peak

250V - 4kV, 50 ohms, Ts=5ns Grade 2: 1kV Supply, 500 I/O, 5kHz

Supply: 2kV, 6 pulse/minute I/O: 500V, 2 pulse/minute FD, CRT: none

puter boards

2.5. Examples of Ordering Codes

802220 MSB900 with LX900 CPU, 0MB-RAM, Battery, PCI/104 and Video input 802221 MSB900L with LX900 CPU, 0MB RAM, … 802205 MSB800CON COM1, LPT1 Expansion board.

These are only examples; for current ordering codes, please see the current price list.

2.6. Related Application Notes

Application Notes are available at http://www.digitallogic.com  support, or on any DIGITAL-LOGIC Application CD.

# Description

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

2.7. Dimensions & Diagrams

2.7.1. MSB900/L

Board / Version Unit: Tolerance: Date / Author

MSB900/L mm (millimeter) + / - 0.1mm 25.10.2006 / BRR

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

2.7.2. MSB800CON Part Nr 802205

Board / Version Unit: Tolerance: Date / Author

MSB800CON mm (millimeter) + / - 0.1mm 25.10.2006 / BRR

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

2.8. MSB900/L Incompatibilities to a standard PC/AT

None.

2.9. Related Application Notes

Application Notes are available at http://www.digitallogic.com  support, or on any DIGITAL-LOGIC Application CD.

# Description

2.10. High Frequency Radiation (to meet EN55022)

All connectors are filtered onboard to comply with the EMI standards.

The following filters are used:

Interface 3db-

Frequency

VGA-RGB Ferrite 2x 10pF 0V/3V Diode VGA-HS/VS 33ohms 33pF 0V/3V Diode VGA-VCC Ferrite 1nF None

Video Input - - - - None

USB Inductors none DLP31D Diode SRV05-4

IDE 33ohms series - - None

Sound I/O Ferrite 1nF None

PS2-KB Ferrite 47pF None PS2-MS Ferrite 47pF None PS2-VCC Ferrite 1nF None PS2-GND Ferrite 1nF None

COM1 47pF MAX211E COM2 47pF MAX211E LPT1 47pF none

LAN Integrated PULSE J00-0065NL Isolated 500V

All 33MHz-Clocks 33Ohms series 10pF None

Inductivity L and R

Capacitor to GND

Filter-Type Protection

GND/5V

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

2.11. Battery-Lifetime

Battery specs:

Manufacturer: pba Type: ER10280 Capacity versus Temp: 10uA 420mAh 400mAh 350mAh Voltage versus Temp. 10uA 3.6V 3.6V Ca. 3.6V Nominal values: 3.6V / 400mAh @ 0.5mA / -55°C...~+85°C Information taken from the datasheet of ER10280

PRODUCT: Temperature

Battery current: +25°C 3.6 < 1 < 3

Battery-Lifetime: +25°C >3.5 years >3.5 year

Lowest temp.

-40°C

Battery voltage

°C

Nominal temp.

+20°C

VCC (+5)

switched ON

µA

Highest temp.

+85°C

VCC (+5V)

switched off

µA

2.11.1. External battery assembling (for the MSB900L):

On the MSB900L board, an external battery can be connected to J3. Attach the battery ground to pin 2.

If the customer wants to connect an external battery, then some precautions have to be taken:

The battery is prohibited from charging. Do not use a rechargeable battery!

The RTC device defines a voltage level of 3.0-3.6V, so use an external battery within this range (inclusive of the diode which is pre-assembled onboard).

3. BUS SIGNALS

3.1. Addressing PCI Devices

3.1.1. MSB900 and MSB900L

DEVICE IDSEL

SLOT 1 AD20 A / B / C / D 3 3 For additional cards (peripheral boards)

Onboard used: LAN A AD28 C 1 1 Onboard device LAN B AD29 A 4 4 Onboard device Mini-PCI AD27 A / B 5 5 Optional device

CPU AD11 A 2 2 Onboard device

PIRQ #REG #GNT

Remarks

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

4. BIOS HISTORY

This BIOS history is for the MSB900/L.

This BIOS history is not for the following products:

MSEP900, MSM900, SM900

Version: Date: Status: Modifications:

1.23 02.2007 Initial Release -

Note…

This product has a unique BIOS version. For a description of the other features of the BIOS, please refer to the driver/software/BIOS manual “GEODE_LX800-LX900” on the Product CD.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5. DETAILED SYSTEM DESCRIPTION

This system configuration is based on the ISA architecture. Check the I/O and memory map in this chapter.

5.1. Power Requirements

The power is connected through the wide-range power connector. The supply uses only the +8V to +32V and the ground connection.

Attention:

Make sure the power plug is wired correctly before supplying power to the board! A built-in diode protects the board against reverse polarity.

Tolerance of supply: Must be within 8-32Volt norm.

Test environment for power consumption measurement:

Peripheries: Hard disk Hitachi Model HTA422020F9ATJ0 20GB Monitor Eizo Flexscan F340I-W PS/2-KB Logitech Model iTouch Keyboard PS/2-MS Logitech Model M-CAA43

Software: MS-DOS V6.22 WinXP

Current consumption @ 12Volt supply at -40°C/+25°C/+85°C

Mode Memory

MSB900-600MHz

DOS: C:\

WinXP: Desktop

1GB

DLAG-Nr. -30 °C

[mA]

+25°C

[mA]

700

5.2. Boot Time

System Boot-Times

Definitions/Boot-Medium Quick Boot Normal Boot

MSB900-600MHz

From hard disk Hitachi Model J4K20-20: Boot from hard disk to “Starting MS-DOS”.-Prompt Boot from hard disk to XP desktop Booting without a storage device (only BIOS)

time [s]

+85 °C

[mA]

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5.3. CPU, Boards and RAMs

5.3.1. CPUs of this MICROSPACE Product

Processor: Type: Clock:

GEODE LX900 National 600 MHz

5.3.2. Numeric Coprocessor

It is integrated in the LX900 CPU.

5.3.3. DDRAM Memory

Speed: Size:

Bits: Capacity:

Bank:

333 DDR-SODIMM DDRDIMM 200pin 64bit 256-1024MBytes DDR-SODIMM 1

5.4. Interfaces

5.4.1. Keyboard AT compatible and PS/2 Mouse

The PS/2 Keyboard and Mouse are combined on the PS2-connector. It is needed to use a Y-Cable to connect both, the mouse and the keyboard.

5.4.2. Line Printer Port LPT1

A standard bi-directional LPT port is integrated into the MICROSPACE PC.

Further information about these signals is available in numerous publications, including the IBM technical reference manuals for the PC and AT computers and from other reference documents.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5.4.3. Serial Ports COM1-COM2

The serial channels are fully compatible with 16C550 UARTS. COM1 is the primary serial port, and is supported by the board's ROM-BIOS as the PC-DOS 'COM1' device. The secondary serial port is COM2; it is supported as the 'COM2' device.

Standard: COM 1/2: National PC87317VUL: 2 x 16C550 compatible serial interfaces

Serial Port Connectors COM1, COM2

Pin Signal Name Function in/out DB25 Pin DB9 Pin

1 CD Data Carrier Detect in 8 1 2 DSR Data Set Ready in 6 6 3 RXD Receive Data in 3 2 4 RTS Request To Send out 4 7 5 TXD Transmit Data out 2 3 6 CTS Clear to Send in 5 8 7 DTR Data Terminal Ready out 20 4 8 RI Ring Indicator in 22 9 9 GND Signal Ground 7 5

The serial port signals are compatible with the RS232C specifications.

5.4.4. Floppy Disk Interface

This is not available with this product; use a USB Floppy.

5.5. Controllers

5.5.1. Interrupt Controllers

An 8259A compatible interrupt controller, within the chipset, provides seven prioritized interrupt levels. Of these, several are normally associated with the board's onboard device interfaces and controllers, and several are available on the AT expansion bus.

