THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
A
B
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
Title
Size Doc ument NumberRe v
Cus tom
D
Date:Sheetof
Compal Electronics, Inc.
Cover Sheet
LA-5251P
E
147Tues day, January 05, 2010
0.9
A
Compal Confidential
File Name : LA-5251P
B
C
Swatch UMA
D
XDP Conn.
Page 4
E
Accelerometer
LI S30 2DLTR
11
Display port panel
Page 20
PEG-eDP
Mobile
Auburndale CPU
BG A 1288pins
DD R3-SO-DIMM X 2DDR3 1066/1333MHz 1.5V
BANK 0 , 1, 2, 3
Fan Control
Page 9,10
Page 24
Page 4
Dual Channel
VGA
Page 18
Display port
22
Express Card 54
PCIE *1 + USB *1
Page 23
10/100/1 000 LAN
Intel Hanksville GbE
PHY
Page 21
Page 18
WLAN Card
PCIE*1
Page 22
WWAN
+SIM Card
USB*1
Ri co R5C835
RGB
DDI_D
Page 23
USB2.0
PCI-E BUS
Controller
Page 25
DDI
PCI BUS
FDI
Intel Ibex Peak M
10 71pi ns
25mm*27mm
Page 12,13,14,15,16,17
Br aidwood
RJ45 CONN
33
Page 21
1394 port
Page 25
Smart Card
Page 25
SD/MM C Slot
Page 32
Page 4,5,6,7,8
DM I X4
ONFI Interface
Page 23
DDI_B
USB2.0
Azalia
SATA0
SATA1
SATA3
DP *1(Docking)
Page 29
USB *1(Docking)
Page 29
USB conn*1(Left side)
Page 24
FingerPrinter Validity VFS451
USB*1
Page 32
USB conn x 3(For I/O)-Rear side, Power USB
BT Conn USB x 1
USB x1(Camara)
MD C V1.5
Page 20
Page 28
Audio CKT
IDT 92HD75
SATA ODD Connector
Page 26
Page 22
AMP & Audio Jack
Thermal Se nsor
EMC 2 113
Page 4
CK505
Clock Generator
SL G8SP5 85V TR
Page 11
daughter board Module
Page 24
RJ11
Page 28
TPA6047A4RHBR
Page 27
NAND F lash Card
Page 23
LPC BUS
1.8" SAT A HDD Connector
Page 22
RTC CKT.
Page 12
Power OK CKT.
44
Power On/Off CKT.
Page 33
Page 28
LED
LED Board
Page 28
Touch Pad CONN.
Page 28
SMSC KBC 1098
page 30
Int.KBD
Page 28
TPM1.2
SLB9635TT
Page 32
SATA*1(Doc king)
Page 29
Page 29
Docking CONN.
(2) USB 1.channels
(1) Display Port Channels
(1) Line In
(1) Line Out
(1) RJ45 (10/100/1000)
(1) V GA
(1) 2 LAN indicator LED's
(1) Power Button
(1) SATA
TrackPoint CONN.
DC/DC Interface CKT.
Page 34
A
SP I ROM
Page 28
8 M B
Page 31
B
Secur ity Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
D
Title
Size Doc ument NumberRe v
Cus tom
Date:Sheetof
Compal Electronics, Inc.
Block Diagram
LA-5251P
E
247Tues day, January 05, 2010
0.9
A
Voltage Rails
State
S0
S1
S3
S5 S4/AC
S5 S4/ Battery only
S5 S4/AC & Battery
don't exist
11
( O MEANS ON X MEANS OFF )
+RTCVCC
power
plane
O
O
O
O
O
O
+B
+3VL+0.75V
O
O
O
O
O
X
+5VALW
+3VALW
O
O
O
O
X
XXX
+3VM
+1.05VM
O
O
O
O
X
X
+1.5V
O
XX
X
+5VS
+3VS
+1.5VS
+VCCP
+CPU_CORE
+1.05VS
+1.8VS
OO
OO
X
X
Symbol Note :
: means Digital Ground
: means Analog Ground
@ : means just reserve , no build
CONN@ : means ME part.
SV@ : means just build on SV Sku. LV Sku no build.
LV@ : means just build on LV Sku. SV Sku no build.
Lay out Note s
L
01/ 04 up da te
: Q ues ti on Are a Mark. (Wa it ch eck )
Install below 45 level BOM structure for ver. 0.1
45@ : means just put it in the BOM of 45 level.
Install below 43 level BOM structure for ver. 0.1
DEBUG@ : means just build when PCIE port 80 CARD function enable.
Remove before MP
SMBUS Control Table
SOURCE
SMB_EC_CK1
SMB_EC_DA1
SMBCLK
SMBDATA
SML0CLK
SML0DATA
SML1CLK
SML1DATA
SMSC1098
Calpella
Calpella
Calpella
BATT
V
X
X
X
THERMAL
SODIMM CLK CHIP
XDPG-SENSOR
X
XX
VV
X
X
XX
MINI CARD
X
VV
X
X
XX
DOCK
X
V
X
X
SENSOR
NIC
XX
X
V
X
X
X
V
X
V
X
V
Secur ity Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2008/09/152010/12/31
A
Compal Secret Data
Deciphered Date
Title
Size Doc ument NumberRe v
Cus tom
Date:Sheetof
Compal Electronics, Inc.
Notes List
LA-5251P
347Tues day, January 05, 2010
0.9
12
1.5K _0402 _1%
12
12
12
12
1
12
12
12
12
T48PA D
R1 4
12
0_02 01_5%
R1 5
12
0_02 01_5%
R1 7
12
0_02 01_5%
R1 8
12
0_02 01_5%
R1 9
12
0_02 01_5%
R2 1
0_02 01_5%
R2 2
12
0_02 01_5%
R2 6
12
0_02 01_5%
R3 2
12
12
750_ 0402_1%
R2 01 K_02 01_5%@
H_CO MP3
R220_0 402_1%
H_CO MP2
R520_0 402_1%
H_CO MP1
R749.9 _0402 _1%
H_CO MP0
R949.9 _0402 _1%
TP_ SKTOCC#
H_ CATE RR#
H_P ECI_I SO
H_ PRO CHOT# _D
H_T HERM TRIP# _R
H_ CPUR ST#_ R
H_ PM_ SYNC _R
SYS _AGE NT_P WROK
VC CPW RGOO D_0
VD DPW RGO OD_R
0_02 01_5%
H_ PWRG D_XD P_RH_P WRGD _XDP
PLT _RST#_R
R3 3
12
R3 5
+VC CP
AD71
AC70
AD69
AE66
M71
N61
N19
N67
N17
N70
M17
AM7
Y67
AM5
H15
Y70
G3
VD DPW RGO OD_R
Processor Pullups
H_ PRO CHOT# _D
H_ CPUR ST#_ R
U1 B
COMP3
COMP2
COMP1
COMP0
PROC_DETECT
CATERR#
PECI
PROCHOT#
THERMTRIP#
RESET_OBS#
PM_SYNC
VCCPWRGOOD_1
VCCPWRGOOD_0
SM_DRAMPWROK
VTTPWRGOOD
TAPPWRGOOD
RSTIN#
INT EL_A UBURN DALE _1288
07 /08 u pda te fo r I NTEL S3 le aka ge issue.
07 /1 7 upd at e f or va lue chan ge back
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
ES1 sa mple n eed ne gative voltage
ES2 sa mple c ontact to GND
12
CFG4-D isplay Port Presence
1: Dis abled ; No Physical Display Port
attach ed to Embedded Display Port
CFG4
0: Ena bled; An external Display Port
device is c onnected to the Embedded
Display Port
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
4
Title
Size D ocum ent N umberR ev
Cu sto m
Da te:She eto f
Compal Electronics, Inc.
Auburndale(3/5)-DDR3
LA -52 51P
5
64 7Tues day, Jan uary 05, 2010
0. 9
DD
C1 9
1U_0 402_6 .3V4Z
1U_0 402_6 .3V4Z
1U_0 402_6 .3V4Z
10U_ 0805_ 6.3V6M
C2 14
C2 18
C3 80
1
2
C3 5
1
2
10U_ 0805_ 6.3V6M
47P _0402_50 V8J
C6 1
1
+
2
1
2
1
2
1
2
10U_ 0805_ 6.3V6M@
1U_0 402_6 .3V4Z
+VC CP
C5 4
@
C9 73
1U_0 402_6 .3V4Z
1U_0 402_6 .3V4Z
1U_0 402_6 .3V4Z
C3 0
1
2
+GF X_CORE
09 /22 u pd ate
1
+
C9 74
2
330U _V_2VM _R6M
C2 13
C2 17
C2 21
1
2
1U_0 402_6 .3V4Z
C3 6
1
2
11 /13 u pd ate
22U_ 0805_ 6.3V6M
C6 2
1
2
47P _0402_50 V8J
U1 G
AN32
330U _V_2VM _R6M
VAXG1
AN30
VAXG2
AN28
VAXG3
AN26
VAXG4
AN24
VAXG5
AN23
VAXG6
AN21
VAXG7
AN19
VAXG8
AL32
VAXG9
AL30
VAXG10
AL28
VAXG11
AL26
VAXG12
AL24
VAXG13
AL23
VAXG14
AL21
VAXG15
AL19
VAXG16
AK14
VAXG17
AK12
VAXG18
AJ10
VAXG19
AH14
VAXG20
AH12
VAXG21
AF28
VAXG22
AF26
VAXG23
AF24
VAXG24
AF23
VAXG25
AF21
VAXG26
AF19
VAXG27
AF17
VAXG28
AF15
VAXG29
AF14
VAXG30
AD28
VAXG31
AD26
VAXG32
AD24
VAXG33
AD23
VAXG34
AD21
VAXG35
AD19
VAXG36
AD17
VAXG37
W21
VTT1_1
W19
VTT1_2
U21
10U_ 0805_ 6.3V6M
VTT1_3
U19
VTT1_4
U17
C3 1
VTT1_5
U15
VTT1_6
U14
VTT1_7
U12
VTT1_8
R21
VTT1_9
R19
VTT1_10
R17
VTT1_11
AK62
VCAP2_1
AK60
VCAP2_2
AK59
1
VCAP2_3
AH60
VCAP2_4
AH59
VCAP2_5
AF60
VCAP2_6
2
AF59
VCAP2_7
AD60
VCAP2_8
AD59
VCAP2_9
AB60
VCAP2_10
AB59
VCAP2_11
AA60
VCAP2_12
AA59
VCAP2_13
W60
VCAP2_14
W59
VCAP2_15
U60
VCAP2_16
U59
VCAP2_17
R60
VCAP2_18
R59
VCAP2_19
INT EL_A UBURN DALE _1288
04/ 29 Ch ang e C55, C56,C5 7 from
@47 P_0 402 to 1UF_ 040 2 by HP.
0112 a dd 7pc s Caps to fo llow D esign guide0112 a dd 7pc s Caps to fo llow D esign guide
2.2U _0402 _6.3V4M
1
1
C6 9
C7 0
2
2
2.2U _0402 _6.3V4M
3
2.2U _0402 _6.3V4M
1
1
C7 1
C7 2
2
2
2.2U _0402 _6.3V4M
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
1
1
C1 41
C1 90
2
2
1U_0 402_6 .3V6K
1
1
C3 06
C1 92
2
2
1U_0 402_6 .3V6K
1U_0 402_6 .3V6K
1
1
C3 07
2
2
1U_0 402_6 .3V6K
1U_0 402_6 .3V6K
1
C5 13
2
1U_0 402_6 .3V6K
CPU CORE
1U_0 402_6 .3V6K
1
C2 01
2
1U_0 402_6 .3V6K
1
C3 05
2
1U_0 402_6 .3V6K
1
C5 11
C5 12
2
1U_0 402_6 .3V6K
1
1
C6 28
C6 36
2
2
+C PU_C ORE
22U_ 0805_ 6.3V6MS V@
C7 3
1
2
C9 5
470U _D2_2 VM_R4.5 MSV@
1
+
2
22U_ 0805_6. 3V6M
C1 01
1
2
BGA Ball Cracking Prevention and Detection
100K _0201_5 %
VSS _NCT F1_R5
100K _0201_5 %
VSS _NCT F6_R5VSS _NCT F7_R5
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
22U_ 0805_6. 3V6M
C7 4
1
2
22U_ 0805_6. 3V6M
22U_ 0805_6. 3V6M
C7 6
C7 5
1
1
2
2
22U_ 0805_6. 3V6M
22U_ 0805_6. 3V6M
C7 8
C7 7
1
1
2
2
Inside cavity
470U _D2_2 VM_R4.5 M
C9 7
C9 6
1
1
+
+
2
2
22U_ 0805_6. 3V6M
C1 03
22U_ 0805_ 6.3V6MS V@
C1 02
1
1
2
1
2
2
05 /0 6 upd ate t o c hange
C9 8
C95 ,C9 6,C 97,C98 f rom
1
SGA 000 02X 00( 330 U_7mR) to
+
SGA 000 042 00( 470U_4 .5mR)
2
1- SV BGA 4x 470uF bu lk on C95, C96,C 97,C98
L
2- LV BG A 3 x33 0uF 9mR (SG A20 331 E10 ) bul k on C96,C 97,C98
Under cavity
22U_ 0805_6. 3V6M
C1 05
C1 04
22U_ 0805_ 6.3V6MS V@
1
1
2
2
22U_ 0805_6. 3V6M
C1 06
22U_ 0805_ 6.3V6MS V@
1
2
470U _D2_2 VM_R4.5 M
470U _D2_2 VM_R4.5 M
Under cavity
+3VS
12
R8 0
+3VS+3VS
R8 1
4
12
CRA CK_B GA
3
Q3B
5
2N70 02DW -T/R7 _SOT363-6
4
CRA CK_B GA
61
Q4A
2N70 02DW -T/R7 _SOT363-6
2
VSS _NCT F2_R5
Title
Size D ocum ent N umberRe v
Cu stom
Da te:She et
22U_ 0805_6. 3V6M
C1 08
+3VS
22U_ 0805_6. 3V6M
22U_ 0805_6. 3V6M
C8 0
1
1
2
2
22U_ 0805_6. 3V6M
C1 09
1
2
12
2
12
5
C8 2
C8 1
1
2
22U_ 0805_6. 3V6M
C1 10
1
2
61
Q3A
2N70 02DW -T/R7 _SOT363-6
CRA CK_B GA
3
Q4B
2N70 02DW -T/R7 _SOT363-6
4
22U_ 0805_6. 3V6M
C7 9
1
2
22U_ 0805_ 6.3V6MS V@
C1 07
1
2
R7 9
100K _0201_5 %
R8 2
100K _0201_5 %
Compal Electronics, Inc.
Auburndale(5/5)-GND/Bypass
LA -5 251 P
5
22U_ 0805_6. 3V6M
SV@
22U_ 0805_ 6.3V6M
C8 3
1
1
2
2
CRA CK_B GA 17, 30
o f
84 7Tues day, Jan uary 05, 2010
C8 4
0. 9
1
DDR3 SO-DIMM B
+V _DD R_CP U_REF
0.1U _0402 _16V4Z
2.2U _0805 _16V4Z
C1 11
1
2
AA
BB
CC
DD
C1 12
1
2
DDR_ CKE2 _DIM MB6
DD R_B_B S26
M_ CLK_ DDR26
M_ CLK_D DR#26
DD R_B_B S06
DD R_B _WE#6
DD R_B_ CAS#6
DDR_ CS3_ DIMM B#6
+3VS
DD R_B _D0
DD R_B _D1
DD R_B_ DM0
DD R_B _D2
DD R_B _D3
DD R_B _D8
DD R_B _D9
DD R_B_ DQS# 1
DD R_B _DQS 1
DD R_B _D10
DD R_B _D11
DD R_B _D16
DD R_B _D17
DD R_B_ DQS# 2
DD R_B _DQS 2
DD R_B _D18
DD R_B _D19
DD R_B _D24
DD R_B _D25
DD R_B_ DM3
DD R_B _D26
DD R_B _D27
DDR_ CKE2 _DIM MB
DD R_B_ BS2
DDR_ B_MA 12
DDR_ B_M A9
DDR_B_MA8
DDR_ B_M A5
DDR_ B_M A3
DDR_ B_M A1
M _CLK_ DDR2
M _CLK_ DDR#2
DDR_ B_MA 10
DD R_B_ BS0
DD R_B _WE#
DD R_B_ CAS#
DDR_ B_MA 13
DDR_ CS3_ DIMM B#
DD R_B _D32
DD R_B _D33
DD R_B_ DQS# 4
DD R_B _DQS 4
DD R_B _D34
DD R_B _D35
DD R_B _D40
DD R_B _D41
DD R_B_ DM5
DD R_B _D42
DD R_B _D43
DD R_B _D48
DD R_B _D49
DD R_B_ DQS# 6
DD R_B _DQS 6
DD R_B _D50
DD R_B _D51
DD R_B _D56
DD R_B _D57
DD R_B_ DM7
DD R_B _D58
DD R_B _D59
12
10K _0201_5%
2.2U _0402 _6.3V6M
0.1U _0402 _16V4Z
C1 36
C1 37
1
1
2
2
+1.5 V+ 1.5V
3A@
3A@1.5V
3A@3A@
JDI MB1
1
VREF_DQ
3
VSS
5
DQ0
7
DQ1
9
VSS
11
DM0
13
VSS
15
DQ2
17
DQ3
19
VSS
21
DQ8
23
DQ9
25
VSS
27
DQS1#
29
DQS1
31
VSS
33
DQ10
35
DQ11
37
VSS
39
DQ16
41
DQ17
43
VSS
45
DQS2#
47
DQS2
49
VSS
51
DQ18
53
DQ19
55
VSS
57
DQ24
59
DQ25
61
VSS
63
DM3
65
VSS
67
DQ26
69
DQ27
71
VSS
73
CKE0
75
VDD
77
NC
79
BA2
81
VDD
83
A12/BC#
85
A9
87
VDD
89
A8
91
A5
93
VDD
95
A3
97
A1
99
VDD
101
CK0
103
CK0#
105
VDD
107
A10/AP
109
BA0
111
VDD
113
WE#
115
CAS#
117
VDD
119
A13
121
S1#
123
VDD
125
TEST
127
VSS
129
DQ32
131
DQ33
133
VSS
135
DQS4#
137
DQS4
139
VSS
141
DQ34
143
DQ35
145
VSS
147
DQ40
149
DQ41
151
VSS
153
DM5
155
VSS
157
DQ42
159
DQ43
161
VSS
163
DQ48
165
DQ49
167
VSS
169
DQS6#
171
DQS6
173
VSS
175
DQ50
177
DQ51
179
VSS
181
DQ56
183
DQ57
185
VSS
187
DM7
189
VSS
191
DQ58
193
R9 5
12
10K _0201_5%
R9 6
DQ59
195
VSS
197
SA0
199
VDDSPD
201
SA1
203
VTT
205
GND1
207
GND2
FOX _AS0 A626-U4 SN-7F~D
CO NN@
Bo tt om S ide H :5. 2mm
L
1.5V
1.5V1.5V
DQS0#
DQS0
DQ12
DQ13
RESET#
DQ14
DQ15
DQ20
DQ21
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
CKE1
CK1#
RAS#
ODT0
ODT1
VREF_CA
DQ36
DQ37
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
EVENT#
BOSS1
BOSS2
VSS
DQ4
DQ5
VSS
VSS
DQ6
DQ7
VSS
VSS
DM1
VSS
VSS
VSS
DM2
VSS
VSS
VSS
VSS
VSS
VDD
A15
A14
VDD
A11
A7
VDD
A6
A4
VDD
A2
A0
VDD
CK1
VDD
BA1
VDD
S0#
VDD
NC
VDD
VSS
VSS
DM4
VSS
VSS
VSS
VSS
VSS
VSS
DM6
VSS
VSS
VSS
VSS
VSS
SDA
SCL
VTT
Wai t u pdate t he sym bo l for co rrect (LTCX 001 HL00)
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Pla ce R1094, R10 95 close to JDIM A1 pi n1 with C1 38,C13 9
L
4/ 24 Ne w add R1 094 , R10 95, R1 096 an d the V ref
cir cui t for DI MM A Ref V olt age.
+V _DDR _CPU_ REF_ A
12
Pla ce R1096 clo se to J DIM A1 pin12 6 w it h C 143,C 144
L
Lay ou t N ot e:
Pl ace near JDI MA1
10U_ 0603_ 6.3V6M
1
2
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
4
Title
Size D ocum ent N umberR ev
Da te:She eto f
Compal Electronics, Inc.
CLOCK GENERATOR
LA -52 51P
5
1147T uesda y, J anuar y 05 , 201 0
0. 9
1
PCH _RTCX 1
32.7 68KH Z_12. 5PF_ Q13MC14 610002
PCH _RTCX 2
1
C1 82
18P _0402_5 0V8J
2
KBC _SPI _SI_R
PCH _JTA G_TCK
HDA _BIT _CLK_ MDC28
HDA _BIT _CLK_ CODE C26
HD A_S YNC _MDC28
HD A_S YNC _CO DEC2 6
HD A_SP KR2 6
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
4/2 3 C hange R1 87, R188 f rom 4 .7K_02 01
to 2.2K_0402 .