Interrupt: Sources: Onboard used:

IRQ0 ROM-BIOS clock tick function, from timer 0 yes IRQ1 Keyboard controller output buffer full yes IRQ2 Used for cascade 2. 8259 yes IRQ3 COM2 serial port yes IRQ4 COM1 serial port yes IRQ5 LPT2 parallel printer (if present) no * IRQ6 Floppy controller yes IRQ7 LPT1 parallel printer yes IRQ8 Battery backed clock yes

IRQ9 Free for user no * IRQ10 Free for user no * IRQ11 Free for user no * IRQ12 PS/2 mouse yes IRQ13 Math. coprocessor yes IRQ14 Hard disk IDE yes IRQ15 Free for user no *

* It may depend on the LAN configuration.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5.6. Timers and Counters

5.6.1. Programmable Timers

An 8253 compatible timer/counter device is also included in the board's ASIC device. This device is utilized in precisely the same manner as in a standard AT implementation. Each channel of the 8253 is driven by a

1.190 MHz clock, derived from a 14.318 MHz oscillator, which can be internally divided in order to provide a variety of frequencies.

Timer 2 can also be used as a general purpose timer if the speaker function is not required.

Timer Assignment

Timer Function

0 ROM-BIOS clock tick (18.2Hz) 1 DRAM refresh request timing (15 µs) 2 Speaker tone generation time base

5.6.2. RTC (Real Time Clock)

An AT compatible date/time clock is located within the chipset. The device also contains a CMOS static RAM, compatible with that in standard ATs. System configuration data is normally stored in the clock chip's CMOS RAM in a manner consistent with the convention used in other AT compatible computers. To attach an external battery on a MSB900L board refer to section 2.11.1.

5.6.3. Watchdog

The watchdog timer detects a system crash and performs a hardware reset. After power up, the watchdog is always disabled as the BIOS does not send strobes to the watchdog. In case the user wants to take advantage of the watchdog, the application must produce a strobe at least every 800 ms. If no strobe occurs within the 800 ms, the watchdog resets the system.

For more information, please refer to the driver/software/BIOS manual “GEODE_LX800-LX900” on the Product CD. The watchdog feature is integrated in the INT15 function.

There are some programming examples available: Product CD-Rom or customer download area: \tools\SM855\int15dl\…

5.6.4. ROM-BIOS Sockets

An EPROM socket with 8bit wide data access normally contains the board’s AT compatible ROM-BIOS. The socket takes a 29F020 EPROM (or equivalent) device. The board's wait-state control logic automatically inserts four memory wait states in all CPU accesses to this socket. The ROM-BIOS sockets occupy the memory area from C0000H through FFFFFh; however, the board's ASIC logic reserves the entire area from C0000h through FFFFFh for onboard devices, so that this area is already usable for ROM-DOS and BIOS expansion modules. Consult the appropriate address map for the MICROSPACE PC-Product ROM-BIOS sockets.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5.6.4.1. Standard BIOS ROM

Device:

Map:

FWH

E0000 - FFFFFh Core BIOS 128k C0000 - C7FFFh VGA BIOS 32k CC000 - CFFFFh FREE

5.6.5. BIOS CMOS Setup

If wrong setups are memorized in the CMOS-RAM, the default values will be loaded after resetting the RTC/CMOS-RAM by de-soldering the battery.

If the battery is down, it is always possible to start the system with the default values from the BIOS.

5.7. CMOS RAM Map

Systems based on the industry-standard specification include a battery backed Real Time Clock chip. This clock contains at least 64Bytes of non-volatile RAM. The system BIOS uses this area to store information including system configuration and initialization parameters, system diagnostics, and the time and date. This information remains intact even when the system is powered down.

The BIOS supports 128Bytes of CMOS RAM. This information is accessible through I/O ports 70h and 71h. CMOS RAM can be divided into several segments:

 Locations 00h - 0Fh contain the real time clock (RTC) and status information

 Locations 10h - 2Fh contain system configuration data

 Locations 30h - 3Fh contain system BIOS-specific configuration data as well as chipset-specific in-

formation

 Locations 40h - 7Fh contain chipset-specific information as well as power management configuration

parameters

The following table provides a summary of how these areas may be further divided.

Beginning Ending Checksum Description

00h 0Fh No RTC and Checksum 10h 2Dh Yes System Configuration 2Eh 2Fh No Checksum Value of 10h - 2Dh 30h 33h No Standard CMOS 34h 3Fh No Standard CMOS - SystemSoft Reserved 40h 5Bh Yes Extended CMOS - Chipset Specific 5Ch 5Dh No Checksum Value of 40h - 5Bh 5Eh 6Eh No Extended CMOS - Chipset Specific 6Fh 7Dh Yes Extended CMOS - Power Management 7Eh 7Fh No Checksum Value of 6Fh - 7Dh

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

CMOS Map

Location Description

00h Time of day (seconds) specified in BCD

01h Alarm (seconds) specified in BCD

02h Time of day (minutes) specified in BCD

03h Alarm (minutes) specified in BCD

04h Time of day (hours) specified in BCD

05h Alarm (hours) specified in BCD

06h Day of week specified in BCD

07h Day of month specified in BCD

08h Month specified in BCD

09h Year specified in BCD

0Ah Status Register A

Bit 7 = Update in progress Bits 6-4 = Time based frequency divider Bits 3-0 = Rate selection bits that define the periodic

interrupt rate and output frequency.

0Bh Status Register B

Bit 7 = Run/Halt 0 Run 1 Halt Bit 6 = Periodic Timer 0 Disable 1 Enable Bit 5 = Alarm Interrupt 0 Disable 1 Enable Bit 4 = Update Ended Interrupt 0 Disable 1 Enable Bit 3 = Square Wave Interrupt 0 Disable 1 Enable Bit 2 = Calendar Format 0 BCD 1 Binary Bit 1 = Time Format 0 12-Hour 1 24-Hour Bit 0 = Daylight Savings Time 0 Disable 1 Enable

0Ch Status Register C

Bit 7 = Interrupt Flag Bit 6 = Periodic Interrupt Flag Bit 5 = Alarm Interrupt Flag Bit 4 = Update Interrupt Flag Bits 3-0 = Reserved

0Dh Status Register D

Bit 7 = Real Time Clock 0 Lost Power 1 Power

Continued...

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

CMOS Map continued...

Location Description

0Eh CMOS Location for Bad CMOS and Checksum Flags

Bit 7 = Flag for CMOS Lost Power

0 = Power OK 1 = Lost Power

Bit 6 = Flag for CMOS checksum bad

0 = Checksum is valid 1 = Checksum is bad

0Fh Shutdown Code

10h Diskette Drives

Bits 7-4 = Diskette Drive A

0000 = Not installed 0001 = Drive A = 360 kB 0010 = Drive A = 1.2MB 0011 = Drive A = 720 kB 0100 = Drive A = 1.44MB 0101 = Drive A = 2.88MB

Bits 3-0 = Diskette Drive B

0000 = Not installed 0001 = Drive B = 360 kB 0010 = Drive B = 1.2MB 0011 = Drive B = 720 kB 0100 = Drive B = 1.44MB 0101 = Drive B = 2.88MB

11h Reserved

12h Fixed (Hard) Drives

Bits 7-4 = Hard Drive 0, AT Type

Bits 3-0 = Hard Drive 1, AT Type

13h Reserved

14h Equipment

Bits 7-6 = Number of Diskette Drives

Bits 5-4 = Primary Display Type

Bits 3-2 = Reserved Bit 1 = Math Coprocessor Presence

Bit 0 = Bootable Diskette Drive

Continued...

0000 = Not installed 0001-1110 = Types 1-14 1111 = Extended drive types 16-44. See location 19h.

0000 = Not installed 0001-1110 = Types 1-14 1111 = Extended drive types 16-44. See location 2Ah.

00 = One diskette drive 01 = Two diskette drives 10, 11 = Reserved

00 = Adapter with option ROM 01 = CGA in 40 column mode 10 = CGA in 80 column mode 11 = Monochrome

0 = Not installed 1 = Installed

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

CMOS Map continued...

Location Description

15h Base Memory Size (in kB) - Low Byte

16h Base Memory Size (in kB) - High Byte

17h Extended Memory Size (in kB) - Low Byte

18h Extended Memory Size (in kB) - High Byte

19h Extended Drive Type - Hard Drive 0

1Ah Extended Drive Type - Hard Drive 1

1Bh Custom and Fixed (Hard) Drive Flags

Bits 7-6 = Reserved Bit 5 = Internal Floppy Disk Controller

0 = Disabled 1 = Enabled

Bit 4 = Internal IDE Controller

0 = Disabled 1 = Enabled

Bit 3 = Hard Drive 0 Custom Flag

0 = Disabled 1 = Enabled

Bit 2 = Hard Drive 0 IDE Flag

0 = Disabled 1 = Enabled

Bit 1 = Hard Drive 1 Custom Flag

0 = Disabled 1 = Enabled

Bit 0 = Hard Drive 1 IDE Flag

0 = Disabled 1 = Enabled

1Ch Reserved

1Dh EMS Memory Size Low Byte

1Eh EMS Memory Size High Byte

1Fh - 24h Custom Drive Table 0

These 6 Bytes (48 bits) contain the following data:

Cylinders 10bits range 0-1023 Landing Zone 10bits range 0-1023 Write Precompensation 10bits range 0-1023 Heads 08bits range 0-15 Sectors/Track 08bits range 0-254

1Fh

20h

Byte 0 Bits 7-0 = Lower 8 bits of Cylinders

Byte 1 Bits 7-2 = Lower 6 bits of Landing Zone

Bits 1-0 = Upper 2 bits of Cylinders

21h

Byte 2 Bits 7-4 = Lower 4 bits of Write Precompensation

Bits 3-0 = Upper 4 bits of Landing Zone

Continued...

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

CMOS Map continued...

Location Description

22h

23h

24h

25h - 2Ah Custom Drive Table 1

Byte 3 Bits 7-6 = Reserved

Bits 5-0 = Upper 6 bits of Write Precompensation

Byte 4 Bits 7-0 = Number of Heads

Byte 5 Bits 7-0 = Sectors Per Track

These 6 Bytes (48 bits) contain the following data:

Cylinders 10bits range 0-1023 Landing Zone 10bits range 0-1023 Write Precompensation 10bits range 0-1023 Heads 08bits range 0-15 Sectors/Track 08bits range 0-254

25h

26h

27h

28h

29h

2Ah

2Bh Boot Password

2Ch SCU Password

2Dh Reserved

Byte 0 Bits 7-0 = Lower 8 bits of Cylinders

Byte 1 Bits 7-2 = Lower 6 bits of Landing Zone

Bits 1-0 = Upper 2 bits of Cylinders

Byte 2 Bits 7-4 = Lower 4 bits of Write Precompensation

Bits 3-0 = Upper 4 bits of Landing Zone

Byte 3 Bits 7-6 = Reserved

Bits 5-0 = Upper 6 bits of Write Precompensation

Byte 4 Bits 7-0 = Number of Heads

Byte 5 Bits 7-0 = Sectors Per Track

Bit 7 = Enable/Disable Password

0 = Disable Password 1 = Enable Password

Bits 6-0 = Calculated Password

Bit 7 = Enable/Disable Password

0 = Disable Password 1 = Enable Password

Bits 6-0 = Calculated Password

2Eh High Byte of Checksum - Locations 10h to 2Dh

2Fh Low Byte of Checksum - Locations 10h to 2Dh

30h Extended RAM (kB) detected by POST - Low Byte

31h Extended RAM (kB) detected by POST - High Byte

32h BCD Value for Century

Continued...

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

CMOS Map continued...

Location Description

33h Base Memory Installed

Bit 7 = Flag for Memory Size

0 = 640kB 1 = 512kB

Bits 6-0 = Reserved

34h

35h

36h Hotkey Usage

40h-7Fh

Minor CPU Revision

Differentiates CPUs within a CPU type (i.e., 486SX vs 486 DX, vs 486 DX/2). This is crucial for correctly determining CPU input clock frequency. During a power-on reset, Reg DL holds minor CPU revision.

Major CPU Revision

Differentiates between different CPUs (i.e., 386, 486, Pentium). This is crucial for correctly determining CPU input clock frequency. During a power-on reset, Reg DH holds major CPU revision.

Bits 7-6 = Reserved Bit 5 = Semaphore for Completed POST Bit 4 = Semaphore for 0 Volt POST (not currently used) Bit 3 = Semaphore for already in SCU menu Bit 2 = Semaphore for already in PM menu Bit 1 = Semaphore for SCU menu call pending Bit 0 = Semaphore for PM menu call pending

Definitions for these locations vary depending on the chipset.

5.8. EEPROM saved CMOS Setup

The EEPROM has different functions, as listed below:

• Backup of the CMOS-Setup values.

• Storing system information (i.e., version, production date, customization of the board, CPU type).

• Storing user/application values.

The EEPROM will be updated automatically after exiting the BIOS setup menu. The system will operate also without any CMOS battery. While booting, the CMOS is automatically updated with the EEPROM values.

Press the Esc-key while powering on the system before the video shows the BIOS message and the CMOS will not be updated.

This would be helpful, if wrong parameters are stored in the EEPROM and the setup of the BIOS does not start.

If the system hangs or a problem appears, the following steps must be performed:

1. Reset the CMOS-Setup (disconnect the battery for at least 10 minutes).

2. Press Esc until the system starts up.

3. Enter the BIOS Setup: a) load DEFAULT values b) enter the settings for the environment c) exit the setup

4. Restart the system.

The user may access the EEPROM through the INT15 special functions. Refer to that chapter in the GEODE LX800-LX900 manual on the Product CD.

The system information is read-only and uses the SFI functions. Refer to the GEODE LX800-LX900 manual.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5.8.1. EEPROM Memory for Setup

The EEPROM is used for setup and configuration data, stored as an alternative to the CMOS-RTC. Optionally, the EEPROM setup driver may update the CMOS RTC, if the battery is running down and the checksum error would appear and stop the system. The capacity of the EEPROM is 2 kByte.

Organization of the 2048Byte EEPROMs:

Address MAP: Function: 0000h CMOS-Setup valid (01=valid)

0001h Reserved 0003h Flag for DLAG-Message (FF=no message) 0010h-007Fh Copy of CMOS-Setup data 0080h-00FFh Reserved for AUX-CMOS-Setup 0100h-010Fh Serial-Number

0110h-0113h Production date (year/day/month) 0114h-0117h 1. Service date (year/day/month) 0118h-011Bh 2. Service date (year/day/month) 011Ch-011Fh 3. Service date (year/day/month) 0120h-0122h Boot errors (Auto incremented if any boot error occurs) 0123h-0125h Setup Entries (Auto incremented on every Setup entry) 0126h-0128h Low Battery (Auto incremented every time the battery is low, EEPROM -> CMOS) 0129h-012Bh Startup (Auto incremented on every power-on start) 0130h Reserved 0131h Reserved 0132h/0133h BIOS Version (V1.4 => [0132h]:= 4, [0133h]:=1) 0134h/0135h BOARD Version (V1.5 => [0124h]:=5, [0125h]:=1) 0136h BOARD TYPE (‘M’=PC/104, ‘E’=Euro, ‘W’=MSWS, ‘S’=Slot, ‘C’=Custom, ‘X’= smart-

Core or smartModule)

0137h CPU TYPE:

(01h=ELAN300/310, 02h=ELAN400, 05h=P5, 08h=P3, 09h=ELAN520, 10h=P-M).