07 /03 u pd ate
Q8A
2N70 02DW -T/R7 _SOT363- 6
SM BCLK
61
+3VS
SMBDA TASMB _DATA_S3
3
2N70 02DW -T/R7 _SOT363- 6
2N70 02DW -T/R7 _SOT363- 6
SML 1CLK
+3V ALW
SML 1DATA
4
XTA L25_IN
XTAL25 _OUT
SMB _CLK_S 3
2
5
4
Q8B
Q2A
12
61
0_02 01_5%
R2 63
2
5
R2 64
12
3
2N70 02DW -T/R7 _SOT363-6
0_02 01_5%
Q2B
12
R2 101M_0 402_5%
12
25MHZ_20PF_7A25000012
C1 99
1
18P _0402_50 V8J
2
Y3
SM BCLKSMB _CLK_S 3
+3VS
SMBDA TA
SML 0CLK
SML 0DATA
SML 1CLK
SML 1DATA
SML 0ALERT#
SML 1ALERT#
SMB _CLK_S3 4 ,9,10 ,11,24
SMB_ DATA_S3 4 ,9,10 ,11, 24
CAP _CLK 2 8,30
CAP _DAT 2 8,30
C2 00
1
18P _0402_5 0V8J
2
12
R1 842.2K _0402_ 5%
12
R1 862.2K _0402_ 5%
12
R1 872.2K _0402_ 5%
12
R1 882.2K _0402_ 5%
12
R1 894.7K _0201_ 5%
12
R1 914.7K _0201_ 5%
12
R1 9210K_ 0201_5%
12
R1 9410K_ 0201_5%
5
+3V ALW
6/1 6 R eserve ba ck th e 2 5MH z des ig n c ircui t. (Reser ve Y3 ,
R21 0,C 199 ); Move R10 93 to cl ose to Y3 and C199.
7/1 De l T12 2, Del R 1093 (0_040 2) and r epl ace b y a dd C2 00
(18 P); Inst all R210, Y3,C1 99 by Intel finalize d DP
wo rk ar ou nd an d n ee d the m.
DD
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
PC I_I RDY #25
PC I_PA R25
PCI _DEV SEL#2 5
PCI _FRA ME#25
PCI _STOP#25
PC I_T RDY#25
PC I_P IRQD #
PCI _PIRQ E#
PCI _STOP#
PCI _REQ 2#
PCI _REQ 1#
PCI _FRA ME#
PC I_ TRDY#
PC I_I RD Y#
PC I_P ERR#
PCI _DEV SEL#
PC I_S ERR#
PCI _REQ 0#
PCI _PIRQ B#
OD D_DE T#
PCI _REQ 3#
PCI _GNT 3#
PLT_R ST#4,12 ,21, 22,23, 31
18
27
36
45
18
27
36
45
18
27
36
45
18
27
36
45
12
R3 001K_0 201_5% @
BB
10 /21 u pd ate
AA
PC I_A D0
PC I_A D1
PC I_A D2
PC I_A D3
PC I_A D4
PC I_A D5
PC I_A D6
PC I_A D7
PC I_A D8
PC I_A D9
P CI_AD 10
P CI_AD 11
P CI_AD 12
P CI_AD 13
P CI_AD 14
P CI_AD 15
P CI_AD 16
P CI_AD 17
P CI_AD 18
P CI_AD 19
P CI_AD 20
P CI_AD 21
P CI_AD 22
P CI_AD 23
P CI_AD 24
P CI_AD 25
P CI_AD 26
P CI_AD 27
P CI_AD 28
P CI_AD 29
P CI_AD 30
P CI_AD 31
PCI _PIRQ A#
PCI _PIRQ B#
PC I_P IRQC #
PC I_P IRQD #
USB 20_N0 24
USB 20_P0 2 4
USB 20_N1 24
USB 20_P1 2 4
USB 20_N2 24
USB 20_P2 2 4
USB 20_N3 24
USB 20_P3 2 4
USB 20_N4 23
USB 20_P4 2 3
USB 20_N8 24
USB 20_P8 2 4
USB 20_N9 23
USB 20_P9 2 3
USB 20_N1 0 31
USB 20_P10 31
USB 20_N1 1 29
USB 20_P11 29
USB 20_N1 2 20
USB 20_P12 20
12
R2 59 22. 6_0402 _1%
R2 65
08 /25 u pd ate
12
0_04 02_5%
PCI _GNT 0#
MOD EM_DIS ABLE
BT_ OFF 2 4
FP R_O FF 31
PRE P# 18, 21,29
LA NLIN K_R# 2 1,30
+3VS
07/ 08 up dat e for INT EL
S3 l eaka ge is sue .
CPP E# 23
R2 671K_ 0201_5%@
12
R2 711K_ 0201_5%@
12
07 /09 u pda te fo r I NTEL S3 le aka ge issue.
GPI O15
R3 0210K _0201_5%LV@
12
09 /12 u pd ate
CP U Type Det ect : Hi gh--> SV , Low -->LV
L
12
R2 880_02 01_5%
+3VS
5
U1 0
1
P
IN1
4
O
2
IN2
G
SN7 4AHC1 G08D CKR_S C70- 5@
3
R2 5010K_ 0201_5%
WWA N_TR ANSM IT_O FF#23,2 8
06 /16 u pd ate
CLK _PCIE _LAN _REQ#21
PCH _XDP _GPIO49
WLA N_TRA NSM IT_OFF#22
PLT_ RST#
3
12
PCH _XDP _GPIO0
OC P#4 1
RU NSC I_E C#30
THE RM_S CI#4
PC H_D DR_R ST4
LA N_DI S#21
ALS _EN#20
WW AN_D ET#23
NPC I_RST #30
WEB CAM _ON20
DO CK_ ID029
DO CK_ ID129
+3V ALW
PC H_N CTF617
PC H_N CTF717
PC H_NC TF191 7
PC H_NC TF261 7
Danbur y Technology Enable
NV_ALE High=Endabled
NV_ ALE
DMI Te rmination Voltage
NV_CLE Set to Vss when LOW
NV _CLE
3
PCH _XDP _GPIO0
RU NSC I_E C#
THE RM_S CI#
PC H_D DR_R ST
GPI O15
PCH _XDP _GPIO16
ALS _EN#
WW AN_D ET#
GPI O24
WWA N_TR ANSM IT_O FF#
PCH _XDP _GPIO28
STP _PCI#
SAT A_CLK REQ#
WEB CAM _ON
DO CK _ID0
DO CK _ID1
CLK _PCIE _LAN _REQ#
10K _0201_5%
R4 30
12
GPI O48
PCH _XDP _GPIO49
WLA N_TRA NSM IT_OFF#
Low=Di sable (@)
+V_ NVRA M_VCCQ
12
R2 841K_ 0201_5%@
Set to Vcc when HIGH
12
R2 971K_ 0201_5%@
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
4
Title
Size D ocum ent N umberR ev
Cu sto m
Da te:She eto f
Compal Electronics, Inc.
IBEX-M(6/6)-GND
LA -52 51P
5
1747T uesda y, J anuar y 05 , 201 0
0. 9
1
2
3
4
5
CRT Connector
AA
F1
1.1A _6VD C_FU SE
1
2
12
R5 7
2.2K _0402 _5%
1
2
+3VS
C2 99
0.1U _0402 _16V4Z
CR T_D DC_CL K 14
CR T_DDC _DAT A 14
D_ DDC CLK 2 9
D_ DDCD ATA 2 9
+3VS
PRE P# 15, 21,29
Pla ce close to JCRT 1 f or EMI b ackup solu tion .
VGA _RED
V GA_G RN
VGA _BLUE
R3 22150_ 0402_1%@
R3 23150_ 0402_1%@
12
12
L
R3 160_04 02_5%
12
R3 170_04 02_5%
12
R3 180_04 02_5%
R3 24150_ 0402_1%@
12
10P _0402_5 0V8J@
10P _0402_5 0V8J@
C2 96
C2 95
1
1
2
2
12
10P _0402_5 0V8J@
C2 97
1
2
11 /27 u pd ate
Pla ce R325,R 326,C3 00, C301 c lo ce to JP 30 (Docking Conn .)
L
HS Y NCD_ HS YN C
R3 250_06 03_5%
12
V SY NC
R3 260_06 03_5%
12
C3 00
5P_ 0402_50 V8C
1
2
D_ VSY NC
1
C3 01
5P_ 0402_50 V8C
2
75_0 402_1%
75_0 402_1%
C3 20
C3 21
1
1
2
2
11 /27 u pd ate
V GA_RE D_R
V GA_G RN_R
VGA _BLU E_R
75_0 402_1%
C3 15
1
2
D_ HS YNC 2 9
D_ VSY NC 29
PRE P#: DOCK --> L
PRE P#: UNDOC K --> H
RE D_R14
GR EEN _R14
BL UE_R1 4
DO CK_ RED2 9
DO CK_ GRN29
DO CK_B LU2 9
BB
CC
CR T_H SYN C1 4
CR T_V SYN C14
RE D_R
GR EE N_R
B LUE_R
DO CK _RED
DO CK _GRN
DO CK_ BLU
VGA _RED
V GA_G RN
VGA _BLUE
CR T_H SY NC
CR T_V SYN C
HS Y NC
V SY NC
U1 3
3
4
5
18
16
14
17
15
13
6
7
11
12
MAX48 85EETG+T_ TQFN24_4X4
ES D d esign insi de U13 alre ady
VCC
R0
MAX4885E
G0
B0
R1
G1
B1
R2
G2
B2
H0
V0
H1
V1
VL
SCL0
SDA0
SCL1
SDA1
SCL2
SDA2
EN
SEL
GND
EP
11 /06 u pd ate
CR T_D DC_C LK
CR T_DD C_DA TA
+5VS
C2 98
0.1U _0402 _16V4Z
8
9
CR T_D DC_C LK
2
CR T_DD C_DA TA
1
D_ DDC CLK
20
D_ DDC DATA
22
VG A_D DC_CL K
19
VGA _DDC _DATA
21
R3 1910K_ 0402_5%
12
23
PRE P#
24
10
25
+3VS
12
R5 3
2.2K _0402 _5%
21
D4
CH 491D _SC59
21
C2 94
0.1U _0402 _16V4Z
VGA _DDC _DATA
VG A_D DC_CL K
1
2
+C RTVD D+R CRT_ VCC+5VS
W=40mi ls
JC RT1
6
11
1
7
12
2
8
13
3
9
14
16
G
4
17
G
10
15
5
SU YIN_ 07054 6FR01 5S23 3ZR
CO NN@
DD
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
4
Title
Size D ocum ent N umberR ev
Da te:She eto f
Compal Electronics, Inc.
CRT Connector
LA -5 251 P
5
1847T uesda y, J anuar y 05 , 201 0
0. 9
5
08 /28 u pd ate
DD
DC A D
R3 460_02 01_5%
12
12
R3 48
1M_ 0402_5%
06 /18 u pd ate
0_06 03_5%
12
CC
+3VS
R3 49
4
+5V ALW+5VAL W
R3 42
10K _0201_5%
12
61
2N70 02DW H 2N SOT3 63-6
2
Q16 A
+3V S_DP_ F
NAN OSMD C050F 0.5 A 13. 2V P OLY- FUSE
21
F2
12
3
5
4
+3V S_DP
C3 08
0.1U _0402 _16V4Z
C3 09
1
2
R3 43
10K _0201_5%
D DC_ ENDP_E N
Q16 B
2N70 02DW H 2N SOT3 63-6
10U_ 0805_ 10V4Z
1
2
3
DPD _CTRL DATA14
DP D_CT RLCLK14
6/ 16 u pd ate
100K _0201_5 %@
DPD _AUX#14
DPD _AUX14
DPD _AUX#
DPD _AUX
100K _0201_5 %@
2N70 02DW H 2N SOT3 63-6
D DC_ EN
2N70 02DW H 2N SOT3 63-6
DP D_CT RLCL KDPD _C_A UX
D DC_ EN
+3VS
R3 38
12
R3 44
12
2
Q13A
61
2
Q14A
61
2
2
2N70 02DW H 2N SOT3 63-6
2N70 02DW H 2N SOT3 63-6
61
Q15A
5
3
4
Q15B
Q13B
2N70 02DW H 2N SOT3 63-6
3
4
5
Q14B
2N70 02DW H 2N SOT3 63-6
3
4
5
DP _EN
61
2N70 02DW -7-F_S OT363-6
DP _EN
3
2N70 02DW -7-F_S OT363-6
Q30A
Q30B
1
+3VS
6/ 16 u pd ate
R3 32
100K _0201_5%
12
DPD _C_AU X#DPD _CTRL DATA
R3 37
100K _0201_5 %
12
2
5
4
DPD_T XP01 4
DPD _TXN014
DPD_T XP11 4
DPD _TXN114
DPD_T XP21 4
DPD _TXN214
DPD_T XP31 4
DPD _TXN314
BB
R3 51
5.1M _0402_5%
AA
5
DPD_ TXP0
DPD _TXN0
DPD_ TXP1
DPD _TXN1
DPD_ TXP2
DPD _TXN2
DPD_ TXP3
DPD _TXN3
DC A D
DPD _C_A UX
12
DPD _C_AU X#
DP D_H PD_ R
+3V S_DP
4
JD P1
1
LAN0+
2
LAN0_shield
3
LAN0-
4
LAN1+
5
LAN1_shield
6
LAN1-
7
LAN2+
8
LAN2_shield
9
LAN2-
10
LAN3+
11
LAN3_shield
12
LAN3-
13
CA_DET
14
GND
15
AUX_CH+
16
GND
17
AUX_CH-
18
HP_DET
19
RTN
20
DP_PWR
MOLEX _105088-0001
CO NN@
GND
GND
GND
GND
24
23
22
21
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
R1 076
100K _0402_5 %
2008/09/152010/12/31
12
Compal Secret Data
+5VS
5
3
4
2N70 02DW H 2N SOT3 63-6
Q46B
12
R1 055
@
0_04 02_5%
Deciphered Date
2
DP D_H PDDP D_H PD_ R
DP D_H PD 14
Title
Size D ocum ent N umberR ev
Da te:She eto f
Compal Electronics, Inc.
Display Port Connector
LA -5 251 P
1
1947T uesda y, J anuar y 05 , 201 0
0. 9
DDI PANEL CONN.
1
2
3
4
5
Web camera POWER CIRCUIT
AA
1
C3 11
2
ALS _EN#15
INV _PWM14
WEB CAM _ON15
12
WCM -2012-9 00T_4P
4
1
L18
@
12
D1 2
2
CH1
1
VN
CM1 213-02S R_SOT143- 4@
+L CDV DD
3
3
2
2
CH2
VP
1
2
C3 12
680P _0402_50V 7K
INV _PWM
WEB CAM _ONWEBCA M_ON _R
+5V _WEBCAM
12
1
2
3
4
+5VS
0_08 05_5%
R3 740_04 02_5%
R3 75
+5V_K L
INV _PWM
R3 72
22_0 402_5%
11 /11 u pd ate
C6 65
220P _0402_25V
R3 76
0_04 02_5%
09 /28 u pd ate
B+IN VPWR _B+
220K _0402_5%@
100K _0402_1%@
12
R1 105
R1 106
+3VS IN VPWR _B++L CDV DD
12
12
DI SP_O FF#
USB 20_P 12_R
USB 20_N1 2_R
MB_ DP_AUX N
MB_ DP_AUXP
12
12
C9 75
0.22 U_060 3_25V7K@
07 /03 u pd ate
JE DP1
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
+3VS
R5 69
100K _0402_5 %
12
R6 13
100K _0402_5 %
12
06 /16 u pd ate
Q78
SI2 301CD S-T1-GE 3 1P SOT 23-3@
12
47P _0402_50 V8J@
1
MB_ DP_AUXP
3
MB_ DP_AUX N
5
7
9
11
13
15
17
19
21
23
25
27
MB_ HPD
29
3132
ACE S_88 242-3001_30PC ONN @
2
WEB CAM _ON_R
D
S
13
G
2
C9 76
1U_0 603_25V 7K@
+3VS
12
C3 10
680P _0402_50V 7K
BB
CC
DD
USB 20_P1215
USB 20_N1 21 5
47P _0402_5 0V8J@
R3 580 _0402_5 %
4
1
R3 590 _0402_5 %
USB 20_N1 2_RUSB 20_P 12_R
IN VPWR _B+
1
C3 13
2
12
R3 650_04 02_5%
61
Q18A
2N70 02DW -T/R7 _SOT363-6
R6 16
100K _0402_5 %
12
12
HCB 2012K F-121T 50_0805
12
1
C3 14
680P _0402_50V 7K
2
MB_DP _AUXP 5
MB_ DP_AUXN 5
MB_ DP_DATA 0_P 5
MB_ DP_DA TA0_N 5
L17
MB_ DP_H PD 5
B+
Keyboar d Light circuit
+3VS
12
R3 56
10K _0402_5%@
DI SP_O FF#
1
C3 26
680P _0402_5 0V7K
2
Q23
SI2 301CD S-T1-GE 3 1P SOT 23-3
D
13
2
R3 62
12
2K_ 0402_5%
ENA BLT
LCD POWER CIRCUIT
EN AVD D14
12
100K _0402_1 %
10K _0402_5%
3
Q56B
Q18B
R3 77
LI D_SW #
5
G
S
12
R3 57
100K _0402_1 %
2N70 02DW -T/R7 _SOT363- 6
+5VS+5V_K L+5VS
R1 49
2N70 02DW H 2N SOT3 63-6
ENAB LT 14
+5VS
+L CDV DD
12
R3 69
100_ 0201_1%
3
5
4
2
IN
12
+3V ALW
2
61
2N70 02DW H 2N SOT3 63-6
Q56A
4
Clo se to JED P1.24
L
R3 040_06 03_5%
12
06 /16 u pd ate
47K _0402_5%
R3 71
12
1
0.1U _0402 _16V4Z
OUT
Q20
DTC 124EK AT146_SC 59-3
GND
3
R3 66
12
DI SP_O FF#LI D_SW #
1
C3 23
2
Pla ce R366 c lo se to Q5 6.
L
12
R3 61
0_04 02_5%@
100K _0402_5 %
D5 7
21
CH75 1H-4 0PT_S OD323-2
47P _0402_5 0V8J
C3 16
C3 17
1
@
2
D
13
G
2
R3 701M_0 402_5%
1
C3 24
4.7U _0805 _10V4Z
2
LID_ SW#_ ISO# 1 3
08 /25 u pd ate
+5V _WEBCAM
0.1U _0402 _16V4Z
C3 18
1
2
1 2
4.7U _0805 _10V4Z
C3 19
1
2
4.7U _0805 _10V4Z
C3 25
@
0.01 U_040 2_16V7K
1
2
Q19
S
SI2 301CD S-T1-GE 3 1P SOT 23-3
12
C3 220.1U _0402 _16V4Z
LI D_SW # 28,3 0
+3VS+L CDV DD
1
2
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
4
Title
Size D ocum ent N umberRe v
Da te:She eto f
Compal Electronics, Inc.
LCD CONN & Q-Switch & GPIO Ext.
LA -52 51P
5
2047T uesd ay, J anua ry 05 , 20 10
0. 9
1
2
3
4
5
+3VM
R3 82
0_06 03_5%
12
0.1U _0402 _16V4Z
AA
C3 27
1
C3 28
2
10U_ 0805_ 10V4Z
+3VM _LAN
1
2
0.1U _0402 _16V4Z
07 /01 u pd ate
CLK _PCIE _LAN _REQ1 #13
CLK _PCIE _LAN _REQ#15
PLT_R ST#4,12 ,15, 22,23, 31
CLK _PCIE _LAN15
CLK _PCIE _LAN #15
PCIE _PRX_DTX _P613
PCI E_PRX_D TX_N613
PCI E_PTX _C_DRX_P613
PCI E_PT X_C_DRX_N 613
SML 0CLK13
SML0D ATA13
Y4
12
LA N_DIS #15
LA NLIN K_R#1 5,30
10P _0402_5 0V8J
2
1
BB
XTAL1_C
25MHZ_20PF_7A25000012
2
C3 41
33P _0402_50 V8J
1
CC
04/ 25 Del ete T RM_ CT, R407, R40 8. lea ve U14 -6 NC.
Add 1uF C339 d ecoup li ng cap t o TRM _CTR.
DD
@
@
C4 11
XTAL1
12
XTAL2
C3 42
33P _0402_50 V8J
10 /01 u pd ate
R4 070_04 02_5%
12
R3 880_02 01_5%
R3 89
C3 36
C3 37
R3 90
R3 91
R3 94
0_02 01_5%
R2 61
10K _0201_5%
R3 98
R4 00
10K _0201_5%
12
12
0_02 01_5%
0.1U _0402 _16V7K
1 2
1 2
0.1U _0402 _16V7K
12
12
12
12
0_02 01_5%
@
12
12
12
R4 031K_ 0201_5%
12
R4 043.01 K_040 2_1%
1 2
C3 46 0.1 U_040 2_16V7K
1 2
C3 49 0.1 U_040 2_16V7K
1 2
C3 52 0.1 U_040 2_16V7K
1 2
C3 54 0.1 U_040 2_16V7K
1
C3 39
1U_0 603_1 0V4Z
2
@
PLT _RST#_L AN
PCI E_PRX _C_DTX_P6
PCI E_PR X_C_DTX_ N6
0_02 01_5%
0_02 01_5%
LAN LINK _STATUS #
XTAL1
XTAL2
LAN _SM_C LK
LAN _SM_DAT
LA N_P HYP C_R
LAN _ACT#
T85PA D
T86PA D
LAN_ JTAG_TMS
LAN _JTAG _TCK
LA N_MD I0N
LAN _MDI0 P
TRM _CTR
LA N_MD I1N
LAN _MDI1 P
TRM _CTR
LA N_MD I2N
LAN _MDI2 P
TRM _CTR
LA N_MD I3N
LAN _MDI3 P
TRM _CTR
+1.0 VM_LAN
1
C3 34
2
04 /2 0 Canc el +1 .0 VM_ LAN from +3 VM reserv e
cir cui t for L AN Lay out P laceme nt is sue i mpr ov e.
05/ 06 In sta ll C4 1(3 30U _2V _B2 _15 mR) b y HP requ est.