0200h-03FFh Reserved

0200h-027Fh Reserved

0400h-07FFh Free for Customer use

5.9. Memory & I/O Map

5.9.1. System Memory Map

The X86 CPU, used as a central processing unit on the MICROSPACE, has a memory address space which is defined by 32 address bits. Therefore, it can address 1 GByte of memory. The memory address MAP is as follows:

CPU GEODE

Address: Size: Function / Comments:

000000 - 09FFFFh 640 kBytes Onboard DRAM for DOS applications 0A0000 - 0BFFFFh 128 kBytes CGA, EGA, LCD Video RAM 128kB 0C0000 - 0C7FFFh 0C8000 - 0CFFFFh 0D0000 - 0DFFFFh 64 kBytes Free for user 0E0000 - 0EBFFFh 0EC000 - 0EFFFFh 0F0000 - 0FFFFFh 64 kBytes Core BIOS 100000 - 1FFFFFFh 31 MBytes DRAM for extended onboard memory

32 kBytes 32 kBytes

32 kBytes 16 kBytes

VGA BIOS Free for user

Bios BIOS extensions

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

5.9.2. System I/O map

The following table details the legacy I/O range for 000h through 4FFh. Each I/O location has a read/write (R/W) capability.

Note the following abbreviations:

--- Unknown or can not be determined.

Yes Read and write the register at the indicated location. No shadow required.

WO Write only. Value written can not be read back. Reads do not contain any useful information.

RO Read only. Writes have no effect.

Shw

The value written to the register can not be read back via the same I/O location. Read back is accomplished via a “Shadow” register located in MSR space.

Shw@ Reads of the location return a constant or meaningless value.

Shw$ Reads of the location return a status or some other meaningful information

Rec

Writes to the location are “recorded” and written to the LPC. Reads to the location return the recorded value. The LPC is not read.

I/O Map

I/O Addr. Function Size R/W Comment

000h Slave DMA Address - Channel 0 8bit Yes 16bit values in two transfers.

001h Slave DMA Counter - Channel 0 8bit Yes 16bit values in two transfers.

002h

003h

004h

005h

006h

007h

008h

009h

00Ah

00Bh

00Ch

00Dh

00Eh

00Fh Slave DMA General Mask - Channels [3:0] 8bit Shw@ Reads return value B2h.

010h-01Fh No Specific Usage --- ---

020h

021h

022h-03Fh No Specific Usage --- ---

040h

041h

042h

043h

044h-05Fh No Specific Usage --- ---

Continued…

Slave DMA Address - Channel 1 8bit Yes 16bit values in two transfers.

Slave DMA Counter - Channel 1 8bit Yes 16bit values in two transfers.

Slave DMA Address - Channel 2 8bit Yes 16bit values in two transfers.

Slave DMA Counter - Channel 2 8bit Yes 16bit values in two transfers.

Slave DMA Address - Channel 3 8bit Yes 16bit values in two transfers.

Slave DMA Counter - Channel 3 8bit Yes 16bit values in two transfers.

Slave DMA Command/Status - Channels [3:0] 8bit Shw$

Slave DMA Request - Channels [3:0] 8bit WO Reads return value B2h.

Slave DMA Mask - Channels [3:0] 8bit Shw@ Reads return value B2h.

Slave DMA Mode - Channels [3:0] 8bit Shw@ Reads return value B2h.

Slave DMA Clear Pointer - Channels [3:0] 8bit WO Reads return value B2h.

Slave DMA Reset - Channels [3:0] 8bit WO Reads return value B2h.

Slave DMA Reset Mask - Channels [3:0] 8bit Shw@ Reads return value B2h.

PIC Master - Command/Status 8bit Shw$

PIT – System Timer 8bit Shw$

PIT – Refresh Timer 8bit Shw$

PIT – Speaker Timer 8bit Shw$

PIT – Control 8bit Shw$

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

I/O Map

I/O Addr. Function Size R/W Comment

060h

061h

062h-063h No Specific Usage --- ---

064h Keyboard/Mouse - Command/ Status 8bit Yes

065h-06Fh No Specific Usage --- ---

070h-071h RTC RAM Address/Data Port 8bit Yes

072h-073h High RTC RAM Address/Data Port 8bit Yes Options per MSR 51400014h[1].

074-077h No Specific Usage --- ---

078h-07Fh No Specific Usage --- ---

080h

081h

082h

083h

084h-086h No Specific Usage 8bit Rec Write LPC and DMA. Read only DMA.

087h

088h No Specific Usage 8bit Rec Write LPC and DMA. Read only DMA.

089h DMA Channel 6 Low Page

08Ah

08B

08Ch-08Dh No Specific Usage 8bit Rec Write LPC and DMA. Read only

08Eh DMA

08Fh

090h-091h No Specific Usage --- ---

092h

093h-09Fh No Specific Usage --- ---

0A0h

0A1h

0A2h-0BFh No Specific Usage 8bit ---

0C0h

0C1h

0C2h

0C3h

0C4h

0C6h

0C7h

0C8h

0CAh

0CBh

Continued…

Keyboard/Mouse - Data Port 8bit Yes

Port B Control 8bit Yes

If KEL Memory Offset 100h[0] = 1(EmulationEnabled bit).

If MSR 5140001Fh[0] = 1 (SNOOP bit) and KEL Memory Offset 100h[0] = 0 (EmulationEnabled bit).

If KEL Memory Offset 100h[0] = 1 (Emulation-Enabled bit). .

If MSR 5140001Fh[0] = 1 (SNOOP bit) and KEL Memory Offset 100h[0] = 0 (Emulation-Enabled bit)

Options per MSR 51400014h[0]. (Note 1)

Post Code Display 8bit Rec Write LPC and DMA. Read only DMA.

DMA Channel 2 Low Page

DMA Channel 3 Low Page

DMA Channel 1 Low Page

DMA Channel 0 Low Page 8bit Rec

DMA Channel 7 Low Page DMA Channel 5 Low Page

8bit Rec

Upper addr bits [23:16]. Write LPC and DMA. Read only DMA.

DMA C4 Low Page 8bit Rec Upper addr bits [23:16]. See comment at 080h.

Port A 8bit Yes

If kel_porta_en is enabled, then access Port A; else access LPC.

PIC Slave - Command/Status 8bit Shw$

Master DMA Address - Channel 4 8bit Yes 16bit values in two transfers.

No Specific Usage 8bit ---

Master DMA Counter - Channel 4 8bit Yes 16bit values in two transfers.

No Specific Usage 8bit ---

Master DMA Address - Channel 5 8bit Yes 16bit values in two transfers.

Master DMA Counter - Channel 5 8bit Yes 16bit values in two transfers.

No Specific Usage 8bit ---

Master DMA Address - Channel 6 8bit Yes 16bit values in two transfers.

Master DMA Counter - Channel 6 8bit Yes 16bit values in two transfers.

No Specific Usage 8bit ---

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

I/O Map

I/O Addr. Function Size R/W Comment

0CCh

0CDh

0CEh

0CFh

0D0h

0D1h

0D2h

0D3h

0D4h

0D5h

0D6h

0D7h

0D8h Master DMA Clear Pointer - Channels [7:4] 8bit WO

0D9h

0DAh

0DBh

0DCh

0DDh

0DEh

0DFh

0E0h-2E7h No Specific Usage --- ---

2E8h-2EFh UART/IR - COM4 8bit ---

2F0h-2F7h No Specific Usage --- ---

2F8h-2FFh UART/IR - COM2 8bit ---

300h- 36Fh No Specific Usage --- ---

370h

371h

372h

373h

374h

375h

376h

377h

378h-3E7h No Specific Usage --- ---

3E8h-3EFh UART/IR - COM3 8bit ---

3F0h

Continued…

Master DMA Address - Channel 7 8bit Yes 16bit values in two transfers.

No Specific Usage 8bit ---

Master DMA Counter - Channel 7 8bit Yes 16bit values in two transfers.