U1 4
48
CLK_REQ_N
36
PE_RST_N
44
PE_CLKP
45
PE_CLKN
38
PETp
39
PETn
41
PERp
42
PERn
28
SMB_CLK
31
SMB_DATA
3
LAN_DISABLE_N
26
LED0
27
LED1
25
LED2
32
JTAG_TDI
34
JTAG_TDO
33
JTAG_TMS
35
JTAG_TCK
9
XTAL_OUT
10
XTAL_IN
30
TEST_EN
12
RBIAS
WG8 2577L M QL MG A3 QFN 48P
TAI MAG I H-037-2
12
TD4-
11
TD4+
10
TCT4
9
TD3-
8
TD3+
7
TCT3
6
TD2-
5
TD2+
4
TCT2
3
TD1-
2
TD1+
1
TCT1
1
C3 35
2
10U_ 0805_6. 3V6M
1
C4 1
+
330U _B2_2V M_R15M
2
MDI
PCIE
RSVD_VCC3P3_1
RSVD_VCC3P3_2
SMBUS
JTAGLED
1:1
1:1
1:1
1:1
1
R3 85
0_06 03_5%
12
MDI_PLUS0
MDI_MINUS0
MDI_PLUS1
MDI_MINUS1
MDI_PLUS2
MDI_MINUS2
MDI_PLUS3
MDI_MINUS3
VDD3P3_IN
VDD3P3_OUT
VDD3P3_15
VDD3P3_19
VDD3P3_29
VDD1P0_47
VDD1P0_46
VDD1P0_37
VDD1P0_43
VDD1P0_11
VDD1P0_40
VDD1P0_22
VDD1P0_16
VDD1P0_8
CTRL_1P0
VSS_EPAD
T47
2
+1.0 5VM_LA N
LAN _MDI0 P
13
LA N_MD I0N
14
LAN _MDI1 P
17
LA N_MD I1N
18
LAN _MDI2 P
20
LA N_MD I2N
21
LAN _MDI3 P
23
LA N_MD I3N
24
6
VCT
R3 923.01 K_040 2_1%
1
12
R3 933.01 K_040 2_1%
2
12
5
+3.3 VM_LA N_OUT
4
+3.3 VM_L AN_OUT_ R
15
19
29
47
46
37
+1.0 VM_LAN 3
43
+1.0 VM_LAN 2
11
40
22
16
8
LAN _CTRL _10
7
49
13
MX4-
14
MX4+
15
MCT4
16
MX3-
17
MX3+
18
MCT3
19
MX2-
20
MX2+
21
MCT2
22
MX1-
23
MX1+
24
MCT1
MDO 0-
MDO 0+
MCT0
MDO 1-
MDO 1+
MCT1
0.01 U_040 2_50V7K
MDO 2-
MDO 2+
MCT2
0.01 U_040 2_50V7K
MDO 3-
MDO 3+
MCT3
0.01 U_040 2_50V7K
12
R3 950_06 03_5%
12
R3 960_06 03_5%
12
R3 990_06 03_5%
12
R4 010_06 03_5%
12
R4 020_06 03_5%
0.01 U_040 2_50V7K
+3VM _LAN
1
C3 38
1U_0 603_1 0V4Z
2
+1.0 VM_LAN+3VM _LAN
T115 P AD
04/ 20 Te st Po int reserve .
MDO 0- 29
1 2
1 2
1 2
1 2
R4 09
75_0 402_1%
12
R4 12
75_0 402_1%
12
R4 13
75_0 402_1%
12
R4 14
75_0 402_1%
12
1000 P_1808_3K V7K
MDO 0+ 29
C3 47
MDO 1- 29
MDO 1+ 29
C3 50
MDO 2- 29
MDO 2+ 29
C3 53
MDO 3- 29
MDO 3+ 29
C3 55
C3 48
LA N_DI S#
2
R2 62
12
0_02 01_5%
+3VM _LAN+3V M_LAN_L ED
12
R3 97
100K _0402_5 %
PRE P#15, 18,29
1
2
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
61
2N70 02DW T/R7 _SOT-363 -6
S
Q2 2
G
SI2 301CD S-T1-G E3 1P SO T23-3
2
3
2N70 02DW T/R7 _SOT-36 3-6
5
4
LAN LINK _STATUS #LA NLIN K_R#
Q9A
D
13
Q9B
+3VM _LAN
R4 05
LAN _ACT#
R4 10
10K _0402_5%
LAN LINK _STATUS #
Deciphered Date
12
+3V M_LAN_L ED
R4 06300_ 0603_5%
2
1
+3VM _LAN
12
C3 45
@
680P _0402_5 0V7K
12
+3V M_LAN_L ED
R4 11300_ 0603_5%
12
2
C3 51
@
680P _0402_50V 7K
1
4
10K _0402_5%
LAN _ACT#29
LAN LINK_ STATUS #29
2008/09/152010/12/31
Compal Secret Data
11 /03 u pd ate
M/ E Des ign c hange
DC2 340 03O0 0(TYCO_200 6067-1 _13P) to
DC0 209 102 01( FOX _JM361 11-R222 5-7H_1 3P-T)
JR J45
11
Yellow LED+
12
Yellow LED-
MDO 3-
MDO 3+
MDO 1-
MDO 2-
MDO 2+
MDO 1+
MDO 0-
MDO 0+
8
7
6
5
4
3
2
1
9
10
DETECT PIN1
PR4-
PR4+
PR2-
PR3-
PR3+
PR2+
PR1-
PR1+
Green LED+
Green LED-
FOX _JM3 6111-R222 5-7H
CO NN@
Size D ocum ent Numbe rRe v
Da te:She eto f
3
Title
SHLD1
SHLD1
2
D1 3
PJS OT05C_SO T23-3
@
1
Compal Electronics, Inc.
LA -52 51P
13
14
15
Intel 82566 Nineveh
5
2147T uesda y, J anuar y 05 , 201 0
0. 9
1
+1.5V S+3V_ WLAN
0.1U _0402 _16V4Z
0.01 U_040 2_16V7K
C3 56
AA
1
2
07 /01 u pd ate
10K _0201_5%@
MC2 _DISA BLE30
BB
XMI T_D_OFF #
4.7U _0805 _10V4Z
C3 57
C3 58
1
1
2
2
+3V ALW
12
R4 22
21
D1 4C H751H -40P T_SOD32 3-2
C3 59
1
2
R4 25
12
220K _0402_1%
0.01 U_040 2_16V7K
C3 62
0.1U _0402 _16V4Z
C3 60
1
2
0.1U _0402 _10V6K@
1
2
2
4.7U _0805 _10V4Z
C3 61
1
2
Q24
31
SI2 305DS-T1 -E3_SOT23 -3
12
R1 190_06 03_5%
WLA N_TRA NSM IT_OFF# 15
+3V _WLAN
39P _0402_5 0V8J
1
C6 29
C4 43
@
2
39P _0402_5 0V8J
+3V _WLAN
1
@
2
2
PCI E_WA KE#14,23
CL KREQ _WLA N#1 3
CLK _PCIE _MCA RD#13
CLK _PCIE _MCA RD13
10 /19 u pd ateLClo se to C 443
CL K_PCI _DB15, 31
PCI E_PRX_D TX_N41 3
PCIE _PRX_DTX _P41 3
PCI E_PT X_C_DRX_N 41 3
PCI E_PTX _C_DRX_P413
CL _CLK113
CL_D ATA113
CL_R ST1#1 3
CL _CLK 1
CL_D ATA1
CL_R ST#1
PCI E_WA KE#
CLK _PCIE _MCA RD#
CLK _PCIE _MCA RD
R4 77
12
0_04 02_5%
R4 230_02 01_5%
12
R4 240_02 01_5%
12
R4 260_02 01_5%
R4 270_02 01_5%
R4 280_02 01_5%
12P _0402_50 V8J
@
C5 39
12
12
12
CL K_PC I_DE BUG
1
2
3
R4 530_0 402_5%
PC I_S ERR# _R
WW _LE D#SIR Q
8051TX_ R
DEB UG_K BCRS T_R
DEG _FRA ME#
DE BUG_ AD3
DE BUG_ AD2
DE BUG_ AD1
DE BUG_ AD0
06/ 25 Del JHDD1 and JHDD2 Cab le de sig n. Ad d JHD D3 B to B dir ect ly connect d esign .
CC
DD
JH DD 3
17
GND
18
GND
19
GND
1
GND
A+
A-
GND
B-
B+
GND
V33
V33
GND
GND
V5
V5
R
Rsv1
Rsv2
FOX _LM25163- BA01-9HCON N@
1
SATA_ PTX_C_DRX _P0SATA_ PTX_DRX_P0
2
SA TA_PTX_C _DRX_N0
3
4
SA TA_PRX_C _DTX_N0S ATA_PRX_ DTX_N0
5
SATA_ PRX_C_DTX _P0SATA_ PRX_DTX_P0
6
7
8
9
10
11
12
13
14
15
16
+3VS
+3VS
1
C3 72
2
10U_ 0805_ 10V4Z
1 2
1 2
1 2
1 2
0.1U _0402 _16V4Z
1
C3 73
2
C3 74
0.1U _0402 _16V4Z
C3 650.0 1U_04 02_16V7K
SATA_ PTX_DRX_ N0
C3 670.0 1U_04 02_16V7K
C3 690.0 1U_04 02_16V7K
C3 700.0 1U_04 02_16V7K
0.1U _0402 _16V4Z
1
C3 75
2
SATA_ PTX_DRX_P0 1 2
SATA_ PTX_DRX_ N0 12
SATA_ PRX_DTX_ N0 12
SATA_ PRX_DTX_P0 1 2
1
2
2
7/1 Up date JOD D1 PCB Foot print f rom AL LTO_C 185 22- 113 03-L_1 3P_NR to T YCO_20 23233-3 _13P_N R
JO DD1
TYC O_202 3233- 3_NRC ONN @
1
GND
A+
A-
GND
B-
B+
GND
DP
V5
V5
MD
GND
GND
3
SATA_ PTX_C_DRX _P1
2
SA TA_PTX_C _DRX_N1
3
4
SA TA_PRX_C _DTX_N1
5
SATA_ PRX_C_DTX _P1
6
7
Issued Date
R4 290_02 01_5%@
12
+5VS
2008/09/152010/12/31
8
9
10
11
12
13
Security Classification
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
PC I_PA R1 5
PCI _FRA ME#15
PC I_T RDY#15
PC I_I RDY #1 5
PCI _STOP#15
PCI _DEV SEL#1 5
PC I_PE RR#15
PC I_SE RR#1 5,22, 30,31
PC I_RE Q2#15
PCI _GNT2 #1 5
PCI _RST#15 ,22
R4 5710K_ 0201_5%@
12
R4 580_02 01_5%
12
R4 5910K_ 0201_5%
12
R4 600_02 01_5%
12
12
R4 62 10K _0402_5%
PC I_PI RQE#15
PC I_PI RQG#1 5
R4 6510K_ 0201_5%
12
+3VS
12
R4 66100K _0201_5%
SMART Card Connector
JP1 6
1
1
2
2
SC_ RST
3
3
4
4
S C_CLK
5
GND
GND
CO NN@
5
SC_ DATA
6
6
7
7
8
8
SC _CD #
9
9
10
10
11
12
DD
ACE S_85 201-1005N
+S C_PW R
1
+S C_PW R
1
C4 53
2
0.1U _0402 _16V4Z
P CI_AD 31
P CI_AD 30
P CI_AD 29
P CI_AD 28
P CI_AD 27
P CI_AD 26
P CI_AD 25
P CI_AD 24
P CI_AD 23
P CI_AD 22
P CI_AD 21
P CI_AD 20
P CI_AD 19
P CI_AD 18
P CI_AD 17
P CI_AD 16
P CI_AD 15
P CI_AD 14
P CI_AD 13
P CI_AD 12
P CI_AD 11
P CI_AD 10
PC I_A D9
PC I_A D8
PC I_A D7
PC I_A D6
PC I_A D5
PC I_A D4
PC I_A D3
PC I_A D2
PC I_A D1
PC I_A D0
PCI _CBE 3#
PCI _CBE 2#
PCI _CBE 1#
PCI _CBE 0#
P CI_PA R
PCI _FRA ME#
PC I_ TRDY#
PC I_I RD Y#
PCI _STOP#
PCI _DEV SEL#
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
04 /23 Ad d Q28 to prev ent +5 VS fr om leaki ng throu gh Q2 7.
SC VCC 3EN#
12
+3VS
R1 08810 0K_0 402_5%
1U_0 402_6 .3V4Z
2N70 02DW H 2N SOT3 63-6
SC VCC 3EN#
R1 091
12
SC VCC 5EN#
100K _0402_5 %
C4 48
R1 090
100K _0402_5 %
Q51A
2
+3VS
1
2
+5VS
12
61
2
31
Q28
AP2 309A GN-HF_SO T23-3
11 /13 u pd ate
+5VS
1
C9 67
1U_0 402_6 .3V4Z
R1 089
12
47K _0402_5%
2
2
31
Q27
AP2 301GN -HF_SOT 23-3
31
Q5 7
AP2 301GN -HF_SO T23-3
2
2
C9 69
1U_0 402_6 .3V4Z
1
+5VS
Pull-downPull-upPull-upEnable serial EEPROM
Pull-upPull-upPull-upEnsable MS,xD Card,disable serial ROM
UD IO5
UD IO3
UD IO4
R4 73100K _0201_5%
12
R4 7910K_ 0201_5%
12
R4 8210K_ 0201_5%
Title
Size D ocum ent N umberRe v
Cu stom
Da te:She eto f
12
Compal Electronics, Inc.
1394+2 in 1 Card
LA -5 251 P
5
+3 V_PH Y
0.01 U_040 2_16V7K
+3VS
1000 P_0402_50 V7K
1
2
C4 29
+S C_PW R
C9 68
1
1U_0 402_6 .3V4Z
2
2547T uesd ay, J anua ry 05 , 20 10
0. 9
5
+V DDA_ CODE C
R4 83
10K _0201_5%
12
HP_ DET
R5 10
100K _0201_1 %
HD A_SP KR
R6 14
20K _0201_1%
3
Q36B
5
2N70 02DW H 2N SOT3 63-6
4
R5 07
20K _0201_1%
61
Q36A
2
2N70 02DW H 2N SOT3 63-6
2
5
5
61
3
4
DD
CC
BB
L
LINE _OUT _SENSE29
AA
HD A_SP KR1 2
MIC _SENS E27
+V DDA _CODE C
R5 00
10K _0201_1%
HP_ DET27
1 2
C4 70 0.1U _0805_ 25V7M
1 2
C4 73 0.1U _0805_ 25V7M
1 2
C4 75 0.1U _0805_ 25V7M
1 2
C4 78 0.1U _0805_ 25V7M
PJP 603
12
PAD -OPE N 4x 4m
Pl ace PJP6 03 b etw een DG ND and A GND by
3vi as an d 8 0 m ils s hap e bri dg e f or ESD.
12
R5 15
12
100K _0201_1 %
LINE _IN_ SENS E29
C4 56
0.1U _0402 _16V7K
12
61
Q29A
2N70 02DW H 2N SOT3 63-6
2
3
Q29B
2N70 02DW H 2N SOT3 63-6
5
4
SEN SE_A
12
SEN SE_B
12
HD A_S DIN01 2
LINE _OUT _SENS E#
Q32A
2N70 02DW H 2N SOT3 63-6
LINE _IN_ SENS E#
Q32B
2N70 02DW H 2N SOT3 63-6
1 2
+V DDA_ CODE C
R4 84
12
300K _0201_5 %
07 /24 u pd ate
+3VS
C4 89 10P _0402_25V 8K@
HDA _BIT _CLK_ CODE C12
HD A_S DOUT_ CODE C1 2
R4 99
33_0 201_1%
HD A_S YNC _CO DEC1 2
HD A_RS T#_CO DEC12
R5 1139.2 K_040 2_1%
R5 1439.2 K_040 2_1%
R4 87
10K _0201_5%
12
12
R7 03
4.7K _0201_5 %
HD A_RS T#_C ODEC
1
C6 37
0.01 U_040 2_16V7K
2
12
12
C4 941U_0 603_16V 7_X7R
C4 9710U_ 0805_16 V6K_X5R
12
C5 00100 0P_0402_ 50V7K_X7R
1 2
R5 12
R5 13
12
C5 01100 0P_0402_ 50V7K_X7R
1 2
4
MO NO_ IN_H D
1 2
C4 570.1U _0402 _16V7K_X7R
C4 59 0.01 U_040 2_16V7K
1
2
+V DDA _CODE C
C4 83
0.1U _0402 _16V7K
1
2
R4 9710_0 201_5%@
12
HDA _BIT _CLK_ CODE C
HD A_S DOUT _CODE C
HD A_S DIN 0_CO DEC
HD A_S YNC _C ODEC
HD A_RS T#_C ODEC
12
MO NO_ IN_H D
12
+MI C_BIAS_ B
+MI C_BI AS_C
SEN SE_A
2.49K_0402_1%
12
2.49K_0402_1%
12
SEN SE_B
4
C4 84
1
2
3
1
1
D2 2P JMB Z6V8_SOT2 3
D2 1
PJM BZ6V8_S OT23
R_S PK+
R_S PKÂL_SP K+
L_SP K-
2
2
C4 62
C4 61
100P _0402_ 50V8J
1
2
3
3
100P _0402_ 50V8J
C4 64
100P _0402_ 50V8J
C4 63
100P _0402_ 50V8J
1
1
1
2
2
2
JP1 7
1
1
2
2
3
3
4
4
5
G1
6
G2
ACE S_85 204-04001
CO NN@
C4 710.02 2U_06 03_25V4Z _X7R
LINE _OU TL
C4 740.02 2U_06 03_25V4Z _X7R
C4 5810U _0805_ 16V6K_X5R
C4 601U_ 0603_1 6V7_X7R
C4 651U_ 0603_1 6V7_X7R
C4 6610U _0805_ 16V6K_X5R
LI NE_C _OUT RL INE_ OUTR
1 2
LINE _C_O UTL
1 2
12
12
12
12
1 2
C4 690.02 2U_06 03_25V4Z _X7R
1 2
C4 720.02 2U_06 03_25V4Z _X7R
C4 761U_0 603_16V 7_X7R
L
Pla ce R509,C 498,C4 99 close to U24.2 3.
L
R4 89
+V _CO DEC_R
0_08 05_5%
1
9
3
DO CK_O UT_R
41
DOC K_OUT _L
39
M IC1_C
22
M IC2_C
21
IN T_M ICR_C
24
INT _MICL _C
23
LI NE_O UTR
36
LINE _OU TL
35
DL INE _IN _RC_ R
15
DL INE _IN _RC_L
14
HP _I N_R
17
HP _IN_ L
16
47
2
4
MUT E_LE D_CNTL
30
31
43
44
45
48
7
49
12
C4 80
C4 81
4.7U _0805 _10V4Z
0.1U _0402 _16V7K
12
C4 87
C4 88
C4 901U_ 0603_1 6V7_X7R
C4 911U_ 0603_1 6V7_X7R
C4 921U_ 0603_1 6V7_X7R
C4 931U_ 0603_1 6V7_X7R
C4 95
C4 96
R5 08
12
0_02 01_5%
L
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
+3VS
C4 85
10U_ 0805_16 V6K_X5R
0.1U _0402 _16V7K
1
2
U2 5
25
AVDD1
38
AVDD2
6
BITCLK
5
SDO
8
SDI_CODEC
10
SYNC
11
RESET#
46
DMIC_CLK
33
CAP2
12
PCBEEP
27
VREFFILT
28
VREFOUT-B
29
VREFOUT-C
32
NC
40
NC
37
NC
18
NC
19
NC
20
NC
13
SENSE_A
34
SENSE_B
26
AVSS1
42
AVSS2
92HD 75B3X 5NLGXYBX 8_QFN48_7X 7
C4 86
10U_ 0805_16 V6K_X5R
1 2
DVDD_LV
DVDD_CORE
DVDD_IO
PORTA_R
PORTA_L
PORTB_R
PORTB_L
PORTC_R
PORTC_L
PORTD_R
PORTD_L
PORTE_R
PORTE_L
PORTF_R
PORTF_L
EAPD/ SPDIF OUT 0 or 1 / GPIO 0
VOL_UP/DMIC_0/GPIO 1
VOL_DN/DMIC_1/GPIO 2
GPIO 3
VREFOUT-E / GPIO 4
GPIO 5
GPIO 6
SPDIF OUT1 / GPIO 7
SPDIF OUT0
DVSS
GPAD
L
U7 6
EAP D#
2
C4 82
A_S D#3 0
0.1U _0402 _16V7K
1
1
+V DDA _CODE C
2
2
47uF _6.3 V_1.3 _H1.9
+
DO CK_ OUTR
12
+
DOC K_OUT LDLIN E_OU T_L
12
47uF _6.3 V_1.3 _H1.9
12
12
12
12
2.2U _0603 _10V6K_X5 R
1 2
DL INE _IN_L
1 2
2.2U _0603 _10V6K_X5 R
EAP D#
MUT E_LE D_CNTL 3 0
A_S D#
BAT 54AW_S OT323-3~D
R5 0915K _0402_1%
12
C4 980.1U _0402 _16V7K_X7 R
1 2
C4 991U_0 603_16V 7_X7R
1 2
R4 9320K_ 0201_5%
R4 9420K_ 0201_5%
60.4_0402_1%
R4 95
R4 96
60.4_0402_1%
INT _MIC1
INT _MIC2
2008/09/152010/12/31
1
3
12
12
DL INE_ OUTRDL INE_ OUT_ R
12
DLIN E_OU TL
12
MI C1 27
R5 02
R5 03
R5 04
R5 05
07 /24 u pd ate
Compal Secret Data
2
AMP. FOR INTERNAL SPEAKER
+5VS
9
17
8
18
30
SPK R_EN
23
2
1
3
4
12
L21MBC 16081 21YZ F_0603
L22MBC 16081 21YZ F_0603
INT _MIC1 27
INT _MIC2 27
6.04K_0402_1%
12
2K_0402_5%
12
6.04K_0402_1%
12
2K_0402_5%
12
14
13
28
11
21
5
33
SPK R_EN
12
12
Por t A = Doc k L ine Out
Por t B = Ext ern al M ic
Por t C = Int ern al M ic
Por t D = Int ern al Spe akers
Por t E = Lin e In
Por t F = Int ern al Hea dpho ne
Deciphered Date
2
U2 4
CPVDD
HPVDD
SPVDD
SPVDD
VDD
SPKR_EN
SPKR_RIN+
SPKR_RIN-
SPKR_LIN+
SPKR_LIN-
HPVSS
CPVSS
SGND
CPGND
SPGND
SPGND
TML
TPA 6047A 4RHB R_QFN32_5X 5
DO CK _LINE _IN_ RDL INE _IN_ R
DO CK_ LINE_ IN_L
REG_EN
REG_OUT
HP_EN
HP_INL
HP_INR
HP_OUTL
HP_OUTR
ROUT+
ROUT-
LOUT+
BYPASS
GAIN0
GAIN1
08 /28 u pd ate
R4 90
12
25
100K _0402_5 %
29
HP_ DET
22
HP _L_I NHP _IN_ L
C4 672.2U _0805 _10V6K
HP _R_ IN
C4 682.2U _0805 _10V6K
R_S PK+
R_S PK-
L_SP K+
L_SP K-
C4 771U_0 603_16V 7_X7R
C4 790.47 U_060 3_16V7K_X 7R
1 2
GA IN0
GA IN1
GA IN0
GA IN1
LOUT-
27
26
16
15
20
19
6
7
10
C1P
12
C1N
24
31
32
9/ 3 updat e
GAI N:10 dB
GAI N:12 dB
GAI N:1 5.6dB
GAI N:2 1.6dB
DO CK_ LINE _IN_R 2 9
DO CK_L INE_ IN_L 2 9
Title
Size D ocum ent N umberR ev
LA -52 51P
Da te:She et
1
+5V ALW
+V DDA _CODE C
R4 88100K _0402_5 %@
12
1 2
1 2
HP_ OUTL 2 7
HP _OUT R 27
12
R4 91100 K_0201_ 5%@
R4 92100 K_0201_ 5%@
R4 850_0 201_5%
R4 860_0 201_5%
12
12
12
12
GAI N0 GAIN 1
LL
LH
HL
HH
DL INE_O UT_R 2 9
DLIN E_OU T_L 29
Compal Electronics, Inc.
HDA CODEC 92HD75
1
HP _I N_R
+5VS
+5VS
0. 9
o f
2647T uesda y, J anuar y 05 , 201 0
5
4
3
2
1
R5 27
100K _0402_5%
12
+MI C_BIAS_ B
DD
1U_0 603_1 6V6K
HP_ OUTL26
HP _OUT R26
CC
EXT_MICEXT _MIC_1
1 2
BB
+V DDA_ CODE C
12
R5 373K_ 0402_5% @
AA
1
C5 14
2
BAV 70W 3P C /C SOT -323
R5 1660.4 _0402_1 %
R5 1760.4 _0402_1 %
11 0NH_H LC060 3CSC CR11J T_5%
C6 390.47 U_040 2_6.3V6 K
R5 31
3K_ 0402_5%
INT _MIC _1_2
INT _MIC _2_2
R5 38
3K_ 0402_5%
12
@
1
C5 26
1U_0 603_1 0V4Z@
2
5
12
2.2K _0402 _5%
R5 28
D5 0
C6 38220 P_0402 _25V8J
12
12
12
20K _0402_5%
L27
12
+MI C_BI AS_C
12
12
R5 32
3K_ 0402_5%
1 2
C5 230.06 8U_06 03_16V7K
560K _0402_5 %
2
3
1
EXT_MIC
HP_ OUT_LHP_ L_OUT
12
R5 18
1
C6 41
68P _0402_5 0V8J
2
R6 17
12
12
EXT_M IC_2
110 NH_H LC060 3CSCC R11J T_5%
+V DDA _CODE C
R5 29
12
5
U7 5
1
P
IN+
4
O
3
IN-
G
2
LMV 331ID CKRG 4_SC70 -5~D
R5 26
120K _0402_5 %
12
L25BLM 18BD 601SN 1D_0603
12
L23BLM 18BD 601SN 1D_0603
12
L24BLM 18BD 601SN 1D_0603
12
R5 19
20K _0402_5%
10K _0402_5%
INT _MIC _1_4INT _MIC _1_1INT_ MIC_ 1_3
1
2
0.01 U_040 2_16V7K
EXT_M IC_3
+C ODE C_RE F
100P _0402_ 50V8J
C6 40
1
2
C5 27
68P _0402_50 V8J
C5 02
+V DDA_ CODE C
3
2
R5 39
10K _0402_5%
12
12
L30
R6 15
10K _0402_5%
12
MIC _SENS E 26
D2 4
PJD LC05_ SOT23@
2
1
3
MIC_EX TOUT
HP _R_O UTHP _OUT _R
1
1
C5 03
2
2
0.01 U_040 2_16V7K
04/ 27 Ch ang e C642 f rom 33 P to 15P vi a
ID T rec omm end to f ix th e SVT P f ail i ssue.
C6 4215P _0402_5 0V8J
12
12
R7 04100 K_0402 _5%
8
P
+
-
O
G
U4 4A
TLV 2462_SO8
4
C5 20
4
M IC1
1
INT _MIC _1_5
+C ODE C_REF
100P _0402_ 50V8J
1
2
C5 17100P _0402_ 50V8J
1 2
12
R5 33100 K_0402_ 5%
+V DDA_ CODE C
0.1U _0402 _16V4Z
C5 21
1
8
2
3
P
+
1
O
2
-
G
U2 6A
TLV2 462_SO8
4
INT _MIC126
JP3 5
7
5
4
3
1
2
6
SIN GA_2 SJ300 5-002211
CO NN@
HP_ DET 26
MI C1 26
04/ 24 Co rrec t the Sy mbol from SIN GA_2SJ -B960- 003
to SINGA_ 2SJ300 5-0 022 11, also corre ct th e
co nn ect io n f or fi x A udio work abn ormal is sue.
8
5
P
+
7
O
6
-
G
U4 4B
TLV2 462_SO8
4
+V DDA_ CODE C
12
R5 343K_ 0402_5% @
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
INT _MIC _2_2
R5 35
1
C5 24
1U_0 603_1 0V4Z@
2
3K_ 0402_5%
12
@
110 NH_H LC060 3CSCC R11J T_5%
1 2
C5 22
0.06 8U_06 03_16V7K
2008/09/152010/12/31
L29
12
Compal Secret Data
Deciphered Date
INT _MIC _2_4INT _MIC _2_1INT_ MIC_ 2_3
1
C5 25
68P _0402_50 V8J
2
2
R5 36
10K _0402_5%
12
CO NN@
JP1 9
INT _MIC _1_2
1
1
2
2
INT _MIC _2_2
3
3
4
4
5
G1
6
G2
ACE S_8520 4-04001
INT _MIC _1_2 INT _MIC _2_2
2
3
PJS OT05C_S OT23
D3 8
1
+V DDA_ CODE C
1
C5 07
4.7U _0805 _10V4Z
INT _MIC _2_5
100P _0402_ 50V8J
C5 19
1
2
2
@
12
R5 24
47K _0402_5%
12
R5 25
47K _0402_5%
C5 16100 P_040 2_50V8J
R5 30100 K_0402_ 5%
+V DDA _CODE C
5
+
6
-
Title
Size D ocum ent N umberRe v
Da te:She eto f
+C ODE C_RE F
1 2
+C ODE C_RE F
12
0.1U _0402 _16V4Z
C5 18
1
2
8
P
7
O
G
U2 6B
TLV2 462_SO8
4
INT _MIC226
Compal Electronics, Inc.
AMP & Audio Jack
LA -5 251 P
1
2747T uesd ay, J anua ry 05 , 20 10
0. 9
1
2
3
4
5
04/ 27 Del Q54, chang e the LED
cir cui t for commo n.
HDD_ STP#
R560
Q31B
3
5
12
4
AA
2N70 02DW H 2N S OT363-6
HDD_ HALTL ED12
@
100K_0201_ 5%
WW AN_TR ANSMIT_ OFF#1 5,23
WW _LED#23
WL_ LED#22
09/ 01 Upd ate
BT_LED
R541100K_020 1_5%
12
JP23
R438
12
1
3
5
7
9
11
ACES_ 88025 -120N-CPCONN @
MOD _RING
3
1
+3VS
2
@
1
CAP_ INT
1
2
HDA_ SDOUT_ MDC1 2
BB
CC
DD
HD A_SYN C_MD C12
WL/ BT_LED#
CAP_ CLK13,3 0
CAP_D AT13,30
CAP_ INT30
LID_ SW#20,3 0
680P _0402_50V7K@
3
HD A_SDIN 112
HDA_ RST#_ MDC12
ACES_ 85204-02001
C742
LID_ SW#
2
D53
PJDL C05 3P _SOT23
1
R54333_0402_ 5%
JP25
1
1
2
2
3
G1
4
G2
CON N@
+3VS+VREG 3_51125
R6120_0201_5%
12
2
2
C744
330P _0402_50V7K
1
1
+3VL
5.1K_ 0402_5%
R695
12
R694
12
5.1K_ 0402_5%
1
HDA_ SDOUT_ MDC
HD A_SDIN 1_MDC
12
MOD _RINGMOD_ TIP
MOD_ TIP
8/2 5 U pd ate
11/ 14 Upd ate
CON N@
JP28
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
CAP_ CLK
CAP_D AT
9
10
10
11
11
12
12
13
GND1
14
GND2
ACES_ 87213-120 0G
10K_0201_5 %
STB_LED#
1
2
3
4
5
6
7
8
9
10
11
12
GND13GND
GND15GND
GND17GND
1
2
3
4
FOX_JM 74613-V5-7F
WL_ LED#
2
D47
PJSOT 05C_SOT23
C752
330P _0402_50V7K
C627
220P _0402_25V
2
4
6
8
10
12
14
16
18
JP26
TIP
RING
GND
GND
CON N@
2N70 02DW T/R7_SOT -363-6
WW _LED#
WL_ LED#
+3VS
BITCL K_MDC
C531
@
1 2
CAP_ INT
STB_LED#
2
3
PJSOT 05C_SOT23
1
CAP_ CLK
CAP_D AT
2
3
D48
PJSOT 05C_SOT23
1
+3VL
2
C753
@
330P_ 0402_50V7K
1
2
12
R1099 0_04 02_5%
12
R1098 0_04 02_5%
12
R1097 0_04 02_5%
2N70 02DW T/R7_SOT -363-6
R544
0_0201_5%
10P_ 0402_25V8K
D49
Q34B
5
BT_LED24
12
3
+3VS
12
4
R540
47K_0402_5 %
WL/ BT_LED#
61
Q34A
2
HDA_ BIT_CLK _MDC 12
ON/ OFF#29
2
3
D45
1
PESD 24VS2UT_SOT 23-3~D
L
0.1U _0402 _16V4Z
AMBER _BATLED#30
AQUAW HITE_B ATLED#1 2,30
SATA_LE D#12,29
STB_LED#29
+3VS
1
1
1
C528
2
12
R547 47_ 0201_5%
+5VALW
ON/ OFF#
STB_LED#
Pla ce C670 c lo se to JP20.2's v ia.
ON/ OFF#
1
C670
2
11/ 11 up date for ESD.
C529
2
0.1U _0402_16 V4Z
1000P_ 0402_50V7K
JP20
1
1
2
2
3
3
4
4
5
G5
6
G6
ACES_ 85205-04001
CON N@
C530
2
4.7U _0805_10 V4Z
@
+3VL
12
1
2
+5VS
+3VL
+3VS
JP22
1
1
2
2
3
3
4
4
5
5
6
HDD_ STP#
WL/ BT_LED#
Pla ce C536 c lo se to JP22. 8
L
STB_LED#
07/ 02 up date
ON /OFFBTN _KBC#
0.1U _0402 _16V4Z
Add C146 cl ose t o D34 pin 1.
L
R546
100K_0201_ 5%
ON /OFFBTN _KBC#
C538
1U_0 603_10V4Z
CH75 1H-40 PT_SOD323-2@
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
6
7
7
8
8
9
9
10
10
11
GND
12
GND
ACES_ 85201-10 05N
CON N@
1
C536
1000 P_0402_50V7K
2
1
C146
01/ 04 up date for ESD
2
ON/ OFFBTN _KBC# 30
07/ 22 up date
D34
12
100K_0402_ 5%
21
SP_C LK3 0
SP_D ATA30
0.1U _0402 _16V4Z
6/1 7 C orr ect JP 27 conn ection fro m currentl y
Pin 1:+5VS ,Pin2 :RI GHT,Pin7: GND,Pi n8:GND to
Pin 1:RIGH T,Pin 2:NC,Pin 7:NC, Pin8: +5VS.
04/ 20 JP3 0.8 b eco me NC, J P30 .48 co nnect t o S LP_S4 # f rom HP
DPB_TX P0 14
DPB_T XN0 14
DPB_TX P1 14
DPB_T XN1 14
DPB_TX P2 14
DPB_T XN2 14
DPB_TX P3 14
DPB_T XN3 14
DPB _AUX 14
DPB _AUX# 14
DPB _CTR LCLK 14
DPB _CTR LDATA 14
DP B_HP D 14
D_ DDC DATA 1 8
D_ DDC CLK 1 8
D_ VSY NC 18
D_ HS YNC 1 8
SATA_ PRX_DTX_P5 1 2
SATA_ PRX_DTX_ N5 12
SATA_ PTX_DRX_P5 1 2
SATA_ PTX_DRX_ N5 12
4/ 5 upda te for H P Doc kin g pin defi ne ch ang e
VA_ ON#
R5 52
1K_ 0201_5%
12
1
C5 40
0.1U _0402 _16V4Z
2
DD
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
3
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
CAP _DAT 1 3,28
CAP _CLK 1 3,28
CEL LS 35
A_S D# 26
ADP _DET# 4 1
THM _MAIN# 3 4
GATEA 20 15
ON /OFF BTN# 1 4,28
LA NLINK _R# 15 ,21
ADP _PRES 33,35
AB1 A_DATA 3 4
AB1 A_CLK 3 4
AB1 B_DATA
AB1 B_CLK
CAP _INT 2 8
ADP _EN 4 1
PW R_G D 32
VC C1_ PWRG D 36,4 1
OC P 41
AMB ER_BAT LED# 28
8051TX 22 ,31
8051RX 22,31
+3VL
AC_ ADP_ PRES 35
ADP _A_I D 41
LI D_SW # 20,2 8
PG D_I N14, 40
L
07 /01 u pd ate
PG D_I N
PM_ RSMRST#
07 /02 u pd ate
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
4
01 /0 4 upda te (Ca ncel Boa rd ID De tec t rese rve
cir cui t (De l U 8,Q37, R571,R572,R 574,R5 75)).
07 /22 u pd ate
L
CAP _CLKS PI_C LK
4.7P _040 2_50V8C
C6 22
1
@
2
R6 0610K_ 0201_5%@
R6 07100K _0201_5%
C6 34
@
12
12
5
CPU _SV_ ID_D ET
R5 51100K _0402_5%
12
R5 53100K _0402_5%@
12
CPU T ype De tec t : H igh -->SV , Lo w-->L V ( No use)
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
4
Title
Size D ocum ent N umberR ev
Da te:She eto f
Compal Electronics, Inc.
TCG/BIOS ROM/PS2/SW LPC DEBUG
LA -52 51P
5
3147T uesda y, J anuar y 05 , 201 0
0. 9
1
1.5V _POK39
+5VS
+3VS
+1.0 5VS
+3VM
+1.05V M
M_P WROK14
SLP _S3#14,23 ,29,3 0,33 ,35,37 ,38
+0.75 VS
12
R6 503.3K _0201_ 5%
12
R6 5349.9 K_0402 _1%
12
R6 5416.2 K_0402 _1%
R6 70
12
3.3K _0201 _5%
AA
GFX VR_P WRGD42
BB
CC
1.05 VM_LAN _POK3 9
PM_SL P_M#14, 30,33
2
12
R6 403.3K _0201_ 5%
12
R6 4176.8 K_040 2_1%
12
R6 4411.5 K_0402 _1%
12
R6 463.3K _0201_ 5%
CH75 1H-4 0PT_S OD323-2
12
R6 473.3K _0201_ 5%
CH75 1H-4 0PT_S OD323-2
@
12
R6 58
56.2 K_040 2_1%
1.8V S_POK38
2VR EF_51 125
R6 653.3K _0201_5 %
12
R6 6746.4 K_040 2_1%
12
R6 6814.7 K_040 2_1%
12
D4 2
12
1N41 48WS -7-F _SOD323- 2
D4 0
D4 1
3300 P_0402_ 25V7K
1
C5 85
2
+1.5V S
2VR EF_51 125
R6 72
86.6 K_040 2_1%
2VR EF_51 125
21
21
1
C5 84
3300 P_0402_ 25V7K
2
3.3K _0201 _1%
12
R6 55
11.5 K_04 02_1%
12
R6 56
78.7 K_04 02_1%~D
R6 61
41.2 K_040 2_1%
12
71.5 K_04 02_1%
12
R6 4210K _0201_5%
12
R6 59
12
R6 62
R6 6610K_ 0201_5%
12
C5 88
3300 P_0402_ 50V7K
3
12
2VR EF_3 93
12
R6 4334.8 K_04 02_1%
12
R6 4549.9 K_04 02_1%
12
R6 5110K _0201_5%
2VR EF_39 3
10K _0201_5%
R6 60
12
2VR EF_39 3
1
C5 86
2
3300 P_0402_ 25V7K
1
C5 87
1000 P_04 02_25V8J
2
12
D4 3
21
CH75 1H-4 0PT_S OD323-2
12
1M_ 0201_1%
+5V ALW
3
+
2
-
1
C5 83
1000 P_0402_ 50V7K
2
12
1M_ 0201_1%
+5V ALW
5
+
6
2VR EF_3 93
-
12
1M_ 0201_1%
+5V ALW
3
+
2
-
R6 631M_ 0201_1%
+5V ALW
5
+
6
-
R6 711M_0 201_1%
12
C5 890.04 7U_04 02_16V7K
R6 38
8
U3 7A
P
O
G
LM3 93DG_SO 8
4
R6 49
8
U3 7B
P
O
G
LM3 93DG_SO 8
4
R6 57
8
U3 9A
P
O
G
LM3 93DG_SO 8
4
12
8
U3 9B
P
O
G
LM3 93DG_SO 8
4
1 2
4
+3VS
12
R6 39
10K _0201_5%
J1
1 2
1
SHO RT P ADS
VCC P_POK37
7
1
+3V ALW
12
7
12
MC7 4VHC1 G08D FT2G_S C70-5
R6 64
3.3K _0201 _5%
M_P WROK
R6 69
1K_ 0201_5%
M_P WROK 14
5
VC CP_E N 37
+3V ALW
5
U3 8
1
IN1
VCC
OUT
2
IN2
GND
3
4/2 3 C ancel H16 f or
M/ E PC B ed ge
mo di fy.
1/4 Ca ncel H17 fo r
M/E modif y.
6
07 /09 u pda te fo r I NTEL S3 le aka ge issue.
SLP _S3#14,23 ,29,3 0,33 ,35,37 ,38
4
R6
0_04 02_5%@
12
R6 48
4.99 K_04 02_1%
12
R6 52
2.49 K_04 02_1%
12
PW R_G D 30
VTT PWRG OOD 4
12
R4
8.2K _0402 _5%
+3V ALW
5
1
IN1
VCC
OUT
2
IN2
GND
3
4/ 9 upda te fo r M /E , C hange
H3 H_3 P3- ->H_3P0, H10
H_2 P5- ->H _2P3
U7 7
4
MC7 4VHC1 G08D FT2G_S C70-5
H1 0
HOL EA
1
H2 4
HOL EA
1
H2 3
HOL EA
1
H1 4
HOL EA
1
H3
HOL EA
1
H2 5
HOL EA
1
H2 2
HOL EA
1
VC CP_1. 5VSP WRG D 4
7
10/ 19 Del ete H1 3 (H_3P 0);
ch ang e H2 fro m H_4P 7 to
H_4 P4; H2 8 fro m H_4 P9 to
H_4 P8.
11 /13 Ch ange H2 fro m
H_4 P4 to H_ 4P7 ; H2 8 fro m
H_4 P8 to H_4 P9.
7/1 5 u pdate fo r
M/ E, de l H31
8/1 8 u pdate fo r
M/ E, ad d bac k H 31
4/8 u pda te fo r
M/ E, d el H6
H4
H5
HOL EA
HOL EA
1
1
H8
HOL EA
1
H2
HOL EA
H3 1
HOL EA
1
8
H2 8
HOL EA
1
1
H1
HOL EA
1
H1 1
HOL EA
1
H2 6
HOL EA
1
08 /28 u pd ate
H3 0
HOL EA
1
H1 2
HOL EA
1
H2 0
HOL EA
1
H7
HOL EA
1
H9
HOL EA
1
H2 1
HOL EA
1
H2 9
HOL EA
1
FM3
FM2
FM1
1
DD
1
FM4
1
1
ZZ Z1
PCB-MB
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
3
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
5
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
6
Title
Size D ocum ent N umberRe v
Da te:She eto f
7
Compal Electronics, Inc.