No Specific Usage 8bit ---

Master DMA Command/Status – Channels [7:4] 8bit Shw$

No Specific Usage 8bit ---

Master DMA Request - Channels [7:4] 8bit WO

No Specific Usage 8bit ---

Master DMA Mask - Channels [7:4] 8bit Yes

No Specific Usage 8bit ---

Master DMA Mode - Channels [7:4] 8bit Shw@

No Specific Usage 8bit ---

Master DMA Reset - Channels [7:4] 8bit WO

No Specific Usage 8bit ---

Master DMA Reset Mask - Channels [7:4] 8bit WO

No Specific Usage 8bit ---

Master DMA General Mask - Channels [7:4] 8bit Shw@

No Specific Usage 8bit ---

MSR bit enables/disables into I/O 2EFh space. (UART1 MSR 51400014h[18:16], UART2 MSR 51400014h[22:20]). Defaults to LPC.

MSR bit enables/disables into I/O 2FFh space. (UART1 MSR 51400014h[18:16], UART2 MSR 51400014h[22:20]). Defaults to LPC.

Floppy Status R A 8bit RO Second Floppy.

Floppy Status R B 8bit RO Second Floppy.

Floppy Digital Out 8bit Shw@ Second Floppy.

No Specific Usage 8bit ---

Floppy Cntrl Status 8bit RO Second Floppy.

Floppy Data 8bit Yes Second Floppy.

No Specific Usage 8bit ---

Floppy Conf Reg 8bit Shw$ Second Floppy.

MSR bit enables/disables into I/O 3EFh space. (UART1 MSR 51400014h[18:16], UART2 MSR 51400014h[22:20]). Defaults to LPC.

Floppy Status R A 8bit RO First Floppy.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

I/O Map

I/O Addr. Function Size R/W Comment

3F1h

3F2h

3F3h

3F4h

3F5h Floppy Data 8bit Yes First Floppy.

3F6h

3F7h

3F8h-3FFh UART/IR - COM1 8bit ---

480h

481h

482h DMA Channel 3 High Page

483h DMA Channel 1 High Page

484h-486h No Specific Usage 8bit WO Write LPC and DMA. Read only DMA.

487h

489h

48Ah DMA Channel 7 High Page

48Bh DMA Channel 5 High Page

48Ch-48Eh No Specific Usage 8bit WO Write LPC and DMA. Read only DMA.

48Fh

490h-4CFh No Specific Usage --- ---

4D0h

4D1h

4D2h-4FFh No Specific Usage --- ---

Continued…

Floppy Status R B 8bit RO First Floppy.

Floppy Digital Out 8bit Shw@ First Floppy.

No Specific Usage 8bit ---

Floppy Cntrl Status 8bit RO First Floppy.

No Specific Usage 8bit ---

Floppy Conf Reg 8bit Shw$ First Floppy.

MSR bit enables/disables into I/O 3FFh space. (UART1 MSR 51400014h[18:16], UART2 MSR 51400014h[22:20]). Defaults to LPC.

No Specific Usage 8bit WO Write LPC and DMA. Read only DMA.

DMA Channel 2 High Page 8bit Rec

Upper addr bits [31:24]. Write LPC and DMA. Read only DMA.

DMA Channel 0 High Page 8bit Rec

DMA Channel 6 High Page 8bit Rec

Upper addr bits [31:24]. Write LPC and DMA. Read only DMA.

DMA Channel 4 High Page 8bit Rec

Upper addr bits [31:24]. Write LPC and DMA. Read only DMA.

PIC Level/Edge 8bit Yes IRQ0-IRQ 7.

PIC Level/Edge 8bit Yes IRQ8-IRQ15.

Note 1: The Diverse Device Snoops writes to this port and maintains the MSB as NMI enabled. When low,

NMI is enabled. When high, NMI is disabled. This bit defaults high. Reads of this port return bits [6:0] from the on-chip or off-chip target, while Bit 7 is returned from the “maintained” value.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

6. VGA

6.1. VGA/LCD Controller of the Geode LX900

• Highly integrated flat panel and CRT GUI Accelerator & Multimedia Engine, Palette/DAC, Clock Synthesizer, and integrated frame buffer

• HiQColorTM Technology implemented with TMED (Temporal Modulated Energy Distribution)

• Hardware Windows Acceleration

• Hardware Multimedia Support

• High-Performance flat panel display resolution and color depth at 3.3V

• 18/24bit direct interface to color TFT panels (X1)

• Advanced Power Management minimizes power usage in:

 Normal operation

 Standby (Sleep) modes

 Panel-Off Power-Saving Mode

• VESA standards supported

• Fully compatible with IBM® VGA

• Driver support for Windows XP, Windows 2000, Windows 98, Windows NT4.0

Attention!

When connecting or disconnecting the monitor, be very careful. Also hold the socket on the board at the same time to add stability.

6.2. Graphic Modes

Bios settings: 254MB video memory (shared)

Resolution Col. Dept. Frequency

800x600 16bit / 32bit 60Hz – 100Hz 1024x768 16bit / 32bit 60Hz – 100Hz 1152x864 16bit / 32bit 60Hz – 100Hz 1280x1024 16bit / 32bit 60Hz – 100Hz 1600x1200 16bit / 32bit 60Hz – 100Hz 1920x1440 16bit / 32bit 60Hz – 85Hz

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

7. VIDEO INPUT

The MSB900 contains a low-cost video input port. It consist of LX900’s video input port (VIP) and the external frame grabber chip SAA7111A. This port is capable of digitizing a CVBS video signal with 15 frames per second at a resolution of 352x288bits. Note that this frame rate is only achievable when the raw data stream is compressed before being stored on the hard drive. Driver support is currently available for the Windows XP platform.

8. DESCRIPTION OF THE CONNECTORS

Flat cable

• 44pin IDE is: IDT Terminal for Dual Row (2.00mm grid) and 1.00mm flat cable

• All others are: IDT Terminal for Dual Row 0.1" (2.54mm grid) and 1.27mm flat cable

• NC: not connected

Connector Structure Pin Remarks

X1 Power 2pin jack plug X14 Video Input SMA X15 Operator panel connector / Flat panel 44pin RM 2.0 Not assembled X20 Sound MIC stereo input 3.5mm jack plug X22 Sound speaker stereo output 3.5mm jack plug X31 Keyboard PS/2 and Mouse Utility connector PS/2 X33 LAN Port A RJ45 X34 LAN Port B RJ45 X39 COM2 serial interface connector 10pin RM 2.54mm X50 USB 0/1 connector Dual-USB X51 USB 2/3 connector Dual-USB X52 Socket for USB UDOC 10pin RM2.54mm Not assembled X60 IDE PATA connector 44pin RM 2.0 X61 COM1 and LPT connector 32pin RM 2.54mm X71 CompactFlash Socket 50pin

X101 PCI/104 expansion connector 120pin X110 POD-Port interface connector 14pin X120 MiniPCI socket 124pin X230 JTAG-Port 4 pin X301 DSUB VGA connector 15pin DSUB High-density

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

Top view of the MSB900/L

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

Bottom view of the MSB900/L

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X1 Power Supply

Pin Signal

1 (Shield) Power supply 8-30V 2 3 Power supply GND

X14 Video IN

Pin Signal Pin Signal

1 CVBS 2 GND

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X15 Operator Panel / Flat Panel (bottom side)

X15 is intended to be used internally to attach an operator panel. Some signals may not be present or are shared with other connectors. This connector is not assembled and is only for OEM-specific applications. A 2mm x 44pin header is needed.