POK CKT
LA -52 51P
3247T uesd ay, J anua ry 05 , 20 10
8
0. 9
1
2
3
4
5
SI7 326DN -T1-E3_P AK1212-8
U4 0
C5 94
0.1U _0402 _16V4Z
C5 93
SLP _S3
10U_ 0805_ 10V4Z
1
2
SLP _S3
1
2
R6 78
330K _0402_5 %
2
ADP _PRE S30,3 5
1
C6 11
10U_ 0805_ 10V4Z
2
+1.05 VS
12
R6 87
470_ 0201_5%
3
Q47B
5
2N70 02DW H 2N SOT3 63-6
4
+1.5 VS
12
R6 89
470_ 0201_5%
3
Q48B
5
2N70 02DW H 2N SOT3 63-6
4
R6 76
12
0_04 02_5%
RU N ON
B+
12
1
C5 97
2
10U_ 0805_ 10V4Z
12
J2
SHO RT P ADS
61
Q45A
2N70 02DW H 2N SOT3 63-6
SI7 326DN -T1-E3_P AK1212-8
U4 3
RU N ON
1
AA
BB
CC
DD
+1.0 5VS+1.0 5VM_LAN
1
2
35
4
C5 95
SI7 326DN -T1-E3_P AK1212-8
U4 1
12
R6 79
820K _0402_5%
3
Q45B
5
2N70 02DW H 2N SOT3 63-6
4
1
2
35
4
SLP _S3
SLP _S3SLP _S3
05/ 06 up dat e to in stal l C3 9
(33 0U_ 2V_ B2_ R15M) by HP
req ues t.
0.1U _0402 _16V4Z
C5 96
10U_ 0805_ 10V4Z
1
1
2
2
+3VS+ 3VALW
1
2
35
C5 98
4
RU N ON
12
R6 80
470_ 0402_5%
1
C6 08
0.01 U_040 2_16V7K
2
+5VS+ 5VALW
0.1U _0402 _16V4Z
C6 09
1
2
+3VS
12
R6 88
470_ 0201_5%
61
Q47 A
2N70 02DW H 2N SOT3 63-6
2
+5VS
12
R6 90
470_ 0201_5%
61
Q48 A
2N70 02DW H 2N SOT3 63-6
2
1
C3 9
+
330U _B2_2V M_R15M
2
0.1U _0402 _16V4Z
10U_ 0805_ 10V4Z
C5 99
1
1
2
2
1
C6 10
10U_ 0805_ 10V4Z
2
PM_ SLP_LAN #14,30, 39
ADP _PRE S30,3 5
PM_SL P_M#14, 30,32
SLP _S3
5
09 /10 u pd ate .
SLP _S3
2
G
+1.0 5VM_LA N+1.05V M
C6 00
10U_ 0805_ 10V4Z
1
2
R6 82 330K _0402_5%
B+
PM_SL P_MSLP _S3
PM_SL P_M#
+1.8V S
12
R6 91
470_ 0201_5%
3
Q49B
2N70 02DW H 2N SOT3 63-6
4
+0.7 5VS
12
R6 93
22_0 402_5%
13
D
Q53
S
2N70 02_SOT2 3-3
2
+3V ALW+3VM
C5 92
0.1U _0402 _16V4Z
12
1
2
C6 01
1
2
12
5
05 /0 6 Upda te R69 3 and Q5 3 b ecome no
in stal l t o avoid th e +0. 75V S lea kag e f rom
DDR sl ot on S3 M od e f or po wer sa vin g.
07 /09 Up date
R6 73
47K _0402_5%
61
Q50A
2N70 02DW H 2N SOT3 63-6
2
SI7 326DN -T1-E3_P AK1212-8
U4 2
0.1U _0402 _16V4Z
R6 83
12
820K _0402_5 %
3
Q44B
2N70 02DW H 2N SOT3 63-6
4
+3VL
12
R6 86
100K _0201_5 %
3
Q50B
5
2N70 02DW H 2N SOT3 63-6
4
SLP _S4
R6 77
12
4.7K _0402 _5%
1
2
35
4
Q44A
2N70 02DW H 2N SOT3 63-6
61
+1.5V
2
Q39
SI2 301CD S-T1-G E3 1P SO T23-3
2
12
R6 92
470_ 0201_5%
61
Q49A
2N70 02DW H 2N SOT3 63-6
LA N_EN
C6 02
1
2
PM_SL P_M
D
S
13
G
2
05/ 06 up dat e to in stal l C4 0
(33 0U_ 2V_ B2_ R15M) by HP
req ues t.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2N70 02DW H 2N SOT3 63-6
07 /08 u pda te fo r I NTEL S3 le aka ge issue.
+1.5 V+1.5 VS_C PU_V DDQ
SI7 326DN -T1-E3_P AK1212-8
C6 24
0.1U _0402 _16V4Z
1
2
RU N ON
2008/09/152010/12/31
+1.05 VM
Q40A
2
U4 5
4
12
1
R1 104
0_04 02_5%
2
SLP _S4
12
R7 02
470_ 0201_5%
61
Q41A
2
2N70 02DW H 2N SOT3 63-6
Compal Secret Data
12
R6 74
470_ 0201_5%
61
1
2
35
C6 25
1
2
C5 05
0.01 U_040 2_16V7K@
07 /17 u pd ate
SLP _S4
Deciphered Date
4
LA N_ENPM_SLP_M
0.1U _0402 _16V4Z
+3VM
12
R6 75
470_ 0201_5%
3
Q40B
5
2N70 02DW H 2N SOT3 63-6
4
Q42
AO4 430L 1N S OIC-8
8
7
10U_ 0805_ 10V4K
C6 05
1
2
5
5
0.1U _0402 _10V6K
R6 81
12
0_04 02_5%
12
R1 103
220_ 0402_5%
3
Q52B
2N70 02DW H 2N SOT3 63-6
4
2
+3VL
12
R6 84
100K _0201_5 %
61
C6 04
1
2
2N70 02DW H 2N SOT3 63-6
Q43A
07 /08 u pda te fo r I NTEL S3 le aka ge issue.
+1.5 VS+1 .5V
1
2
36
4
RU N ON
Add C626, C664 c lose to JDIMA 1;
L
C65 6,C 657 cl ose to JDIM B1.
+1.5 V+1.5 VS_C PU_V DDQ
C6 260.1U _0402 _16V4Z
1 2
C6 640.1U _0402 _16V4Z
1 2
C6 560.1U _0402 _16V4Z
1 2
C6 570.1U _0402 _16V4Z
1 2
07 /10 u pda te fo r I NTEL S3 le aka ge issue.
Add C666, C667,C 671 clo se to JP11 .
L
+5VS
C6 660.1U _0402 _16V4Z
1 2
C6 670.1U _0402 _16V4Z
1 2
C6 710.1U _0402 _16V4Z
1 2
C6 07
10U_ 0805_ 10V4K
C6 06
0.1U _0402 _10V6K
1
1
2
2
1/5 u pda te fo r E MI PC I I ssue.
07 /1 7 u pdate B OM.
Title
Size D ocum ent N umberR ev
Da te:She eto f
Compal Electronics, Inc.
DC/DC Circuits
LA -52 51P
5
3347T uesda y, J anuar y 05 , 201 0
0. 9
1
2
3
4
PJP1
4
V-
5
V-
6
AA
PJP2
@SU YIN_2002 75MR0 05G15U ZL_5P
BB
GND_1
7
GND_2
8
GND_3
9
GND_4
@FO X_JPD1 131-DB371-7F
1
1
2
2
3
3
4
4
5
5
6
GND
7
GND
PJSOT24 CW_SOT323 -3
3
ID
1
V+
V+
PD6
THM _MAIN#30
A DPIN
2
3
2
PD1
1
@PJSOT2 4C_SOT23
2
3
2
3
1
PD7
1
PJSOT24 CW_SOT323 -3
PR4
100K_04 02_5%
+3VL
12
ADP _SIGNA L 29,4 1
ADPIN
12
12
PC 1
PC2
1000P_0 402_50V7K
100 P_0402_50V8J
12
12
PR 3
PC 7
1K_04 02_5%
100 P_0402_50V8J
PD5
BAV99W T1G_SC70-3
1
PL1
HCB 2012KF-121 T50_0805
12
12
PL3
HCB 2012KF-121 T50_0805
100P_04 02_50V8J
12
12
PC 8
PR 5
100_0 402_5%
100 P_0402_50V8J
PD3
1
BAV99W T1G_SC70-3
PC3
12
PR 6
100_0 402_5%
PD4
1
BAV99W T1G_SC70-3
VIN
12
PC 4
1000P _0402_50V7K
VMBBATT
12
PC9
100P_04 02_50V8J
12
12
PL2
HCB 2012KF-121 T50_0805
12
12
PL4
12
HCB 2012KF-121 T50_0805
PC5
1000P_0 402_50V7K
AB1A_DA TA 30
AB1 A_CLK 30
PR1
@15K_04 02_5%
12
PC6
0.01 U_0402_5 0V4Z
BATT
B+_DEBUG
Vin
PD1 2
1SS 355_SOD323-2
PD2
CH7 51H_SO D323-2
PD8
RLZ 27V
21
PR3 7
0_0402_ 5%
12
B++51125_PWR
12
PD2 2
1SS 355_SOD323-2
12
PR2 3
100_080 5_5%
12
B+_ DEBUG
12
0.1U _0603_50V7 K
PC1 5
12
ADP_SIGNAL
+3VL
2
3
2
3
2
3
+3VL
PH1 under CPU botten side :
CPU thermal protection at 93 +-3 degree C
(Need to be checked)
CC
Clos e to CPU
PC1 2
0.1U _0603_25V7 K
DD
0.9
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2VR EF_51125
12
PH1
100 K_0603_1%_T SM1A104F4361 RZ
PR12
53.6 K_0603_1%
12
12
12
PR16
19.1 K_0402_1%
2008/09/152010/12/31
12
2VR EF_51125
PR1 3
75K_040 2_1%
150K_04 02_1%
Compal Secret Data
Deciphered Date
3
PR17
12
1
2
3
12
PC1 3
1000P_0 402_50V7K
PR8
470K_04 02_1%
12
VL
PU1
IN+
GND
IN-
LMV 331IDCK RG4_SC70 -5
VCC+
OUT
5
4
VL
PR10
100K_04 02_5%
12
13
D
PQ1
2
G
SSM 3K7002FU _SC70-3
S
Title
Size Do cum ent Num berR ev
Cu stom
Da te:Sheetof
Compal Electronics, Inc.
DC-IN/ BATTERY CONN
LA-4902P
4
EN0 36
3447T uesd ay, J anuary 05, 201 0
A
VI N
8
7
5
3
+
2
-
12
PR1 40
23. 7K_0402_1%
PR1 18
255K_04 02_1%
8
P
+
O
-
G
PU1 03B
LM393DG _SO8
4
PQ102
AO4 407AL 1P S O8
4
12
13
D
S
VL
PR1 38
12
100K_04 02_5%
PR139
12
1M_0402 _5%
8
P
1
O
G
PU1 05A
LM393DG _SO8
4
BAT_PW M_OUT30
+3VL
12
7
PR105
15K_040 2_5%
PQ101
AO4407L _SO8
1
2
36
8
7
5
4
11
12
PC1 01
0.1U _0603_50V7 K
12
PR1 01
P2
P2BATT
PR1 36
24.3 K_0603_1%
12
PR1 11
150K_04 02_5%
PR1 35
100K_04 02_1%
12
12
PR1 37
12
200K_04 02_5%
ADP _EN#41
12
100K_04 02_1%
22
12
PR1 19
200K_04 02_1%
12
PR123
41.2 K_0402_1%
33
5
6
2VR EF_51125
P4
1
2
36
12
PR1 03
47K_040 2_5%
2
G
PQ104
SSM 3K7002FU _SC70-3
422K_04 02_1%
1U_ 0603_6.3V6M
AC Detector
PR1 20
22K_040 2_5%
High 11.85
Low 10.55
ADP_PRES 30,33
12
PR1 14
PC116
+3VL
12
56K_040 2_1%
12
PR1 04
SLP_S3#14,23,29,30,32,33,37,38
12
PC1 11
1U_ 0603_6.3V6M
12
PR1 13
453K_04 02_1%
12
PR1 15
1M_0402 _1%
22.6 K_0402_1%
IADAPT4 1
12
PC1 07
0.01 U_0402_16V 7K
PR1 09
0_0402_ 5%
12
BQ2 4740VREF
+3VL
PR1 16
100P_04 02_50V8J
B
B+
PR1 02
0.01 _2512_1%
1
2
ACD ET
AC P
1U_ 0603_6.3V6M
12
+3VL
7
LPREF
8
IADSLP
9
AGND
10
VREF
11
VDAC
12
VADJ
13
EXTPWR
14
ISYNSET
12
IADAPT
15
IADAP T
12
PC1 19
PC1 08
0.1 U_0603_50V 7K
4
5
6
LPMD
ACSET
ACDET
PU1 01
BQ2 4740RH DR_QFN28_ 5X5
BAT
SRSET
SRN
17
16
18
BATT
12
PR1 24
147K_04 02_1%
PC1 05
12
3
2
ACP
ACN
SRP
CELLS
19
20
PR1 22
210K_04 02_1%
12
PC1 22
1U_ 0603_6.3V6M
4
3
AC N
12
PL101
HCB 2012KF-121 T50_0805
12
PC106
@0.1 U_0603_25V 7K
CH GEN#
1
29
TP
CHGEN
28
PVCC
27
BTST
26
HIDRV
25
PH
24
REGN
23
LODRV
22
PGND
DPMDET
21
SRSET 41
12
CH GCTRL 30
PC109
1U_0805 _25V6K
BST _CHG
DH _CHG
LX_CHG
RE GNVA DJ
DL _CHG
C
12
PC1 02
4.7 U_0805_25V 6-K
12
12
PR1 21
0_0402_ 5%
12
PR1 45
0_0402_ 5%
PD1 01
RLS 4148_LL34-2
PC1 18
12
1U_ 0603_10V6K
12
12
PC1 03
4.7 U_0805_25V 6-K
PR1 10
10_0805 _1%
12
PC1 10
0.1U _0402_10V7 K
12
12
PR1 17
100K_04 02_5%
12
PC1 20
0.1U _0603_50V7 K
PC1 04
4.7 U_0805_25V 6-K
PQ106
AON 7406L
CEL LS 30
12
P4P2
CHG _B+
CHG _B+
PQ105
SIS41 2DN-T 1_POWER PAK8-5
35
241
10U H_MMD-10DZ -100M-X1_6A_20 %
12
PR1 41
@4.7 _1206_5%
12
12
PC1 26
@680P_0 603_50V8J
35
241
12
PC1 21
@0.1 U_0603_25V 7K
PQ103
AO4 407AL 1P S O8
1
2
36
4
PR106
0_0402_ 5%
12
PL102
12
12
PC1 12 4. 7U_0805 _25V6-K
8
7
5
P2
PC1 13 4. 7U_0805 _25V6-K
12
PC1 29 4. 7U_0805 _25V6-K
D
PR1 12
0.01 _1206_1%
12
12
PC1 17
0.1U _0402_10V7 K
PC1 14 4. 7U_0805 _25V6-K
BATT
12
12
12
PC1 15 4. 7U_0805 _25V6-K
PC1 28 4. 7U_0805 _25V6-K
12
PR1 25
3
2
VL
8
P
+
-
G
PU1 03A
LM393DG _SO8
4
604K_04 02_1%
12
PC1 24
0.1U _0402_10V7 K
1
O
VI N
P2
12
12
PR1 28
PR1 27
76. 8K_0402_1%
@76 .8K_0402_1%
12
PR1 31
10K _0603_0.1%
2VR EF_51125
44
Charge Detector
High 17.588
+3VL
Low 17.292
12
PR1 32
22K_040 2_5%
AC_ADP_PRES 30
CH GCTRL
PR1 30
1K_0402 _5%
12
1SS 355_SOD323-2
0.04 7U_0402_16 V7K
Note: X7R type
PD1 02
PC1 23
12
2
G
12
PR1 34
470K_04 02_5%
12
PR1 26
100K_04 02_5%
12
PR1 29
220K_04 02_5%
12
CH GEN#
13
D
PQ107
S
SSM 3K7002FU _SC70-3
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
A
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
B
2008/09/152010/12/31
+3VL+3VL
PQ108
E
3
B
2
1
MMBT3906H_S OT23-3
C
47K_040 2_5%
12
PR1 46
ACD ET
12
PR133
300K_04 02_5%
Compal Secret Data
Deciphered Date
C
IADAP T
PR1 42
11K_040 2_1%
12
PC1 27
1U_ 0603_6.3V6M
OUT
+5VALW
5
V+
4
PMC 3 0
PU1 04
1
12
+IN
2
V-
3
-IN
LMV321AS5X_SOT23-5
12
12
PR1 44
49.9 K_0402_1%
Title
Size Do cum ent Num berR ev
Da te:Sheetof
PR1 43
39.2 K_0402_1%
Compal Electronics, Inc.
Charger
LA-4902P
D
3547T uesd ay, J anuary 05, 201 0
0.9
A
B
C
D
E
2VREF_51125
12
PC3 02
1U_ 0603_10V6K
11
PR3 01
13.7 K_0402_1%
+3VALWP
B+
PL301
HCB 2012KF-121 T50_0805
12
2200P_0 402_50V7K
22
PC3 01
+3VALWP
150 U 6.3V M B2 LESR 45M
33
2N7 002KDW H-2N_SOT3 63-6
44
PC3 10
ENT RIP1
61
PQ305A
SSM 3K7002FU _SC70-3
B++
12
4.7U H 20% FDVE06 30-H-4 R7M=P3 5.5A
1
+
2
2
12
12
PC3 17
PC3 03
0.1 U_0402_25V 6
4.7 U_0805_25V 6-K
SIS41 2DN-T 1_POWER PAK8-5
PL302
12
PR3 11
2.2_ 1206_5%
PC3 12
1000P_0 603_50V7K
5
100K_04 02_5%
12
13
D
2
G
S
PQ307
PQ301
12
AON 7406L
12
ENT RIP2
34
PQ305B
2N7 002KDW H-2N_SOT 363-6
PR3 16
PR3 17
330K_04 02_5%
241
PQ304
241
12
12
PD3 05
1SS 355_SOD323-2
12
PD3 01
1SS 355_SOD323-2
35
35
VL
12
PR3 18
100K_04 02_5%
2.2U _0805_10V6 K
UG1 _3V
PR3 09
0_0402_ 5%
12
KBC_PWR_ON 30
DEBUG_KBCRST 22,31
VCC1_PWRGD 30, 41
12
PC3 07
12
PC3 08
0.1U _0402_10V 7K
VL
12
PC3 16
10U _0805_10V6K
+5VALW P
+3VALW P
+3VLP
PR3 07
12
0_0402_ 5%
PJP301
12
PA D-OPE N 4x4m
PJP303
12
PA D-OPE N 4x4m
EN0 34
A
B
12
PR3 03
20K_040 2_1%
12
PR3 05
110K_04 02_1%
12
BST_3V
UG_ 3VUG_ 5V
LX_3V
LG_3V
PR3 15
@620K_0 402_5%
21
21
21
ENT RIP2
3
4
5
6
25
P PAD
VFB2
VREF
TONSEL
ENTRIP2
7
VO2
8
VREG3
9
VBST2
10
DRVH2
11
LL2
12
DRVL2
GND
VIN
SKIPSEL
EN0
15
16
14
13
12
12
2VREF_51125
PC3 14
0.1U _0603_50V7 K
(4.5A, 180mil s ,Via NO.= 9)
+5VALW
(3A,12 0mils ,Via NO.= 6)
+3VALW
PJP302
PA D-OPE N 2x2m
PJP304
PA D-OPE N 2x2m
PJP305
PA D-OPE N 2x2m
+VREG3_51125+3VLP
VL+5VLP
+3VL+3VEXTLP
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2008/09/152010/12/31
C
PR3 02
30.9 K_0402_1%
12
PR3 04
20K_040 2_1%
12
PR3 06
100K_04 02_1%
ENT RIP1
12
1
2
VFB1
ENTRIP1
24
VO1
23
PGOOD
22
VBST1
21
DRVH1
20
LL1
19
DRVL1
VREG5
VCLK
PU3 01
17
18
TPS 51125RGER_ QFN24_4X4
+5VLP
12
12
PC3 15
22U _0805_6.3V6M
PR3 19
@0_040 2_5%
1U_ 0603_10V6K
PR3 08
0_0402_ 5%
BST_5V
12
LX_5V
LG_5V
+3VL
12
PR3 14
@100K_0 402_5%
51125_P WR
B++
P2
PR3 20
255K_04 02_1%
12
PC3 21
PR3 21
Compal Secret Data
Deciphered Date
+5VALWP
12
PC3 18
0.1 U_0402_25V 6
PC3 09
0.1U _0402_10V7 K
12
RPG OOD 14
DEBUG_KBCRST22,31
12
12
11. 5K_0402_1%
12
12
PC3 05
PC3 04
2200P _0402_50V7K
PR3 10
0_0402_ 5%
12
PC3 19
10U _0805_10V6K
PU3 02
1
+IN
2
V-
3
-IN
LMV321AS5X_SOT23-5
D
B++
12
PC3 06
4.7 U_0805_25V 6-K
4.7 U_0805_25V 6-K
35
35
PQ303
IRFH3 707TR PBF_P QFN8-3
+5VLP
12
12
PR3 25
220K_ 0402_5%
12
+5VLP
470K_04 02_5%
5
V+
PR3 31
4
12
OUT
680K_04 02_5%
PQ302
SIS41 2DN-T 1_POWER PAK8-5
241
241
PL303
4.7U H 20% FDVE06 30-H-4 R7M=P3 5.5A
12
12
PR3 12
2.2_ 1206_5%
12
PC3 13
1000P_0 603_50V7K
1
+
PC3 11
2
150 U 6.3V M B2 LESR 45M
+5VALWP
+3VEXTLP
PU3 03
1
VIN
GND
EN
VOUT
FB
2
3
APL5317
PR3 26
PR3 24
16.5 K_0402_1%
PD3 04
12
1SS 355_SOD323-2
Title
Size Do cum ent Num berR ev
Cu stom
Da te:Sheetof
Compal Electronics, Inc.