Pin Signal

1 GND 2 VCC (+5V output) 3 LVDS YAM0 4 LVDS YAP0 5 GND 6 VCC (+5V output) 7 LVDS YAM1 8 LVDS YAP1

9 GND 10 VCC (+5V output) 11 LVDS YAM2 12 LVDS YAP2 13 GND 14 Enable VDD 15 LVDS CLKAP 16 LVDS CLKAM 17 CRT red 18 CRT green 19 CRT blue 20 CRT hsync 21 CRT vsync 22 CRT SCL 23 CRT SDA 24 GND 25 COM2 DCD 26 COM2 DSR 27 COM2 RXD 28 COM2 RTS 29 COM2 TXD 30 COM2 CTS 31 COM2 DTR 32 COM2 RI 33 SYS_RST# 34 VCC3 (+3.3V output) 35 USB D- 36 USB D+ 37 VCC3 (+3.3V output) 38 SMB SCL 39 SMB SDA 40 AVR PA0 41 AVR PA3 42 DCMAIN (filtered power input) 43 GND 44 VCC (+5V output)

Note...

VCC: max. 0.5 Amp VCC3: max. 0.5 Amp DCMAIN: DC supply input must be within the 8-30V range.

Attention!

If the VGA or COM2 signals on X15 are used, the X10 (VGA connector) or the X39 (COM2 connector) must not be connected.

Attention!

USB-signals on X15 are multiplexed with the USB-Port1. They must be enabled by soldering the two resistors.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X15 Reverse Pin Configuration MSB900 LVDS X15 (on component side)

Attention!

When X15 is soldered on the component side, a different pin numbering schema must be applied. Odd and even pin numbers are swapped. Ignoring this warning may result in the destruction

of any attached devices such as displays!

Pin Signal

1 VCC (+5V Output) 2 GND 3 LVDS_YAP0 4 LVDS_YAM0 5 VCC (+5V Output) 6 GND 7 LVDS_YAP1 8 LVDS_YAM1

9 VCC (+5V Output) 10 GND 11 LVDS_YAP2 12 LVDS_YAM2 13 Enable VDD 14 GND 15 LVDS_CLKAM 16 LVDS_CLKAP 17 CRT green 18 CRT red 19 CRT hsync 20 CRT blue 21 CRT SCL 22 CRT vsync 23 GND 24 CRT SDA 25 COM2 DSR 26 COM2 DCD 27 COM2 RTS 28 COM2 RXD 29 COM2 CTS 30 COM2 TXD 31 COM2 RI 32 COM2 DTR 33 VCC3 (+3.3V Output) 34 SYS_RST# 35 USB D+ 36 USB D37 SMB SCL 38 VCC3 (+3.3V Output) 39 AVR PA0 40 SMB SDA 41 DCMAIN (filtered power input) 42 AVR PA3 43 VCC (+5V Output) 44 GND

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X31 Keyboard PS/2 and Mouse Utility Connector

Connector and Adapter

Mini- DIN PS/2 (6 PC) Remarks

Shield Shield KEYBOARD DATA 1 GND 3 VCC (+5V) 4 CLK 5

Mini- DIN PS/2 (6 PC) Remarks

VCC (+5V) 4 MOUSE DATA 2 GND 3 CLK 6

PS/2 Front side (female)

X33 10/100 BASE-T Interface Connector 0

Pin Signal (CAT 5)

1 TX+ 2 TX3 RX+ 4 5 6 RX7 8

X34 10/100 BASE-T Interface Connector 1

Pin Signal

1 TX+ 2 TX3 RX+ 4 5 6 RX7 8

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X39 Serial Port COM2

Header onboard D-SUB connector Signal

Pin 1 Pin 1 DCD Pin 2 Pin 6 DSR Pin 3 Pin 2 RxD Pin 4 Pin 7 RTS Pin 5 Pin 3 TxD Pin 6 Pin 8 CTS Pin 7 Pin 4 DTR Pin 8 Pin 9 RI Pin 9 Pin 5 GND Pin 10 open

Attention!

If the X39 connector is used, DO NOT connect the COM2 signals on the X15 connector!

X50 USB 1 Connector (Dual-USB)

Pin Signal Remarks

1 VCC 2 USB-P1- 3 USB-P1+ 4 GND 5 VCC 6 USB-P27 USB-P2+ 8 GND

X51 USB 2 Connector (Dual USB)

Pin Signal Remarks

1 VCC 2 USB-P2- 3 USB-P2+ 4 GND 5 VCC 6 USB-P4- 7 USB-P4+ 8 GND

On MPC20/21, not assembled.

Pin 1 VCC Pin 2 USB-PPin 3 USB-P+ Pin 4 GND

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X52 USB UDOC (not assembled)

Pin Signal Pin Signal

1 VCC 6

2 3 USB-P2- 8

4 5 USB-P2+ 10

Attention!

X52 for USB-DOC-Flash drives are only for OEM use. The connector is not assembled. The UDOC may be assembled if the CompactFlash is not assembled.

X60 IDE Interface

Pin Signal Pin Signal

1 Reset (active low) 2 GND 3 D7 4 D8 5 D6 6 D9 7 D5 8 D10

9 D4 10 D11 11 D3 12 D12 13 D2 14 D13 15 D1 16 D14 17 D0 18 D15 19 GND 20 21 DREQ 22 GND 23 IOW (active low) 24 GND 25 IOR (active low) 26 GND 27 IORDY 28 ALE / Master-Slave 29 DACK 30 GND 31 IRQ14 32 33 ADR1 34 35 ADR0 36 ADR2 37 CS0 (active low) 38 CS1 (active low) 39 LED (active low) 40 GND 41 VCC Logic 42 VCC Motor 43 GND 44

7 GND

NC NC

(keypin) NC

NC NC

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X61 Serial Port COM1, Parallel Port LPT1

Header onboard D-SUB connector Signal

Pin 1 Pin 1 DCD Pin 2 Pin 6 DSR Pin 3 Pin 2 RxD Pin 4 Pin 7 RTS Pin 5 Pin 3 TxD Pin 6 Pin 8 CTS Pin 7 Pin 4 DTR Pin 8 Pin 9 RI Pin 9 Pin 5 GND Pin 10 GND Pin 11 select Pin 12 Pin 12 paper end Pin 13 Pin 11 busy Pin 14 Pin 10 acknowledge Pin 15 Pin 9 data 7 Pin 16 Pin 8 data 6 Pin 17 Pin 7 data 5 Pin 18 Pin 6 data 4 Pin 19 Pin 5 data 3 Pin 20 Pin 17 shift in Pin 21 Pin 4 data 2 Pin 22 Pin 16 init printer Pin 23 Pin 3 data 1 Pin 24 Pin 15 error Pin 25 Pin 2 data 0 Pin 26 Pin 14 auto feed Pin 27 Pin 1 strobe Pin 28 Pin 23-25 GND Pin 29 power supply GND Pin 30 power supply 8-30V Pin 29 power supply GND Pin 30 power supply 8-30V

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X101 PCI-104 BUS Interface

Pin A B C D

1 GND/5.0V KEY2 Reserved +5 AD00 2 VI/O AD02 AD01 +5V 3 AD05 GND AD04 AD03 4 C/BE0* AD07 GND AD06 5 GND AD09 AD08 GND 6 AD11 VI/O AD10 M66EN 7 AD14 AD13 GND AD12 8 +3.3V C/BE1* AD15 +3.3V 9 SERR* GND SB0* PAR 10 GND PERR* +3.3V SDONE 11 STOP* +3.3V LOCK* GND 12 +3.3V TRDY* GND DEVSEL* 13 FRAME* GND IRDY* +3.3V 14 GND AD16 +3.3V C/BE2* 15 AD18 +3.3V AD17 GND 16 AD21 AD20 GND AD19 17 +3.3V AD23 AD22 +3.3V 18 IDSEL0 GND IDSEL1 IDSEL2 19 AD24 C/BE3* VI/O IDSEL3 20 GND AD26 AD25 GND 21 AD29 +5V AD28 AD27 22 +5V AD30 GND AD31 23 REQ0* GND REQ1* VI/O 24 GND REQ2* +5V GNT0* 25 GNT1* VI/O GNT2* GND 26 +5V CLK0 GND CLK1 27 CLK2 +5V CLK3 GND 28 GND INTD* +5V RST* 29 +12V INTA* INTB* INTC* 30 -12V Reserved Reserved GND/3.3V KEY2

Notes:

1. The shaded area denotes power or ground signals.

2. The KEY pins are to guarantee proper module installation. Pin-A1 will be removed and the female side plugged for 5.0V I/O signals and Pin-D30 will be modified in the same manner for 3.3V I/O. It is highly recommended that both KEY pins (A1 and D30) be electrically connected to GND for shielding.

DLAG boards have them as NC (not connected).

X110 LPC-Port

Only for factory and POD-Diagnostic use.

Pin Signal Pin Signal

1 VCC 3.3V 2 LAD0 3 LFrame# 4 LAD1 5 PCI_RST# 6 LAD2 7 FWH_TBL# 8 LAD3

9 VCC 5V 10 PCI_RST# 11 LPC_Clock 12 nc 13 Ground 14 FWH_Control

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

X230 JTAG-Port

Pin Signal Pin Signal

1 TCK 2 TMS

3 TDI 4 TDO

X301 VGA Monitor (CRT-Signals)

15pins High-Density DSub Pin Signal

1 Red 2 Green 3 Blue 13 H-Synch 14 V-Synch 5 + 11 Bridged 5, 6, 7, 8 Grounded

The VGA-CRT signals from J2 must be wired to a standard VGA High Density DSub-connector (female):

The LCD signals must be wired panel-specific.

Solder-side view of the female 15pin HiDSub 1 2 3 4 5

Red Green Blue GND

6 7 8 9 10

GND

11 12 13 14 15

HSyn VSyn

Attention!

If the X10 connector is used, DO NOT connect the VGA signals on the X15 connector!

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

9. JUMPER LOCATIONS ON THE BOARD

The following figure shows the location of all jumper blocks on the MSB900/L board. The numbers shown in this figure are silk screened on the board so that the pins can easily be located. This chapter refers to the individual pins for these jumpers. The default jumper settings are indicated with asterisks.

Be careful: some jumpers are soldering bridges; you will need a miniature soldering station with a vacuum pump.

9.1. The Jumpers on MSB900/L

Settings written in bold are defaults.

Jumper Structure 1-2 / open 2-3 / closed

J1 CompactFlash master Slave J2 Autostart function Enabled N/A J3 Disconnect Battery J4 Disconnect CMOS EEPROM

1) With the autostart function enabled, the system will start booting up within 2 seconds after the power supply is turned on.

Disabled Disabled

Master

N/A N/A

Remarks

9.2. Reload Default BIOS Settings

To reload default BIOS settings when the system refuses to boot after defective BIOS settings have been made please proceed as follows.

• Turn off the system.

• Remove J3 on MSB900 or disconnect the optional external battery on the MSB900L.

• Remove J4.

• Turn on the system and enter the BIOS setup menu.

• Close J4 and J5 or attach the optional external battery.

• Choose save and exit in the BIOS setup menu.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

c d

10. CABLE INTERFACES

10.1. The Hard Disk Cable 44pin

IDT Terminal for Dual Row (2.00mm grid) and 1.00mm flat cable; 44pins = 40pins signal and 4pins power.

1 1 2

39 39

Max. length for the IDE cable is 30cm.

Attention!

Check the pin 1 marker of the cable and the connector before you power-on. Refer to the technical manual of the installed drives because a wrong cable will immediately destroy the drive and/or the MICROSPACE MSB900/L board. In this case the warranty is void! Without the technical manual you may not connect this type of drive.

The 44pin IDE connector on the drives is normally composed of the 44 pins, 2 open pins and 4 test pins, 50 pins in total. Leave the 4 test pins unconnected.

40 40

43434444

Testpin

open pin

1 3 43a b

44pin IDE Interface with integrated power lines

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

10.2. The COM1/LPT Serial Interface Cable

Terminal for dual row 2mm grid and 1mm flat cable.

Connector X61

Pin Signal COM1 9pin D-Sub male

Pin 1 = DCD 1 Pin 2 = DSR 6 Pin 3 = RXD 2 Pin 4 = RTS 7 Pin 5 = TXD 3 Pin 6 = CTS 8 Pin 7 = DTR 4 Pin 8 = RI 9 Pin 9 = GND 5 Pin 10

Pin Signal LPT1 25pin D-Sub female

Pin 11 = SELECT 13 Pin 12 = Paper end 12 Pin 13 = Busy 11 Pin 14 = Acknowledge 10 Pin 15 = Data 7 9 Pin 16 = Data 6 8 Pin 17 = Data 5 7 Pin 18 = Data 4 6 Pin 19 = Data 3 5 Pin 20 = Shift in 17 Pin 21 = Data 2 4 Pin 22 = Init 16 Pin 23 = Data 1 3 Pin 24 = Error 15 Pin 25 = Data 0 2 Pin 26 = Autofeed 14 Pin 27 = Strobe 1 Pin 28 = GND 18-25

Attention!

• Do not short circuit these signal lines.

• Never connect any pins on the same plug or to any other plug on the MICROSPACE

MSB900/L. The +/-10 Volts will immediately destroy the MICROSPACE core logic. In this case the warranty is void!

• Do not overload the output; the maximum output of the current converters is 10mA.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

10.3. The COM2 Serial Interface Cable

DT terminal for dual row 0.1" (2.54mm grid) and 1.27mm flat cable.

Connector X39

Pin Signal COM2 9pin D-Sub male

Pin 1 = DCD 1 Pin 2 = DSR 6 Pin 3 = RXD 2 Pin 4 = RTS 7 Pin 5 = TXD 3 Pin 6 = CTS 8 Pin 7 = DTR 4 Pin 8 = RI 9 Pin 9 = GND 5 Pin 10

Attention!

• Do not short circuit these signal lines.

• Never connect any pins on the same plug or to any other plug on the MICROSPACE

MSB900/L. The +/-10 Volts will immediately destroy the MICROSPACE core logic. In this case the warranty is void!

• Do not overload the output; the maximum output of the current converters is 10mA.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

11. THERMAL SPECIFICATIONS

11.1. Thermal Analysis for Case Integration

The MSB900/L has a unique thermal design. Heat sources are located on the bottom side of the PCB.

Usually this means the board will be mounted upside down with the CPU thermally in contact with a heat sink. Alternatively, the CPU will be in contact with the system enclosure which then works as a heat sink.

The LX900 CPU is rated with a Total Dissipated Power (TDP) of 3.8W maximum and 1.6W typical @ 600 MHz.

The following picture is a thermal analysis of the bottom side. It was taken after one hour of operating (BIOS screen) at room temperature. There was no heat sink mounted on the CPU.

CPU

[MHz]

600 12

Uin [V] T

CPUmax

[°C] T

CS5536max

[°C]

Pay particular attention when mounting the PC-product in a fully enclosed case/box. The thermal energy will be stored in the interior of this environment.

If the case has a fan:

• The hot air must be exchanged with cool air from outside using a filtered fan.

• The hot air must be cooled with a heat exchanger.

If the case has no fan or opening to exchange hot air:

• The heat sink of the CPU must be mounted directly to a heat sink integrated in the case. The heat will be conducted directly through the alloy of the heat sink to the outside.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

12. ASSEMBLY VIEWS

12.1. MSB900/L

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

12.2. Mechanical Dimensions

MSB900 Version

Unit: mm (millimeter) Tolerance: +/- 0.1mm

Date: 28.03.2006 Author: BRR

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

13. PXE-BOOT AND PXE-SETUP IN THE BIOS

PXE Protocol PXE is defined on a foundation of industry-standard Internet protocols and services that are widely deployed in the industry, namely TCP/IP, DHCP, and TFTP. These standardize the form of the interactions between clients and servers. To ensure that the meaning of the client-server interaction is standardized as well, certain vendor option fields in DHCP protocol are used, which are allowed by the DHCP standard. The operations of standard DHCP and/or BOOTP servers (that serve up IP addresses and/or NBPs) will not be disrupted by the use of the extended protocol. Clients and servers that are aware of these extensions will recognize and use this information, and those that do not recognize the extensions will ignore them.