12
PR3 22
12
64.9 K_0402_1%
12
PR3 23
20K_040 2_1%
5
4
12
3.3VALWP/5VALWP
LA-4902P
E
PC3 20
2.2U _0805_10V6 K
3647T uesd ay, J anuary 05, 201 0
0.9
A
B
C
D
11
22
B+
PL401
HCB 2012KF-121 T50_0805
12
12
PC4 16
SLP_S3#14,23,29,30,32,33,35,38
VCCP_EN32
VCC P_B+
12
PC4 01
0.1 U_0402_25V 6
+62 69_VCC
2.2U _0805_10V6 K
12
PC4 02
4.7 U_0805_25V 6-K
2200P _0402_50V7K
12
12
PR4 27
10K_040 2_5%
PC4 04
PC4 03
4.7 U_0805_25V 6-K
4.7 U_0805_25V 6-K
VCC P_POK32
1
PC4 07
12
@0_040 2_5%
12
0_0402_ 5%
12
PR4 06
PR4 28
PR4 05
0_0402_ 5%
12
22P_040 2_50V8J
2
3
4
12
PC4 11
@10K_04 02_5%
12
PC4 14
+3VS
12
PR4 01
@10K_04 02_5%
17
PU4 01
VIN
VCC
FCCM
EN
12
PR4 09
22. 6K_0402_1%
12
+VC CP
12
LX_ VCCP
16
15UG14
GND
PHASE
PGOOD
COMP5FB6FSET
FB _VCC P
PR4 10
49. 9K_0402_1%
DH _VC CP
BST _VCCP
7
12
12
PR4 02
0_0603_ 5%
+5VALW
12
PR4 03
0_0402_ 5%
13
BOOT
12
PVCC
DL _VCCP
11
LG
10
PGND
SE_ VCCP
9
ISEN
VO
8
ISL62 69ACR Z-T_QF N16
+VC CP
12
PC4 13
0.0 1U_0402_1 6V7K
0.22 U_0603_10V 7K
PR4 04
2.2_ 0603_5%
12
12
12
8.06 K_0402_1%
12
PR4 17
0_0603_ 5%
12
PC4 05
+62 69_VCC
PC4 06
2.2U _0805_10V 6K
PR4 07
578
PQ401
DH _VCC P1
AO4474L _SO8
36
241
PQ402
35
241
AO N6718 L 1N D FN
PL402
0.47 U 20% FDVE06 30-H-R 47M=P3 17.7 A
12
12
PR4 08
2.2_ 1206_5%
PC4 12
12
1000P_0 603_50V7K
(18A,7 20mils ,Via NO.= 36)
+VCCP
1
1
+
PC4 08
2
330 U_V_2VM_R6M
1
+
+
PC4 09
2
PC4 10
2
330 U_V_2VM_R6M
330 U_V_2VM_R6M
33
PC4 15
6800P_ 0603_50V7K
12
12
PR4 12
1.96 K_0402_1%
PR4 11
1.5K_ 0402_1%
12
12
12
PC4 17
@0. 1U_0402_2 5V6
12
PR4 15
0_0402_ 5%
PR4 13
10_0402 _5%
PR4 14
0_0402_ 5%
+VC CP
VTT_SENSE 7
VSS_SENSE_VTT 7
Need t o clos e CPU chipset
44
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
A
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
B
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
C
Title
Size Do cum ent Num berR ev
Da te:Sheetof
Compal Electronics, Inc.
1.05V_VCCP
LA-4902P
D
3747T uesd ay, J anuary 05, 201 0
0.9
A
12
PJP604
PA D-OPE N 3x3m
PJP605
PA D-OPE N 3x3m
+5VALW
5
+1.5V
11
+1.5 VS_CP U_VDDQ
To re sol ve +0 .7 5V S t o +1 .5V_ CPU_ VDDQ timi ng i ssue
PR6 04
20K_040 2_5%
SLP_S3#14,23,29,30,32,33,35,37
22
12
PD6 01
1SS 355_SOD323-2
12
.1U_ 0402_16V7K
PC6 06
B
12
12
12
PR602
10K_040 2_5%
2N7 002KDW H-2N_SOT3 63-6
34
+0.75VSP
PQ601A
2
PQ601B
2N7 002KDW H-2N_SOT 363-6
12
12
12
PC6 01
10U _0805_6.3V6 M
61
PJP601
PA D-OPE N 3x3m
PC6 02
@10 U_0805_1 0V4Z
12
PR6 01
1K_0402 _1%
12
PR6 03
1K_0402 _1%
+0.75VS
PU6 01
VIN1VCNTL
2
GND
3
VREF
4
VOUT
G29 92F1U_SO8
6
5
NC
7
NC
8
NC
9
TP
+0.75VSP
12
12
PC6 05
10U _0805_6.3V6M
0.1 U_0402_10V 7K
PC6 04
(2A,80 mils , Via NO.= 4)
C
12
PC6 03
1U_ 0603_10V6K
D
+5VALW
Change +1.8VS VR
316K_04 02_1%
12
12
PC6 08
0.1U _0402_16V7 K
PC6 09
12
10U_0 805_10V_X5R
PR6 07
12
12
PR6 09
0_0402_ 5%
+1.8VSP
PU6 02
1
FB
2
GND
3
SW
4
IN
5
BS
MP2 121DQ-LF -Z_QFN10_3X3
PJP602
12
PA D-OPE N 3x3m
EN/SYNC
GND
POK
10
9
8
SW
7
IN
6
11
TP
(1.5A, 60mils ,Via NO.= 3)
+1.8VS
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
B
PR6 08
12
402K_04 02_1%
12
PC6 11
0.1 U_0402 _10v_X7R
PC6 10
10U_0 805_10V_X5R
+1.8VSP
33
+5VALW
44
A
PL601
HCB 1608KF-121 T30_0603
12
PR6 05
0_0402_ 5%
12
12
PC607
@0.1 U_0402_16V 7K
SLP_S3# 14 ,23,29 ,30,32, 33,35,37
PL602
1.2U H +-30 % 1231 AS-H-1R 2N=P3 2.9A
12
12
1.8VS_POK 32
2008/09/152010/12/31
12
PD6 02
@B340A_ SMA2
PR6 06
4.7_ 1206_5%
12
PC6 12
680P_06 03_50V7K
Compal Secret Data
Deciphered Date
PC6 13
22U _0805_6.3V6 M
C
+1.8VSP
1
1
PC6 14
2
2
22U _0805_6.3V6 M
Title
Size Do cum ent Num berR ev
Da te:Sheet
Compal Electronics, Inc.
0.75VSP/1.8VSP
LA-4902P
D
3847T uesd ay, J anuary 05, 201 0
0.9
o f
A
B
C
D
PR5 16
PM_SLP_LAN#1 4,30, 33
11
+5VALW
+5VALW
22
12
PR5 18
316_040 2_1%
PC5 20
1U_ 0603_10V6K
12
SLP_S4#14,24,2 9,33
33
+5VALW
+5VALW
12
PR5 22
316_040 2_1%
PC5 22
1U_ 0603_10V6K
0_0402_ 5%
+1.0 5VMP_LAN
+1.0 5VMP_LAN
PR5 21
0_0402_ 5%
+1.5VP
+1.5VP
12
12
PC5 19
12
@1000P_ 0402_50V7K
12
PR5 190_0402_5%
PR5 03
12
4.12 K_0402_1%
12
PC5 26
@10P_04 02_50V8J
10K_040 2_1%
12
PC5 24
12
@1000P_ 0402_50V7K
12
PR5 200_0402_5%
PR5 01
12
10.2 K_0603_0.1 %
12
PC5 25
@10P_04 02_50V8J
10K _0603_0.1%
PR5 24
255K_04 02_1%
12
PR504
PR5 23
255K_04 02_1%
12
PR502
PR5 11
0_0402_ 5%
BST_1.05 V
12
1
PU5 01
2
TON
3
VOUT
4
V5FILT
5
VFB
6
PGOOD
12
1
PU5 02
2
TON
3
VOUT
4
V5FILT
5
VFB
6
PGOOD
12
14TP15
VBST
EN_PSV
DRVH
LL
TRIP
V5DRV
DRVL
GND7PGND
TPS 51117R GYR_QFN 14_3.5 x3.5
8
1.05 VM_LAN_POK 32
BST_1.5V
14TP15
VBST
EN_PSV
DRVH
LL
TRIP
V5DRV
DRVL
GND7PGND
TPS 51117R GYR_QFN 14_3.5 x3.5
8
13
12
11
10
9
PR5 10
0_0402_ 5%
12
13
12
11
10
9
UG_ 1.05V
LX_1.05V
PR5 17
12
+5VALW
LG_ 1.05V
UG_ 1.5V
LX_1.5V
PR5 15
12
+5VALW
LG_ 1.5V
PC5 11
0.1U _0402_10V7 K
12
14.3 K_0402_1%
PC5 10
0.1U _0402_10V7 K
12
14.3 K_0402_1%
12
PC5 21
4.7U _0805_10V6 K
12
PC5 23
4.7U _0805_10V6 K
PR5 09
0_0402_ 5%
12
PR5 08
0_0402_ 5%
12
UG1 _1.05V
AON 7702L_ DFN8-5
UG1 _1.5V
AON 7702L_ DFN8-5
PQ504
PQ503
SIS41 2DN-T 1-GE3_POW ERPAK8-5
35
241
35
241
PQ501
SIS41 2DN-T 1-GE3_POW ERPAK8-5
35
241
35
241
12
PQ502
+1.0 5VMP_LAN
12
+1.05VM_ LAN_B+
12
12
PC5 05
PC5 04
0.1 U_0402_25V 6
1000P _0402_50V7K
2.2U H_PCM C063T-2R2 MN_8A_20%
12
PR5 13
2.2_ 1206_5%
12
PC5 17
1000P_0 603_50V7K
PJP501
12
PA D-OPE N 4x4m
1.5V_B+
12
12
PC5 02
PC5 01
0.1 U_0402_25V 6
1000P _0402_50V7K
2.2U H_PCM C063T-2R2 MN_8A_20%
12
PR5 12
2.2_ 1206_5%
12
PC5 16
1000P_0 603_50V7K
PC5 06
4.7 U_0805_25V 6-K
PL503
12
4.7U _0805_ 6.3V6K
PC5 08
4.7 U_0805_25V 6-K
PL502
12
4.7U _0805_ 6.3V6K
PL501
HCB 1608KF-121 T30_0603
12
12
PC5 07
4.7 U_0805_25V 6-K
12
PC5 14
+1.0 5VM_LAN
PL504
HCB 1608KF-121 T30_0603
12
12
PC5 09
4.7 U_0805_25V 6-K
12
PC513
B+
+1.05VMP_LAN
1
+
PC5 15
2
220 U_B2_2.5VM_ R25M
(8A,32 0mils ,Via NO.= 16)
B+
+1.5VP
1
+
PC5 12
2
330 U_2.5V_B2_ R15M
1.5V _POK 32
PJP502
44
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
A
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
B
2008/09/152010/12/31
Compal Secret Data
Deciphered Date
C
+1.5VP
12
PA D-OPE N 4x4m
Title
Size Do cum ent Num berR ev
Da te:Sheetof
(8A,32 0mils ,Via NO.= 16)
+1.5V
Compal Electronics, Inc.
1.5VP/1.05VMP
LA-4902P
D
3947T uesd ay, J anuary 05, 201 0
0.9
8
HH
H _VID 0
H_ VID 07
H _VID 1
H_ VID 17
H _VID 2
H_ VID 27
H _VID 3
H_ VID 37
H _VID 4
H_ VID 47
H _VID 5
H_ VID 57
H _VID 6
GG
PR OC_D PRS LPVR7
FF
H_P ROCH OT#4
EE
PR2 35
8.0 6K_040 2_1%
DD
PC2 27
150 P_040 2_50V8J
PR2 38
CC
PR2 60
H_ VID 67
PG D_IN14 ,30
CLK _EN#11
VGATE1 2,14
+VC CP
PSI #7
12
PR2 23 147K _0402_1%
+V CCP
PC2 20 @ 56P_ 0402_50V 8
1 2
PR2 27 @4. 02K_04 02_1%
12
12
@47 0K_0 402_5%_ TSM0B47 4J4702RE
12
12
PC2 22
1 2
PC2 25
10P _0402_ 50V8J
1 2
12
PR2 41
412 K_0402_ 1%
S V
LL= -1.9
2.8 7K3 .92 K
1.3 K1.1K
PR2 09220 _0402_5 %
12
PR OC_ DPRS LPVR
PR2 19
0_0 402_5%
12
PR2 21 @1K_ 0402_5%
12
PSI #
100 0P_040 2_50V7K
12
12
PR2 25
0_0 402_5%
PH2 02
12
PR2 36
562 _0402_1 %
ISE N2
ISE N1
L V
LL= -3
PR2 22 0_0 402_5%
PR2 83 1K_0 402_5%
12
12
PR2 24
68_ 0402_5%
22P _0402_ 50V8J
390 P_0402 _50V7K
12
PR2 38
2.8 7K_040 2_1%
+3V ALW
1 2
47K _0402_1 %
1 2
PC2 21
PC2 24
VSU M-
10K1 0. 7KPR2 46
8
12
PR2 51 0 _0402 _5%
PR2 63 0 _0402 _5%
12
330 P_0402 _50V7K
100 0P_040 2_50V7K
VC CSEN SE7
BB
VSS SENSE7
AA
PR2 15
12
PR2 29
12
+5V ALW
12
0.2 2U_0 603_10V7K
PC2 36
PC2 44
PC2 47
7
PM_ PWR OK
CLK _EN#
37
38
39
40
PU2 01
1
PGOOD
2
PSI#
3
RBIAS
4
VR_TT#
5
NTC
6
VW
7
COMP
8
FB
9
ISEN3
10
ISEN2
41
AGND
@0_ 0402_5%
12
0.2 2U_0 603_10V7K
PC2 37
12
12
12
7
35
VID4
VR_ON
CLK_EN#
DPRSLPVR
ISEN111VSEN12RTN13ISUM-14ISUM+15VDD
16
12
PC2 48
330 P_0402 _50V7K
PC2 49
1 2
@12 00P_04 02_50V7K
VID031VID132VID233VID334VID536VID6
BOOT2
UGATE2
PHASE2
VSSP2
LGATE2
VCCP
PWM3
LGATE1
VSSP1
PHASE1
VIN
IMON18BOOT119UGATE1
ISL 6288 3HRZ- T_QFN40 _5X5
17
20
12
12
PC2 28
1U_ 0603_ 10V6K
82.5_0402_1%
PR250
PC2 45
0.0 1U_0 402_16V7K
PR2 60
1.3 K_0402 _1%
12
@10 0_0402_ 1%
12
PR2 65
H _VID 0
H _VID 1
H _VID 2
H _VID 3
H _VID 4
H _VID 5
H _VID 6
PR OC_ DPRS LPVR
PC2 11
1U_ 0603_ 10V6K
30
29
28
27
26
25
24
23
22
21
12
PR2 42 0 _040 2_5%
12
PR2 44 1 _040 2_5%
12
PC2 29
0.2 2U_0 603_25V 7K
6
1 2
PR2 28
0_0 402_5%
12
PC2 23
1U_ 0603_ 10V6K
CPU_B+
+5V ALW
10K _0402_1 %
12
0.2 2U_0 603_10V 7K
PC2 42
6
+5V ALW
PR2 46
12
PC2 43
12
PR2 66 1K_0 201_5%
12
PR2 67 1K_0 201_5%
12
PR2 68 1K_0 201_5%
12
PR2 69 @1K_ 0201_5%
12
PR2 70 @1K_ 0201_5%
12
PR2 71 1K_0 201_5%
12
PR2 72 @1K_ 0201_5%
12
PR2 73 1K_0 201_5%
12
PR2 39 0 _0402 _5%
12
12
12
PC2 30
VSS SENS E
VSUM +
12
PR2 52
2.6 1K_040 2_1%
0.0 22U_ 0402_16V7 K
12
12
PH2 01
PR2 62
11K _0402_1 %
VSU M-
PC2 50
0.1 U_04 02_10V7 K
+VC CP
IMV P_IMON 7
0.0 47U_ 0603_16 V7K
12
PH2 03
@10 KB_0 603_5 %_ERTJ1 VR103J
10K B_06 03_5% _ERTJ1V R103J
5
H _VID 0
H _VID 1
H _VID 2
H _VID 3
H _VID 4
H _VID 5
H _VID 6
PR OC_ DPRS LPVR
BOO ST_C PU2
UGA TE_C PU2
PHA SE_C PU2
LGA TE_C PU2
5
BOO ST_C PU1
PR2 08
0_0 603_5%
UGA TE_C PU1
PHA SE_C PU1
LGA TE_C PU1
4
PR2 80 @1K_ 0201_5%
12
PR2 81 @1K_ 0201_5%
12
PR2 82 @1K_ 0201_5%
12
PR2 75 1K_0 201_5%
12
PR2 76 1K_0 201_5%
12
PR2 77 @1K_ 0201_5%
12
PR2 78 1K_0 201_5%
12
PR2 79 @1K_ 0201_5%
12
12
PR2 48
0_0 603_5%
Security Classification
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
VID[5:3] =100 fo r SV CP U 48A
VID[5:3] =011 fo r LV CP U 35A
PC2 09
0.2 2U_0 603_10V7K
1 2
12
PR2 49
0_0 603_5%
PR2 74
0_0 603_5%
PC2 40
0.2 2U_0 603_10V7K
1 2
Issued Date
4
UGA TE1_ CPU2
4
12
UGA TE1_ CPU1
12
4
2008/09/152010/12/31
3
CPU_B+
PC2 01
PQ2 01
IRF H79 14TR PBF
123
PQ2 02
TPC A8028 _PSO8
241
PQ20 5
123
IRF H79 14TR PBF
PQ2 06
TPC A8028 _PSO8
241
Deciphered Date
0.1 U_04 02_25V6
PC2 31
3
5
35
5
35
Compal Secret Data
12
PC2 02
12
0.1 U_04 02_25V6
2
PL2 01
HCB 2012 KF-121 T50_0805
12
12
PL2 03
12
220 0P_040 2_50V7K
12
PC2 32
220 0P_040 2_50V7K
PC2 46
12
12
PC2 03
PC2 07
4.7 U_08 05_25V6- K
PR2 11
PC2 10
100 0P_060 3_50V7K
12
PR2 53
12
100 0P_060 3_50V7K
PC2 08
4.7 U_08 05_25V6 -K
4.7 U_08 05_25V6- K
12
PR2 13
2.2 _1206_ 5%
12
2.2 _1206_ 5%
3.6 5K +- 1% 0603
12
PC2 33
4.7 U_08 05_25V6- K
PR2 55
HCB 2012 KF-121 T50_0805
12
12
PC2 04
4.7 U_08 05_25V6 -K
PL2 02
0.3 6UH 20% PCM C104 T-R36MN 1R105 3 0A
1
LF 2V2 N
12
12
PR2 14
PR2 20
10K _0402_1 %
@0_ 0402_5%
12
ISE N2
VSUM +
12
12
PC2 38
PC2 34
4.7 U_08 05_25V6- K
4.7 U_08 05_25V6- K
LF 1V1 N
12
12
PR2 56
10K _0402_1 %
3.6 5K +- 1% 0603
ISE N1
VSUM +
Title
Size Doc ume nt N umberR ev
Dat e:Sheeto f
2
4
3
2
V1 NVS UM-
CPU_B+
12
PC2 39
4.7 U_08 05_25V6- K
PL20 4
0.3 6UH 20% PCM C104 T-R36MN 1R105 3 0A
1
4
3
2
PR2 59
@0_ 0402_5%
12
V2 N
Compal Electronics, Inc.
CPU_CORE
L A-39 42P
1
B+
1
+
PC2 06
100 U_25V_M
2
+C PU_C ORE
12
PR2 16
1_0 402_5%
+C PU_C ORE
12
PR2 57
1_0 402_5%
VSU M-
4047Tue sday , J anua ry 05, 2010
1
0. 9
5
BQ2 4740VREF
12
PR1 000
165K_04 02_1%
IADAP T35
DD
12
PR1 013
10K_040 2_1%
1
2
3
12
PR1 018
76.8 K_0402_1%
ADP _SIGNA L
12
PR1 022
100_040 2_5%
CC
VI N
PQ1003
NDS 0610_NL_ SOT23-3
12
PR1 030
68K_040 2_5%
12
PR1 040
33K_040 2_5%
12
PR1 045
BB
4.7 K_0402_5%
1SS 355_SOD323-2
2VR EF_51125
12
PR1 063
130K_04 02_1%
AA
12
PR1 065
10K_040 2_1%
PD1 004
PR1 046
8.6 6K_0402_1%
12
12
12
12
5
6
12
10K_040 2_5%
PR1 042
8.06 K_0402_1%
E
3
C
PQ1006
1
MMBT3906H_S OT23-3
AD P_A_ID
PR1 059
45.3 K_0402_1%
12
PR1 062
1M_0402 _5%
VL
8
P
+
O
-
G
PU1 05B
LM393DG _SO8
4
AD P_A_ID
PR1 066
5
+3VL
B
2
8
3
P
+
O
2
-
G
PU1 004A
4
LM393DG _SO8
+3VL
12
PR1 064
22K_040 2_5%
7
AD P_A_ID 30
ADP _DET# 30
4
PC1 000
0.22 U_0603_10V 7K
12
PU1 000
+IN
V-
-IN
LMV321AS5X_SOT23-5
1SS 355_SOD323-2
D
S
13
G
2
1
4
5
V+
4
OUT
PD1 000
12
2N7 002KDW H-2N_SOT3 63-6
2N7 002KDW H-2N_SOT3 63-6
+5VS
12
PC1 001
0.0 1U_0402_16 V7K
12
PR1 017
2K_0402 _5%
PD1 001
1SS 355_SOD323-2
12
12
1
PR1 025
2
3.9 K_0402_5%
PQ1007B
PQ1007A
3
SRSET 35
C
PQ1005
PR1 028
OC P_A_IN
2
B
E
31
12
PD1 003
GLZ 4.7B_LL34-2
ADP _EN# 35
MMBT3904W H_SOT323-3
OC P_A_IN 30
OCP30
12
PR1 031
100K_04 02_1%
12
27. 4K_0402_1%
PR1 029
12
PC1 004
0.0 1U_0402_16 V7K
12
100K_04 02_5%
12
PR1 032
100_040 2_5%
PC1 003
3900P _0402_50V7K
34
5
VCC 1_PW RGD 30,36
61
2
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
ADP _EN 30
2008/09/152010/12/31
3
Compal Secret Data
Deciphered Date
2
PR1 033 @0_0402 _1%
12
PR1 034 200K_04 02_1%
12
5
6
12
PR1 027 100K_04 02_1%
PR1 026
100K_ 0402_1%
2
+5VS
8
P
+
-
G
PU1 004B
4
LM393DG _SO8
12
1
+3VS
PR1 019
10K_040 2_5%
12
12
PR1 020
0_0402_ 5%
13
D
2
G
S
PQ1004
SSM 3K7002FU _SC70-3
PR1 035
12
7
O
10K_040 2_5%
+3VL
Title
Size Do cum ent Num berR ev
Cu stom
LA-4902P
Da te:Sh eeto f
+3VS
Compal Electronics, Inc.
ADP_OCP
4147T uesd ay, J anuary 05, 201 0
1
OCP # 15
5
4
3
2
1
B+
DD
PR7 04
10_0402 _5%
12
VSS_AXG _SENSE7
VCC _AXG_SENSE7
+GF X_CORE
CC
PR7 06
10_0402 _5%
12
150P_04 02_50V8J
PL701
HCB 2012KF-121 T50_0805
12
PL703
HCB 2012KF-121 T50_0805
12
12
PC7 09
1000P_0 402_50V7K
12
PC7 12
330P_04 02_50V7K
PR7 10
10.5 K_0402_1%
12
12
PC7 20
PR7 35
17.8 K_0402_1%
825K_04 02_1%
12
12
GFX_B+
12
PC7 01
2200P _0402_50V7K
12
PR7 11
12
PC7 16
100P_04 02_50V8J
PC7 21
22P_040 2_50V8J
12
12
12
PC7 02
4.7 U_0805_25V 6-K
PC711
330P_04 02_50V7K
PC7 17
1000P_0 402_50V7K
8.06 K_0402_1%
PC7 03
4.7 U_0805_25V 6-K
PR7 34
12
12
12
PC7 04
4.7 U_0805_25V 6-K
PC7 27
PC7 05
0.1 U_0402_25V 6
4.7 U_0805_25V 6-K
+5VALW
PR7 01
1_0402_ 5%
12
12
PC7 06
1U_ 0603_10V6K
29
AGND
7
VSEN
6
FB
5
COMP
4
PR7 12
47K_040 2_1%
12
+GF X_CORE
VW
3
12
RBIAS
2
PGOOD
1
CLK_EN#
12
12
12
PR7 19
PR7 20
@10K _0402_1%
@1. 91K_0402_1%
PR7 02
0_0402_ 5%
ISUM+
ISU M-
10
9
8
11
12
RTN
PU7 01
ISL62 881HR Z-T_QFN28_4X 4
28
VIN
VDD
ISUM
ISUM+
VID5
VID626VR_ON27DPRSLPVR
25
24
12
12
13
IMON
VID323VID4
PC7 07
0.2 2U_0603_25 V7K
BST_GFX
14
BOOT
UGATE
PHASE
VSSP
LGATE
VCCP
VID0
VID1
VID2
22
12
PR7 03
22. 6K_0402_1%
12
PR7 05
0_0603_ 5%
15
LX_GFX
16
17
DL_GFX
18
19
20
21
12
0_0402_ 5%
12
PC7 08
0.2 2U_0402 _6.3V6K
12
PC7 10
0.22 U_0603_10V 7K
PR7 33
0_0603_ 5%
12
PR7 13
12
0_0603_ 5%
12
PC7 18
2.2U _0603_10V7 K
GFX VR_IMON7
PR7 15
VSS_AXG _SENSE 7
DH_ GFX1DH_ GFX
+5VALW
AO N6718 L 1N D FN
PQ702
578
36
35
PQ701
AO4474L _SO8
241
241
12
PR7 07
2.2_ 1206_5%
12
PC7 19
0.56 UH +-2 0% PCM C104T-R5 6MN 25A
1000P _0603_50V7K
PL702
12
12
PR7 08
3.65 K_0603_1%
12
PR714
2.61 K_0402_1%
PR717
12
11K_040 2_1%
PC7 22
12
0.1U _0402_16V7 K
12
PR7 09
PH7 01
12
10K B_0603 _5%_ERTJ1VR1 03J
0_0402_ 5%
(15A,6 00mils ,Via NO.= 30)
+GFX_CORE
GFX VR_PW RGD32
GFX VR_CLKEN#
BB
PR7 310_0201_ 5%
12
PR7 320_0201_ 5%
12
AA
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Versio n chan ge lis t (P.I.R. List)Power sectionPage 1 of 1
1
ItemReason for changePG#Modif y List
For all S MSC10 98 pl atfor ms, p lease chan ge
1
the signa l "AC _AND_ CHG" to "A C_ADP _PRES ".
This is t o kee p up with AC ad apter tabl e cha nges made
2
DD
in K BC co de.
Chan ge PR 604 t o 15K to r esolv e +0. 75VS to
3
+1.5 V_CPU _VDDQ timi ng is sue s een o n Car tier/ Dior/ Vers ace.
To w orkar ound TPS51 125 t urn o n abn ormal issu e,
4
need to m ake s ure t otal caps on +5 VL ra il is at l east
30uF . Cu rrent ly on ly ha ve 20 .2uF.
The +1.8V S pow er ra il is very inef ficie nt an d
5
want to c hange to a bett er so lutio n.
For ULV C PU de sign reser ve.
6
To b est s olve the i ssue of +1 5V co mbo a dapte r
(air line adapt er) d etect , res erve PR127 , Add
35
PR12 8 76. 8K +- 1% 04 02.
PR10 42 ch ange the v alue from 21K + -1% 0 402 t o 8.0 6K + -1% 0 402.
PR10 59 ch ange the v alue from 24.9K +-1% 0402 to 4 5.3K +-1% 0402 .
41
PR10 46 ch ange the v alue from 4.12K +-1% 0402 to 8 .66K +-1% 0402 .
PR60 4 cha nge t he va lue f rom 1 0K to 20K.
PD60 1 add the compo nent 1SS35 5.
38
PC60 6 add the compo nent 0.1uF _0402 _16V7 K.
Add PC316 10U_ 0805_ 10V6K
PC30 7 cha nge t he va lue f rom 1 0U 6. 3V M X5R 0 805
to 2 .2U 1 0V K X5R 0 805.
36
PC31 5 cha nge t he vl aue f rom 1 0U 10 V K X 5R 08 05
H1.2 5 to 22UF 6.3V M X5R 0805 H1.2 5.
36
Chan ge +1 .8VS VR sc hemat ic.
Rese rve P R229 / 0_0 402_5 % and
40
PH20 3 10K B_060 3_5%_ ERTJ1 VR103 J
DatePh ase
2009/5/4
2009/6/29
2009/8/28
2009/8/29
2009/9/16
2010/01/04
DB-2
SI-1
SI-2
SI-2
SI-2 B
MV
7
CC
BB
AA
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
Compal Secret Data
2008/09/152010/12/31
Deciphered Date
2
Compal Electronics, Inc.
Title
Changed-List History
Size D oc umen t Numbe rRe v
Date :Sheetof
LA- 4902 P
4347Tuesda y, Janua ry 0 5, 201 0
1
0.9
5
pin1 &
Redu ce u n-insta ll parts f or XDP-CPUDel R4, R6, R8, R11, R40, R41, R43, R48, R49
<2009.01.12>
DD
CC
<2009.01.14>
1
Add test points at XDP-CPU4Add T112, T113
2
Redu ce e DP la ne to meet panel res olution.5Red uce lan e1, 2
3
Add 1uf Cap s to meet Intel design gu de at +VCA P0, +VCAP17add Caps account t o 12pcs
4
5
Add L31 at +VTT_DDR
6
Add L32 at +VDDQ_CK
7
Chan ge R 171 net name at XD P-PCH1 2Cha nge USB_OC #6 to PCH_ XDP_GPIO10
8
Add R190 at XDP-PCH12ad d R1 90 & USB_O C#4
9
Chan ge p ull up for Intel Design Gui de13ch ange pu ll up to contact t o R206 pin 1
1 0
Remo ve L VDS for HP request1 4Rem ove LVDS-A ch annel
1 1
chan ge v alue for H P request15ch ange R270 , R274 val ue to 39oh m
1 2
Add Resi sters for XDP-PCH
1 3
Chan ge R 295 net name at XD P-PCH1 5Cha nge USB_OC#7 t o WOW#
1 4
Chang e value25Ch ange R4 51 to lerance to 1% and C4 41 toleran ce
1 5
Chang e value25Ch ange C428 value to 1 000P
1 6
Remo ve E -SATA for HP request
1
4
PA G EMod i fy L is tFi xe d Is s ue a n d ch an g e it emI t em
3
2
1
M. B . V er .
0.14
0.1
0.1
0.1
8a dd C aps a ccount to 24pcsAdd 1uf Cap s to mee t Intel de sign gude at +Vccp
7a dd L31
7a dd L32
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
15Ad d R35 1, R265
0.1
0.1
0.1
0.1
12Re move SATA-2 channel
24Re move E-SAT A support circuit
0.1
Chan ge U SB group for HP re quest1 5Cha nge USB -1 from Right side to Rear-1 side
2
Modi fy Aud io circuit
3
Add 4.7K ohm pul lup to +3 V and a 0. 01uF capac itor at HD A_RST#26Ad d R703 , C637
4
Chan ge Audi o Gain dB26R48 6 & R49 1 instal l ; R485 & R492 un-i nstall.
5
Dele te c hannel-C signals o f DP
<2009.01.15>
BB
<2009.01.16>
AA
1
Chan ge p ower USB control m ethod chan ge P owe r USB s olution to one chip control so lution
2
chan ge A udi o Dock Line in / out sense circuit
3
Add Ext-Mic A mp.
4
Chan ge XDP- CPU net
1
Chan ge e DP_AUXN contact t o CPU pin
2
Remo ve CFG 7 (No supp ort)
3
Add pull up for HP request
4
GFX_ CORE ne eds high f requency d ecoupling.
5
VTT pins contac t wrong po wer source
6
CPU_ CORE mi ssing high frequency decouplin g.
7
Chan ge L AN po wer source control m ethod
8
9
26
Add FET and s upport cir cuit for S ENSE.
27
Chan ge Audi o jack
14
Dele te c hannel-C signals o f DP
24
26ch ange R5 10, R515 value t o 100k and R510, R51 5 pin1 con tact to A- GND
27
Add Ext-Mic A mp.
4J P4 [ 28, 30] conn ect to CFG [10:11 ]. JP4 [34 ,36] conne ct to CFG [6:7].
5
MB_C _DP_ AUXN should con nect to U1 A.D19.
5
delet e R71.
7A dd 1 0K (R70 5) NI pull -up to +VC CP on GFXV R_EN.
Add 16x040 2 1uF caps .
7
Chan ge VTT pin to +V CCP
7
Add 25x040 2 1uF caps .
7
C330 - C 333 , C3 29, R383, R386, Q21 uninstall and change "LAN_CTRL _18" to "L AN_CTRL_10 "
21
Add USB cha nnel 6Add USBP 6 for su pport WiMa x. 22
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
15
Secur ity Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2006/02/132010/12/31
Compal Secret Data
Deciphered Date
Title
Size Doc ument NumberRe v
Cus tom
2
Date:Sheetof
Compal Electronics, Inc.
HW PIR(1)
LA-5251P
1
4447T uesday, J anuary 05, 2 010
0.9
5
4
3
2
1
KAT10 from DB-2 to SI-1 LA-5251P REV:0.2 -> 0.3 Modify <2009.06.08.~2009.07.02. >
ItemImpactDatePageRev.Modify DescriptionChange Cause
0.316/12CKT,Layout29-To avoid Docking side DP monitor signals back drive PCH during S3/S4/S5 <HP>.
0.3-Add U13,R319 (10K_0402);Remove and Del C550,C551,C552,Q12,U11,U12,U29,U30,U31,R320,R321,R327,R328,R329,R330;Del D5,D6,D7.36/14CKT,BOM,Layout18,29-Change CRT Switch design from TI/TS5A3157 to MAXIM/MAX4885E
0.346/16BOM19-Make R338 & R344 no install. Make R332 & R337 installed.-Correct the DP design. <HP>
for Layout Quality improve also Components reducing. <Compal>
0.356/16CKT,Layout23-Change net connection and move C933 to in between R1079.2 and R1077.1.-Current placement of C933 is ineffective to limit inrush current.<HP>
0.366/16CKT,Layout13-Add back the 25MHz XTAL_IN circuit for Intel workaround on sighting #400750 -
DD
0.376/16CKT,BOM,Layout26-A udio Am p Int. regulator design concern.<HP>-Add R490 (100K_0402) close to U24.25 to connect U24.25 and PLT_RST#.
0.38
6/16CKT,BOM,Layout15,20-To leverage the LDO regulator of the camera modules.<HP>-1.Change R365 from 0_0201 to 0_0402. Change R569,R613 from 100K_0201 to 100K_0402.Change R377 from 100K_0201_1% to
3306048 - 96MHz jitter.<HP>
0.396/17CKT,Layout28-Correct the TouchPoint pin connection.<Compal>-Correct JP2 7 conn ection from currently Pin1:+5VS,Pin2:RIGHT,Pin7:GND,Pin8:GND to Pin1:RIGHT,Pin2:NC,Pin7:NC,Pin8:+5VS.
0.3106/18CKT,Layout16-Simplify the reserve circuit.<HP>-Del C277(@10U_0603). Move C276 and related routing to bottom layer 0 mm limit high area without vias.
0.3116/18CKT,Layout30-Design Change for KBC I/F power rail synchronize.<HP>-Change U8.5 power from +3VALW to +3VL.
0.3126/18CKT,BOM,Layout24-Add com mon mo de chokes on all USB walk-up ports to address PCH EMI
0.3136/18CKT,BOM,Layout30-Design Change for KBC I/F power rail synchronize.<HP>-Change U8.5 power from +3VALW to +3VL.
issue on full/low s peed USB devices.<HP/INTEL>
0.3146/18CKT,BOM,Layout19-Add fus e (0.5A) for DP Safty solution.<Compal>-Add F2(FUSE) between R349.2 and JDP1.20 for Safty s olution.
0.3156/22CKT,Layout16-Layout Placement Limitation.<Compal>-Del C277(@10U_0603) and C276, add the test points T126,T127 for the ball pins.
CC
0.3166/25CKT,Layout22-Change 1. 8"HDD design from cable to Board to Board connection.<HP>-Del JHDD1 a nd JHDD2 Cable design. Add JHDD3 B to B directly connect design.
0.3177/1CKT,Layout25-Need to add ES D protection to SC_DATA, SC_RST, & SC_CLK.<HP>-Reserve D54,D55,D56 ESD protection design as what Ricoh recommend.
180.37/1CKT,BOM,Layout11-Reserve Low Power CLK Gen design.<Compal>-Modify U6 Pin1,17,24 connection from +3VS_CK505 to +3VS_CK505_G (+3VS and +1.5VS option for tuture); Add R143(0ohm_0603)
190.37/1CKT,BOM,Layout12,20-Mak e the LID_S W# design change for leakage issue fix.<HP>-Change Q56.5 from DISP_OFF# to LID_SW#; Del D10(DAP202U); Add R361(10K_0402) close to U7; Add D57(CH751H); Remove
0.3207/1CKT,BOM,Layout13-Fix I NTEL Chipset Issue impact DP function. <HP/INTEL>-Del T122, Del R1093(0_0402) and replace by add C200 (18P); Install R210,Y3,C199 by Intel finalized DP workaround and need them.
0.3217/1CKT,BOM,Layout13,21-Follow INTEL Design Change. <HP/INTEL>-Remove R388 (0_0201); Connect U14.48 through add R407 (0_0402) to U7.U4 (R202.2) by INTEL request.
0.3227/1CKT,BOM,Layout30-Follow SMsC KBC Chip Design Change and VCC1 decoupling improve. <HP/SMsC>-Add C565 (0.1U_0402) on and close to U32.14 for VCC1 decoupling improve by SMsC request; Change C559 from 4.7UF_Y5V to 4.7UF_X5R.
0.3237/1CKT,BOM,Layout30,14,22 -D esign s implify on b oth EE and PWR from HP. <HP>-Del D37(@CH751H) and related. Remove R246,R422,and delete PR217.
0.3247/1CKT,BOM,Layout33-Add +VCCP and +GFX_CORE discharge circuit. <HP>-Add R699,R702,Q41 for +VCCP and +GFX_CORE discharge
0.3257/1CKT,BOM,Layout22-Half size m ini card I/F transfer design reserve for future. <Compal>-Del T87, Add R475 (0_0201) and R453 (0_0402); Reserve R433,R437,R432,R421,R431,R441 close to JP6 bottom layer under the module
0.3267/1CKT,Layout22-Update t he Symbol and PCBFootprint for meet. <Compal>-Update JODD1 PCB Footprint from ALLTO_C18522-11303-L_13P_NR to TYCO_2023233-3_13P_NR
0.3277/2CKT,BOM15-Simp lify the design for save power consumption. <HP>-Change R279 from 10K_0201 to 100K_0201.
0.3287/2CKT,BOM,Layout23-Design change for WW AN Power Rail. <HP>-Chang e R1077.1,C933.1,Q77.3,J3.2 connection from +3VS to +3VALW for WWAN power rail. Install C933(1000P_0402) in order to slow
0.3297/2CKT,Layout15-Design change for LAN_DIS#. <HP>-LAN_DI S# R298 should be pulled-up to +3VM_LAN instead of +3VALW.
BB
0.3307/2CKT,BOM,Layout12-Design change for LID_SW#. <HP>-Delete R135 since it is a duplicate. Change R361 to 100K_5%. Add 100K_5% pull-up to +3VL on LID_SW# and close to U32.64.
0.3317/2CKT,BOM30-Update the Board ID setting for SI-1. <HP>-For SI-1 Bo ard ID detec t, make R574 installed & make R575 no install.
0.3327/2CKT,BOM30-Simp lify the design for save power consumption. <HP>-Remove R589 on KBRST# pull-high to +3VL. Change R607 on PM_RSMRST# from 10K to 100K to reduce current.
0.3337/2CKT,Layout31-Design change t he USB I/F FPR ESD solution. <HP>-C hange the ESD diode (D39.4) power supply from +3VALW to +5VALW.
0.3347/2CKT,BOM31-Simp lify the design for save power consumption. <HP>-Remove R626 (0_0201) since there is an internal pull-down in U34.
0.3357/2CKT,Layout28-Reserve Caps solution on STB_LED# for EMI verify. <Compal EMI>-Reserve C536(1000P_0402) Cap on STB_LED# close to JP22.8 for EMI noise issue verify.
0.3367/3CKT,Layout23-New Card Power Switch design change for portload test improve. <TI>- Connect U17 pin 12 and 14;pin2 and pin4;pin11 and 13;pin3 and 5 for express card portload test.
0.3377/3CKT,BOM,Layout12,13- GPIO13 has internal pull-down which is source of leakage. <HP>-Change U7. J30 c onnection from LID_SW#_ISO# to T122. Change U7.B9 connection from SMBALERT# to LID_SW#_ISO#. Del R193
0.3387/3CKT,Layout20-Current draw on INVPWR_B+ could be very high.<HP>-Change JEDP1 pin6 connection from +3VS to INVPWR_B+.
0.3397/3CKT,BOM,Layout30-Save one resistor but also reduce the two long traces.<HP>-Del R594 (220_0402) (PM_PWROK)
-Change JP30 Pin 8 connection from NC to SLP_S3#
-Change JP30 Pin 39 connection from NC to SATA_LED#0.326/12CKT,Layout29-New add SATA_LED# to monitor stand port <HP>.
-Reserv e back the 25MHz design circuit. (Reserve Y3, R210,C199); Move R1093 to close to Y3 and C199.
100K_0402_1%.
2.Renam e WEBCAM_OFF to WEBCAM_ON and connect PCH GPIO37(U7.AB13) through WEBCAM_ON_R by R375(0_0402) to JEDP1.18.
3.Connect +5 VS_WEBCAM to +5VS through R304 (0_0603) close to JEDP1.24 and move C316~C319 close to JEDP1.24. Del
Q17,C315,C321,R360-R362,R367,R373.
4.Change U7.AB13 and R287.1 connection from PCH_XDP_GPIO37 to WEBCAM_ON. Change R287 from 10K_0201 to
@10K_0402(uninstall).
5.Change U7.F16 connection from WEBCAM_OFF to USB_OC#2 and add pull-high R301(10K_0201) to +3VALW.
-Change JP13,JP14,D18,D19,D20 USB pairs net connection and add or reserve R352,R350,R354,R353,R360,R355,L8,L9,L19,L26. Change
R443,R444 from 0201 to 0402 and also the net connection.
to +3VS and reserve R120(@0ohm_0603) to +1.5VS but place close to U6.
R356(10K_0402);Change U7.J30 and R135.2 connection from LID_SW# to LID_SW#_ISO#.
Add 1K VGATE to PGD_IN resistor at PCH pin M6. Connect PGD_IN through add R408 (1Kohm_0402) to PCH U7.M6.
area for reworkable.
+3V_WWAN bring-up
(10K_0201) +3VALW PH.