In brief, the PXE protocol operates as follows. The client initiates the protocol by broadcasting a DHCPDISCOVER containing an extension that identifies the request as coming from a client that implements the PXE protocol. Assuming that a DHCP server or a Proxy DHCP server implementing this extended protocol is available, after several intermediate steps, the server sends the client a list of appropriate Boot Servers. The client then discovers a Boot Server of the type selected and receives the name of an executable file on the chosen Boot Server. The client uses TFTP to download the executable from the Boot Server. Finally, the client initiates execution of the downloaded image. At this point, the client’s state must meet certain requirements that provide a predictable execution environment for the image. Important aspects of this environment include the availability of certain areas of the client’s main memory, and the availability of basic network I/O services.

Deployment of servers

On the server end of the client-server interaction there must be available services that are responsible for providing redirection of the client to an appropriate Boot Server. These redirection services may be deployed in two ways:

1. Combined standard DHCP and redirection services.

The DHCP servers that are supplying IP addresses to clients are modified to become, or are replaced by servers that serve up IP addresses for all clients and redirect PXE-enabled clients to Boot Servers

Preboot Execution Environment (PXE) Specification 11

This diagram illustrates the relationship between the NBP (the remote boot program) and the PXE APIs.

as requested.

2. Separate standard DHCP and redirection services.

PXE redirection servers (Proxy DHCP servers) are added to the existing network environment. They respond only to PXE-enabled clients, and provide only redirection to Boot Servers. Each PXE Boot Server must have one or more executables appropriate to the clients that it serves.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

BIOS-Setup Screen with the LAN-BOOT (PXE) DISABLE / ENABLE menu:

After ENABLING the LAN-Boot, the Password must be entered.

The Password must be requested with the PXE-licence order form on the following page.

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

14. PXE-LICENSE ORDER

The PXE-Function must be licensed before it can be enabled. To order, fill out and sign this form; return to the fax number below. This form may be printed out separately from the digital copy of this manual on the Product CD.

Note... One license per form

Each computer system requires an individual, one-time royalty payment for the PXE-license. After

receipt of payment, you will be emailed the password necessary to enable the PXE-Function (see Section 13).

Customer Information:

Company Name:

Your Name:

Street Address:

ZIP / City:

Email:

Information for the PXE-License:

Product

MPC20

MPC21/A

Price per license

For each additional license, please fill out another form.



Currency

(circle one)

USD

Euro

CHF

23 USD

17 Euro

28 CHF

Date: Signature:

dd / mm / yyyy

Fax this form to your DIGITAL-LOGIC Sales Manager:

(please write in his/her name)

Fax: +0041 32 681 58 01

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

15. INDEX

10/100 BASE-T Interface 47

Addressing PCI Devices 23 Application Notes 16, 22

Battery-Lifetime 23 BIOS CMOS 29 BIOS History 24 BIOS, Reload Default Settings 53 Block Diagram 13 Boot Time 25 Bus Signals 23

CMOS 29 CMOS Setup 34 Connectors 41 Controllers 27 Counters 28 CPU 26

Dimensions & Diagrams 17 Disclaimer 5 DRAM 26

I/O Map 36 IDE interface 15 IDE Interface 49 Incompatibilities 22 Interfaces 15, 26 Interrupt Controllers 27 ISO 9001:2000 11

JTAG-Port 52 Jumper Locations 53

Keyboard PS/2 26, 47

LCD TFT Interface 45 LPC-Port 51 LPT1 26

Manual, How to Use It 2 Mechanical Dimensions 61 memory address MAP 35 Memory Map 35 Mouse Utility Connector 47 MSM800-LVDSCON 21

EEPROM Memory for Setup 35 EMI / EMC 16 Environmental Protection Statement 5 External battery assembling 23

Features, Standard 12 Features, Unique 12 Floppy disk 15 Floppy Disk Interface 27

Graphic Modes 40

Hard Disk Cable 55

Ordering Codes 16

Parallel Port 50 PCI-104 BUS Interface 51 power 25 Power Requirements 25 Power Supply 44 Printer 26 PS/2 47 PXE-Boot 62 PXE-License Order 64 PXE-Setup 62

Radiation 22 RAM Map 29 Recycling Information 6

DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0

RoHS Commitment 9 ROM-BIOS 28 RTC 28

Safety Precautions 9 Schematics 59 Serial Interface Cable 56, 57 Serial Port COM1 50 Serial Port COM2 48 Serial Ports 27 Specifications 14 SQS 11 Standards 8 Swiss Association for Quality and Management

Systems 11 Swiss Quality 11 Symbols 7 System Description 25

Technical Support 6 Thermal Specifications 58 Timers 28 Trademarks 5

UDOC 44, 49 USB 48

VGA 40 VGA Monitor 52 Video Input 41

Warranty 6 Watchdog 28

Compaq MSB900L, MSB900 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. PREFACE

1.1. Trademarks

1.2. Disclaimer

1.3. Environmental Protection Statement

1.4. Who should use this Product

1.5. Recycling Information

1.6. Technical Support

1.7. Limited Two Year Warranty

1.8. Explanation of Symbols

1.9. Applicable Documents and Standards

1.10. For Your Safety

1.11. RoHS Commitment

1.11.1. RoHS Compatible Product Design

1.11.2. RoHS Compliant Production Process

1.11.3. WEEE Application

1.12. Swiss Quality

2. OVERVIEW

2.1. Standard Features of the MSB900/L

2.2. Unique Features

2.3. MSB900 Block Diagram

2.4. MSB900/MSB900L specifications

2.5. Examples of Ordering Codes

2.6. Related Application Notes

2.7. Dimensions & Diagrams

2.7.1. MSB900/L

2.7.2. MSB800CON Part Nr 802205

2.8. MSB900/L Incompatibilities to a standard PC/AT

2.9. Related Application Notes

2.10. High Frequency Radiation (to meet EN55022)

2.11. Battery-Lifetime

2.11.1. External battery assembling (for the MSB900L):

3. BUS SIGNALS

3.1. Addressing PCI Devices

3.1.1. MSB900 and MSB900L

4. BIOS HISTORY

5. DETAILED SYSTEM DESCRIPTION

5.1. Power Requirements

5.2. Boot Time

5.3. CPU, Boards and RAMs

5.3.1. CPUs of this MICROSPACE Product

5.3.2. Numeric Coprocessor

5.3.3. DDRAM Memory

5.4. Interfaces

5.4.1. Keyboard AT compatible and PS/2 Mouse

5.4.2. Line Printer Port LPT1

5.4.3. Serial Ports COM1-COM2

5.4.4. Floppy Disk Interface

5.5. Controllers

5.5.1. Interrupt Controllers

5.6. Timers and Counters

5.6.1. Programmable Timers

5.6.2. RTC (Real Time Clock)

5.6.3. Watchdog

5.6.4. ROM-BIOS Sockets

5.6.4.1. Standard BIOS ROM

5.6.5. BIOS CMOS Setup

5.7. CMOS RAM Map

5.8. EEPROM saved CMOS Setup

5.8.1. EEPROM Memory for Setup

5.9. Memory & I/O Map

5.9.1. System Memory Map

5.9.2. System I/O map

6. VGA

6.1. VGA/LCD Controller of the Geode LX900

6.2. Graphic Modes

7. VIDEO INPUT

8. DESCRIPTION OF THE CONNECTORS

9. JUMPER LOCATIONS ON THE BOARD

9.1. The Jumpers on MSB900/L

9.2. Reload Default BIOS Settings

10. CABLE INTERFACES

10.1. The Hard Disk Cable 44pin

10.2. The COM1/LPT Serial Interface Cable

10.3. The COM2 Serial Interface Cable

11. THERMAL SPECIFICATIONS

11.1. Thermal Analysis for Case Integration