AA
Secur ity Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2006/02/132010/12/31
Compal Secret Data
Deciphered Date
Title
Size Doc ument NumberRe v
Cus tom
2
Date:Sheetof
Compal Electronics, Inc.
H/W2 EE Dept. PIR SHEET(2)
LA-5251P
4547T uesday, J anuary 05, 2 010
1
0.9
5
4
3
2
1
KAT10 from SI1 to SI1-R LA-5251P REV:0.3 -> 0.4 Modify <2009.07.07.~2009.07.14. >
ItemImpactDatePageRev.Modify DescriptionChange Cause
0.417/8CKT,BOM,Layout32-To fix INT EL CPL S3 Power Leakage Issue <INTEL>.
0.427/8CKT,BOM,Layout4,15-To fix INTEL CPL S3 Power Leakage Issue <INTEL>.
0.437/8CKT,BOM,Layout33-To fix INT EL CPL S3 Power Leakage Issue <INTEL>.
DD
0.447/8CKT,BOM,Layout7,10-To fix INTEL CPL S3 Power Leakage Issue <INTEL>.
CKT,BOM,Layout32-To fix I NTEL CPL S3 Power Leakage Issue <INTEL>.
0.467/9--Install R693 (470_0201) and Q53 (2N7002).CKT,BOM33-To fix INTEL CPL S3 Power Leakage Issue <INTEL>.
0.477/9CKT,BOM,Layout4,5-T o fix INTEL CPL S3 Power Leakage Issue <INTEL>.--Change R1092 PD connection from PCH_DDR_RST to SM_DRAMRST# and close to U1.BJ12. Add C6 (470P_0402) close to Q52.2.
0.487/10CKT,Layout7-To f ix INTEL CPL S3 Power Leakage Issue <INTEL>.--Change L32.2 connection from +1.5V to +1.5VS_CPU_VDDQ.
0.497/10CKT,BOM,Layout33-To fix I NTEL CPL S3 Power Leakage Issue <INTEL>.--Add C626,C664 close to JDIMA1;C656,C657 close to JDIMB1.
0.4107/17CKT,BOM4-To meet Intel electrical requirements <INTEL>.--Change back R12 from 4.99K_0402_1% to 1.5K_0402_1%; R13 from 2.49K_0402_1% to 750_0402_1%.
CKT,BOM,Layout7/17110. 4--Change R1103 from 470_0402 to 220_0402; R693 from 470_0201 to 22_0402.-To meet Intel ramp down timing for 1.5V and 0.75VS <INTEL>.33
0.4137/17CKT,BOM,Layout33-To to avoid a glitch while turning on +1.5V_CPU_VDDQ <HP>--Add C505 (@0.01UF_0402) close to U45.4.
0.4147/17CKT,BOM24-Correct BOM <Compal>--Change U18 and U20 from SA000027C00 (G548A2P8U MSOP) to SA00002WY00 (G548A1P8U MSOP) for BOM correct.
0.4157/22CKT,BOM,Layout28,30-Design change ON/OFF# control from PCH directly become through EC. <HP>
0.4167/22CKT,BOM,Layout30-Design reserve for themal fan table switch for SV/LV CPU type detect. <Compal>--Reserve CPU_SV_ID_DET with R551(@100K_0402)PH and R553(@100K_0402)PD.
CC
0.4177/22CKT,Layout15-Design res erve for themal fan table switch for SV/LV CPU type detect. <Compal>--Add R302(@10K_0201) PD close to R280 on PCH GPIO15.
<KBC will b lock the PWRBTN# and hold PWRBTN_OUT# HIGH when it receives a
comman d from the BIOS indicating BOOT BLOCK reprogramming is in progress.>
0.4187/24CKT,BOM26-Increas es at tenuat ion of PC beep to an acceptable loudness level. <HP>--Change R484 from 100K_0201 to 300K_0201.
0.4197/24CKT,BOM26-Increas es line in attenuation from -6dB to -10dB. <HP>--Change R502, R504 from 4.7K_0402_5% to 6.04K_0402_1% & R503, R505 from 4.7K_0402_5% to 2K_0402_5%.
0.4207/24CKT,BOM36-Per TI 's recommendation for 3VLP. <TI>--Change PC307 from 10U_0805_6.3V6M to 2.2U_0805_10V6K.
--Update U38 Symbol. Add one new signal "VCCP_1.5VSPWRGD" be generated from VCCP_EN through an new add AND gate U77 to R12.2 .
--Change R12.2 connection from +1.5V to VCCP_1.5VSPWRGD. Change R12 from 1.1K_0402_1% to 4.99K_0402_1%; Change R13 from
3K_0402_1% to 2.49K_0402_1%. Change U1.BJ12 connection from DRAMRST# to SM_DRAMRST# by add Q52 which control by
PCH_DDR_RST new connect from U7.F10 (PCH GPIO8)(GPIO8-->PCH_DDR_RST) and with add R1093 (1K_0402) PH to +1.5V, add R1092
from @10K_0402 to 100K_0402.
--Add new Power from +1.5V to +1.5VS_CPU_VDDQ by add U45,C624,C625,R1104 close to C152; Add +1.5VS_CPU_VDDQ discharge circuit
by add R1103(470_0402) and Q52B (already exist) close to U45.
--Change U1 VDDQ Power source from +1.5V to +1.5VS_CPU_VDDQ but keep C20~C27 at the same place; Del C145,C146,C119,C120
10UF_0603 reserve for U45 and related placement.
--Change U77.1 connection from VCCP_EN to SLP_S3# reserve through R6(@0_0402) or to +3VALW through R4 (8.2K_0402).0.457/9
--Disconnect LANLINK_R# from KBC (GPIO24/KSO16) by through R608(@0_0402) reserve; Rename GPIO24 of KBC to PWRBTN_OUT#;
Install R550 (Change R550 from 100K_0201 to 100K_0402); Disconnect the PWRBTN# output from the button switch to the PCH by remove
D34; Co nnect ON/OFFBTN# from KBC GPIO24 to the PCH let KBC can now control the PWRBTN#.
KAT10 from SI1-R to SI2 LA-5251P REV:0.4 -> 0.5 Modify <2009.08.11.~2009.08.28. >
ItemImpactDatePageRev.Modify DescriptionChange Cause
0.518/18CKT,Layout32-To avoid the thermal module Assy. risk. <Compal DFx>.
0.53--Change JP28-1 from +3VL to +VREG3_51125 power rail.8/25CKT,Layout28-To fix f alse CBB button triggering on AC insertion due to noise seen on +3VL
0.54--Change U7.P8 connection from LPC_PD# to SUS_STAT# as NC with only T87 test pad only. Add R367 4.7K_0402 with PH +3VS on U34.28.8/25CKT,BOM,Layout14,31-Disconnect LPC_PD# from TPM U34. <HP/Intel/Infineon>.
power rail. <HP>.
0.558/25CKT,BOM,Layout15,23--Change U7.T15 GPIO14 connection through R265(0_0402) from WOW# as NC to CPPE# which connect to ExpressCard JEXP1-17 & U17-10.-Rename WOW# (U7F-T15) to CPPE# and connect to JEXP1-17 & U17-10. <HP>.
0.568/25CKT,BOM26-Correct the Audio Amp. Gain setting. <Compal>.--Remove R485 (0_0201).
0.578/28CKT,BOM4-Prevent glitch on DRAMRST#. <HP>.--Change C6 from 470P to .1U_0402.
0.588/28CKT,BOM,Layout26-Ch ange audio REG_EN pin to +5VALW to prevent pop sound on warm boot. <HP>.- -Change R490.2 connection from PLT_RST# to +5VALW.
0.598/28CKT,BOM12-Remove PCH Debug Port related to save power consumption. <Compal>.--Remove R158,R156,R167,R165.
0.5108/28CKT,BOM,Layout29-Cancelled Dock ing +5VS Caps design reserve before for design simplify. <Compal>.--Del C543 (10U_0805), C544~C546 (0.1U_0402).
BB
0.5118/28CKT,Layout32-Cancel S kew Hole because of M/E PCB outline change. <Compal>.--Del H27 (H_3P0).
0.5128/28CKT,BOM,Layout19-Cancel Swatch system side Display Port Common Mode Choke reserve for design
0.5138/28CKT,Layout18-Reserve 10PF caps on VGA_RED_R, VGA_GRN_R, VGA_BLUE_R for EMI backup
0.5148/28CKT,BOM23-Cancel Braidwood support but keep design reserve. <HP>.--Remove R567,R562,C571,C566,JP11.
simplif y and layout space free. <Compal>.
solution. <Compal>.
0.5158/31CKT,BOM,Layout12-Add back PCH GPIO1 3 Ext. Pull-High to +3VALW. <HP>.--Change U7.J30 connection from T122 to become PCH_GPIO13 and pull-high to +3VLAW through R8(10K_0402).
0.5169/01CKT,BOM,Layout28-W W_LED# Design change for fix WWAN Module LED issue. <HP/Compal>.--Del Q33,Q35,R542 Change R1097,R1098,R1099 value and connection.
0.5179/01CKT,BOM,Layout24-Stakup USB Connector update fro Compal DFb review. <Compal>.--Chaneg JP13 PCB Footprint from SUYIN_020122MR008S51CZL_8P to SUYIN_020122GR008S51CZL_8P-T.
0.5189/03CKT,BOM15-Cancel Braidwood support but keep design reserve. <HP>.--Remove R257 (@32.4_0402_1%).
0.5199/03CKT,BOM23-To resolve slow turn off of +3V_WWAN. <HP>.--Install R1077 (10K_0402_5%).
209/03CKT,BOM26-To fix E Q set ting m ake the changes. <HP>.--Remove R491 (@100K_0201) ; Add R485,R486 (0_0201_5%).
0.5
0.5219/10CKT,BOM---To correc t the sym bol inside information to make value match with SMT BOM for
AA
long-term. <Compal>.
229/11CKT,BOM23-To reduce power consumption. <HP>.--Remove R1077 (@10K_0402)0.5
--Add b ack H 31 and make the DDR routing modify for this.
--Reserve R366 (@0_0402 ohm NI) resistor between Q56-1 and R361-2.0.528/25CKT,Layout20-To disconnect LID_S W#_ISO# from LID_SW# function. <HP>.
--Del L12~L16(@WCM-2012-900T_4P),R331,R333,R334,R335,R336,R339,R340,R341,R345,R347(0_0402) and related Net.
--Reserve C315,C320,C321(@10P_0402) close to R316,R317,R318.
--Change U8 from SA000023O00 to SA00003FF00; Q13 Q14 Q15 Q16 Q29 Q30 Q31 Q32 Q36 Q40 Q41 Q43 Q44 Q45 Q46 Q47 Q48
Q49 Q50 Q51 Q52 Q56 from SB570025280 to SB00000AR10; U17 from SA00001SL00 to SA00001SL20; U18,U20 from SA00002WY00
to SA000037P00; Q19, Q22, Q23, Q26, Q38, Q39 from SB923010030 to SB00000H500; U14 from SA00002MO10 to SA00002MO40; U6
from SA00002WX00 to SA00003NM00; U2 from SA000021J00 to SA00002ZT00; Change U46 from SA097010020 to SA097010040;
Correct L31 Value from TDK-MPZ140BS300A 0603 to 0_0603_5% for match; Correct L32 Value from 1UH_SQV322520T-1R0M-N_20% to
0_0603_5% for match; Install R551 (100K_0402) as default setting; Remove R143(@0_0603) and add R120(0_0603) for LP CLK Gen.
power as default setting; Remove &U1 for SMT BOM Match
Secur ity Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2006/02/132010/12/31
Compal Secret Data
Deciphered Date
Title
Size Doc ument NumberRe v
Cus tom
2
Date:Sheetof
Compal Electronics, Inc.
H/W2 EE Dept. PIR SHEET(2)
LA-5251P
4647T uesday, J anuary 05, 2 010
1
0.9
5
4
3
2
1
KAT10 from SI2 to SI2-R LA-5251P REV:0.5 -> 0.6 Modify <2009.09.11.~2009.09.29. >
ItemImpactDatePageRev.Modify DescriptionChange Cause
0.619/21CKT,BOM,Layout11,24-To fix BT turn off time (>250mS spec) <HP>.
0.6--Reserve Q28(SI2301),C975,C976,R1105,R1106 close to JEDP1.39/28CKT,Layout20-To prev ent inrush current problem seen on some panels. <HP>.
0.649/28CKT,Layout20--Reserve Reserve R372,C665 close to JEDP1.-To reserve the EMI solution for verify. <Compal-EMC>.
0.6510/01 CKT,BOM21-To fix c rysta l frequ ency stability risk. <INTEL>.--Change C341 and C342 from 27P_0402 to 33P_0402.
DD
--Change CLK Gen CK_PWRGD from Q7(2N7002_SOT23-3) to Q55(2N7002DWH 2N SOT363-6); Add Q55B 2N7002 discharge FET on
+3VAUX _BT; Add R135 (470_0402) series resistor between drain of FET and +3VAUX_BT. Reserve C506 (@0.1UF_0402) for tune.
--Change PC713,PC714 location name to C973,C974.0.629/22CKT,BOM7-Move +GFX_CORE Bulk Caps from Power related to EE related. <Compal>.
KAT10 from SI2-R to PV LA-5251P REV:0.6 -> 0.7 Modify <2009.10.13.~2009.11.4. >
ItemImpactDatePageRev.Modify DescriptionChange Cause
0.7110/13 CKT,BOM,Layout24-Change one of the USB Bulk Cap from 150UF to 220UF. <Compal>.
0.73
0.74
0.75
10/19 CKT,BOM,Layout--Design change and del R270 to simplify that become CLK_PCI_DEBUG; Add R477 0 ohm to separate for JP6.19 option
10/21 CKT,Layout15--Modify RP1 Pin1,2,3 connection for layout routing smoothly. -Modify RP1 Pin1,2,3 connection for layout routing smoothly. <Compal>.
15,22,31 -S implify the CLK_PCI_DB and CLK_PCI_DEBUG design and routing for improve
EE signals quality and EMI Issue. <Compal>.
11/03 CKT,BOM,Layout21-M/E D esign change the RJ-45 connector. <Compal>.--M/E Design change JRJ45 DC234003O00(TYCO_2006067-1_13P) to DC020910201(FOX_JM36111-R2225-7H_13P-T). 0.76
11/030.7CKT,BOM,Layout24-Add t he RC delay circuit between SLP_S4# and SLP_S4_R to fix dual USB
0.711/058CKT,BOM,Layout29-Ad d the isolat e circ uit fo r Skagen side Monitor Stand HDD LED light on issue fix.
0.7911/05 CKT,BOM29-Sc hematic BOM change for actual and common. <Compal>.--BOM change on Q30, Q19, U6.
can not power on issue. <Compal>.
<Compal>.
0.71011/06 CKT,BOM30-Sc hematic BOM change for CBB Reset function. <HP>.--BOM change to install R605 (0_0201).
0.71111/06 CKT,BOM,Layout18-Add + 3VS PH on CRT_DDC_CLK &C RT_DDC_DATA for design change.. <MAXIM>. --Add R53,R57(2.2K) +3VS pull-high on CRT_DDC_CLK &C RT_DDC_DATA for MAXIM CRT switch design change.
1211/06 CKT,BOM,Layout4-Cancel REMOTE thermal sensor reserve. <HP/Compal>.--Delete REMOTE2+/- traces & Q1. Move C5 close to pins 16/15 of U2.0.7
CC
1311/110.7CKT,BOM,Layout14,28-A dd 0.1UF ca p for EMI issue fix. <Compal>.--Add C669 (0.1UF) close to R215; C668 (0.1UF) close to JP22.2.
1411/110.7CKT,BOM20-I nstall EMI INV_PWM reserve solution for issue fix. <Compal>.--Install R372 (22_0402) and C665 (220P_0402).
0.71511/11 CKT,BOM,Layout28-Add 0.1UF CA P on ON/OFF# for ESD issue fix. <Compal>.--Add C670 (0.1UF_0402) close to JP20.2's via.
0.71611/12 CKT,BOM,Layout28-Add 0 ohm resisto r for CBB reset function pin ground to avoid floating. <SMsC/Compal>. --Add R60 (0_0402) close JP28 pin 3 for CBB reset function reserve.
11/12170.7--Add power jumper options for +1.5VS_CPU_VDDQ(PJP605) & +1.5V(PJP604) to PU601.1. Make PJP605 option installed.-To res olve glitch seen on +0.75VS power rail during S0->G3 transition. <HP/Compal>.38CKT,BOM,Layout
0.71811/12--Update the symbol and PCB Footprint FOX_QL1044L-D261A1-7H_82P-T for fix.-To resolve Docking Connector (JP30) SMT soldering issue. <HP/Compal>.CKT,Layout29
0.71911/12 CKT,BOM---S chemat ic BO M change for actual and common. <Compal>.--BOM change on C68,C69,C70,C71,C72,C92,C93,C94,C113,C114,C115,C140, C63,C64,C65,C66,C67,C85,C86,C87,C88,C89,C90,C91; C29,
0.72011/13 CKT,BOM,Layout32-M/E S crew hole size modify. <Compal/HP>.--Change H2 from H_4P4 to H_4P7; H28 from H_4P8 to H_4P9.
0.72111/13 CKT,BOM25-To fix CB B aut o active caused by +3VS leakage issue. <Compal>.--Change Q28 from AP2301(SB000007H10) to AP2309(SB00000MI00).
0.72211/13 CKT,BOM13-To follow INTEL Design Guide requirement. <INTEL>.--Change C193,C194,C195,C196,C197,C198 from 0.1U_0402_16V4Z(SE070104Z80) to 0.1U_0402_25V4K(SE00000G880).
0.72311/14 CKT,BOM,Layout28,30-Ca ncel CAP_RST related design reserve to avoid the ESD issuet. <HP/SMsC>.--Del CAP_RST Net and also R60,R605, leave the KBC pin63 (GPIO35) alone as NC.
0.72411/27 CKT,BOM14,18-BOM change for C RT EMI and EE SVTP fail issue. <HP/Compal>.--Remove R247,R248,R249 (150_0402); Install C232,C233,C234 (18P_0402); Remove C235,C236,C237 (18P_0402); Change L2,L4,L6
0.72511/27 CKT,BOM7-T o fix I NTEL Leakage circuit sequence issue. <HP/Compal>.--Change C26,C27 from 10UF(SE093106M80) to 22UF(SE000000I10); also change the soldering pad from PJP604 to PJP605.
BB
--Change C406 from 150U_B2_6.3VM_R35M (P/N:SGA00002N80) to 220U_6.3V_M (P/N:SF000002Y00).
--Delete USB20_N6/P6 between WLAN slot JP6.36/38 and PCH U7.M22/N22.0.7210/13 CKT,Layout15,22-Delete USB 20_N6/P 6 from WLAN slot. WiMAX is dead. <HP>.
--Delete H13 (H_3P0); change H2 from H_4P7 to H_4P4; H28 from H_4P9 to H_4P8.10/19 CKT,Layout32-Delete and modify Skew Hole PCB Footprint for M/E Drawing update. <Compal>.
CLK_PCI_DEBUG connection.
--Del R697(0_0201); Add R11(470K_0402) and C7(0.01UF) close to U33 pin3 and pin4. 7
--Design in the isola te circuit on SATA_LED# by add Q79 (2N7002) and R49 (10K) PH close to Docking Connector JP30.39.
C60,C48,C62; C30;
from 0805CS-111XJLC_0805 to 0_0603_5%; Change L1,L3,L5 from 0805CS-111XJLC_0805 to HLC0603CSCC33NJT_0603;
Remove R322,R323,R324 (150_0402_1%); Install C321,C320,C315 (75_0402_1%)
KAT10 from PV-R to Pre-MV LA-5251P REV:0.8 -> 0.9 Modify <2009.12.29.~2010.01.05. >
ItemImpactDatePageRev.Modify DescriptionChange Cause
0.9101/04 CKT,BOM,Layout30,31-Need rotate the BIOS Socket for new type one implement without repair and SMT
interfere issue. <Compal>.
0.93--Cancel H17 Screw Hole for M/E design change.01/04 CKT,Layout32-Cancel H17 Screw Hole for M/E design change. <Compal>.
40.9--Add C119 between JP4 pin 37 and 41; Add C120 close to R20.1; Add C145 close to R231 pin 1; Add C146 close to D34 pin 1.-Add Ca ps fo r ESD CBB issue fixed. <Compal>.4,14,28CKT,BOM,Layout01/04
0.95--1. Change L2,L4,L6 PCB Footprint from TAIYO_LB2012T100MR_L2012_2P to R_0603 for final.
01/04 CKT,BOM,Layout14-Reduce L1~L6 pack age size for fix repair and SMT issue. <Compal>.
0.9601/05 CKT,BOM,Layout33-Add Cut Mode Caps for EMI PCI issue fix. <Compal>.--Add 4 pcs 0.1UF Cut Mode Caps (C666,C667,C671) which located around the canceled Braidwood module. for EMI PCI issue fix.
--1. Cancel 16pin BIOS reserve (Del U36 and R696); 2. Cancel Board ID Detect reserve circuit (Del U8,Q37,R571,R572,R574,R575);
3. Rot ate 8 pin BIOS Socket 90 degree.
--Update PCB Footprint (FOX_QL1044L-D261A1-7H_82P-T) from Compal Server --> No change and same as PV phase.0.9201/04 Layout29-To final Foxconn Docking Connector layout footprint. <Compal>.
2. Change L1,L3,L5 from TAIYO_LB2012T100MR_L2012_2P to KC_HLC0603CSCCR11JT_2P for final.
AA
Secur ity Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2006/02/132010/12/31
Compal Secret Data
Deciphered Date
Title
Size Doc ument NumberRe v
Cus tom
2
Date:Sheetof
Compal Electronics, Inc.
H/W2 EE Dept. PIR SHEET(2)
LA-5251P
4747T uesday, J anuary 05, 2 010
1
0.9
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